TJ Green Associates, LLC
:: Corporate Member News ::

:: Visit Hi-Rel Laboratories at IMAPS 2010 (full story)

:: Photo Sciences Exhibiting at IMAPS 2010 (full story)

:: Visit Henkel's Booth at IMAPS 2010 (full story)

:: New from Sonoscan – the Fastline™ P300™ C-SAM® and Other Methods of Non-Destructive Testing on Display at IMAPS 2010 -- Booth # 519 (full story)

:: For the latest in innovative UNDERFILLS and THERMALLY CONDUCTIVE ADHESIVES see Namics at IMAPS 2010 Booth # 615 (full story)

:: Visit Blue Oceans LLC at IMAPS 2010 (full story)

:: Valtronic Technologies at IMAPS 2010 (full story)

:: Batten and Allen on Display at IMAPS 2010 (full story)

:: Come Visit LORD Corporation During IMAPS 2010 (full story)

:: Visit Remtec, Inc. at IMAPS 2010 in Raleigh, NC, November 2-4, 2010, Booth # 214 (full story)

:: Visit Booth # 427 at IMAPS 2010 to Learn More About Haiku Tech (full story)

:: Hary Manufacturing Incorporated (HMI) on Display at IMAPS 2010 (full story)

:: Visit Systems Packaging Research Center (PRC) at the Georgia Institute of Technology in Booth # 512 (full story)

:: CPS Technologies Exhibiting at IMAPS 2010 (full story)

:: Nordson DAGE will be Showcasing Their New 4000Plus Bondtester at IMAPS 2010 (full story)

:: Visit Silicon Cert Laboratories at IMAPS 2010 (full story)

:: Interconnect Systems Incorporated on Display at IMAPS 2010 (full story)

:: Come see how LASERS are replacing PHOTOLITHOGRAPHY - Tamarack Scientific at IMAPS 2010 (full story)

:: AIT will be Showing a Variety of Insulating Metal Substrates at IMAPS 2010 in Raleigh (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

AI Technology
UTZ Technologies
Valtronic Technologies

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Visit Hi-Rel Laboratories at IMAPS 2010

Hi-Rel Laboratories is an independently owned and operated corporation.  Our field is the materials evaluation of the micro-electronic phases of commercial industry, aerospace and defense.  Expertise in Destructive Physical Analysis, Failure Analysis, and Materials Analysis of electronic components, packaging, interconnections and circuitry, makes Hi-Rel the leader in these areas.

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Photo Sciences Exhibiting at IMAPS 2010

Photo Sciences manufactures a diverse range of photomask products, precision imaged coatings on glass, metal and specialized substrates. Photomask products include laser imaged chrome or iron oxide on soda lime and quartz for 1x masters, stepper reticles and contact prints. Our FAST TRACK photomask service offers free replacement within 30 days for any reason except design change.

Specialty products include laser imaged thin film coatings on linear and nonlinear surfaces such as sputtered gold, ITO, aluminum, binary gray scale masks, precision apertures, calibration targets, diffraction gratings, eyepiece reticles, glass motion control products, metal shadow masks and deposition masks.

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Visit Henkel's Booth at IMAPS 2010

Henkel’s portfolio includes the leading industry brands of Ablestik™, Acheson™, Hysol®, Loctite® and Multicore®, all renowned for their reliable and high-performance materials. This impressive technology toolbox of advanced materials products all maintain the lead in their respective market segments through continuous, dedicated research and development.

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New from Sonoscan – the Fastline™ P300™ C-SAM® and Other Methods of Non-Destructive Testing on Display at IMAPS 2010 -- Booth # 519

New from Sonoscan – the Fastline™ P300™ C-SAM®
Maximum Throughput, Minimal Footprint

The FastLine™ P300™ Acoustic Microscope is specifically designed for accelerated inspection throughput in manual screening of microelectronic devices on the manufacturing floor. With an integrated design to minimize footprint, the FastLine is the new platform for Acoustic Microscopes.   To hear more about this new product and other methods of non-destructive testing, please visit us at IMAPS -- Booth #519.

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For the latest in innovative UNDERFILLS and THERMALLY CONDUCTIVE ADHESIVES see Namics at IMAPS 2010 Booth # 615

NAMICS Corporation is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells.  NAMICS subsidiary, DIEMAT, Inc. located in Byfield, MA, specializes in the development and manufacture of innovative thermally conductive adhesives and sealing glasses.  Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.

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Visit Blue Oceans LLC at IMAPS 2010

Blue Oceans LLC is organized in United States to represent the highest quality Chinese manufactured products in the North America market. Our products are highly focused on Hybrid Microelectronic and Fiber Optic Hermetic Sealed Packages. We have strong and long term relationship with Chinese manufacturers. Blue Oceans LLC can negotiate very competitive price from manufacturer for North America customers and it is an enabler to reduce structure cost for North America customers.

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Valtronic Technologies at IMAPS 2010

Valtronic Technologies designs, develops, and manufactures microelectronic and micromechanical assemblies. Leaders in the packaging of high density multichip modules and high density microsystems. Offering a turnkey solution, including project management, procurement, assembly, testing, and specialized shipping. We provide miniaturized electronics for the medical, commerical industrial and aerospace markets.  Visitors will have the opportunity to see several implantable electronic assemblies, such as a retinal implant as well as box builds where miniaturization was essential.  ISO 13485:2003 certified. 

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Batten and Allen on Display at IMAPS 2010

Batten and Allen is a world class supplier of precision stampings, with in house plating facilities, for the electronics, telecommunicatios, automotive,solar and medical industries. We work together with clients to design and develop components for their specialized requirements as well as producing a comprehensive range of open tool leadframes for Hybrid and Thick Film and Pcb. Batten and Allen can also offer turnkey solutions for over moulded applications."Visit our web site www.batten-allen.com or contact sales@batten-allen.co.uk

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Come Visit LORD Corporation During IMAPS 2010

For more than 40 years, LORD Corporation has been creating solutions to your most demanding challenges from potting and encapsulants to semiconductor packaging/circuit assembly materials to thermal management and conductives. Our expertise in multiple chemistries and diverse applications has allowed us to partner and develop innovative solutions that help ensure your success. We can help … Ask Us How.

WWW.LORD.COM
1.877.ASK.LORD (275.5673)

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Visit Remtec, Inc. at IMAPS 2010 in Raleigh, NC, November 2-4, 2010, Booth # 214

Remtec, Inc. is a leader in design and manufacture of custom and semi-custom metallized ceramic substrates and packages with Plated Copper on Thick Film (PCTF®) technology for commercial and military electronics. Remtec provides innovative ceramic packaging solutions on Alumina, BeO, AlN, Barium Titanate and Quartz for DC power applications and RF & microwave products. This also includes cost effective, reliable SMT leadless packages operating from DC to mm wave, as well as high power laser diode submounts and LED substrates. Remtec's specialty is in its unique metallization technique with hermetic copper plated plugged vias and castellations, including selective gold tin plating on submounts, lids and substrates. Remtec, operating two manufacturing facilities totaling 30,000 sq. ft. in Norwood, MA is a RoHS compliant and ISO 9001:2000 registered company. Additional information is available at www.remtec.com or visit Remtec, Inc. at IMAPS 2010 in Raleigh, NC, November 2-4, 2010, Booth # 214.

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Visit Booth # 427 at IMAPS 2010 to Learn More About Haiku Tech

Haiku Tech offers materials, equipment and solutions for the manufacturing of electronic passive components (LTCC, MLCC, etc.), Solid Oxide Fuel Cells (SOFC), Solar Cells, and Printed Electronics, including: Dielectric powders, binders, tape casters, sheet blankers, mechanical punches, screen printers, stackers, isostatic laminators, chip dicers, termination equipment, LTCC zero shrinkage sintering presses, tape and reel, optical dilatometers and visual inspection equipment. Please visit our booth (# 427) to learn more about us.

Haiku Tech is headquartered in Miami, FL and has offices/representatives in The Netherlands, India, Brazil and Taiwan.

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Hary Manufacturing Incorporated (HMI) on Display at IMAPS 2010

Hary Manufacturing Incorporated (HMI) manufactures precision screen printers, automated print systems and infrared conveyor dryers. HMI, formerly Affiliated Manufacturers, Inc. (AMI) provides full support, parts and consumables for existing AMI equipment.

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Visit Systems Packaging Research Center (PRC) at the Georgia Institute of Technology in Booth # 512

The 3D Systems Packaging Research Center (PRC) at the Georgia Institute of Technology is a Global Academic Center dedicated to leading-edge research and education in the System-on-a-Package (SOP) concept to enable highly miniaturized, multi to mega-functional systems in a single package. Led by Prof. Rao Tummala who will be a Keynote Speaker at IMAPS 2010, the PRC has developed a unique and integrated approach to research, education and industry partnership using its comprehensive 300 mm SOP panel facilities, research staff, faculty and students. The Center’s research encompasses a full spectrum of the most advanced packaging technologies including design and test, multi-functional organic, glass, and silicon packages with embedded nanoscale passive and thin active components, enabled by leading advances in materials and processes, interconnections, assembly, and reliability and thermal management. The PRC offers a variety of industry partnerships that include one-on-one contracts, and an extensive array of consortia research programs involving the entire supply chain of companies, and UnITE PAC; a global network and information sharing program connecting Academia, Industry. Government Agencies are targeted at the acceleration of adoption of leading-edge packaging technologies. Benefits include intellectual property rights, technology transfer, and access to students for recruiting, one-on-one company-faculty relationships, state-of-the-art R&D facilities, and more.

For more information about the consortia and membership programs, research areas or other information, we invite you to visit our website at www.prc.gatech.edu. Come see what we are all about in booth 512 at IMAPS 2010.

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CPS Technologies Exhibiting at IMAPS 2010

CPS Technologies Corporation is the worldwide leader in the design and high-volume production of AlSiC (aluminum silicon carbide) for high thermal conductivity and device compatible thermal expansion. AlSiC thermal management components manufactured by CPS include Hermetic electronic packages, Heat sinks, Microprocessor & Flip chip heat spreader lids, Thermal substrates, IGBT base plates, Cooler baseplates, Pin Fin baseplates for Hybrid Electric Vehicles (HEV), Microwave & Optoelectronic Housings and System in Package (SiP) Heat Spreader Lids that address multiple IC’s on a PCB with a single lid design.  

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Nordson DAGE will be Showcasing Their New 4000Plus Bondtester at IMAPS 2010

Nordson DAGE will be showcasing their new 4000Plus Bondtester at IMAPS 2010.  This next generation system represents the industry standard in bond testing and offers unsurpassed accuracy and repeatability of data, providing complete confidence in results. The 4000Plus multi-purpose bondtester performs shear tests up to 500kg, pull tests up to 100kg and push tests up to 50kg, covering all test applications including new hot bump pull and fatigue applications.

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Visit Silicon Cert Laboratories at IMAPS 2010

Silicon Cert Laboratories, an ISO 9001:2008 Certified, ISO 17025:2005 Accredited, DSCC approved laboratory,  provides a broad range of in-house mechanical Integrity, Environmental/Endurance testing and Analytical Services to ensure our client’s products meet all of the reliability criteria whether for commercial or military applications. We also have multi-faceted failure analysis experience to assist with diagnosing problems. Our staff is highly trained, motivated and experienced in providing  assurance that the products are tested to the specifications and conditions required.

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Interconnect Systems Incorporated on Display at IMAPS 2010

Interconnect Systems Incorporated designs and manufactures multi-component modules, bare-die packages, high-performance connectors, high density memory modules, and footprint conversion adapters including IC obsolescence solutions and BGA fan-out interposers. Services include BGA reballing. ISI is ITAR registered and certified to ISO9001:2008.

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Come see how LASERS are replacing PHOTOLITHOGRAPHY - Tamarack Scientific at IMAPS 2010

Come see how LASERS are replacing PHOTOLITHOGRAPHY. Lasers used to pattern and via drill dielectrics and polymers for WLCSP, 3D TSV and FO-WLP. Come see how UV Projection Scanners are being used for thick resists applications such as Cu PILLAR in lieu of Steppers and Mask Aligners. Manufacturer of EXCIMER & DPSS LASER SYSTEMS, UV STEPPERS and UV SCANNERS down to 1um resolution. We specialize in applications including: Advanced Packaging, 3D TSV, Organic Electronics, MEMS, Displays, RFID, Solar Cells, Medical Devices and HDI. Systems designed for 300mm Wafer handling, Reel-to-Reel and Large Substrate handling. Machines designed for 24/7 production environments. www.tamsci.com.

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AIT will be Showing a Variety of Insulating Metal Substrates at IMAPS 2010 in Raleigh

INSULATING METAL SUBSTRATES AND THERMAL INTERFACE MATERIALS

AIT will be showing a variety of Insulating Metal Substrates, at the IMAPS annual symposium in Raleigh, NC.  The COOL-CLAD™ IMTS is comprised of a top circuit layer of 1-2 oz standard copper and 40 mils thick aluminum on the bottom. Our patented flexible stress-free adhesive is sandwiched between the metal layers. Many customers have requested various thicknesses of conductive or insulating layers for their specific applications. As with all products manufactured by AIT, it is possible  to meet  these special requirements and provide fast turn-around times.  With the increased demand of LED, SOLAR, BATTERY and other technologies, requirements for Ultra-low thermal resistance as well as Ultra-low moisture absorption can be achieved.

Thermal interface materials have always been a popular product for AIT.  With electronic packaging pushing the demands for thermal requirements, all variations of our thermal interface materials have been in constant demand. Thermal Gel and Grease are both manufactured “silicone-free” so they can be used for all semiconductor applications. Other gap filling products such as our Phase Change Materials provide the highest bulk thermal conductivity while minimizing interfacial thermal resistance. Various gap sizes can be accommodated by providing TIMs thicknesses of 1 mil up to 40 mil thickness. Our CPR (compressible gasket with melt-flowing, void eliminating characteristics) volumes continue to grow to meet the increased demand for thermal management challenges. All of our thermal interface products are provided in both conductive and non-conductive formulations.  Preforms can be made out of our thermal gap pads to meet any customer requirements.

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View the Corporate Bulletin Archives

 

:: Issue 95 ::
October 6, 2010

LLORD Corporation

Compex Corp.