TJ Green Associates, LLC
:: Corporate Member News ::

:: ERG Lighting Introduces Edriver Family of Led Drivers for Solid State Lighting with Slim Form Factor, Universal Input and 90% Efficiency (full story)

:: Endicott Interconnect Technologies, Inc. Honors Employees at Seventh Annual Patent Award and Trade Secret Dinner (full story)

:: DuPont Delivers OLED Technology Scalable for Television (full story)

:: LORD Corporation Develops Thermal Conductivity Adhesive (full story)

:: Two New Innovations from Miyachi-Unitek (full story)

:: Panasonic Factory Solutions Wins 2010 NPI Award For Panacim™ Enterprise Edition MES Software (full story)

:: Indium Corporation Announces Promotion (full story)

:: Zenite® LCP and Thermx® PCT products to strengthen Ticona’s electrical and electronics applications (full story)

:: PA&E Announces New Lightweight, Hermetic Micro-D Connector (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Dyconex AG
Orthodyne Electronics (a Division of KNS)
Reinhardt Microtech

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

ERG Lighting Introduces Edriver Family of Led Drivers for Solid State Lighting with Slim Form Factor, Universal Input and 90% Efficiency

ERG Lighting, a new Division of Endicott Research Group, Inc., has introduced the eDriver family of LED power supplies for maximum efficiency in a range of solid state lighting (SSL) applications.

The eDriver family is available in a broad range of constant voltage and constant current drivers. These driver modules are 90% efficient and fully isolated, with universal input (120V, 220V, 277V), power factor correction > 90%, and 0-10V dimming options.

eDrivers offer superior efficiency and economy and include the slimmest 100W LED power supplies on the market – up to 30% slimmer than other drivers in similar power ranges, and up to 50% smaller in total volume.  All eDrivers are manufactured in the USA, with short lead times, full application engineering support and a 5-year warranty.

“It’s all about efficiency,” said Graham Upton, Vice President of Engineering. “Efficient power, size, cost and support. Endicott Research Group has been designing and manufacturing power supplies since 1979, and ERG Lighting has leveraged its expertise in LED control for solid state lighting.”

eDrivers provide the precise voltage and current critical for proper light output and SSL longevity and reliability. There is no wasted energy due to driver/load mismatch.  ERG Lighting provides the exact driver that customers specify, with no unnecessary materials or functionality that would drive up the cost.

Applications for eDrivers include cove and architectural lighting, refrigeration lighting, parking and street lights, commercial and bay lighting, and more.  All ERG Lighting eDrivers will have UL8750 and CE approvals and a rating of IP67.  ERG is ISO 9001 certified as well as RoHS and REACH compliant.

ERG Lighting complements its eDriver family with its DRIVERsity program of custom solutions.   Future options include multiple outputs, ambient light sensing, thermal feedback, a range of dimming control options, color temperature variation and custom mechanicals.

For more information, please visit

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Endicott Interconnect Technologies, Inc. Honors Employees at Seventh Annual Patent Award and Trade Secret Dinner

Endicott Interconnect Technologies, Inc. (EI) honored 36 employees for patent applications filed, U.S. patents issued and trade secrets received in 2009 at an awards dinner and ceremony held Friday, April 16th at The McKinley in Endicott, N.Y.

Awards were presented to: John Adams, Dave Alcoe, Tim Antesberger, Ashwinkumar Bhatt, Dave Caletka, Varaprasad Calmidi, Norman Card, James Carey, Benson Chan, Rabindra Das, Subahu Desai, Frank Egitto, Dale Fiske, Robert Harendza, Robert Japp, John Konrad, John Kresge, John Lauffer, How Lin, Roy Magnuson, Voya Markovich, Luis Matienzo, Thomas Miller, Matthew Neely, Byron Otis, Cheryl Palomaki, Kostas Papathomas, Susan Pitely, Mark Poliks, Jose Rios, Steve Rosser, William Rudik, Mark Schadt, Norman Seastrand, Tonya Tucker, Bill Wilson and Michael Wozniak.

“I am very proud of these individuals whose bold invention, creativity and technology innovation has contributed to the success of EI, ensuring our technical vitality and allowing us to compete aggressively in the open market.  The progress we have made in penetrating new markets and industries has been the direct result of customers’ interest in EI’s technology,” commented James McNamara, President and CEO at EI.  
“This seventh annual ceremony signifies how firmly and decisively EI’s corporate leadership encourages innovation as the corner stone for the future of the company’s progression,” affirmed Voya Markovich, Senior VP of R&D and CTO at EI.  “I am honored to be working with this team of inventors,” he continued.

EI has 145 filed applications and has been awarded 103 U.S. patents to date, including 25 new patents issued and 7 trade secrets in 2009.
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DuPont Delivers OLED Technology Scalable for Television

Cost-Effective Solution Printing Process and Materials Deliver Record Lifetime Performance

DuPont announced that it has achieved record performance in printed organic light emitting diode (OLED) displays, sufficient to enable future adoption of OLED television (TV).  Using proprietary DuPont Gen 3 solution OLED materials, DuPont has for the first time demonstrated a solution-based manufacturing process in which OLEDs can be cost effectively printed while delivering the necessary performance and lifetime.
OLEDs are an inherently more sustainable display technology when compared with liquid crystal displays (LCDs).  OLEDs have the potential for lower power consumption and eliminate the need for many of the LCD components, such as backlights and color filters.  OLEDs also can offer consumers an improved viewing experience through higher contrast ratios and faster response times.  
“OLED displays are in portable devices available in the market today, but the current high-cost of manufacturing with evaporated materials has limited market adoption, and constrained OLED manufacturing for larger size displays,” said David B. Miller, president – DuPont Electronics & Communications.  “Now, with DuPont printed OLED materials and process technology, fabrication costs can be significantly reduced, and manufacturing can be scaled to accommodate TV-size displays.”
DuPont previously announced the development of solution-based OLED materials with record-setting lifetime performance.  With the new results, DuPont has now translated its advances in materials science to a scalable manufacturing process where an OLED television operating eight hours per day would last over 15 years.(1)  
To report these results, DuPont made printed test devices which can be operated at elevated luminance for an accelerated lifetime test.  Printed devices using the DuPont process have reliably achieved lifetimes to 50 percent of initial luminance of 29,000 hours for red, 110,000 hours for green and 34,000 hours for blue at typical television brightness levels.(2)
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LORD Corporation Develops Thermal Conductivity Adhesive

LORD Corporation has announced the availability of a new low modulus, high thermal conductivity adhesive.
Created in response to a market need for a more flexible, high thermal conductivity adhesive, MT-815 can be used in a variety of applications including as a thermal adhesive for large die, in die attach applications, or as a solder replacement. The first in a series of new low modulus, thermal conductivity adhesives from LORD Corporation, MT-815 has a modulus of <1 GPa , allowing it to be more flexible and therefore less likely to crack or delaminate under the stresses of temperature cycles.  MT-815 was also formulated to achieve thermal conductivity of >10 W/m-K, creating a new class of flexible adhesives with high thermal conductivity.

According to Sara Paisner, Staff Scientist for Thermal Management Technology at LORD Corporation, MT-815 builds on a long tradition of innovation in thermal management materials, including GeleaseTM thermal conductive gels, as well as high performance thermal conductivity adhesives like MT-315 and TC-501 no pump-out grease.

“Most thermal adhesives are either flexible with low thermal conductivity (i.e. silicones) or highly rigid with higher adhesion (epoxies). As a result, their uses are limited in microelectronic packages,” said Paisner. “However, this thermal conductive adhesive combines the advantages of high adhesion and thermal conductivity with the need for lower modulus to accommodate the large stresses experienced by electronic packages.”

“LORD is responding to interest from customers who require a low modulus, thermal adhesive to accommodate higher stresses from larger die sizes but cannot sacrifice thermal conductivity,” said Adam Conklin, LORD Global Market Manager – Electronic Materials.  

More information on LORD MT-815 can be found at
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Two New Innovations from Miyachi-Unitek

Miyachi Releases Fully-Integrated Laser Marker Motion Package
The new, fully integrated LMC1 laser marker motion package enables any combination of linear or rotary motion control in up to 4 axes. Automated functions such as serialization, step-and-repeat, or marking around a cylinder can be easily programmed utilizing our automation build function. Standard stage sizes for single linear or combined xyz axes range from 6” to 18”. There are two rotary options: ‘direct drive’ suited for banding applications, or ‘precision rotary’ for high resolution marking.

New 1kw Fiber Laser Welder Enables High Speed Penetration Welding
The new LF1000A 1kW fiber laser welder has a number of features unique to Miyachi Unitek lasers which enable both high speed and penetration welding of steel and aluminums with high process stability and reliability. These features include real time power feedback a 100% optically isolated cavity, energy and time share options, and laser characteristics specifically tuned for laser welding.

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Panasonic Factory Solutions Wins 2010 NPI Award For Panacim™ Enterprise Edition MES Software

Panasonic Factory Solutions Company of America has been awarded a 2010 New Product Introduction (NPI) Award for its PanaCIM Enterprise Edition MES software. 

The award was accepted by the company’s president, Tom Gebhardt, at a ceremony during IPC APEX in Las Vegas, Nevada. Gebhardt commented, “This award further solidifies Panasonic as a total solutions provider. Already recognized as an industry-leading electronics assembly equipment provider, we’ve listened to the industry to develop PanaCIM Enterprise Edition as a unique software solution that can maximize a customer’s productivity from equipment-level to enterprise-wide. What’s more, this solution can be used with Panasonic and third-party equipment.”

PanaCIM Enterprise Edition is a manufacturing execution software system (MES) that offers new levels of integration across a company’s entire enterprise; streamlining processes and driving costs down no matter what mix, no matter what volume, and no matter where a company manufactures.

A highlight of Panasonic’s MES software includes a total MSD (moisture-sensitive device) tracking solution that prevents equipment from placing a locked-out component. Additionally, the Production Monitoring and Dispatch module supplies plant-wide visibility through dashboards and notification systems, utilizing monitors, email, PDA, and more to notify necessary personnel of production issues so they can quickly respond and prevent additional downtime. The incorporation of custom KPI indicators provides at-a-glance efficiency gauges that can be displayed throughout a facility.

Sponsored by Circuits Assembly, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are awarded by a distinguished panel of industry experts.

PanaCIM Enterprise Edition’s nine modules available globally include: Production Analysis, Production Planning, Production Monitoring and Dispatch, Material Verification, Traceability, Material Control, Product Changeover and Control, Maintenance, and Enterprise Link. To learn more about them, visit

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Indium Corporation Announces Promotion

Indium Corporation announces that Nicole Palma has been promoted to Senior Quality Engineer.

Nicole’s new responsibilities include continued support for both internal and external customers; data analysis using six sigma principles; and implementation of control plans, failure modes effect analysis (FMEA), and metrology analysis (MSA).
Nicole joined Indium Corporation in 2004 as a Flux Quality Technician and was promoted to Quality Engineer in 2005. She has a bachelor’s degree in biochemistry from Daemen College. She is a Certified Quality Engineer with the American Society for Quality (ASQ), <>  and has earned her Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth University. Nicole resides in Rome, NY.
Indium Corporation is a premiere materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation visit

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Zenite® LCP and Thermx® PCT products to strengthen Ticona’s electrical and electronics applications

Celanese Enhances Advanced Engineered Materials Segment Through Acquisition of Global LCP and PCT Product Lines from DuPont Performance Polymers

Celanese Corporation has announced that its Advanced Engineered Materials business has completed a transaction to acquire two product lines, DuPont™ Zenite® liquid crystal polymer (LCP) and Thermx® polycyclohexylene-dimethylene terephthalate (PCT), from DuPont Performance Polymers.

“This acquisition will continue to build upon Celanese’s position as a global supplier of high performance materials and technology-driven applications as we continue to expand our innovative offerings in growth-oriented segments to support our customers,” said David Weidman, chairman and CEO, Celanese. “These two products broaden the company’s Ticona Engineering Polymers offerings, enabling Celanese to respond to a globalizing customer base, especially in the high growth electrical and electronics application segments.”

“As the leading supplier of high performance engineering resins, DuPont Performance Polymers is fully committed to growing and strengthening its broad product portfolio,” said Diane Gulyas, president, DuPont Performance Polymers. “DuPont Performance Polymers has concluded that this opportunity to divest Zenite® LCP and Thermx® PCT is in the best long-term interests of our portfolio and customers. We will work closely with Celanese to make the transition period as effective as possible for our customers.”

Revenues of Zenite® LCP and Thermx® PCT were approximately US$40 million in 2009 during a period of global economic recessionary conditions. The acquisition price is not being disclosed at this time.

Green Electronics

Leading electronics manufacturers, governments and consumer groups around the world are increasingly calling for the development of “green electronics.” Many of these global manufacturers are discontinuing the use of halogenated compounds in their products in favor of more environmentally friendly components.

This acquisition will strengthen Ticona´s industry position and broaden its LCP product portfolio to enable Ticona to offer consumers additional environmentally friendly electrical and electronics product solutions. These “green devices,” made out of LCPs, ensure the highest levels of product performance without the use of halogens. LCPs are used in switches, connectors, memory module sockets, in-play consoles, laptops, televisions and mobile phones and other electrical and electronics devices.

The acquisition will also enable Ticona to offer a broader variety of excellent product solutions for automotive suppliers like sensor-equipped cars or future-oriented LED lighting applications.

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PA&E Announces New Lightweight, Hermetic Micro-D Connector

Aluminum Shell Option Provides a 67% Weight Savings

Design engineers in defense, aerospace and other industries where low weight and superior electrical performance are key considerations have a new option, following PA&E’s release of its new aluminum Micro-D connector.

The new PA&E aluminum Micro-D is the only connector on the market that combines the lightweight characteristics of all-aluminum construction with high levels of hermetic performance. This MIL-PRF-83513 compliant, sealed connector is approximately 67% lighter than standard stainless steel alternatives. It can be mounted to a lightweight aluminum electronic housing with laser welding or an O-ring seal. The connector provides greater than 5,000 megohms of insulation resistance at 500 VDC and exhibits no evidence of dielectric withstanding voltage breakdown when tested in accordance with MIL-STD-1344, Method 3003. PA&E’s lightweight aluminum Micro-D connectors can be configured with 9, 15, 21, 25, 31 and 37 pin counts. Its contacts are made of beryllium copper CDA alloy that are finished in nickel/gold plating. PA&E’s new aluminum Micro-D connector has an operating temperature range of -55°C to +125°C.

The new connector uses PA&E’s industry-proven polycrystalline ceramic-to-metal sealing technology, Kryoflex®, to achieve a leak rate of less than or equal to 1X10-5 cc/sec He at one atmospheric differential pressure. Its chemically active Kryoflex seals provide a direct ceramic-to-metal bond, by means of oxygen-pinned valence bonding. This unchanging chemical and mechanical bond is enhanced by Kryoflex's randomly organized crystalline structure, which allows this unique material to relieve stresses from within itself. Kryoflex has an electrical resistivity of 1x1018 Ohms/cm and easily maintained resistance values exceeding 50,000 megohms. Kryoflex seals allow the use of copper alloys so this connector has up to 70 times the current-carrying capacity of conventional products.

Because PA&E’s new aluminum Micro-D connectors can be laser welded into an electronic package, a common failure point – solder joint fatigue – is eliminated. Laser welding is a non-contact, highly-precise welding process that produces an extremely small heat-affected zone, ensuring components or electronic packaging are exposed to the least-hostile welding environment possible.

For more information about aluminum Micro-D connectors from PA&E, visit us at
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View the Corporate Bulletin Archives


:: Issue 90 ::
May 17, 2010

RGL Enterprises LLC

Compex Corp.