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Metalor to Acquire Henkel’s Silver Powder Site
Metalor Technologies International SA (www.metalor.com) and Henkel (www.henkel.com). have signed and closed on an agreement for Metalor Technologies USA Corporation to acquire Henkel’s silver powder manufacturing assets in Port Huron, Michigan.
Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf, Ablestik and Loctite. Henkel is the world market leader in adhesives, sealants and surface treatments for consumers, craftsmen and industrial applications
The Metalor Group, with headquarters in Neuchatel, Switzerland, specializes in the field of precious metals and related advanced technologies. Present on 3 continents, Metalor employs more than 1600 people.
This acquisition is highly complementary to the Metalor Group’s existing Advanced Coatings Division in terms of products, customers and strategic geographical footprint. It provides turnkey capacity to meet the current and future needs of Metalor’s customers in die attach & the dynamic photo voltaic market, as well as redundant manufacturing capability to compliment its Attleboro, MA. & Suzhou, China silver manufacturing sites. It will confirm Metalor’s position as one of the world’s leading suppliers to the electronics and photo voltaic markets.
Fan-out Wafer Level Packages Gain Momentum - News from TechSearch
TechSearch International conducted a survey to determine the market growth for fan-out wafer level packages (FO-WLPs) and the latest developments. FO-WLPs are a package option for devices with a large number of I/Os that cannot be accommodated by a fan-in design. The use of a fan-out solution provides the same low-profile advantage as the conventional WLP. In the fan-out process, singulated die are placed into a "reconstituted wafer" with enough space around each chip to accommodate second-level connections. FO-WLPs are offered (or are under development) in many companies, including ADL Engineering, Amkor, ASE, Deca Technologies (the new Cypress and SunPower funded start-up), Freescale Semiconductor, Fujikura, Intel (purchased Infineon’s wireless division), King Dragon International, NANIUM, Nepes (which purchased Freescale Semiconductor’s 300mm RCP line), Renesas Electronics, SPIL, STATS ChipPAC, and Teramikros (formerly Casio Micronics). While some companies plan to go to finer pitch (0.3 or 0.35mm pitch) to continue the use of conventional fan-in technology, others are planning to use fan-out methods. According to Tim Olson, president and CEO of Deca Technologies,” the promise of fan-out to eliminate the cost, inflexibility, and cycle time delays of tooling substrates is tremendous. The industry just needs to overcome the capital disadvantages and a few engineering challenges. We are close to a tipping point.”
The report also examines assembly price trends. Supply chain disruptions from Japan’s March 11th earthquake and tsunami have been mitigated, but traditional price declines for many substrates did not take place in 2011. In some cases there were price increases. Metal prices continue to have a major impact on the cost of semiconductor packaging and assembly. With gold prices remaining at near record levels, many companies continue to move to copper wire bonding to reduce cost. Companies continue to look for material saving measures and Amkor has announced its pin gate molding process for PBGA to aid in cost reduction. The report describes Xilinx’s 2.5D packaging solution with through silicon vias (TSVs) in the silicon interposer.
TechSearch International’s analysis has just been published in a new 55-page Advanced Packaging Update report. The report includes an economic update for the semiconductor packaging industry and an analysis of the impact of the flooding in Thailand on the electronics industry. Plants that produce disk drives and subassembly suppliers to this sector were flooded and equipment will need to be replaced. In addition, some IC assembly facilities, automotive plants, and related suppliers also suffered flood damage.
CPS Technologies Corporation to display AlSiC Pin Fin Coolers at the EV Japan 3rd EV and HEV Drive System Technology Expo
CPS will be displaying its complete product line of Metal Matrix Composites (MMC’s) including Aluminum Silicon Carbide (AlSiC) Dome IGBT Baseplates, AlSiC Pin Fin Coolers, AlSiC Microprocessor Heat Spreader Lids, AlSiC Hermetic Packages and Structural Metal Matrix Composites for Automotive weight reduction. at the EV Japan 3rd EV & HEV Drive System Technology Expo (http://www.evjapan.jp/en/ ) from January 18 to 20, 2012 in Tokyo. The CPS booth (# E6-34) will be located in the "Materials/Components Zone".
CPS’ AlSiC Pin Fin Coolers which are used in liquid cooling IGBT assemblies for Hybrid Electric Vehicles (HEV) and Electric Vehicles (EV) will be of particular interest to the audience at this show. The key factors in the design of coolers for IGBT power modules in HEV applications are high reliability, CTE compatibility, and light weight, along with strength and stiffness. CPS AlSiC coolers meet these Electric Vehicle requirements with optimum thermal performance and high reliability throughout the product life cycle. They are ideal IGBT power module coolers for Hybrid Electric Vehicle Applications.
Liquid cooling is the most effective way to dissipate heat (1 – 2KW) in HEV power module products. CPS AlSiC coolers cost effectively provide the pin fin geometries that are required for optimum liquid cooling. Additionally, CPS AlSiC coolers provide an isotropic thermal expansion that is compatible with IGBT die/electronic substrate to reduce mechanically induced stresses during power thermal cycling for improved electronics and module reliability.
The AlSiC device compatible thermal expansion (8 ppm/°C) simplifies IGBT assembly compared to Cu pin fin coolers (17 ppm/°C) thermal expansion, eliminating the need for stress compensation layers that increase thermal resistance, assembly complexity and IGBT power module cost.
AlSiC is a lightweight, thermal efficient material (1/3 that of Cu), which makes it an ideal cooler material for the weight-sensitive hybrid electric (HEV), electric vehicle (EV) application and in kinetic energy recovery systems (KERS). AlSiC also has higher strength and stiffness than Cu, which, combined with its lightweight nature, makes AlSiC coolers more tolerant of shock and vibration.
In this new position, Chris’s technical responsibilities have been expanded to encompass global technical support to Indium Corporation’s multi-national customers. This also includes coordinating, maintaining, and deploying technical resources for printed circuit board assembly (PCBA) materials and processes.
Chris joined Indium Corporation in February 2005, and has served in a variety of roles, including Inside Sales, Powder Product Management, and Technical Support for the Midwest and Southeastern United States. Most recently, he was promoted to Senior Technical Support Engineer.
Chris has a bachelor's degree from Clarkson University. He is certified as a Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering. He has earned his certification as an SMTA Process Engineer and is a certified IPC-A-600 and IPC-A-610D Specialist. Chris is based at Indium Corporation’s global headquarters in Clinton, NY. He resides in Oriskany.
New Technical Support Engineer for Global Accounts Group
Indium Corporation announces that Greg Wade has been hired as Technical Support Engineer for the Global Accounts Group.
Greg provides global technical support for Indium’s multi-national customers. This also includes coordinating, maintaining, and deploying technical resources for printed circuit board assembly (PCBA) materials and processes.
Greg is an expert in surface mount and through-hole technologies, with more than 18 years of experience working with a number of electronics manufacturers and suppliers throughout the world.
Greg is a veteran of the United States Navy and is educated in aviation RF electronics. After the Navy he continued his education, attaining his Six Sigma Green Belt, as well as certifications on numerous equipment sets and patents for tooling design.
Greg is based at Indium Corporation’s Global Headquarters in Clinton, NY and resides in West Eaton.
Materion Purchases Lid Product Line from Micross Components
Materion Microelectronics and Services announced today that it has purchased the capabilities of the epoxy-coated lid product line from Micross Components USA, allowing it to offer the RF and microwave markets both the ceramic package and its matching epoxy-coated lid.
This acquisition provides Materion Microelectronics & Services with the equipment to add epoxy coating to our ceramic (alumina) and metal (Kovar ™) lids. The Epo-Lids™ (epoxy lids) product line acquired can now be purchased along with Materion’s matching Cu-Pack™ and RF packaging lines. “From a design and seal process, as well as overall logistics and cost perspective, customers will benefit greatly when purchasing both the lid and package from Materion,” states Richard Koba, Product Market Manager, Materion Microelectronics & Services. “Our new offering of Epo-Lids™ is expected to have consistent seals and excellent product repeatability. Additionally, the epoxy has an extended shelf life.”
The new Epo-Lids™ complement Materion's current microelectronic package lid offering that includes Combo-Lids™, Micro Lids™, Seam Seal-Lids™, Solder Reflow-Lids™, Visi-Lids™, and ceramic and non-magnetic lids for specialty applications. Materion is currently tooled for over 100 epoxy-coated lids, and its on-site tooling capabilities allows it to produce new lid designs to meet specific customer requirements. This new addition to the lid product line heightens Materion’s ability to serve as the “customers’ first choice” for standard or custom lids needs.
Nordson YESTECH Selected by Niltronix Circuits As Supplier for Automated Optical Inspection Equipment
Nordson YESTECH, has announced that it has been selected by Niltronix Circuits, a full-service contract electronics manufacturer, as their AOI supplier. Niltronix Circuits will utilize Nordson YESTECH’s BX benchtop AOI for automated inspection of printed circuit boards at their Houston, Texas facility.
Niltronix Circuits selected Nordson YESTECH after an extensive evaluation of various AOI systems, based on their proven inspection capabilities, ease of programming, as well as their excellent reputation for customer service. With an emphasis on prototyping, in-house engineering, on-time delivery and a reputation for quality, Niltronix relies on the BX benchtop to provide fast and accurate inspection. Nordson YESTECH’s powerful and user-friendly software was the key factor in Niltronix’s decision “The BX benchtop is incredibly easy to program and operate compared to other systems” said Mehul Patel, Process Engineer, for Niltronix Circuits. “Once the program is complete, inspection is simple to perform for any operator. The experienced team at Nordson YESTECH are quick to respond to our needs as well, providing detailed training and support. The level of service and follow-up they provide to their customers is impressive.”
“The Nordson YESTECH system increases our productivity significantly,” said Bharat Karsaliya, President of Niltronix Circuits. “Utilizing the BX benchtop has cut down our inspection time by 75% versus manual inspection. We are able to detect any issues easily and early in the process, which saves us valuable time. Overall, the BX has proven to be a key factor in our productivity, and we will be turning to Nordson YESTECH again for our future inspection needs.”
“We are very pleased to be working with a quality organization such as Niltronix Circuits,” said Scott Roberson, Nordson YESTECH Regional Sales Manager. “Our ultimate goal is to ensure our customer’s success by providing the best technology, with excellent service and support. We look forward to continuing our strong relationship with Niltronix Circuits.”
Sikama International, Inc. has released their newest reflow solder/curing oven – the Ultra Profile 1200. The UP 1200 is a multi-purpose, continuous flow, reflow and curing oven capable of temperatures up to 400°C and atmosphere levels as low as 10ppm O2.
The UP 1200 extends Sikama’s offering of 300mm ovens with the addition of this bottom conduction, top convection oven. With eight (8) work zones internal to the oven: six (6) heat zones and two (2) cooling zones the oven is capable of a wide variety of processes.
This versatile oven can be used in solder reflow applications from 300mm 10um wafer bumping to 5kg microwave power modules as well as for epoxy curing. The ovens “Walking Beam” transport mechanism is designed to move even the heaviest of these work items from zone-to-zone through the oven with ease.
Sikama ovens are well known in the wafer bump industry and the factory has already received orders from two major wafer fabs and an LED chip manufacturer for this newest member of the Sikama lineup.
Incorporating Sikama’s Falcon ICS 412 Flux Coater with the Ultra Profile 1200 creates a system capable of processing 6” to 12” wafers (flux and reflow) in a multi-zone, in-line system with a small 1.2 meter x 5.7 meter footprint.
Process Certification And Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules
Pasadena CA April 10-13, 2012 Bethlehem PA September 25-28, 2012
This course is a must for process engineers, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of visual inspection criteria and materials and processes used to assemble Hybrids, Microcircuits and RF MMIC Modules for high reliability Military and aerospace applications. Trained instructors with years of industry experience deliver the material in a straight forward and easy to understand format.
Boston MA May 9-11, 2012 San Diego CA Sept 5-7, 2012
This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids.This three day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material trade offs and process selection are all covered in detail.
This three-day course is a combination of classroom and "hands-on" exercises conducted at the wire bonder designed to teach the basics of manual gold ball and wedge wirebonding. The goal is to teach the process of wirebonding, which includes the wire, tool, machine settings and operation, work stage adjustments and operator skills. Especially important is how to troubleshoot a wire bond problem and get the process back on track. Students develop a functional understanding of the wire bond process along with important quality and reliability considerations for hi rel military and medical products.
Hybrid Pre Cap Visual June 28 (Full Day)
Incoming Visual Inspection June 29 (Half Day)
The students are exposed to a variety of defects seen at both incoming and Pre Cap Visual Inspection. Checklists are used to simply the criteria and focus on the major problem areas. Students learn what to look for and how to interpret and apply MIL-STD-883 and 750 inspection criteria. Microscopes in the classroom allow for “hands-on” demonstrations. The course is intended for quality assurance engineers, inspectors, lead operators and others responsible for inspection of the hardware prior to the final package sealing process.
HENGLI Belt Furnaces Gain New Representation from Industry Experts
Torrey Hills Technologies, LLC recently announced a new venture with Furnace Guy, LLC, worldwide furnace experts.
“We appreciate this opportunity to work with the Furnace Guy team,” said Torrey Hills Technologies President Ken Kuang. “Ken Reynolds is the most esteemed expert in this industry and we are honored to have him on board introducing customers to the unmatched quality of HENGLI furnaces.”
Furnace Guy, LLC and Torrey Hills Technologies, LLC will collaborate to provide global furnace solutions; Furnace Guy, LLC fully endorses Torrey Hills Technologies, LLC as a trusted supplier of HENGLI belt furnaces widely used in electronics, photovoltaic, automotive and similar industries, for processes such as drying, firing, sintering, brazing, and annealing.
“We are all very excited to have been given this opportunity to help Torrey Hills make a significant difference in the way the furnace industry does business around the world,” said Ken Reynolds, former president of The LORAC Company and current president of Furnace Guy, LLC.
Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today they fully support copper wire bonding with their K&S Maxum Ultra wire bonder. Quik-Pak offers copper ball bonding using wires with diameters ranging from 20µm (0.8 mil) to 30µm (1.2 mils). Quik-Pak can support prototype and pre-production volumes.
Copper wire bonding is fast becoming the preferred material for wire bonding in many semiconductor and microelectronic applications. Copper wire has higher thermal and electrical conductivity than gold and aluminum wire and is mechanically stronger than both. Once bonded under a protective reducing gas atmosphere, copper wire has excellent ball neck strength and loop stability during encapsulation. An additional benefit is the intermetallic growth in copper bonds is significantly slower than in gold wire bonds. It results in lower electrical resistance, lower heat generation, and increased long-term bond reliability.
Steve Swendrowski, Quik-Pak’s General Manager says, “We’ve had copper wire bonding capability for some time but did not fully utilize it until recently. We want to get the word out that we can provide microelectronic assemblies bonded using copper wire. Our business model has always been to support our customers’ desire to build prototypes using the same package and materials set used in volume production. This now applies to the wire type, as well.” Wires sizes currently in stock include 25µm (1.0 mil) bare copper and palladium coated copper.
Sonoscan, has been working with several organizations, IDEA and SAE G19 especially, throughout 2011 to help identify counterfeit ICs. Sonoscan developed analytical techniques that can acoustically detect features and characteristics used to separate counterfeit plastic IC packages from genuine packages and have been sharing its C-SAM® expertise.
Identifying a counterfeit component can be straightforward, but is often more complex. Part of the problem is that counterfeiters continuously become more skilled at making their knock-offs resemble genuine components, especially removing and remarking ICs. Using a greater number of acoustic techniques increases the confidence factor, less risk, when separating genuine parts from fake parts. Measuring two or three parameters may suggest that a part is genuine or fake, but having a menu of techniques makes it much easier to make clear distinctions.
Completely identifying counterfeit parts may involve multiple disciplines - optical inspection, acoustic imaging, and sometimes X-ray. However, C-SAM imaging is especially credible, because it has the flexibility to investigate hard-to-imitate features and material characteristics such as acoustic impedance, filler particle distribution and bond integrity.
FIGURE CAPTION: In this C-SAM® image of a confirmed counterfeit part that had been “Blacktopped” in an attempt to hide the residual sanding marks from removing the original ID marks of the IC. Also note the rounded edges, especially the bottom right corner.
IMAPS has a large global network of members, from senior professionals to students, that participate in IMAPS programs, events, and chapters. This participation shows their dedicated interest in the microelectronics industry.
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