TJ Green Associates, LLC
:: Corporate Member News ::

:: Nordson ASYMTEK Receives Intel’s Preferred Quality Supplier Award (full story)

:: Railway Quarter-Brick Modules Announced by TDK-Lambda (full story)

:: Integra Technologies Becomes a DMEA Trusted Supplier for Test Services (full story)

:: Managing the Thermal Resistance for Critical Thermal Management Applications from AI Technology (full story)

:: Maxtek Expands Services to Include Component Test and COTS Screening for Military, Space and Commercial Aerospace Markets (full story)

:: Twenty Years of Technological Development Position Remtec as Leader in Metallized Ceramic Substrates and Packages (full story)

:: Vectra® LCP From Ticona Gives Dimensional Stability To Housing In Award Winning Samtec BullsEye™ System (full story)

:: TJ Green Associates Announces A Four Day Training Course On: Process Certification And Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules (full story)

AI Technology

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

CPS Technologies
Integra Technologies
Remtec

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Nordson ASYMTEK Receives Intel’s Preferred Quality Supplier Award

Nordson ASYMTEK has been recognized as one of 16 suppliers to receive Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2009. Nordson ASYMTEK is recognized for their significant contributions, providing Intel with dispense equipment, deemed essential to Intel’s success.

“Nordson ASYMTEK is honored to have received this prestigious award. It reinforces our commitment to quality, continuous improvement and customer satisfaction. We will continue to work to meet our customers’ expectations by providing high value products and the best service worldwide,” said John P. Byers, president, Nordson ASYMTEK.

 “In the last year, Nordson ASYMTEK displayed outstanding customer orientation,” said Ron Rinfret, Assembly Capital Equipment Development director, Intel. “Nordson ASYMTEK provided exceptional support of value-added projects and initiatives beneficial to both companies. Intel appreciates Asymtek’s commitment, and we look forward to a successful 2010.”

The PQS award is part of Intel’s Supplier Continuous Quality Improvement (SCQI) program that encourages suppliers to strive for excellence and continuous improvement. To qualify for PQS status, suppliers must score 80 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and customer satisfaction goals. Suppliers must also achieve 80 percent or greater on a challenging improvement plan and demonstrate solid quality and business systems. Furthermore, the 2009 awardees demonstrated compliance to the Electronic Industry Citizenship Coalition Code of Conduct and Intel’s Environmental Social Governance Program. Additional information about the SCQI program is available at http://supplier.intel.com/quality.
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Railway Quarter-Brick Modules Announced by TDK-Lambda

Global power supply manufacturer TDK-Lambda has expanded its DC-DC converter line-up with the introduction of the new CN-A Series that have a wide range 60V to 160VDC input, which is widely used in railway applications. Available with output voltages from 5V to 24VDC (adjustable ±10%) with output power ratings of 30W, 50W and 100W, these fully-regulated and isolated power modules deliver exceptional performance in the industry standard quarter-brick footprint.

The CN-A DC-DC modules are suitable for both rolling stock and fixed installations, enabling customers to design cost-effective EN50155 compliant systems without the risks associated with custom product designs and in a much shorter timescale. TDK-Lambda also offers a custom design and manufacture service for customers preferring to buy a complete system that meets their exact electrical and mechanical requirements.

Designed for very harsh environments, the CN-A Series meets the stringent shock and vibration requirements of IEC61373 Category 1 Class B, as well as the Japanese equivalent standard JIS E 4031. In addition, all models accept the wide-range DC input commonly found in railway applications, which allows operation from any voltage between 60V and 160VDC.

These baseplate-cooled power converters have standard pin-outs and provide full output power from -40 to +100°C, without deratings. The 100-watt model CN100A110-24, for example, delivers 4.2 Amps at 24VDC with a conversion efficiency of up to 88%.  These quarter-brick modules measure 36.8 x 57.9 mm and are only 12.7mm high.  This translates to a power density of up to 60.5W/in3

As standard, the CN-A units are equipped with remote sense, remote on/off, over voltage and over current protection circuitry, and include TDK-Lambda’s five-year warranty.  All CN-A models have an input-to-output isolation of 3000VAC, are safety-approved to UL/CSA/EN60950-1 and carry the CE mark in accordance with the LV Directive.

The new CN-A family of DC-DC converters is available now and priced at $147.00 each in 100 piece quantities. More information can be obtained at the following TDK-Lambda website http://www.us.tdk-lambda.com/lp or by calling 800-LAMBDA-4.
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Integra Technologies Becomes a DMEA Trusted Supplier for Test Services

Integra Technologies, LLC has been accredited by The Defense Microelectronics Activity (DMEA) as a DoD Category 1A Trusted Integrated Circuit Supplier for Test Services at their Wichita , KS facility.  As a Trusted test supplier, Integra offers semiconductor test software development, testing, qualification, characterization and other related technical services.  Integra's electrical test services encompass both final test and probe.  Integra has one of the largest and most experienced test engineering organizations in the industry and has earned an outstanding reputation for quality, consistency, and on-time delivery.   Integra's engineering staff of 25 experienced engineers and installed base of 32 test systems is capable of handing all device technologies including RF, Digital, Analog, Linear and Mixed Signal.

 For more information, visit our website at www.integra-tech.com.

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Managing the Thermal Resistance for Critical Thermal Management Applications from AI Technology

Thermal management is becoming one of the critical design and manufacturing considerations in electronic devices that generate heat. In some solar applications, the ability to channel heat to the designed power generation mechanism is becoming an important consideration in balancing the costs of goods being made. There are two main categories of thermal interface materials (TIM): adhesive and non-adhesive.

Non-adhesive TIM are used in electronics and other applications to provide an intimate interface between contact surfaces to reduce thermal impedance.  These materials include thermally conductive greases, gels and thermal pads. In the manufacturing environment, dry thermally conductive phase-change pads can be applied with pick-and-place equipment whenever applicable. For pads that are tacky they can be applied manually.

Traditionally well-engineered thermal grease and gels empirically provide for the lowest thermal resistance for a majority of applications. The more prevalent use of phase-change pads is primarily based on the perceived predictable and repeatable performance because the pads have the same size and thickness before they are applied. In recent years the low melting metal-alloys that melt at temperatures below the operating temperature of the interface have also been used. In either case mechanical fasteners must still be part of the device or application construction.
In some of the less critical TIM applications, compressible thermal gaskets or pads are also used. Normally, these applications required periodic removal of the assembly for inspection, repair and maintenance operations. In some cases, the tolerance between various components or portions of the heat-generating sources vary in height. Again, strong mechanical fasteners are required to provide substantial compression to remove as much of the interfacial gaps and voids as possible.  AIT has developed compressible phase-change thermal pads [1]  that have been proven to have the same thermal resistance as the best thermal greases.

For those applications that do not or cannot use a mechanical fastener, the TIM must double as an adhesive and form a thermal interface bond between the heat-generating device and the dissipating structure. AIT has pioneered many thermal adhesives for long-term reliability with flexible stress-free bonding since its inception in 1985[2]. One of the patented applications is the use of thermal pressure sensitive adhesives that are further cured for additional bond strength "in-situ" using the heat generated by the device.

Thermal interface resistance is known to change over time because of either TIM aging or stresses induced during thermal cycling and shock. The paper in the link below provides more detail of important management aspects such as reliability issues.

http://www.aitechnology.com/uploads/pdf/WHITE%20PAPER/ball%20grid%20thermal.pdf   

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Maxtek Expands Services to Include Component Test and COTS Screening for Military, Space and Commercial Aerospace Markets

Effective immediately, Maxtek Components Corporation will offer component test and COTS (commercial off-the-shelf) screening for military, space and commercial aerospace applications through the Component Test organization of Sypris Test & Measurement. Maxtek is a Tektronix Company and a provider of turnkey IC packaging services with a 40-year track record of handling the toughest challenges in custom microelectronics, where critical performance factors are managed to tight tolerances. Sypris Test & Measurement, acquired by Tektronix in October 2009, is a leading provider of calibration services, testing and component sourcing services, and specialty products.

With this significant addition to Maxtek's service offering, customers can source their projects to one trusted vendor for a broad variety of services. Maxtek now provides component testing, including electrical and package integrity testing, COTS up-screening, qualification, and characterization all of which complement Maxtek's proven full-custom ASIC design, package development, assembly, and test services.

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Twenty Years of Technological Development Position Remtec as Leader in Metallized Ceramic Substrates and Packages

Remtec Inc. is celebrating its twentieth year as a company specializing in manufacturing a variety of ceramic packaging products for both commercial and military electronics.  Acknowledging this anniversary, Remtec President Nahum Rapoport commented:  “Over these years, we have focused on design, development and manufacture of reliable, cost effective products providing a multitude of ceramic packaging solutions that meet the changing and demanding needs in DC power electronics, RF / microwave packaging and optoelectronics.”

The first of Remtec’s technological breakthroughs came shortly after it’s founding in 1990 in developing its core manufacturing technology, PCTF®, based on combining Plated Copper and Thick films, and a patent for this technology and manufacturing process was issued in 1994.  Since then PCTF® technology has become the foundation for Remtec’s business and has undergone continuous development and advancement.

Initially, PCTF® was developed for high circuit density and high power in DC electronics. In 1997, development of unique metal filled via holes and wraparounds allowed Remtec to also enter the high frequency RF market, offering leadless ceramic SMT substrates and packages for direct PCB mount with improved thermal and electrical performance. In 1998, in order to meet high reliability requirements, Remtec developed a line of highly integrated hermetic SMT ceramic packages, both leadless and leaded, incorporating passive components and multilayers for military, aerospace and industrial applications.

With broadening product lines and fast sales growth, Remtec recognized the need for higher volume production and integrated manufacturing. In 1999 Remtec moved to a new manufacturing site, acquired a plating company and installed a fully automatic, cassette-to-cassette screen printing line.  As a result, today Remtec is a fully integrated design and manufacturing company with state- of -the -art equipment operating in a 30,000 sq. ft modern facility.

The emphasis on new process and product development has continued in this decade. Improved etched conductor capability combined with thermal vias and integrated copper heat sinks allowed Remtec to penetrate the high power packaging market up to mm wave frequencies.

In 2007 Remtec entered the laser submount market introducing its new high performance submounts with Zero Pullback™ metallization of 50 micron thick copper for high power laser diodes.  In 2009, Remtec added a new capability: an innovative, low cost gold tin finish for high power laser diode submounts.  Remtec now offers this industry a reliable single source for submounts based on PCTF® technology with Zero Pullback copper metallization and an economical gold tin finish on BeO and AlN.

Remtec, a ROHS compliant and ISO 9001:2000 registered company, operates two manufacturing facilities totaling 30,000 sq. ft. in Norwood, MA.  Remtec provides custom and semi-custom packaging solutions with PCTF® metallization on Alumina, BeO, AlN, Barium Titanate and Quartz for DC power electronics, optoelectronics and MW/RF components and modules.

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Vectra® LCP From Ticona Gives Dimensional Stability To Housing In Award Winning Samtec BullsEye™ System

Samtec Inc., a worldwide manufacturer of a broad line of electronic interconnects, has specified a glass-fiber reinforced Vectra® liquid crystal polymer (LCP) from Ticona Engineering Polymers for an injection molded housing used in its award-winning BullsEye™ test point system.

"The decision to use Vectra E130i was simple — it provides the needed precision, dimensional stability and mold flow that Samtec requires in thin-wall electronic connectors," said Jon Hoffman, Advanced HDR Development Engineer, Samtec. "We've had a lot of success with it so we didn't need to spend much time considering alternatives."

Samtec’s BullsEye, named the DesignVision winner at DesignCon 2010, is a high-density, high-performance, low-cost solution that eliminates the need for expensive radio frequency (RF) connectors on production boards. An inexpensive microwave cable adaptor (RF25M) attaches to the existing SubMiniature version A (SMA) type RF connector on the test equipment, then to a plastic housing (CCH) on the board via a compression tip with locking features. A conductive elastomeric inside the plastic housing allows for the ground to transfer to the board in the same manner as it would in an SMA. The plastic housings use the exact footprint as an SMA, but cost much less. Ganged versions can be used to increase the density.

The BullsEye unit contains a Vectra LCP housing that forms the heart of the RF connector. The Vectra LCP workhorse, 30 percent glass filled E130i, was Samtec's material of choice because it offers high-heat resistance, good dimensional stability and good flow.

Vectra LCP is well suited for electrical and electronic components.
"Its high flowability allows it to fill long, complex flow paths in molding and create thin-walled parts having outstanding dimensional accuracy, both of which are essential in creating high-precision parts like the housing that Samtec used in the BullsEye," said Ed Hallahan, marketing manager — Vectra LCP. "Vectra LCP also gives electronic component manufacturers excellent dimensional stability and a low coefficient of thermal expansion, so they can consistently obtain dimensional accuracy with virtually flash-free parts at an economical cost."

Vectra E130i is 30 percent glass filled and offers the following material characteristics:

  • High temperature capability for easier flow and quicker cycle times, making it suitable for applications where very thin walls are required
  • UL 94 V-0 listed at 0.20 millimeters thickness in natural and black
  • Relative-Temperature-Index (RTI), according to UL 746B: Electrical 464 degrees Fahrenheit (240 degrees Celsius), Mechanical 464 degrees Fahrenheit (240 degrees Celsius), Mechanical with Impact 428 degrees Fahrenheit (220 degrees Celsius) at 0.75 millimeters
  • Inherently flame resistant without additives
  • Halogen-free  

"In choosing the material for the BullsEye housing, we quickly went with what had worked in the past," said Samtec's Hoffman. "We knew Vectra would work and that Ticona wouldn’t let us down with quality or deliveries. This confidence saved us time in getting the product to market.”

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TJ Green Associates Announces A Four Day Training Course On: Process Certification And Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules

 

This course is a must for process engineers, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of visual inspection criteria and materials and processes used to assemble Hybrids, Microcircuits and RF MMIC Modules for high reliability Military and Medical applications.   Trained instructors with years of industry experience deliver the material in a straight forward and easy to understand format. 

TomGreen_20090204_0035.jpg

 Course Fee:   $2,300.00

 Course Description

Includes: Comprehensive Student Workbook
and Workmanship Standards CD
plus Continental Breakfast and Lunch daily

 Register Now...Space is Limited!

Courtyard by Marriott Los Angeles Pasadena/Old Town

180 North Fair Oaks Ave    
Pasadena CA 91103
1-800-321-2211

May 25th to May 28th, 2010
Class Times:  8:30am to 4:00pm
Room rate: $149.00 available until April 17

Hotel Bethlehem

437 Main St        
Bethlehem PA 18018
1-800-607-2384

September 20th to September 23rd, 2010    
Class Times: 8:30am to 4:00pm
Room rate: $149.00 available until August 13

To register call 610-625-2158 or contact Terri at terri@tjgreenllc.com 
Visa and MC accepted

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View the Corporate Bulletin Archives

 

:: Issue 89 ::
April 1, 2010

RGL Enterprises LLC

Compex Corp.