TJ Green Associates, LLC
:: Corporate Member News ::

:: Visit 3D Systems Packaging Research Center (PRC) in Booth # 512 (full story)

:: Visit Booth # 530 for Palomar’s New Product: 3800 Utlra Flexible Die Bonder (full story)

:: Visit XYZTEC at Booth # 528 (full story)

:: CAD Design Software Exhibiting at IMAPS 2010 in Booth # 318 is Showcasing Advanced Ceramic Hybrid EDA Design Software (full story)

:: Crane Aerospace & Electronics Exhibiting at IMAPS 2010 in Booth # 622 (full story)

:: Come Visit Torrey Hills Technologies at IMAPS 2010 (full story)

:: Visit HEI, Inc. at IMAPS 2010 (full story)

:: Visit High Connection Density at Booth # 818 During IMAPS 2010 (full story)

:: Indium Corporation Will Be On Display in Booth # 415 at IMAPS 2010 (full story)

:: Come Visit Ferro at Booth # 506 During IMAPS 2010 as they Introduce 2 New High Performance LTCC Systems for the High Performance Packaging Market (full story)

:: Chip Supply, Inc. Invites YOU to Make the Most of IMAPS 2010 by Visiting Booth # 510 (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Finetech
CAD Design Software
Chip Supply

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Visit 3D Systems Packaging Research Center (PRC) in Booth # 512

The 3D Systems Packaging Research Center (PRC) at the Georgia Institute of Technology is a Global Academic Center dedicated to leading-edge research and education in the System-on-a-Package (SOP) concept to enable highly miniaturized, multi to mega-functional systems in a single package. Led by Prof. Rao Tummala who will be a Keynote Speaker at IMAPS 2010, the PRC has developed a unique and integrated approach to research, education and industry partnership using its comprehensive 300 mm SOP panel facilities, research staff, faculty and students. The Center’s research encompasses a full spectrum of the most advanced packaging technologies including design and test, multi-functional organic, glass, and silicon packages with embedded nanoscale passive and thin active components, enabled by leading advances in materials and processes, interconnections, assembly, and reliability and thermal management. The PRC offers a variety of industry partnerships that include one-on-one contracts, and an extensive array of consortia research programs involving the entire supply chain of companies, and UnITE PAC; a global network and information sharing program connecting Academia, Industry. Government Agencies are targeted at the acceleration of adoption of leading-edge packaging technologies. Benefits include intellectual property rights, technology transfer, and access to students for recruiting, one-on-one company-faculty relationships, state-of-the-art R&D facilities, and more.

For more information about the consortia and membership programs, research areas or other information, we invite you to visit our website at www.prc.gatech.edu. Come see what we are all about in booth 512 at IMAPS 2010.

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Visit Booth # 530 for Palomar’s New Product: 3800 Utlra Flexible Die Bonder

Palomar’s fully automated 3800 ultra flexible die bonder is the first of its kind to combine 1) throughput, 2) precision and accuracy, and 3) flexibility, accommodating many application types on one platform.  Palomar engineers created an entirely new Control Architecture for micron-level precision motion control and process sequencing (as evidenced in the data). Also new to the 3800 is a stiff mechanical structure and cantilever design permitting open access on three sides for ease of loading and unloading , along with the option to integrate an inline assembly system. The 3800 has a user-friendly ergonomic user interface, 0.1 micron linear encoders, a built-in process camera for live view of pick tool during pick and place, combined with fast, quiet linear motors, making this machine the most versatile die bonder on the market today.

Visit Palomar at IMAPS 2010 in Booth #530.

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Visit XYZTEC at Booth # 528

Tel: 408-846-5475

Gilroy, CA 95020
Tel: 408-846-5475
Fax: 408-852-4011
E-mail: cynthia.blank@xyztec.com
Website: www.xyztec.com

XYZTEC, a leading global supplier of bond test equipment, offers the most flexible bond testing platform on the market today! The Condor series features a single platform with multiple test capabilities allowing end-users the added flexibility of performing many types of tests all on one system. In addition to standard bond testing applications such as wire pull, ball shear, die shear, the Condor series has the capability to perform peel testing, push testing, high impact testing, fatigue testing, and creep testing.

XYZTEC is the only bond test supplier that offers a Revolving Measurement Unit, featuring four different measurement sensors to address 80% of your test requirements.  The joysticks are ergonomically friendly, easily move the XY stage to the desired position, and feature 12 logically arranged buttons for increased operator efficiency. The Condor EZ software features onboard graphics and intelligent wizards, providing intuitive operator control as well as sophisticated SPC software thus ensuring complete documentation of the test protocol.

Come by and visit us at IMAPS 2010 Symposium at booth # 528.

 
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CAD Design Software Exhibiting at IMAPS 2010 in Booth # 318 is Showcasing Advanced Ceramic Hybrid EDA Design Software

CAD Design Software exhibiting at IMAPS 2010 in Booth # 318
is showcasing advanced Ceramic Hybrid EDA Design Software
CTO John Sovinsky is presenting at the Technical Program on November 2, 5 PM: “The Future of Maximum CAD/CAM Automation for Ceramic Hybrids

CAD Design Software (CDS) standard and customizable circuit design software suites provide Electronic Design Automation layout solutions to meet unique design technology needs and reduce time-to-market. CDS' EDA Layout/DFM solutions include Digital / Analog / Flex PCBs, Ceramic Hybrids, RF / Microwave, IC Packaging, IC Test and Custom Development Applications.

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Crane Aerospace & Electronics Exhibiting at IMAPS 2010 in Booth # 622

With over 40 years of manufacturing experience, Crane Aerospace & Electronics, Microelectronics Solutions, is a major supplier of systems and components found in some of the toughest environments, from aircraft engines and landing gear to space satellites and medical implants. Our expertise is in miniaturizing electronics to reduce weight and size with increased reliability. Our product and test system development capabilities complement the expertise and experience of manufacturing chip-and-wire, chip-on-board, chip-on-flex, surface mount or mixed technology products. We offer Microelectronics Solutions from co-design and development to build-to-print or turnkey applications to meet customer demand for time-to-market and time-to-volume. Visit us at IMAPS, Booth 622.

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Come Visit Torrey Hills Technologies at IMAPS 2010

Torrey Hills Technologies, LLC is a leader in developing and delivering quality yet affordable microelectronic packaging components and production equipment for multiple industries. Since its establishment in 2004, the company has expanded its business from Cu-W, Cu-Mo, CMC and CPC heat sinks manufacturing to the supply of large-scale mixing and furnace equipment for electronics and solar cell industries. Headquartered in San Diego, CA, its mission is to help customers achieve higher profitability by the provision of innovative products and services. The company is now shipping worldwide to more than 40 countries. In 2010, Torrey Hills Technologies LLC was ranked number 1013 on INC 500|5000 list and recognized as the 49th fastest growing privately held company in San Diego.

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Visit HEI, Inc. at IMAPS 2010

HEI, Inc. is an ITAR Registered, FDA Registered Contract Manufacturer specializing in Electronic Manufacturing Services (EMS), including Microelectronic and Ultra-Miniaturized Assembly, and High-Density Interconnect Flex / Rigid / Rigid-Flex / Ceramic Substrate Manufacturing. HEI supports complete product life-cycle, from Concept - to - Rapid Prototyping - to - Production.

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Visit High Connection Density at Booth # 818 During IMAPS 2010

High Connection Density, Inc. (HCD) provides board-to-board, flex-to-board, and package-to-board solderless connectors for BGA, LGA and socket applications. HCD’s patented SuperButton® and SuperSpring® technology-based products are the perfect solution for applications requiring high frequency, high current and low resistance. Designed for manufacturability, HCD offers innovative technology at competitive prices.  Our proprietary technology provides you a competitive advantage.

Visit us in Booth 818 at IMAPS 2010.

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Indium Corporation Will Be On Display in Booth # 415 at IMAPS 2010

Indium Corporation is a supplier of advanced and industry-standard joining and bonding materials. Our exhibit will be staffed with certified engineers, including Chris Nash, who can talk to you “From One Engineer to Another” about your applications and materials requirements. Come see us at booth #415.

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Come Visit Ferro at Booth # 506 During IMAPS 2010 as they Introduce 2 New High Performance LTCC Systems for the High Performance Packaging Market

Ferro introduces 2 new high performance LTCC systems for the high performance packaging market. 

A6M-E is an improved handling and processing version of Ferro’s performance-leading A6M LTCC system, which maintains the same low and stable relative permittivity and low loss tangent over a wide frequency. A6M-E is fully compatible with the current A6M Au-based metallization series.  

Ferro’s new L8 LTCC system, exhibits stable relative permittivity to >30 GHz and low loss tangent of < 0.3%, over this range. The L8 system has available matched Au, Mixed-metal, and all Ag metallization which allows this system to be used for many applications where cost and performance are crucial. 

Ultra-Low Temperature Pb-free Glasses

Ferro has developed a new line of ULTRA-low temperature Pb-free glasses pastes that fire at < 500°C making them ideal for ROHS-friendly end products.

Like our other low temperature glass paste products, they encompass a wide range of properties to meet the requirements of a wide variety of metal, ceramic and glass substrates and specifically targeted to provide hermetic sealing of electronic packages and devices.

Ferro continues to be the performance leader in Glass Products.

Visit us at Booth 506 to Enter a drawing for a I-Pod touch!

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Chip Supply, Inc. Invites YOU to Make the Most of IMAPS 2010 by Visiting Booth # 510

Chip Supply, Inc., a global provider of semiconductor die and specialized packaging, invites you to visit us at Booth No. 510 for an introduction to what we call Thinking Beyond Silicon™. Authorized by more than 20 leading semiconductor manufacturers, Chip Supply offers a complete range of interconnect solutions, from bare die to customized packaging to obsolescence management. By combining our breadth of products and services with our industry knowledge and expertise, we can supply the best solution for your specific goals and challenges. Make the most of this year’s conference by visiting our booth and finding out how our Thinking Beyond Silicon™ could benefit you.

For additional information, you may also visit our website at www.chipsupply.com.

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View the Corporate Bulletin Archives

 

:: Issue 96 ::
October 18, 2010

LORD Corporation

Compex Corp.