TJ Green Associates, LLC
:: Corporate Member News ::

:: Amkor Technology Joins Electronics Industry Citizenship Coalition (full story)

:: Gore Expands Development with Engineered Ptfe Cables for Industrial, Aerospace and Semiconductor Markets (full story)

:: Torrey Hills Technologies, LLC Sponsors Torrey Hills School to Launch Torrey Hills Science Alliance (full story)

:: Indium Corporation Hires Dr. Ming Hu as Research Chemist (full story)

:: Vectra LCP E488i And E471i Grades From Ticona Receive UL 94 V-O Classification For All Colors At 0.15 mm (full story)

:: STATS ChipPAC Expands Wafer Level Package Offering with 300mm Manufacturing in Taiwan (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

AGC Electronics America
Kyzen Corp.
Coining Inc/SPM

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Amkor Technology Joins Electronics Industry Citizenship Coalition

Amkor Technology has announced that it has joined the Electronic Industry Citizenship Coalition (EICC) as an Applicant Member.  The EICC has established a Code of Conduct that provides guidelines for performance and compliance with critical corporate social responsibility policies in the areas of labor, health and safety, environment, management systems, and ethics.  

"We are proud to join with the other leading companies in the electronics industry that have become members of the EICC, and we are committed to fully support the vision and mission of the EICC and align our operations with the provisions of the Code,” said Ken Joyce, Amkor’s president and chief executive officer.   “We believe that by adhering to the principles of the Code, and encouraging our suppliers to do the same, we can improve conditions for workers, increase efficiency and productivity for customers and suppliers and provide cleaner environments for our communities."

   ^ Top

Gore Expands Development with Engineered Ptfe Cables for Industrial, Aerospace and Semiconductor Markets

W. L. Gore & Associates (Gore) continues to enhance its engineered PTFE (polytetrafluoroethylene) technology for use in flat and round cables, making them the premier choice for demanding, extreme environments such as semiconductor manufacturing, aerospace, and industrial applications. Gore’s customized materials and unique cable designs have resulted in products that minimize particulation and outgassing while maximizing longevity – a combination of qualities not found in any other cable technology.

The low coefficient of friction and excellent tear resistance of Gore’s expanded PTFE composite jacket material enable its high flex cables to maintain excellent signal integrity. This flexible material also allows the flat cables to be stacked on top of each other without needing dividers and shelves, reducing the overall size and weight of the cable system. Unlike flat cables with jackets made of extruded materials such as silicone and polyurethane, GORE® High Flex Flat Cables’ extremely low coefficient of friction does not create particles — a crucial advantage in cleanroom environments.

“Gore’s High Flex Flat Cables ensure electrical and mechanical integrity in demanding environments – valued in applications where high-flex cycles, high-temperature resistance, or clean manufacturing and operation are required,” said Brian Tallman, Flat Cable Business Leader. “We are also continuing to invest in fluoropolymer technology and cable development to increase dielectric strength and performance while reducing cable size and weight.”

Gore offers several high flex, clean (low particulation and outgassing) cable solutions including GORE® High Flex Flat Cable, GORE® Trackless High Flex Cable, and GORE® High Flex Round Cable. GORE® High Flex Flat Cable provides excellent cable management because they do not require cable dividers within cable chain. This reduces particulation and results in extended cable life. GORE® Trackless High Flex Cable eliminates the need for cable chain and many of the problems associated with cable chain, such as particulation, vibration, size, weight and noise. Additionally, a low-particulation jacket is available for GORE® High Flex Round Cable. For more information about Gore’s full line of cables and material-based solutions, visit http://www.gore.com/electronics.

   ^ Top

Torrey Hills Technologies, LLC Sponsors Torrey Hills School to Launch Torrey Hills Science Alliance

In its ongoing commitment to support local community and education activities, Torrey Hills Technologies, LLC today announced that it will sponsor Torrey Hills School to launch Torrey Hills Science Alliance 2011, a program that is designed to help students develop a positive attitude towards science and better prepare students for success in 21st century.

Activities throughout the 2011 calendar year for the science alliance include Robotics Teams at Torrey Hills, Science Olympiad Teams, Science Field Day Teams, Invention Fair and Science Fair, Careers in Science, Alternate Energy -Green Technology, and STEM (Science Technology Engineering and Math) Education. Torrey Hills Technologies will sponsor all the activities by providing financial support, laptops, K’Nex construction sets and other necessary equipment, team uniforms, and prizes for Invention Fair and Science Fair. The company will also help find mentors, coaches, and field engineers to assist and work with students during the activities. For more information about Torrey Hills School and Torrey Hills Science Alliance, please visit http://www.dmusd.org/torrey.

“We are very proud to support Torrey Hills School as it endeavors to bring quality education to its students” stated Ken Kuang, president of Torrey Hills Technologies, LLC. “Our mission is to not only help our customers and suppliers achieve higher profitability by providing innovative products and services, but also support the local communities we serve.”

   ^ Top

Indium Corporation Hires Dr. Ming Hu as Research Chemist

Indium Corporation announces Ming Hu, Ph.D., has been hired as a Research Chemist. He is responsible for researching formulations for epoxy flux, conductive inks, and other polymer-based products. He is based at Indium’s global headquarters in Clinton, NY.
 
Dr. Hu has a master’s degree in Organic Chemistry from the University of Houston and a master’s degree in Photo Chemistry from the Graduate School of Chinese Academy of Science, Institute of Photographic Chemistry. He received his Ph.D. in Polymer Chemistry from the Polytechnic University (NYU-Poly) in Brooklyn, NY. Dr. Hu earned the prestigious 1998 Thomas Alva Edison Patent Award in the Consumer Products Category from the Board of Directors of Research and Development Council of New Jersey. His patent for a “glass decorating method using bis-phenol-a epoxy resins and related compositions and articles” was granted in 1995.
 
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
 
For more information about Indium Corporation, visit www.indium.com  or email abrown@indium.com.    

   ^ Top

Vectra LCP E488i And E471i Grades From Ticona Receive UL 94 V-O Classification For All Colors At 0.15 mm

Ticona Engineering Polymers has announced that two Vectra® liquid crystal polymer (LCP) specialty grades — E488i and E471i — received an Underwriters Laboratories (UL) V-O classification, according to the global independent safety science company’s UL 94 plastic flammability standard for all colors and at wall thicknesses of 0.15 millimeters.

Both the Vectra E488i and E471i specialty grades will be showcased at the Ticona Booth, #627, during the two-day DesignCon 2011 exhibition on Feb. 1 and 2 in the Santa Clara Convention Center, Santa Clara, Calif. These glass and mineral filled specialty grades offer very low warp characteristics, which is important for injection molded, lead-free solderable electrical components with ultra-thin wall thicknesses.

“Designed for use in eco-friendly electrical and electronic components and available in different colors for quality and assembly purposes, these specialty grades offer unique property profiles that can help E/E customers meet demanding lead-free soldering and halogen-free requirements,” said Ed Hallahan, technical marketing manager — Ticona High Performance Polymers. “Now, the Vectra E488i and E471i specialty grades from Ticona provide a UL 94 V-0 classification for thin-walled parts in all colors.”

The Vectra LCP ultra-low warpage E488i grade from Ticona is specifically designed for use in flatter molded parts such as CPU sockets and DIMM connectors that must maintain extremely tight dimensional tolerances after lead free reflow soldering temperatures of 260 Celsius. Formulated with enhanced mechanical properties for design flexibility, the 45 percent glass-fiber and mineral filled Vectra E488i grade offers:

  • Improved flatness
  • Heat deflection temperature (HDT) at 260 degrees Celsius (500 degrees Fahrenheit)
  • High flow characteristics to fill thin, complex flow paths at faster cycle times

The 35 percent glass-fiber and mineral filled Vectra E471i grade is designed as a low warpage LCP with excellent properties for use in long type connectors. It offers a good balance of:

  • Mechanical properties
  • HDT at 265 degrees Celsius (509 degrees Fahrenheit)
  • Improved flow
  • Improved flatness

Vectra LCP is widely used by customers to make eco-friendly connectors, bobbins, switches and relays that meet Restriction of Hazardous Substances Directive (RoHS) and European Waste Electrical and Electronic Equipment (WEEE) directives. In addition, customers and original equipment manufacturers are striving to accelerate the production of green and safe products.

   ^ Top

STATS ChipPAC Expands Wafer Level Package Offering with 300mm Manufacturing in Taiwan

STATS ChipPAC has expanded its wafer level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan. The 300mm WLP operation is located in Hsin-chu Hsien in proximity to the world’s leading wafer foundries and supplements the Company’s current 300mm wafer bumping operation. The 300mm WLP offering also notably includes a number of new process technologies such as low cure temperature polymers and the use of copper for under bump metallization (UBM) and redistribution layers (RDL) to achieve higher densities and increased package reliability.

“The expansion of our 300mm wafer level packaging is important because it provides a significant increase in total available capacity for our customers and allows us to drive higher efficiencies and economy of scale in our wafer level processes for more cost effective packaging solutions,” said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

With wafer level packaging, the cost per package is primarily determined by the number of die per wafer rather than the number of I/O per device. STATS ChipPAC has benefited from a successful production ramp up in wafer level packaging and has more than doubled its production volume in Asia since 2009. The expansion to the larger scale 300mm wafers for WLP reinforces STATS ChipPAC’s commitment to deliver production capacity and capabilities in strategic locations to service its customers with full turnkey WLCSP assembly and test services for both 200mm and 300mm wafer sizes.

STATS ChipPAC’s new process technologies such as electroplated copper RDL and UBM enable customers to achieve higher densities and increased reliability in their wafer level packages.  To support a wider range of applications, the Company has completed qualification on WLCSP body sizes up to 5x5mm with qualification underway for 7x7mm.

For more information, please visit www.statschippac.com.

   ^ Top
 


View the Corporate Bulletin Archives

 

:: Issue 100 ::
February 1, 2011

LORD Corporation

Compex Corp.