TJ Green Associates, LLC
:: Corporate Member News ::

:: LORD Corporation’s Paisner to Speak at the Advanced Technical Workshop on Thermal Management (full story)

:: IBM Awards Endicott Interconnect Technologies, Inc. Supercomputing Contract (full story)

:: Silicon Cert’s Real Time X-Ray Imaging (full story)

:: Indium Corporation Introduces a Thermal Interface Material for IGBT Modules (full story)

:: Quik-Pak Announces ITAR Registration (full story)

:: SET Receives Strategic Wafer Level Packaging Equipment Order from SEMATECH at UAlbany NanoCollege (full story)

:: Component Surfaces Inc., Computer Integrated Machining Inc. and Torrey Hills Technologies, LLC Form Strategic Alliance to Step into Military Heat Sink Market (full story)

:: Sonoscan® Gives Details of Stacked Die Tool (full story)

AI Technology

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Interplex Engineered Products
Royce Instruments

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

LORD Corporation’s Paisner to Speak at the Advanced Technical Workshop on Thermal Management

LORD Corporation has announced that Sara Paisner, Ph.D. will speak at the International Microelectronics and Packaging Society (IMAPS) Advanced Technical Workshop on Thermal Management.

The workshop will take place at Dinah’s Garden Hotel in Palo Alto, Calif., Oct. 5-8. Paisner will be speaking at “Session Seven: Thermal Interface Materials,” from 3:30-5:30 p.m. on Wednesday, Oct. 7. The presentation will include an overview of the thermally conductive no-pump out grease that LORD recently released, its properties and applications. The presentation will highlight the industry trend toward reduced feature size and faster operating speed, which has generated demands for higher powered devices.

LORD Corporation’s thermal grease, TC-501, has properties that dramatically exceed traditional thermal greases. The material has thermal conductivity values as high as 8W/mK and thermal resistance values as low as 6 mm2K/W. In addition, LORD Corporation’s new thermal grease will never bleed or pump out, eliminating the reliability problem most commonly encountered with traditional thermal greases. The innovative technology used to develop this material helps engineers solve complex fundamental thermal management problems by allowing the use of high performance thermal greases in applications previously restricted to lower thermally conductive materials, such as gels or adhesives.

Paisner is a Staff Scientist in the Electronic Materials Product Development Group at LORD Corporation. She leads a variety of projects focused on developing the company’s next generation of thermal interface gels, greases and adhesives for the microelectronics industry.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials and systems solutions for removing, spreading and dissipating heat from microelectronic devices and systems. The workshop emphasis is for practical, high-performance solutionsto meet current and evolving requirements in computing and telecom systems. The Advanced Technology Workshop and Tabletop Exhibition on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS workshops held each year.

The event will take place at Dinah’s Garden Hotel in Palo Alto, Calif. from Oct. 5-8. The cost for members is $650 and $750 after Sept. 18 or at the door. Please visit for more details and to RSVP.
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IBM Awards Endicott Interconnect Technologies, Inc. Supercomputing Contract

Endicott Interconnect is Sole Sourced on IBM’s Next Generation Program

Endicott Interconnect Technologies, Inc. (EI) announced today that IBM has awarded the Company a contract to supply 100% of the printed circuit boards, board level assemblies, and full functional test including all of the critical interconnect components for an advanced program. 

“EI has a long standing relationship with IBM and we’re very pleased to have been chosen as the key supplier for this state-of-the-art solution.  EI is committed to supplying high quality, high reliability and cost efficient products and services to IBM,” said Michael J. Hills, Senior VP of Sales, Marketing and Product Management at EI.
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Silicon Cert’s Real Time X-Ray Imaging

Silicon Cert Laboratories is pleased to announce real time X-Ray imaging as its latest in-house analytical services offering.  X-Ray imaging is the nondestructive, internal examination of devices and packages.  Samples ranging from low-density plastic packages to higher-density steel can be viewed with a high degree of detail.

Applications for this technology are wide-ranging in the type of samples that can be examined from a variety of industries.   Within the microelectronics industry, for example, X-Ray imaging serves to detect defects such as wirebond problems, package cracks and voids, and die attach voids.  Real Time X-Ray imaging is often an important technique used in conjunction with other analytical processes.   It is also becoming increasingly important as one of the final steps whperforming counterfeit detection.   For more information,visit our website

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Indium Corporation Introduces a Thermal Interface Material for IGBT Modules

Indium Corporation announces the Heat-Spring® metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACKTM IGBT modules.
Many applications call for a TIM that can easily be placed against a backing plate and a cooling solution. Indium’s Heat-Spring® is a soft metal alloy (SMA) developed as a compressible metallic shim that can be used in IGBT mounting applications.
Heat-Spring has been tested for the latest PrimePACK configurations and has been optimized to reduce thermal resistance below that of other more traditional thermal interface materials.
Because of the increased number of fasteners used in the PrimePACK and its decreased width base plate, the Heat-Spring is ideal for this IGBT module.
Heat-Springs are soft metal preforms that are compressible, allowing for adaptation to irregularities in the mounting surface. They do not contain silicone, do not out-gas, and do not exhibit pump-out which can occur with thermal greases and other viscous materials.
Heat-Springs are stable, easy to handle, and require no special mounting apparatus. They are highly conductive both thermally and electrically.  Heat-Springs are also made of 100% recyclable and reclaimable metal and are considered a “green” interface material.
For more information about Thermal Interface Materials, visit Indium’s Thermal blog: .

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Quik-Pak Announces ITAR Registration

Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced today that they have received their official International Traffic in Arms Regulations (ITAR) registration from the US Department of State, Bureau of Political-Military Affairs.

This registration documents Quik-Pak’s dedication to adhering to the strict regulations that control the export and import of defense-related articles and services. Quik-Pak is working to meet all ITAR compliance requirements in their organizational structure, documentation, training, quality systems, technology control plans and procedures. A commitment to ITAR compliance ensures that Quik-Pak has the knowledge, ability and regulatory oversight to properly meet the unique needs of the Defense industry.
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SET Receives Strategic Wafer Level Packaging Equipment Order from SEMATECH at UAlbany NanoCollege

SEMATECH Will Perform Innovative 3D Applications at CNSE’s Albany NanoTech with SET’s High Accuracy FC300 System

SET, Smart Equipment Technology, a wholly owned subsidiary of Replisaurus Technologies, has received an order for its high accuracy and high force Device Bonder FC300 from SEMATECH, the global consortium of semiconductor manufacturers. The order was booked earlier this year and the delivery of the machine is scheduled for the end of 2009 at SEMATECH’s 3D R&D Center at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex in Albany, N.Y.

 “Our comprehensive program is aimed at enabling the manufacturability of 3D interconnects, and will benefit from this versatile platform that addresses the broad spectrum of our member companies’ bonding requirements,” said Sitaram Arkalgud, SEMATECH’s 3D program director.

“As the SEMATECH-CNSE partnership continues to drive innovative solutions for next-generation nanodevice manufacturing, the addition of SET’s bonding system will support that effort,” added Richard Brilla, CNSE vice president for Strategy, Alliances and Consortia. “At the same time, the enhanced capabilities at CNSE’s world-class Albany NanoTech Complex will further enable the leading-edge research and development that is critical to our global corporate partners.”

The FC300 is a new generation of high accuracy (0.5 µm), high force (4,000N) device bonder for wafers diameters up to 300 mm. It can be equipped with an optional built-in chamber for collective reflow in a gas or vacuum environment. The FC300 also features nanoimprinting capabilities.

In the frame of its 3D integration program, SEMATECH will explore three-dimensional technology and design for applications in various domains. The technology research using the FC300 focuses mainly on die-to-wafer bonding applications. Other processes such as die-to-die bonding will be explored in the future.

The system ordered encompasses an ultrasonic bonding head and a high force bonding head equipped with a confinement chamber that reduces oxide on bumps and bonding pads. This configuration is especially interesting for Cu-Cu bonding applicable to 3D-Ics integration.

The FC300 has unrivalled versatility, and is able to perform various applications on the same platform with a quick process head reconfiguration:

  1. High Force Bonding Head, adapted to the thermo-compression bonding process.
  2. Low Force Bonding Head, for reflow bonding of all sorts of components, including RF & Optoelectronics device assembly.
  3. UV-curing Head for adhesive bonding using the UV-NIL process, etc.
“SET is proud of confirming its leadership position within the industry by providing cutting-edge bonding solutions to major players like SEMATECH. By working closely with our customers, SET has raised process development and flexibility of its equipment to the highest level,” said Gilbert Lecarpentier, SET business development manager.


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Component Surfaces Inc., Computer Integrated Machining Inc. and Torrey Hills Technologies, LLC Form Strategic Alliance to Step into Military Heat Sink Market

Component Surfaces Inc., Computer Integrated Machining Inc. and Torrey Hills Technologies, LLC have announced that they have forged a strategic alliance to become an ITAR (International Trafficking in Arms Regulations) compliant supplier to the military heat sink market.  The alliance vertically integrates the manufacturing capabilities of the three companies and seeks to generate increasing economies of scale, even though all participating parties are small businesses based in San Diego, CA.

“This alliance brings together excellent materials, fabrication and finishing capabilities to address the ITAR market requirements for thermal management components.” said David Shields, President of Component Surfaces, Inc. “The customers for these products will be pleased to see the improvements we bring in quality, price and delivery time compared to what has been previously available.”

Under the agreement, Component Surfaces Inc. will lead the initiative and act as the general contractor. Materials such as copper tungsten blanks will be supplied by Torrey Hills Technologies, LLC to Computer Integrated Machining Inc. for precision machining. It is then Component Surfaces Inc.’s responsibility to finish off the production with electroless gold plating and related processing services.

Michael J. Brown, President of Computer Integrated Machining, Inc. said, “My Company has worked with many difficult materials and specialized alloys used in aerospace work for 14 years. We have extensive experience in meeting Military Specs and DPS, a fact that also holds true for my partners in this alliance. There is no doubt we can reach even the most stringent military environmental and performance standards.”

In addition to the pledge of quality, this alliance has also worked out terms to lower the cost of production. “We have agreed upon financial and operational mechanisms to keep off the unnecessary expenditures,” said Ken Kuang, President of Torrey Hills Technologies, LLC. “It is our pleasure to introduce some healthy competition to the military heat sink market.”
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Sonoscan® Gives Details of Stacked Die Tool

Sonoscan has unveiled some of the details that enable its powerful new software tool to perform acoustic imaging to identify anomalies and defects in stacked die configurations.  The software, announced in August, is already being used in the headquarters SonoLab® to solve stacked die problems for client companies.

“The question most often asked is, How many die can you image in one stack?” reports SonoLab manager Ray Thomas.  The number that is typically mentioned is four or more die, but SonoLab personnel have also been able to image all of the interfaces in a stack of eight die.

“Imaging eight die,” Thomas adds, “may not be feasible in every case.  Imaging is generally more successful when SonoLab personnel have good data about the dimensions and geometry of the stack.”

The key problem is that ultrasound pulsed into the stack by the C-SAM® system’s transducer is reflected from such a large number of internal interfaces.  If there are eight die, then there are at least 17 interfaces and numerous multiple reflections.

The real value of the new software is that it can sort out the right echoes and provide the acoustic imaging accuracy that lets manufacturers build high reliability into their die stacks.

For more information, please visit


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:: Issue 79 ::
September 15, 2009

RGL Enterprises LLC

Compex Corp.