Silver Sponsor Heraeus Thick Film Division Exhibiting at IMAPS 2009 - Booth 710

Heraeus Thick Film Division is proud to be the Silver Sponsor for IMAPS 2009.  Heraeus is a long term supporter of the IMAPS organization and we continue to be excited about the symposium.  In honor of our Silver sponsorship we will be giving away a 10 TOz. silver bar each day of the show.  Please stop our booth (#710) and put your name in for our drawing to win one of our silver bars.

This year at IMAPS we are showcasing our precious metal powder technology, our new IP6075, low temperature dielectric for aluminum substrates and our resinate pastes recently acquired from BASF.  Stop by our booth and talk to our technical experts and see how these new and innovative products can help solve your engineering challenges.

Visit Teledyne Microelectronic Technologies at Booth 920

Teledyne Microelectronics is proud to be a part of the 42nd IMAPS International Symposium on Microelectronics in San Jose, California on November 3-5, 2009.  This event attracts a global audience and is centered around a technical conference that addresses the latest topics relating to advanced microelectronics packaging.

At this show, Teledyne Microelectronics will feature its innovative approaches in packaging and testing of microcircuits, multichip modules and multichip assemblies.  We specialize in high density microminiature devices utilizing the latest advanced packaging techniques.   Areas of expertise include RF/microwave, optoelectronics, military secure communications and analog/digital.  We are certified to IS09001:2000, MIL-PRF-38534 Class “H” and “K” and received accreditation by the DOD/DMEA as a Microelectronics Trusted Source for Packaging, Assembly and Test.  We are committed to bringing reliability, precision, performance and innovation to every packaging project.  Please stop by the Teledyne booth #920 and we can talk about your packaging challenges.

Ferro Launches Three Electronic Packaging Products

Ferro Electronic Materials introduces three new products designed to meet your electronic packaging needs.

Ferro’s A6M-E enhanced tape system continues to provide industry leading low-loss, high-frequency performance in military, aerospace and high-reliability applications with improved handling properties and reduced process sensitivity for 10-110-GHz systems.

Our L8 tape system for ceramic components and modules completes our portfolio of the industry’s most diverse LTCC product offering. For use in low to mid frequency aerospace, medical, and telecommunications applications, L8 tape is lead-free and has matched silver and gold metallization.

Finally, Ferro introduces a new low-temperature, lead-free sealing glass family for ceramic, glass, and metal substrates. These glasses seal at temperatures below 500°C and are available in powder and paste formulations.

Visit us at booth 724-726. Be sure to enter our drawing for an I-Pod Touch.

Ferro Electronic Materials, www.ferro.com.

Visit Orthodyne Electronics at Booth 921

For years Orthodyne's ultrasonic small and large-wire bonders have led the market in innovation and efficient, reliable performance. Our PowerRibbon® technology extends the tradition as it creates a new category of interconnect for power devices.

PowerRibbon®
We invite you to see our innovative Large Ribbon Bonding capability. Sized from 20x4mil to 80x12mil, PowerRibbon® offers the solution to smaller packaging - more power with fewer connections.  PowerRibbon® combines the flexibility and robustness of large aluminum wire bonding with greater current-capacity and lower RDS(on).  Efficient, reliable, and retrofittable, PowerRibbon® is the most advanced interconnect alternative for small SO-8, PQFN type leadframe applications as well as large complex power modules.

We look forward to seeing you at IMAPS San Jose, Booth #921!!

Visit Trebor Instrument Corp. at Booth 1012

Trebor Instrument Corp. has been a proud member and exhibitor of IMAPS (ISHM) since 1980.  The Model 135 Eutectic Die Bonder is a machine for bonding dice to packages or substrates.  The bonding is done on a heat column that heats the package or substrate upto 410 degrees C.  To enable the operator to concentrate on placement of the dice, locating motions are mechanized and some operations are performed automatically in sequence.  

TREBOR INSTRUMENT CORP.  www.treborinst.com

Visit nanosystec at Booth 524

nanosystec specializes in customized production stations for high precision alignment and laser assembly. Systems include active alignment for optoelectronic devices as well as lid sealing of sensitive ceramic packages. Selective laser soldering stations with proprietary multi-spot beam technology complete the portfolio.

Visit Integra Technologies, Inc. at Booth 525

Let the Integra team help get your newly designed IC to market!  Integra Technologies is pleased to be exhibiting at IMAPS 2009 in booth #525.  Integra provides every post-wafer fabrication service necessary to deliver a cost-effective, fully assembled and tested product to your end customer including: Wafer probe, Assembly, Final Test, Test Development, Qualification, ESD and Latch-Up.  We feature the largest test engineering organization, highest on time delivery performance and highest customer satisfaction ratings in our industry. 
  
Whether you need all of our services or just one, stop by our booth to see how Integra can cost-effectively and consistently help you get your products to your customers! 

Visit Laser Tech at Booth 522

Laser Machined Ceramics, High Density Laser Drilled Micro-Holes in ceramics, silicon, and other materials. Custom Laser Machining of metals, plastics, adhesives, silicon, rubber, etc.  Custom Laser Engraving
ISO 9001:2000 Certified.

Laser Tech, Inc.     1134 East Pine Street, Saint Croix Falls, WI 54024

                                  715-483-1636 | Fax 715-483-5598

                                      www.laser-tech-inc.com      quotes:  sales@laser-tech-inc.com

Visit us at IMAPS 2009 Booth #522!

Visit Cyber-Technologies at Booth 824

Discover SET’s cutting edge bonding solutions for 3D-IC at Booth 930

3D assembly by Chip-to-Chip (C2C) and Chip-to-Wafer (C2W) stacking enables the development of very high density, multifunction devices and satisfies the demand for higher packaging miniaturization.

There are a number of different ways to design 3D chip packages. For stacked packages, the placement accuracy of chip layers becomes more and more important as the number of layers increases.  The co-planarity of the layers is also an extremely important issue. 3D considerations are also crucial to assembly of MEMS devices, as well as other advanced 3D structures, such as VCSEL arrays and smart pixel arrays. In all cases, 3D packaging requires unparalleled accuracy in the x-, y- and z-directions.

The SET FC300, recently sold to technology leaders (IMEC, Sematech, CEA LETI), provides this accuracy, with post-bond accuracy down to 0.5 µm. SET Device Bonders also deliver high leveling accuracy which can be critical for stacked packages or 3D optoelectronic devices. Leveling accuracy as high as 10 µrad ensures that the 3D structure is correctly assembled and aligned.

By joining the IMEC Industrial Affiliation Program (IIAP) on 3D integration, SET is confirming its leadership position within the industry by providing cutting-edge high accuracy bonding solutions. Thanks to a close cooperation with its customers, SET has raised process development and flexibility of its equipment to the highest level.

To learn more, come & hear Gilbert Lecarpentier, SET leading bonding expert, who will give a presentation on November 4, during the afternoon technical sessions. The subject is High Accuracy Placement Enabling High Density and Fine Pitch in 3D-IC with High Density TSV, with Chip to Wafer (C2W) Bonding Approach.

Visit us on www.set-sas.fr .

Stellar Industries – New and Improved – Visit us at Booth 413

Visit Dr. Tresky AG at Booth 830

For more than 29 years, DR. TRESKY AG has been well known for its high quality products in the electronic industry.

Consequent developments and the mostly in-house production of our manual and semi-automatic Component Placers allow to react quickly to the trend of the market and to meet the customer requirements.

The great diversity of options has the ability to alter the standard-machines into multi-functional devices, this leads to highly universal items and it still guarantees a user-friendly operation. Different applications can be performed with one machine only:

Die attach, high-accuracy bonding, chip on defined height bonding, thermo- and ultrasonic bonding, stacking of laser bars, eutectic bonding, AuSn and AuAu soldering, 3D packaging and a lot more.

TRESKY’S main attention is still based on further developments for our products what results in a wide range of application-fields, better ergonomics, more repeatability and accuracy as well. Our aim is to produce high quality equipment with high performance but at a reasonable price.

The Beam-Splitter System, Flip-Chip09, is now ready for serial production, as many customers are already using it successfully. Even for its attractive price you will get the Flip-Chip09 with higher optical resolution, auto-focus/ auto-zoom camera and integrated LED illumination. A new additional equipment called Flip-Chip09mpa allows a Multi-Point Alignment in X and Y. In combination with the as well newly developed XY-Table Micro Adjustment and Locking Facility high accuracy of up to 1µm can be reached.

IMAPS 2009  -  Booth 830
DR.TRESKY AG  /  Böhnirainstr. 13  / CH-8800 Thalwil  /  Schweiz  /  www.tresky.com

DuPont Microcircuit Materials Introduces GreenTape™ 9K7 LTCC at Booth 615

DuPont Microcircuit Materials (MCM) is introducing DuPont™ GreenTape™ 9K7 Low Temperature Co-fired Ceramic (LTCC) material system at the IMAPS 2009 42nd International Symposium on Microelectronics, being held November 1-5, 2009 in San Jose, CA.  The DuPont™ GreenTape™ 9K7 LTCC material is a lead-free* glass-ceramic dielectric tape, and is available with compatible gold and silver conductive materials as well as co-fired embedded resistor materials.  It is specifically designed for advanced high-frequency, microwave, and millimeter wave electronic circuit applications within the aerospace, automotive, military, consumer electronics, and telecommunications industries.  

LTCC technology has long provided circuit designers with the ability to further miniaturize high density interconnect circuits, but the development of a new proprietary crystallizable glass, with alumina fillers for added mechanical strength, has been a significant technical breakthrough with GreenTape™ 9K7.  With this system, circuit designers and LTCC fabricators now have the ability to design and build high frequency microwave circuits up to 100 Gigahertz and beyond, using electronic materials that are improved over other commercial tape systems, demonstrating superior dielectric properties and improved process capability.  All components of the DuPont™ GreenTape™ 9K7 LTCC system are compatible, to facilitate their introduction into the manufacturing process.  For more information about the new DuPont™ GreenTape™ 9K7, visit http://mcm.dupont.com.

Visit DuPont at Booth #615.

Visit Haiku Tech at Booth 1115

Visit Rogers Corporation at Booth 1024

Rogers Corporation will display a number of its innovative and practical materials solutions for microelectronics packaging and production at the upcoming IMAPS 2009 Conference and Exhibition. Rogers will be represented by both its Advanced Circuit Materials Division (ACM) and its Thermal Management Solutions (TMS) Division.

Rogers’ representatives will be available (Booth 1024) to offer guidance on the optimum use of their packaging materials. Rogers ACM Division will show its RO4003?, RO4350B?, RO4450F?, RO2800®/R02808?, and RO4000® LoPro? materials. Rogers TMS products on hand will include COOLSPAN? thermal interface materials and HEATWAVE? AlSiC metal matrix composites.

ALLVIA - Through-Silicon Via (TSV) Foundry Service - Booth 1011

ALLVIA provides Through-Silicon Via specialty foundry services for MEMS and Semiconductor Industries, and offers package interposer solutions to meet the demands of advanced vertical interconnects and System-in-Package (SiP) solutions. Through-Silicon vias provide the shortest electrical path between two sides of silicon die, allow miniaturization through 3D stacking, and support wafer level packaging (WLP) for RF and MEMS devices.  With a full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs for manufacturing TSVs, silicon etching, copper plating, photolithography, CMP, etc.

For more information about ALLVIA please visit www.allvia.com.

Visit Palomar Technologies at Booth 410

Palomar Technologies, solutions provider for microelectronic and optoelectronic packaging, and experts in precision wire bonding, gold wire bonding, and high accuracy component placement systems, will be available at IMAPS Booth #410 to discuss your microelectronic packaging needs.Palomar's award winning automated high-precision assembly systems enable customers to increase yield and reduce costs in the manufacturing of LED, optoelectronic, solar, RF, and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace, defense, medical, and life sciences industries.  Palomar Microelectronics is the development, test, and contract assembly division of Palomar Technologies. Contract assembly is an ideal solution for customers in need of immediate production of parts/packages while their customized wire and die bonding systems are being built. Start-up and cash-strapped companies also benefit by getting scalable production accomplished while keeping capital costs low.

While at IMAPS 2009, catch the paper presented Palomar Sr. Scientist, Daniel D. Evans, Jr. “Odd Form Factor Package Wire Bond Case Studies”. This paper will explore the wire bonding requirements of several devices that could be considered odd form factor package formats or atypical microelectronic packages. Mr. Evans will be discussing wire bond challenges and solutions through case studies in RF, Automotive, and Optical markets including challenges with large form factor (12”x6”), deep reach (0.535”), leads and pins.