Amkor Technology

:: Corporate Member News ::

:: Announcement on Impacts of the Tohoku Kanto Earthquakes Asahi Glass Co., Ltd. (full story)

:: STATS ChipPAC New fcCuBE Technology (full story)

:: NuSil Releases Thermally Conductive Silicone Adhesive for Electronics Industry (full story)

:: New PEI Web Site Provides the Ultimate Convenience in Sourcing Etched Metal Parts (full story)

:: Indium Corporation Expands Sales Efforts in Austria (full story)

:: LORD Corporation Announces New Distributor (full story)

TJ Green Associates, LLC

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Specialty Coating Systems
STATSChipPAC
Crane Aerospace & Electronics

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Announcement on Impacts of the Tohoku Kanto Earthquakes Asahi Glass Co., Ltd.

A strong earthquake hit the northern part of Japan on Friday, March 11. AGC (Asahi Glass Co., Ltd.; Headquarters: Tokyo; President & CEO: Kazuhiko Ishimura) announces the impacts of the earthquake on the AGC Group’ operations as follows.

1. Employees
AGC is currently in the process of confirming the safety of its Group members. It has been reported that several employees have been slightly injured.

2. Facilities
The following facilities have been heavily affected by the earthquakes and tsunamis.The damage situation in the Tohoku area (northern part of Japan) is very serious, and operations not listed below might also be affected depending on the electrical power supply and lifeline utilities in the region.

AGC Asahi Glass Kashima Plant (Kamisu, Ibaraki prefecture)
Float glass facility for architectural flat glass has been partially damaged.
Production operations have been suspended and it is expected to take
approximately one month to restart the production. The loading berth used for the shipments of architectural float flat glass and the receiving of raw materials has been damaged, and it is expected to take time to restore the facility.

AGC Asahi Glass Chiba Plant (Ichihara, Chiba prefecture)
While access restriction has been imposed in the area due to the ongoing fire
on the premises of neighboring Cosmo Oil Co., Ltd., AGC is currently working
on the confirmation of the status of the plant facilities.

AGC Display Glass Yonezawa (Yonezawa, Yamagata prefecture)
There is no critical damage to the building facilities of AGC Display Glass
Yonezawa, which processes small/mid-sized LCD glass substrates, and
production operations are resuming accordingly.

AGC Electronics Koriyama Plant (Koriyama, Fukushima prefecture)
Production facility has been partially damaged, and restoration work is
currently underway.

Other than the above locations, production has been suspended at some of the plants for architectural processed glass in Tohoku/North Kanto region due to the damage to facilities or raw materials (i.e. flat glass), or their employees not being able to go to the plant. At this moment, it is not clear when operations will resume.

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STATS ChipPAC New fcCuBE Technology

STATS ChipPAC has introduced the innovative fcCuBE™ technology, an advanced flip chip packaging technology that features copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and Enhanced assembly processes.  fcCuBE technology delivers high input/output (I/O) density, high performance and superior reliability in advanced silicon nodes.  The fcCuBE technology offers enhanced flip chip packaging with a 20-40% lower cost over standard flip chip packaging, a compelling value with price points comparable to mainstream semiconductor packaging solutions.

For more information visit the Company’s website at www.statschippac.com.

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NuSil Releases Thermally Conductive Silicone Adhesive for Electronics Industry

With low viscosity and low ionic and volatile content, EPM-2890 is ideal for applications requiring a broader operating temperature range.

NuSil Technology LLC (http://www.nusil.com), introduces EPM-2890, a thermally conductive, non-corrosive silicone adhesive. This addition to NuSil’s electronics product line provides moderate heat transfer between electrical components and their heat sinks. In addition, EPM-2890 exhibits less than or equal to 1 percent weight loss when heated for 30 minutes at 275ºC to withstand lead-free solder reflow.

NuSil’s EPM-2890 is a one-part, white silicone adhesive that will room-temperature vulcanize, with moisture, in 72 hours. It can be used as an adhesive or sealing, caulking or potting material in electronics applications that require minimal volatility to avoid condensation in sensitive devices. For applications in which adhesion is important (for example, bonding for ruggedizing LCD displays), EPM-2890 offers 100 psi minimum primer-less adhesion on aluminum. It provides enhanced thermal conductivity at 0.6 W/(mK) for applications in which stress relief during thermal cycling and heat management are desired.

EPM-2890 is ideal for any application containing grooves or other configurations that require a non-slumping and non-flow to limited-flow material. It is sold in a convenient, one-part configuration, which is easy to handle and ensures homogeneity. EPM-2890 has an extrusion rate of 40 grams per minute, making it easy to apply and ideal for confined spaces where a thin bond line is required.

“EPM-2890 is a great addition to NuSil’s thermal management product line,” said Brian Nash, Vice President of Sales and Marketing. “The product is excellent for many applications in electronics today that require a material with excellent thermal conductivity and adhesion.”

EPM-2890 is ROHS-compliant. It has low sodium, potassium and chloride content to help prevent corrosion of electronic components, while the low volatility helps with reducing contamination in environments where heat and vacuum are present.

For more information, please contact NuSil, or visit http://www.nusil.com/products/engineering/electronics

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New PEI Web Site Provides the Ultimate Convenience in Sourcing Etched Metal Parts

Photofabrication Engineering, Inc. (PEI), has launched its new web site, www.photofabrication.com, to make it easy and fast to source custom-fabricated etched metal parts.  The site provides detailed information on industries served, specific product categories, technical etching guidelines, process diagrams, and an industry first:  an interactive template which allows companies to design their own seam-sealed microelectronic package lids (with or without moisture getters) on-line.

Chip Lehrer, President of PEI, recently observed:  “After listening to our customers and prospects, we designed our new web site to both inform and simplify the photochemical etching (chemical milling) process and to support their product development, prototyping and high-volume production runs.”  The photochemical metal etching process offers significant benefits over traditional methods of fabrication such as stamping and molding.  Photochemically-etched parts have no burrs, deformations, or changes in magnetic properties resulting from the process.  The process offers improved yields and tighter tolerances (0.0005 in on a .25 in. radius hole or flange thickness) with minimum set-up time and cost, as well as easy and inexpensive tooling changes.  PEI etches most metals, including stainless steel, copper, brass, kovar, silver, beryllium copper, nickel silver, gold, sterling, titanium, zirconium and other standard and specialty metals and alloys.

PEI’s products, blending art, proprietary etching chemistry and knowledge, can be found in virtually all of today’s fastest growing technology industries including hydrogen fuel cells, medical implants, and advanced microelectronic devices.

In choosing PEI to be featured on the 21st Century Business Network, with showings on CNBC and Fox Business News,  J.L. Haber, Vice President of Programming at Multi Media Productions, stated that “Photofabrication Engineering, Inc. is a unique company and truly stands out as a leader in their industry.  We are excited to have them as a guest on our program.”  For specific market-by-market air dates and times, visit http://www.21cbtv.com.

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Indium Corporation Expands Sales Efforts in Austria

Indium Corporation <http://www.indium.com>  announces that they have appointed AdoptSMT Europe GmbH as its newest sales channel partner in Austria. AdoptSMT is responsible for distributing Indium’s solder products, including solder paste, wire, rework fluxes, engineered solders, and thermal interface materials.
 
Based in Grödig near Salzburg, AdoptSMT has been a distributor in Europe for over 20 years. The sales process will be managed by Günther Breckner, Sales Manager Europe and Michael Petöcz, Field Sales Engineer Austria.
 
According to Brian Craig, Managing Director of Indium Corporation’s European Operations, “This new partnership with AdoptSMT greatly improves Indium Corporation’s ability to supply and service the local Austrian market. In addition, customers will benefit from this locally established supply chain. AdoptSMT has built their reputation on providing high quality products and exceptional customer service, which mirrors Indium Corporation’s value proposition.”
 
Erhard Hofmann, General Manager AdoptSMT Europe, said, ”We are selective about the suppliers we work with. Indium Corporation offers not only the standard solder products, such as bismuth-containing low-temperature solder products, but also industry-leading solutions for thermal interface materials. They also manufacture customized solder preforms and InFORMS®, in addition to the more standard preforms. Working with Indium Corporation means that we can now offer our customers not only standard products, but also more customized solutions for their soldering challenges."

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LORD Corporation Announces New Distributor

LORD has added Wolcott-Park, Inc. of Rochester, N.Y.  to their list of authorized distributors. 

Founded in 1963, Wolcott-Park, Inc. is an AS9120 certified and ITAR registered distributor of adhesives, sealants and specialty chemicals.  According to LORD Corporation’s Jim Greig, Americas Sales and Marketing Manager - Electronic Materials, Wolcott-Park, Inc. will carry LORD Corporation’s potting, encapsulant and micro materials. 

“We are pleased to have Wolcott-Park, Inc. as a part of our team,” said Greig, “as we know they will ensure we are able to provide optimal service to our customers.

According to Richard A. Park, president, Wolcott-Park, Inc., the company is focused on solving unique problems for the aerospace and electronics industries. “We are excited to be adding LORD Electronic Materials to our select group of suppliers,” he said. ”Being able to offer LORD Corporation’s excellent products and outstanding technical service to our customers will enhance our standing as the leading materials distributor to the electronics industry.”

For more information, visit www.wolcott-park.com/.

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View the Corporate Bulletin Archives

 

:: Issue 102 ::
April 1, 2011

LORD Corporation

Compex Corp.