Palomar Technologies
:: Corporate Member News ::

:: President and CEO of Chip Supply, Inc., Edward Perrott Announces Retirement (full story)

:: John P DiStasio appointed Senior Director of Business Development, Microwave Solutions for Crane Aerospace & Electronics (full story)

:: Indium Corporation’s Dr. Lee Presents at SMT/Hybrid/Packaging (full story)

:: DuPont Features Material Innovations for Advanced Displays at SID (full story)

:: Remtec Increases Sales 62%, Adds New Technologies and Products for Optoelectronics, Wireless Communication, Medical Instrumentation, Defense and Space Applications (full story)

:: CAD Design Software and Cadence Design Systems, Inc. launch flow for Chip-Lead Frame-Board Co-Design (full story)

Amkor Technology

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Hi-Rel Laboratories

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

President and CEO of Chip Supply, Inc., Edward Perrott Announces Retirement

After 30 years with Chip Supply, Inc., President & CEO Edward J. Perrott announces his retirement.

Perrott served in various capacities through the years, becoming president and CEO in 1991. Under his tenure, Chip Supply grew into the largest independent die distributor in the world, as well as a leading global provider of high reliability interconnect solutions, serving the military, aerospace,  medical, industrial and communications industries. According to Perrott, “It was truly an honor to have been a part of Chip Supply. I thank all my Chip Supply teammates, customers and suppliers for all the years of confidence and support.”

Due to its growth and industry prominence, Chip Supply was recently acquired by Micross Components, and the company’s Orlando facility is slated to become one of two major sites for Micross operations in the U.S.

Leadership at the Orlando facility will be transitioned to Tony Hamby, former vice president of sales and marketing for Chip Supply, and the new head of U.S. die distribution for Micross.

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John P DiStasio appointed Senior Director of Business Development, Microwave Solutions for Crane Aerospace & Electronics

Crane Aerospace & Electronics has announced the appointment of John P. DiStasio, Senior Director of Business Development for Microwave Solutions for the Electronics Group. DiStasio will lead the Microwave Solutions business development team, which includes sites in Beverly, Massachusetts, Chandler, Arizona, West Caldwell, New Jersey and San Jose, Costa Rica.

DiStasio comes to Crane Aerospace & Electronics with an extensive background in the Microwave industry. He joins us from Cobham – M/A-COM Inc., where he held the position of Director of Field Sales. At Cobham, DiStasio managed the worldwide field sales organization for several years and brings to us valuable leadership and industry experience. DiStasio holds a BS in Electrical Engineering from Northeastern University.

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Indium Corporation’s Dr. Lee Presents at SMT/Hybrid/Packaging

Indium Corporation’s  Vice President of Technology, Dr. Ning-Cheng Lee presented two tutorials at SMT/Hybrid/ Packaging exhibition and conference in Nuremberg, Germany

The first tutorial, Solder Defects for Advanced SMT Manufacturing — Formation Mechanisms and Troubleshooting, explored new challenges engineers face with the advancement of the electronics industry and approaches to prevent solder defects.
The second tutorial, Materials Selection for Lead-Free Soldering, covered the detailed material considerations required for lead-free soldering, including how to select proper solder alloys and surface finishes for achieving high reliability.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.  

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DuPont Features Material Innovations for Advanced Displays at SID

DuPont will highlight its latest innovations in electronic display technologies at the Society for Information Display’s (SID) Display Week 2011, to be held May 17-19 at the Los Angeles Convention Center.  With a broad and growing portfolio of materials and process technologies, DuPont will feature Organic Light Emitting Diode (OLED) materials for large format displays and lighting, DuPont™ Vertak® optical bonding adhesives for enhanced display durability, DuPont Teijin Films for flexible displays and touch screens and DuPont™ PerMX™ 3000 dry film for reflective display technology.  Two key poster presentations on DuPont OLED technology will also be presented as part of the technical conference.

“By tailoring highly engineered materials and processes to work together, we’re able to improve display performance and enable cost-effective, next-generation breakthroughs across a broad range of technologies,” said William F. Feehery, global business director – DuPont Electronics and Communications.  “SID creates an ideal environment for the types of discussions that add to our insight and opens up exciting possibilities for new collaborations to tackle the challenges facing this industry.”

The demonstrations will include OLED displays showcasing the innovative, low-cost fabrication process and high-performance OLED materials developed by DuPont.  Printed OLED device performance continues to improve.  For example, DuPont has quadrupled the printed green lifetime over the past year.  New optical bonding adhesives for more rugged, longer life displays, novel stabilized polyester films optimized for touch screen devices and film technologies for use in color e-paper applications also are a focus for DuPont

In addition to participating in the exhibition at SID, DuPont representatives will deliver two significant technical presentations.  Jonathan Ziebarth will focus on Measurement Methods for Solution-coated AMOLED Display Uniformity. The data of this presentation will show how DuPont printed AMOLEDs match or exceed the uniformity of commercial AMLCDs. Mark Hildner will discuss the Extraction of Printed OLED Internal Emission Characteristics.

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Remtec Increases Sales 62%, Adds New Technologies and Products for Optoelectronics, Wireless Communication, Medical Instrumentation, Defense and Space Applications

Remtec Inc., has reported an increase in sales of 62 % for Y2010. This growth has permitted Remtec to add new equipment and to develop new technologies that have resulted in a more advanced and diverse product offerings for optoelectronics, wireless communication, medical instrumentation and defense and space applications.

The largest sales increase in the company’s history has also allowed Remtec to expand and diversify its sales base. Remtec’s president, Nahum Rapoport explains, “We now have a more advanced and diverse product mix as well as the technology for more demanding applications in current and new markets.  Our technological advancements have permitted us to solidify new market development in advanced ceramic packaging for high power industrial lasers and high brightness LED devices, medical instrumentation, and defense electronics.”  Remtec’s current business model and product mix now reflect a greater diversity and wider market penetration as well as an even split between domestic and international sales.

Remtec’s growth during the year was supported by the addition of a new gold-tin plating line for economic production of high quality laser diode submounts and semiconductor packaging. A new production line for direct bond copper (DBC) substrates for high power applications and semiconductor packaging was also added.  Other capital improvements during the year included additional production machinery, test and inspection equipment upgrades as well as facility expansion. In support of increased sales activity and capital improvements, Remtec increased the number of critical personnel with the addition of a quality assurance manager, process development engineers and technical and operations personnel.

Remtec’s exceptional sales growth in 2010 has continued through the first quarter of 2011 with a sales increase of 35 percent over the first quarter of 2010.  A recent customer survey projects positive growth for 2011 with 65% of customers predicting sales increases for the year.

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CAD Design Software and Cadence Design Systems, Inc. launch flow for Chip-Lead Frame-Board Co-Design

New Silicon Realization convergence approach embodies EDA360 vision

CAD Design Software, Inc., a leader in integrating mechanical and electrical design tools, today announced the release of their solution for Lead Frame package design utilizing unique technology convergence between CAD Design’s Electronics Packaging Designer (EPD) and the Cadence Design Systems Allegro IC Package design and analysis environment. The collaborative solution enables a Silicon Realization flow for ICs that reside in Lead Frame packages.

Semiconductor companies have been challenged to take advantage of new low cost Lead Frame technology that supports IC’s with much higher IO counts. Lead Frame designs with IO counts now in the hundreds require Silicon Realization tools that enable chip-package-board co-design, complex wirebonding with 3D design rule checks, and characterization and modeling tools. CAD Design Software integrates mechanical design packages, where a typical Lead Frame package is initially designed, with the Cadence Allegro IC Packaging tools where constraint-driven organic and ceramic substrate packages have typically been designed.

Freescale Semiconductor is an early adopter of the converged solution and helped refine the flow. Neil Tracht, Freescale Design Manager, says, “The collaboration between CAD Design Software and Cadence has greatly reduced the difficulty in designing complex Lead Frame packages. This integration has significantly reduced our design cycle time.”

Mario Rocha, CAD Design Software’s Sr. Product Manager says, “CDS has worked closely with Freescale and Cadence to architect a converged solution that enhances the value of the individual tools, reduces time to market, and enhances design reliability, through the entire design flow, from intent through abstraction to convergence.”

Brad Griffin, Product Management Director for the Cadence Allegro IC Packaging solutions, says, “More efficient Silicon Realization is now enabled for chips targeted for low-cost packages through this collaboration with CAD Design Software. Lead Frame packages can now be realized more efficiently using the convergence chip-package-board co-design capabilities that include sophisticated 3D visualization and wirebond rule checking.”

For more information on the flow contact CAD Design Software at 877-CAD-USER

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View the Corporate Bulletin Archives


:: Issue 104 ::
May 16, 2011



LORD Corporation