:: TJ Green Associates posts white paper Hermetic vs. 'Near Hermetic' Packaging - a Technical Review (full
story)
:: Nusil Technology Adds New Low-Viscosity Silicone Polymer (full
story)
:: Crane Aerospace & Electronics Power Solutions TRUs Fly on Gulfstream G650 (full
story)
:: Toshiba and Amkor Sign Memorandum of Understanding for the Acquisition of Toshiba’s Malaysian Semiconductor Assembly and Test Operations (full
story)
:: EV Group and Yole Developpement Announce a New Live Webcast! (full
story)
::
Corporate Fast Links ::
Click
below to learn more about this issue's featured corporate members.
All IMAPS
Corporate Members will have the opportunity to place their logo/link
in the "Fast Links" section. To have your company logo
included in an upcoming "Fast Links," email your logo
as a JPEG or GIF to Brian Schieman at bschieman@imaps.org.
You should also identify which URL to link your logo to. If you
have questions, contact Brian at 202-548-8715. There is
no charge for this service, it is offered as part of the corporate
membership
benefits.
::
More Information ::
::
Only news about IMAPS Corporate Members will be published in this
Corporate Bulletin. Please send your electronic press releases
to Ann Bell, abell@imaps.org,
at least 3 days before the first
or fifteenth
of
every
month to be considered for publishing in this bulletin.
:: For advertising
opportunities, please contact Ann Bell at abell@imaps.org or
202-548-8717.
:: To have your
company logo included in an upcoming "Fast Links," contact
Brian Schieman at bschieman@imaps.org or
202-548-8711.
:: For comments and questions about this e-mail newsletter, please
contact Brian Schieman at bschieman@imaps.org or 202-548-8715.
TJ Green Associates posts white paper
Hermetic vs. 'Near Hermetic' Packaging - a Technical Review
Hermetic cavity packages have long been the standard for military and space applications. On one hand the hermeticity specs are getting tighter, on the other hand the question that is now being poised is; Do I need to be hermetic? "Near hermetic" or "non-hermetic" packages hold the promise of reliability at a greatly reduced cost ... maybe ..
Click here to download a 10 page white paper authored by Tom Green on this important subject Free Download
Hermetic packaging has long provided the required protection from dust, dirt, contamination, moisture, and other threats to operating reliability for sensitive electronic devices. Hermetic packages are expensive and technical and manufacturing resources for them are diminishing in availability. Designers are searching for ways to lower cost, reduce weight and increase performance by looking to design-in alternate material sets including engineered plastics such as LCP and robust barriers offering enhanced protection from moisture permeation. There are a variety of materials and approaches that hold the promise of enhancing reliability of non-hermetics while reducing cost. The problem essentially becomes one of minimizing moisture diffusion through the bulk of package materials and at package/lead interfaces. Packages made from polymeric materials, or robust barrier coatings, as opposed to traditional hermetic seals (i.e. metal, ceramics, eutectic etc.) require a different approach from a reliability testing and qualification standpoint.
Packaging technologies and materials that are not hermetic, and that offer reliability without hermeticity, are available to the industry. These approaches include flip-chip laminate designs or cavity packages made of materials that provide physical protection for sealed devices, but which are not positively absolute barriers to moisture. The conference proposes to bring together providers of non-hermetic concepts, products, and materials, with package designers, manufacturing and assembly production engineers, quality and reliability managers, and program managers to explore and explain enhanced moisture resistance packaging and provide technical guidance to those capabilities for potential users of such packages especially, for high reliability environments with extended service life expectations
Nusil Technology Adds New Low-Viscosity Silicone Polymer
This silicone rubber boasts a variable cure schedule and high dielectric strength.
NuSil Technology LLC (http://www.nusil.com), has unveiled R-2188, a solvent-free, two-part, translucent silicone system. R-2188 can be used as a compliant, high-strength adhesive and encapsulant in power electronics applications specifically requiring a highly insulative material.
R-2188 is a non-corrosive material with a low modulus that overcomes stress between materials with different Coefficients of Thermal Expansion (CTE). Due to its high dielectric strength, it can withstand medium and high voltage; thermal and mechanical stress; and long, elevated operating temperatures.
“R-2188 has helped solve many of the packaging issues engineers are facing with the growing use of power electronics and the many designs currently on the market. NuSil understands the need for long-term reliability and ease of processing to keep production costs low in the emerging energy markets, and we are proud to be a participant,” said Brian Nash, Vice President, Sales and Marketing.
R-2188 has a variable cure schedule, low shrinkage, and is easily repairable. It is effective in potting, encapsulating and coating modules, relays, power supplies, delay lines or complete electronic units, as well as a dip-coating for encapsulating components and printed circuit boards. A low-viscosity elastomer with a long work time, R-2188 is also suitable for automatic dispensing.
Crane Aerospace & Electronics Power Solutions TRUs Fly on Gulfstream G650
Crane Aerospace & Electronics Power Solutions was selected by Gulfstream Aerospace Corp. to supply its Transformer Rectifier Units (TRU) on the Gulfstream G650. The five 250A TRUs on each G650 provide DC bus power throughout the aircraft.
Ed Fuhr, Vice President, Power Solutions for Crane Aerospace & Electronics said, “We have a long-standing relationship with Gulfstream and are pleased to be working with them on the G650. We are excited to provide our high reliability, low weight and high power quality TRUs.”
Crane Electronics, Inc., Power Solutions offers ELDECTM, InterpointTM and KeltecTM power conversion, power distribution and battery systems for commercial aerospace, defense and space for use in avionics, ATA Chapter 24 Power Systems, communications, electronic countermeasures, missiles, radar, navigation, guidance and utility systems.
Toshiba and Amkor Sign Memorandum of Understanding for the Acquisition of Toshiba’s Malaysian Semiconductor Assembly and Test Operations
Toshiba Corporation and Amkor Technology, Inc. have announced that they have signed a non-binding memorandum of understanding for the acquisition by Amkor of Toshiba Electronics Malaysia Sdn. Bhd. (“TEM”), Toshiba’s semiconductor assembly operation in Malaysia, together with a license to Amkor for certain related intellectual property rights. Subject to the satisfactory conclusion of due diligence, negotiation and signing of definitive agreements and receipt of any necessary government approvals, Toshiba and Amkor expect to complete the transaction by early January 2012.
Established in 1973, TEM has steadily expanded the scale of its assembly operations, primarily of discrete and analog semiconductors. In recent years, its main product has been power semiconductors.
Toshiba positions power semiconductors as a driver of growth for its semiconductor business and seeks to maximize cost competitiveness across its front- and back-end operations. Transferring ownership of TEM to the Amkor group will allow TEM to take full advantage of Amkor’s large scale production and material procurement capabilities and boost the overall efficiency of its power semiconductor operations.
Toshiba will continue to subcontract power semiconductor assembly and test to TEM as an important source of key products. As it does so, Toshiba will shift its focus and resources to front-end wafer fabrication for power semiconductors by reinforcing production capabilities at Kaga Toshiba Electronics Corporation, Toshiba Group’s discrete semiconductor production base in Japan’s Ishikawa Prefecture.
Amkor expects the transaction to further strengthen its relationship with Toshiba and to grow its semiconductor assembly and testing business. In particular, Amkor believes that TEM will provide an excellent platform for increasing its presence in the power discrete market, where Amkor estimates there is unmet customer demand for outsourced assembly and test services.
Indium Corporation announces that Mike Steenbeke has joined the company as Regional Sales Manager and Key Account Specialist for Northern California, where he is based in the Bay area.
Mike is responsible for market development and sales of Indium Corporation products to major technology corporations.
Mike has over 29 years of experience in high-tech sales, including serving as a sales director for an electronics manufacturing company. He also has extensive background in distribution, as well as in the rep industry. Mike has an associate’s degree from DeAnza College, Cupertino, CA.
Technical Sales Support Engineer
Indium Corporation announces that Joe Bahou has joined the company as a Technical Sales Support Engineer. He is based in Huntington Beach, CA.
Joe is responsible for providing product and process support to customers, sales channel partners, sales team members, and co-suppliers for all of Indium Corporation’s solder and solar products. He assists in customer site evaluations, responds to customer inquiries, and provides technical advice.
Joe has extensive engineering experience that includes process engineering and engineering management. He has a bachelor’s degree in Mechanical Engineering from the University of Massachusetts (Boston).
