TJ Green Associates, LLC
:: Corporate Member News ::

:: Indium Corporation Acquires Assets of Reactive NanoTechnologies (full story)

:: Namark Process Design LLC to Represent Torrey Hills Technologies, LLC in Southeast U.S. (full story)

:: Quik-Pak Names World Wide Sales Director (full story)

:: Advanced Packaging at Yole Developpement (full story)

:: TDK-Lambda Introduces DIN Rail Power Supplies that Operate with 3-Phase AC Inputs (full story)

:: Panasonic Forms Alliance With Leading IP Infrastructure Supplier (full story)

:: SUSS MicroTec Cooperates with Research Institute ITRI on Technology Development in 3D Integration (full story)

AI Technology

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

The Bergquist Company

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

Indium Corporation Acquires Assets of Reactive NanoTechnologies

Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.
Indium will move the RNT process and equipment, and a core staff, into its Utica Business Park (Utica, New York) facility. There will be minimal disruption in the RNT business operation as integration activities have already been underway. Customers will now place their orders and inquires directly through Indium Corporation. The core RNT team, along with Indium Corporation personnel, will continue supporting the NanoFoil® and NanoBond® business.

"We are very excited about this acquisition by Indium Corporation," stated Joe Grzyb, RNT's CEO.  "Indium's presence in the global electronics materials market will allow NanoBond® technology to proliferate more quickly and broadly. There is a strong synergy with the Indium Corporation solder, assembly, and thermal interface materials product lines."
According to Ross Berntson, Indium VP of Sales, Marketing, and Technical Support, "Indium Corporation is pleased to add another advanced joining technology to our portfolio. We expect this nano technology to enhance Indium Corporation's diversity and strength as a materials supplier to the $2.8billion sputtering target market as well as to enhance our position in the metallic thermal interface market, two application segments that are the primary focus of this business. Additionally, we are pleased to bring this technology and business to the City of Utica."
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Namark Process Design LLC to Represent Torrey Hills Technologies, LLC in Southeast U.S.

Torrey Hills Technologies, LLC has announced that the company has selected Namark Process Design LLC to represent its products in Florida, Georgia, Alabama, North Carolina and South Carolina. Delip “Doug” Bokil, owner and president of Namark Process Design LLC, has become the official representative in the region as of September 15.

“I am thrilled to have Doug on board.” said Ken Kuang, president of Torrey Hills Technologies, LLC.  “It is an honor to have an experienced and successful industrial expert representing our company in these important markets. We look forward to a productive partnership with Namark Process Design LLC.”

Bokil, who is also the 2009 president of International Microelectronics and Packaging Society (IMAPS), has been involved with microelectronics for over 30 years working with companies including RCA, Analog Devices, APC, and Computer Products. Being a Certified Quality Engineer, Bokil possesses detailed knowledge of the entire microelectronics manufacturing process. His spectrum of experience spans design through manufacturing. He has worked as a consultant to setup a DC-DC manufacturing factory in China. He has trained personnel in auto-emission testing in Beijing, AOI inspection in Massachusetts, and optimized the design of a SMT product in the Philippines. His education includes a BTech ECE & an MSc in Eng Mgmt from Northeastern University.

“We chose to align with Torrey Hills Technologies, LLC not only because they build great products, but also because they share our philosophy of providing innovative solutions to the industry,” said Bokil. “We believe that together we’ll offer unrivalled solutions for the microelectronics industry.”

Contact details of Delip “Doug” Bokil: Namark Process Design LLC, P.O. Box 582889, Kissimmee, FL 34758. Cell: 781-354-0962; FAX: 1-863-582-3330. Email:
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Quik-Pak Names World Wide Sales Director

Quik-Pak, a division of Delphon Industries, has announced the appointment of Julie Adams as Worldwide Sales Director.

Ms. Adams is responsible for directing all sales activities and working with engineering and manufacturing staff to drive business development opportunities and to assure that customer requirements are met. She brings with her extensive experience in strategic sales and development of semiconductor packaging technologies and manufacturing equipment.  She has held senior engineering positions at Motorola and Amkor and has spent several years in executive sales positions with RVSI Vanguard and most recently Royce Instruments. Ms. Adams also holds a BSME Degree from the University of Arizona. “We are excited to have Julie as part of our team,” says Darby Davis, Delphon Director of Worldwide Sales & Marketing.  “She has a long track-record of success in the semiconductor industry and we’re confident that she will be successful in expanding Quik-Pak’s worldwide sales efforts. 

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Advanced Packaging at Yole Developpement

Yole Développement has appointed Jean-Marc Yannou as Project Manager for Advanced Packaging, WLP and 3D System integration. This recruitment confirms Yole Développement’s strategy to increase its activity in the Advanced Packaging industry. Yole Développement has been working on this sector for several years now and proposes consulting services as well as different market & technological studies.

“Wafer Level Packaging 2009 is the first report ever dedicated to this promising market, with worldwide sales expected to reach one billion dollars by 2013, and an expected CAGR of 16% from 2008 to 2015” Développement”, explained Jean-Marc Yannou, Project Manager at Yole Développement…

For more information please contact: Advanced packaging activities, Jean-Marc Yannou (  and Jérôme Baron (
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TDK-Lambda Introduces DIN Rail Power Supplies that Operate with 3-Phase AC Inputs

TDK-Lambda has released a new series of AC-DC DIN Rail-Mount power supplies with outputs rated from 120 to 480-watts that operate off a 3-phase AC line input from 340 to 575 VAC. These models are ideal for factory automation, industrial control systems and test and measurement equipment.

Each series are available with the most popular output voltages: 12VDC and 24VDC outputs are available in the DPP120 series (rated at 120W) plus 24VDC and 48VDC outputs are available in the DPP240 series (rated at 240W) and the DPP480 series (rated at 480W). An important feature of these new units is their bi-phase operation; under a dropped phase condition they will continue to operate with the output power derated to 80%. All models incorporate power factor correction in accordance with EN61000-3-2.

Output voltages can be adjusted to allow for the voltage drop in cables and similar factors. Load regulation is ±1% when the supplies are used individually and ±5% when two supplies are connected in parallel for higher power applications.

For additional convenience in control and automation applications, the 24V model includes a voltage monitoring (DC Good) relay. The relay contacts are rated at 0.3A and they close when the output voltage is above 17.6V to 19.4VDC; this can be useful  in protecting devices such as sensors and solenoids that may be unpredictable at reduced voltages, i.e., below their nominal 24V rating.

Further features of these DPP 3-phase series include over current protection, over voltage protection and over temperature protection with auto recovery. The operating  temperature range of the power supplies is from -25°C to +71°C.

These new DPP 3-phase series power supplies from TDK-Lambda meet EN55022 Class B EMI standards (radiated and conducted), are CE marked, and are safety-approved to UL/EN60950-1 and UL508 specifications. All models are suitable for either TS35/7.5 or TS35/15 DIN-Rail mounting, and have a robust metal case with convenient screw terminal connections. All models carry a two-year warranty.

The DPP 3-phase series are available now and priced from $64.00 each in quantities of 1k units. For more information, please call TDK-Lambda directly at 1-800-LAMBDA-4 or view our full specs on this and other DIN Rail Mount supplies at:

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Panasonic Forms Alliance With Leading IP Infrastructure Supplier

Collaboration With Berk-Tek  Will Further Enable End-To-End Solutions.

Panasonic announces an agreement with a leading company in the Internet Protocol (IP) infrastructure market to bridge the convergence gap and expedite development of enhanced end-to-end system solutions. Joining Panasonic in a technical, marketing, training and testing alliance is industry veteran Berk-Tek, a Nexans Company, provider of reliable cabling infrastructure solutions for IP networks.

Working together will enable the companies to better leverage Panasonic's strength in video surveillance systems and the expertise of Berk-Tek, the industry leader in the information transport market to provide converged IP solutions offering superior end-to-end video image quality. Cooperative activities involving Panasonic and Berk-Tek will include collaborative training for the sales channel and end-users, joint trade show participation and support, and jointly produced sales and promotional materials. Testing to ensure throughput and optimal performance results will facilitate the development of robust, reliable integrated systems. The alliance also reinforces Panasonic's commitment to providing superior open architecture system solutions that excel in the Information Technology (IT) arena.

“It's great news for customers when the leading suppliers of reliable, high-quality solutions join forces and take a system-wide, end-to-end approach to giving customers exactly what they need,” said John Centofanti, National Sales Manager, Panasonic Security Systems. “The quality and functionality of copper and fiber cable products from Berk-Tek perfectly complement Panasonic's strengths, and the resulting systems will provide superior video performance for our customers.”

“As more and more security and building automation devices become connected to the IT network, collaboration between the cabling infrastructure and edge device manufacturers will be critical to overall system performance,” said Paul Trunk, Vice President of Sales and Marketing, Berk-Tek, a Nexans Company. “This technical alliance is a commitment to the IP movement.”

For more information, contact Panasonic by visiting
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SUSS MicroTec Cooperates with Research Institute ITRI on Technology Development in 3D Integration

SUSS MicroTec, has announced that it is engaging with one of the world's leading research institutes, the Industrial Technology Research Institute (ITRI) in Tawain, on the development of 3D integration technologies. The Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI, will implement the 300mm lithography cluster LithoPack300 and the 300mm bond cluster CBC300 of SUSS MicroTec in its 300mm demo production line at ITRI in Hsin-Chu, Taiwan. With this SUSS MicroTec is joining the consortium and will actively apply its expertise in 3D Integration to further process development.

The Ad-STAC aims at driving technology advances for industrial development in the field of 3D Integration. It consists of 12 multinational companies installing the world's first 300mm demo-production line, targeting solely at 3D research and development. This line provides state-of-the-art equipment and materials for a wide range of processes. The facility which is open to all parties interested in 3D development offers companies from different fields as well as research institutes a unique environment to develop and test new technologies and products.

The 300mm wafer processing equipment of SUSS MicroTec joining the demo production line represents the core solutions of the SUSS MicroTec 300mm portfolio. The LithoPack300 integrates two latest generation 300mm photolithography modules, the MA300 Gen2 mask aligner and the ACS300 Gen3 spray coater, in one system. The CBC300 is a modular wafer bonding platform configured to run the latest fusion bonding techniques with plasma activation, thermo compression bonding including copper-to-copper (CuCu) bonds for 3D Integration. It offers temporary bonding capability using the latest generation adhesives specifically designed for the 3D applications.

"We are looking forward to SUSS MicroTec joining Ad-STAC," noted Dr. Ian Chan, VP & EOL General Director of ITRI. "SUSS MicroTec is known as the leading expert in their field so I am confident that their experience will become a real asset to the challenging environment of our demo production line."

"We are proud to have become part of this important alliance in ITRI's Ad-STAC program," stated Frank Averdung, CEO and President of SUSS MicroTec. "We will be working with worldwide leading research and industry partners on viable production platforms to enable cost efficient and high yielding manufacturing processes. Being at the forefront of technology development we will be able to directly pass our technology advancements on to our customers to shorten the time to market for our customers' advanced products."

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View the Corporate Bulletin Archives


:: Issue 80 ::
October 1, 2009

RGL Enterprises LLC

Compex Corp.