Palomar Technologies
:: Corporate Member News ::

:: STATS ChipPAC Expands Through Silicon Via Capabilities with Mid-End Processing (full story)

:: DYCONEX Joins Phasedcom Eurostars Project Consortium (full story)

:: Materion Introduces New Alloys for Magnetic Data Storage Industry (full story)

:: Nusil Technology Debuts Low Modulus Fluorosilicone Gel (full story)

:: Indium Corporation Technology Expert Presenting at IMAPS Mid-Atlantic Microelectronics Conference (full story)

:: LORD Corporation Develops High Quality, Low Cost Underfill Encapsulant (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

LORD Corporation

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

STATS ChipPAC Expands Through Silicon Via Capabilities with Mid-End Processing

STATS ChipPAC is expanding its 300mm Through Silicon Via (TSV) offering with the addition of mid-end manufacturing capabilities. The mid-end process flow occurs between the wafer fabrication and back-end assembly process. Mid-end processes support the advanced manufacturing requirements of 2.5D and 3D TSV as well as wafer level packaging, flip chip and embedded die technology.

STATS ChipPAC was one of the first OSAT providers to invest in TSV technology and has complete front to back-end manufacturing capabilities for 200mm wafers, handling both chip-to-chip and chip-to-wafer assembly. STATS ChipPAC’s capabilities include high density microbump in both solder and copper column materials, microbump bonding down to 40um pitch, thin wafer handling, wafer level underfill, thin wafer dicing and microbumps for flip chip interconnection.

TSV is an important developing technology that utilizes short vertical interconnections through a silicon wafer to achieve greater space efficiencies and higher interconnect densities than wire bonding and flip chip stacking.  When combined with microbump bonding and advanced flip chip technology, TSV technology enables a higher level of functional integration and performance in a smaller form factor. One of the first implementations of TSV technology is in the form of 2.5D interposers used to bridge silicon designs into more advanced and efficient 3D configurations.  TSV interposers provide flexibility for the integration of die from different technology nodes and deliver advantages in miniaturization, thermal performance and fine line/width spacing in a semiconductor package.

For more information on TSV, visit STATS ChipPAC’s website at


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DYCONEX Joins Phasedcom Eurostars Project Consortium

DYCONEX has joined the PhasedCom Eurostars project consortium that has started the development of an innovative shaped (non-planar) antenna based on novel, low cost, phased array technology. It will provide high speed broadband internet connections for aircraft, trains and other mobile communication platforms such as automotive applications.

DYCONEX supports the project with its know how on RF materials, flexible substrate technology, Design for manufacturing and cost optimized solutions.

The project consortium comprises Phasor Solutions Ltd., UK, Bitsim AB, Sweden, DYCONEX AG, Switzerland, CSEM SA, Switzerland and Acreo AB, Sweden.
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Materion Introduces New Alloys for Magnetic Data Storage Industry

Materion Microelectronics & Services, has introduced lower oxygen, higher purity, CoFeB and FeCo alloy materials to support the production of magnetic data storage  devices.  

To enable their customers' advanced technologies by fulfilling the need for lower oxygen levels and decreased impurity variation, Materion's new CoFeB shows greater than a tenfold reduction in oxygen. The current standard process for manufacturing this alloy is powder consolidation.  Materion has now developed a new melt process for many compositions that have less than 50 ppms of oxygen and are fully dense compared to the existing greater than 600 ppm oxygen levels for current products.

Current FeCo process shows oxygen levels between 300 - 400 ppm. By enhancing the raw material supply and using a new "clean processing" melt technique, Materion now offers a product with a 4X reduction in oxygen. The new oxygen specification for the enhanced FeCo alloy from Materion is less than 100 ppm.

"This new process is expected to provide lower oxygen in your sputtered film and more consistent sputtering performance both through the life of each target and from target-to-target," states Chris Cosgrove, Director of Marketing, Materion Microelectronics & Services.  "Additionally, by constantly improving our supply chain for raw materials, we can offer higher quality materials with even less variation in chemical composition."
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Nusil Technology Debuts Low Modulus Fluorosilicone Gel

Two-part, white gel backfills electronics, boasts hydrocarbon resistance. 

NuSil Technology LLC ( debuts its 100 mol% fluorosilicone gel. The gel is used to fill small gaps and backfill electronics in applications that require solvent and/or fuel resistance.

FS-3502-1 is a two-part, white, fluorosilicone gel available in an easy-to-use 1:1 mix ratio. It bonds aggressively with most surfaces, and its cure can be heat-accelerated. FS-3502-1 is hydrocarbon-resistant for components exposed to aviation fuels, such as JP-8; chemicals; and solvents used in automotive, electronics and aircraft applications.
With a low Type ’00’ durometer, FS-3502-1 exhibits low modulus and absorbs stresses incurred during thermal cycling. It is a tough gel with minimal tack and low moisture permeability. In addition, electronics applications benefit from FS-3501-1’s non-corrosive properties and minimal contamination. FS-3502-1 is able to compensate for CTE mismatch and exhibits minimal shrinkage after cure.

“FS-3502-1 is another great addition to the myriad fluorosilicone products we offer,” said Brian Nash, vice president, sales and marketing. “It is self-leveling and has a conveniently low viscosity compared to other typical fluorosilicone materials.”
This product is controlled in accordance with applicable ITAR regulations and is RoHS compliant. FS-3502-1 is available in white, but can be translucent or color-matched to the Pantone Matching System (PMS) or Federal Standards.

For more information, please visit

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Indium Corporation Technology Expert Presenting at IMAPS Mid-Atlantic Microelectronics Conference

Indium Corporation Applications Engineer Amanda Hartnett will present her technical findings at IMAPS Mid-Atlantic Microelectronics Conference in Atlantic City, NJ, June 23-24, 2011.

Right-click here to download pictures. To help protect your privacy, Outlook prevented automatic download of this picture from the Internet.Amanda's presentation, Metallic TIMs for High-Brightness LED Packaging, will include a discussion of metallic TIMs and solders, including packaging techniques required for use and the expected performance derived from independent thermal materials testing, as well as in-situ testing completed on functional LED boards.

Amanda provides advice on thermal design issues in many different industries, including communications, military, and photonics. Amanda specializes in coaching manufacturing, process, and design engineers on their choice and application of solder interface materials and other bonding materials to achieve reliable and high-performance thermal attachment solutions.

Amanda has presented at industry technical seminars and authored technical papers on thermal management and microelectronics packaging materials. She is active in several industry organizations including SPIE, IMAPS, and the IPC.

Prior to establishing her career with Indium Corporation, Amanda received her bachelor's degree in Chemistry from Utica College and worked as a research lab technician at Cornell University, focusing on the physical properties of silicon. She is a member of the American Chemical Society. Amanda is based at Indium Corporation's global headquarters in Clinton, NY. She also authors a technology blog, which can be found at

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LORD Corporation Develops High Quality, Low Cost Underfill Encapsulant

LORD Corporation – a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries – has announced a new, low cost underfill encapsulant developed specifically for the semiconductor packaging and assembly industries.

Developed to meet technical requirements of customers, LORD Corporation has been able to present this material with a significant cost reduction compared to competitive underfill materials. Comparable with underfills such as Henkel 4526, the ME-555 offers excellent flow characteristics, thermal cycling reliability and low Coefficient of Thermal Expansion (CTE).

LORD ME-555 underfill encapsulant is a high purity, semiconductor grade epoxy underfill material for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.

Designed with optimum surface tension and viscosity to achieve full coverage without producing bulky fillet or creeping on top of the device, LORD ME-555 will flow consistently without voids while maintaining a fast flow rate. It can be used under CSP/BGAs and small dies with stand-off heights as small as 25 microns. Owing to the low CTE, ME-555 minimizes the possibility of cracking and greatly improves reliability during temperature cycling and temperature shock. Further, LORD ME-555 provides good adhesion to laminate, ceramic, solder mask and metal surfaces, as well as a high Tg and high fracture toughness, which provides a strong mechanical protection for the entire device and prevents premature failures in the package.

According to Jim Greig, sales and marketing manager Electronic Materials, ME-555 was designed to meet industry standards for underfills used in the semiconductor packaging and assembly markets. “Normally the low cost title comes with some sacrifice to the quality – not with ME-555. We listened to our customers’ requests and have developed a high quality solution that is still cost-effective,” said Greig.

For more information or to request a sample, visit or call 1-877-ASK LORD.

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View the Corporate Bulletin Archives


:: Issue 105 ::
June 15, 2011



LORD Corporation