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:: Corporate Member News ::

:: STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan (full story)

:: SOURIAU PA&E Announces New Hermetic Mini-Micro-D (full story)

:: Remtec Has Developed Innovative Flip Chip Packaging for Faster Speed Switching Power Devices (full story)

:: DuPont Awarded for Supply Excellence by Suntech (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Micro Systems Technologies
Finetech
QSIC

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

Palomar Technologies

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan

STATS ChipPAC has completed the expansion of its 300mm wafer bump and Wafer Level Chip Scale Packaging (WLCSP) operation in Taiwan. STATS ChipPAC has invested more than US$150 million in Taiwan to provide a strong full turnkey wafer bump and WLCSP offering. With the recent expansion, production capacity at STATS ChipPAC Taiwan has increased to 420,000 bumped wafers per year and 60,000 WLCSP devices per year.

“We have significantly increased our ability to support customers with 300mm production capacity and can leverage the benefit of higher efficiencies and economy of scale to deliver cost effective packaging solutions,” said Wan Choong Hoe, Executive Vice President and Chief Operating Officer, STATS ChipPAC.

STATS ChipPAC Taiwan has tripled its Class 100 cleanroom space to 37,437 square feet.  Advanced wafer level process technologies include low cure temperature polymers and the use of copper for under bump metallization (UBM) and redistribution layers (RDL) to achieve higher densities and increased package reliabilities. STATS ChipPAC has been working to expand its technology processes to support bump pitches down to 40um.

“The addition of fully integrated wafer level processing capabilities in our Hsin-chu Hsien facility increases our ability to provide customers with more cost-effective, high density wafer level packaging solutions for thin, light weight, portable products,” said Richard Weng, Managing Director, STATS ChipPAC Taiwan.

For more information, please visit www.statschippac.com.

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SOURIAU PA&E Announces New Hermetic Mini-Micro-D

27% Lower Profile than Standard Micro-D Connectors

Design engineers who need to reduce component size and weight without compromising electrical performance have a new hermetic connector option, following the release of SOURIAU PA&E’s new Mini Micro-D Connector.

These new Mini-Micro-D connectors are designed for space, airborne, down-hole oil and any other hermetic applications where reducing size and weight are priorities. They have a 27% lower profile than standard Micro-D connectors and are designed to be laser welded into aluminum, titanium or kovar housings. These new hermetic connectors are MIL-PRF-83513/7 interface compliant and mate with connectors manufactured to MIL-PRF-83513/8.

SOURIAU PA&E’s Mini Micro-D connectors can be configured with 9, 15, 21, 25, 31 and 37 pin counts. Its beryllium-copper pins support 600 VAC and 3A per pin and each pin is hermetically sealed with SOURIAU PA&E’s polycrystalline ceramic, Kryoflex®. They provide greater than 5,000 megohms of insulation resistance at 500 VDC and exhibit no evidence of dielectric withstanding voltage breakdown when tested in accordance with MIL-STD-1344, Method 3003. These new hermetic Micro-D connectors have a leak rate of less than 1X10-9 cc/second of helium at one atmospheric differential pressure and will operate reliably at temperatures from -65º C to 200º C.

For more information about this new hermetic Mini Micro-D connector from SOURIAU PA&E, or to learn more about the company’s other interconnect products, EMI filters, and integrated electronic packaging capabilities, contact SOURIAU PA&E at 509-664-8000 or visit us at http://www.pacaero.com.

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Remtec Has Developed Innovative Flip Chip Packaging for Faster Speed Switching Power Devices

Remtec has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for  simple, effective packaging of various Si, SiC and GaN  FET transistors - MOSFETs and eGAN transistors  amongst others -  in the form of interposers and  hermetic packages for  single devices or multi-chip modules (MCM), often  integrated  with discrete components in a significantly smaller footprint,  reaching system-in-package (SIP) level.

Using its PCTF technology, Remtec is able to maintain low dc resistance thick copper tracks and copper plated vias in ceramics (less than 1 mΩ) that ensure minimal dc losses and inductance; it allows higher than 20 AMP current capability and faster switching times. For example, the switching speeds of power MOSFETs are reduced from 3ns to 1ns. Equally important to designers seeking miniaturization is the 4-6 time reduction in footprint size.

Remtec’s packaging technology offers designers interposers and packages with lower development costs, more rapid time-to-market, user-friendly flip chip assembly capable meeting BGA footprint, with effective heat dissipation and high reliability. The ability to integrate gold tin layers in the package base makes final assembly significantly less expensive.  Using these features, designers can now meet the ever-increasing need for lower cost, higher power density and increased integration levels.

Remtec’s innovative packaging technique is used in high speed power MOSFETs for drivers, DC/DC converters, RF transmissions, network and server power supplies and other power electronic applications.

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DuPont Awarded for Supply Excellence by Suntech

Collaboration is Key to Continued Success in Solar Energy, Reducing Dependence on Fossil Fuels
DuPont was recently recognized with a Supplier Excellence Award from Suntech Power Holdings Co., Ltd., a global leader in solar energy and the world’s leading solar company, for providing superior supply and technical service, product innovation and collaboration.  DuPont supplies DuPont™ Solamet® photovoltaic metallization pastes to enhance the efficiency of solar cells made by Suntech, as well as DuPont™ Tedlar® polyvinyl fluoride film used in protective backsheets for their solar modules.  These materials are part of DuPont’s broad and growing portfolio of products that improve the efficiency and lifetime of solar cells and modules, and help reduce overall system costs to make solar more competitive with traditional sources of energy.

“Materials matter in how well and how long solar modules perform, and Suntech holds its material suppliers to an exceptionally high standard as we develop, manufacture and deliver the world’s most reliable and cost-effective solar energy solutions,” said Eric Luo, senior vice president, Suntech.  “High value collaborations with fellow energy innovators such as DuPont are a core component to Suntech's business and define our approach to driving the solar energy industry toward grid parity.”

DuPont materials, and its collaboration with Suntech, were featured as part of a short documentary titled, “City of Science, City of Hope,” that recently aired during the BBC News “Horizons” program series.  The documentary highlights the role of DuPont materials that enable Suntech solar modules to help power the city of Masdar – one of the most sustainable communities on the planet, and a model of what green urban development can be.

“DuPont began its collaboration with Suntech in 2002 when it was newly established,” said David B. Miller, president, DuPont Electronics & Communications.  “We have developed a close and positive working relationship that has continued over the last 10 years.  Continuous collaboration centered on innovation and superior technical service are critical factors that have enabled us both to achieve success today.  This type of collaboration is essential as we seek to address critical global issues including reducing dependence on fossil fuels.”

The Supply Excellence award was presented to DuPont during a recent Global Supplier Conference hosted by Suntech.  More than 120 suppliers competed for the honor of the award, and DuPont was one of 19 recipients.  The awards are divided into five categories including Innovation, Quality, Best Partners, Shining Service and Excellence Suppliers.  According to Suntech, more than 30 evaluation criteria were taken into consideration for granting this award.  They included supply stability, technical service, quality, consistency, commercial terms, product innovation and collaborations.

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View the Corporate Bulletin Archives

 


:: Issue 111 ::
December 5, 2011

LORD Corporation

RGL Enterprises

EPP