:: Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at IMAPS 2011 (full
:: LORD Corporation Develops High Quality, Low Cost Underfill Encapsulant – Visit Booth # 226 For More Information (full
:: Epoxy Technology Offers Two New MIL-STD-883/5011 Certified Products – Stop By Booth # 334 (full
:: GPD Global to Showcase PCD ‘H’ Series at IMAPS – Long Beach 2011 (full
:: Azimuth Electronics Innovations in Sockets - See you at Booth # 220 (full
:: SET Introduces FC300R High Accuracy Device Bonder with Robotics – Visit Booth # 1200 For More Details (full
:: Benchmark Electronics on Display at Booth # 333 at IMAPS 2011 (full
:: IC Assembly Services Inc. to attend IMAPS 2011 Long Beach (full
:: Technic Engineered Powders Completes Analytical Laboratory Renovations - Stop By To Hear More at Booth # 429 in Long Beach (full
Corporate Fast Links ::
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in the "Fast Links" section. To have your company logo
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have questions, contact Brian at 202-548-8715. There is
no charge for this service, it is offered as part of the corporate
More Information ::
Only news about IMAPS Corporate Members will be published in this
Corporate Bulletin. Please send your electronic press releases
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at least 3 days before the first
month to be considered for publishing in this bulletin.
:: For advertising
opportunities, please contact Ann Bell at email@example.com or
:: To have your
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:: For comments and questions about this e-mail newsletter, please
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Come and Visit Microcertec at Booth # 134 at IMAPS 2011 Long Beach
Come and visit us on our booth # 134 at the IMAPS 2011 - 44th International Symposium on Microelectronics, at Long Beach Convention Centre, Long Beach, California, at the exhibition that will be held October 11-13, 2011.
Microcertec will exhibit its unique expertise in ceramic 3D interconnect devices that are ideal for the integration of chips on a component that offer both mechanical and electrical functions in a true 3D arrangement. But also, alumina and aluminium nitride 2D substrates with photolithography electrical circuits, high-performance AlN heat sinks, solderable submounts.
Also featured on our stand will be hermetic glass-to- metal and ceramic-to-metal microelectronic packages and assemblies, with a focus on a new light-weight composite material with enhanced thermal dissipation ideal airborne microelectronics applications.
FINETECH to Showcase Modular Die Bonder at IMAPS 2011
FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition, scheduled for October 11-13, 2011 at the Long Beach Convention Center in Long Beach, California.
The FINEPLACER® Lambda is ideal for low-volume, prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding placement accuracy (down to 0.5 µm). This versatile system can be used for precise placement, die-attach and advanced packaging utilizing various bonding technologies -- soldering (Eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, gold/tin laser bar bonding, adhesives and UV curing. Options are available for inert atmosphere and forming gas.
Applications include flip chip, 3-D packaging, MEMS, wafer level packaging (C2W), optoelectronic and micro optics bonding and assembly, sensors and more.
Kyzen to Display MICRONOX® MX2302 Wafer-Level Cleaning Solution at IMAPS 2011 – Long Beach
Kyzen will display its MICRONOX® MX2302 Wafer-level Cleaning Solution in Booth #517 at the upcoming IMAPS 44th International Symposium on Microelectronics, scheduled to take place October 9-13, 2011 at the Long Beach Convention Center in Long Beach, CA.
MICRONOX® MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages.
MX2302 has proven effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems. Easy to use, MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers.
MICRONOX® MX2302 is available in one, five, and 55 gallon containers.
Kyzen® and MICRONOX® are registered trademarks in the United States and other countries.
Visit Palomar Technologies in booth #231 at IMAPS 2011, October 11-13 in Long Beach, CA
We're Proud to be Exhibiting at IMAPS 2011, And We Want to See You There!
Wrestling with a microelectronic packaging challenge? Striving to reach higher reliability while maintaining high-yield applications? Looking for the most innovative, fully automatic wire bond and die attach systems? Visit Palomar Technologies in booth #231 at IMAPS 2011, October 11-13 in Long Beach, CA.
Get up to speed on the latest advancements in HB LED assembly with a FREE on-demand webcast: http://tinyurl.com/HB-LED-webcast. Listen in as Palomar Assembly Services™ general manager, Don Beck, presents a process flow of high-yield HB LED automated assembly, supported by equipment certification, product inspection and SPC data collection methods.
Keep up with Palomar Technologies on the fly!
Follow us on Twitter! @PalomarTech
Click the titles below for instant access to the latest technical papers:
Part of Newport’s Integrated Systems Business, the MRSI products have been supplying high precision dispense and assembly equipment for the microelectronics industry for over two decades. Newport MRSI supports the manufacture of Microwave, Optical, MCM’s and MEM’s devices, as well as the next generation of TSV and 3D packaging technologies. Newport products support multiple interconnect technologies, including epoxy die bonding, eutectic attach and flip chip. The ultra-precision Newport MRSI-M5 with 5 micron accuracy and MRSI-605 Assembly Work Cells specialize in GaAs handling. Newport MRSI-175Ag Epoxy Dispenser is the leader for high precision conductive epoxy dispensing utilizing a variety of technologies including augers, time pressure, positive cavity displacement and jetting technologies.
Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at IMAPS 2011
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will highlight its latest bond testing and X-ray inspection capabilities in Booth #512 at the upcoming IMAPS 44th International Symposium on Microelectronics, scheduled to take place October 9-13, 2011 at the Long Beach Convention Center, Long Beach, CA.
The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next generation Paragon™ software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.
Also featured at the show will be the Nordson DAGE μCT Inspection Option that provides Computerised Tomography (CT) functionality to compliment the 2-D X-ray investigations on Nordson DAGE X-ray inspection systems. It uses the superior, submicron feature recognition of 2-D X-ray images that Nordson DAGE X-ray systems always provide to produce the best CT models for 3-D sample analysis, virtual micro-sectioning and internal dimensional measurements. Additionally, the option reduces the number of time-consuming micro-section analyses needed, assisting in identifying where micro-section preparation and investigation must concentrate. The μCT inspection capability is available with a system order or as retro-fit to suit application and workflow needs.
LORD Corporation Develops High Quality, Low Cost Underfill Encapsulant – Visit Booth # 226 For More Information
LORD Corporation has announced a new, low cost underfill encapsulant developed specifically for the semiconductor packaging and assembly industries. Developed to meet technical requirements of customers, LORD Corporation has been able to present this material with a significant cost reduction compared to competitive underfill materials. Comparable with underfills such as Henkel 4526, the ME-555 offers excellent flow characteristics, thermal cycling reliability and low Coefficient of Thermal Expansion (CTE).
LORD ME-555 underfill encapsulant is a high purity, semiconductor grade epoxy underfill material for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.
Designed with optimum surface tension and viscosity to achieve full coverage without producing bulky fillet or creeping on top of the device, LORD ME-555 will flow consistently without voids while maintaining a fast flow rate. It can be used under CSP/BGAs and small dies with stand-off heights as small as 25 microns. Owing to the low CTE, ME-555 minimizes the possibility of cracking and greatly improves reliability during temperature cycling and temperature shock. READ MORE
Epoxy Technology Offers Two New MIL-STD-883/5011 Certified Products – Stop By Booth # 334
EPO-TEK®H20E- MP and EPO-TEK® EK1000-MP Deliver Breakthrough Performanc With Extensive MIL-STD Certified Testing
Epoxy Technology, Inc. proudly announces the introduction of two new products, EPO-TEK H20E-MP and EK1000-MP. These latest offerings, added to Epoxy Technology’s extensive line of Military Certified adhesives, have been found to meet the extensive certification requirements of Test Method 5011 in MIL-STD 883 for adhesives.
“Epoxy Technology continues to expand our offerings of specialty adhesives, meeting the high performance requirements of advanced technologies worldwide”, said Joan Bramer, Global Marketing Director, Epoxy Technology, Inc.
EPO-TEK H20E-MP and EK1000-MP deliver exceptional performance in thermal management and electrical conductivity, with excellent mechanical reliability. Both products are ideally suited for use in a wide variety of applications where high thermal conductivity is critical, such as solar modules and concentrators, LEDs and high reliability military devices.
EPO-TEK H20E-MPis based on our “standard in the industry”, EPO-TEK H20E, which has a long history of reliability and performance for over 35 years—and has been specified in countless demanding applications.
EPO-TEK EK1000-MP is based on our newest generation silver epoxy adhesive, EPO-TEK EK1000. It exhibits outstanding thermal conductivity with excellent thermal and mechanical reliability. This innovative epoxy is a single component, silver-filled system, formulated with a very shiny finish to enhance device reflectivity.
For more information on the EPO-TEK H20E-MP and EK1000-MP or any of Epoxy Technology products, please visit our website at: www.EPOTEK.com.
GPD Global to Showcase PCD ‘H’ Series at IMAPS – Long Beach 2011
GPD Global will showcase its Positive Cavity Displacement (PCD) ‘H’ Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics, scheduled to take place October 11-13, 2011 at the Long Beach Convention Center in Long Beach, CA.
GPD’s PCD Dispensing provides next-generation volumetric dispensing and is compatible with materials used in electronics assembly such as epoxies, thermal greases, underfills, oils, silicones and UV encapsulants, as well as materials outside of the electronics industry. PCD Technology is designed for GPD Global platforms and may be used with other robots or tabletop operations with an easy-to-use tabletop controller.
Viscous fluids are delivered to the substrate via luer nozzles and performance excels when using GPD Global ‘S’ Taper tips. The metering technique is not affected by variations in temperature or reservoir pressure, thereby improving day-to-day and start-to-finish process results. GPD’s enhanced flow rate luer dispense tips offer higher flow rates than standard luer nozzles with a much lower pressure build-up.
GPD also will demonstrate the PCD and MicroDot technologies on its MAX Series platform. MAX Series dispensing systems offer high accuracy, precision dispensing over a wide range of applications. The MAX Series platforms are ideal for die attach, underfill, MEMS, micro-volume conductive adhesive and paste applications. Max Series equipped with Micro-volume technology enables dispensing for 0201 components as well as die attach adhesives. Further expanding the Max Series capabilities with the continuously volumetric PCD dispense pump yields outstanding results with underfills, encapsulation and LED applications.
For more information about GPD Global’s PCD Dispensing, meet company representatives in Booth #439 at the show or visit www.gpd-global.com.
Azimuth Electronics Innovations in Sockets - See you at Booth # 220
The latest in Test and Burn-In Sockets for:
QFP, CQFP, MCM, SOIC, Laser Diode, LCC,
LGA, BGA, QFN, MLF, MEM, 3D Memory Stack,
Medical Substrates, HF Device, PGA, Substrate Modules and Custom Integrated Circuits
Supporting the Electronics Industry in….
Space and Defense
Azimuth Electronics is a US manufacturer of Test and Burn-In Sockets providing innovative interconnect socketing solutions for the electronics industry for over 50 years. Our broad experience with test and burn-in sockets allows us to tackle the challenges of a constantly evolving industry. Azimuth offers complete in-house services facilitating cost-effective solutions from engineering and design, machine shop prototyping, tooling fabrication, and production injection molding. Azimuth is committed to providing state of the art concepts in sockets with a commitment to excellence. www.azimuth-electronics.com
SET Introduces FC300R High Accuracy Device Bonder with Robotics – Visit Booth # 1200 For More Details
FC300R: an Easy-to-Use Production Platform Ideal for High Accuracy C2W Bonding, Die Attach, Flip-Chip and 3D Integration with TSV.
SET - Smart Equipment Technology – has ched the FC300R, which combines robotic handling with the company’s proven FC300 platform to address the needs of the pre-production market for high accuracy bonding.
The FC300R offers hands-free placement capabilities for Chip-to-Substrate or Chip-to-Wafer assembly as well as Chip-to-Chip stacking. With an unmatched submicron post-bonding accuracy at bonding forces ranging from 0.4N to 4000N, the FC300R is the ideal tool for 3D-IC applications using high density TSV’s. This enhanced bonder accommodates components from 150 x 150 µm to 100 x 100 mm and substrates up to 200 x 200 mm or 300 mm wafers to serve a wide range of applications.
The addition of a loading robot to the base FC300 enables the handling of a wide range of components as well as increased machine autonomy by storing a large number ofwaffle packs or GELPAKTM. It is optionally equipped with a direct die feeder from diced wafer on frame capable of handling thin die. A tape and reel feeder is also available for device loading.
The loading robot operates inparallel with the bonding process module contributing to a significant reduction in the dry cycle time. When required, the FC300R makes use of up to three pre-alignment and inspection optics subsystems in the robotic feeding area to ensure proper pick up of tiny components like laser diodes. Image processing is available for a wide variety of recognition functions such as pattern search, synthetic pattern generation, calipers, edge detection. It also provides contrast enhancement.
“As the FC300R has recently been ordered by a major global semiconductor company, for 3D bonding applications, SET is proud of confirming its technological leadership by providing cutting-edge bonding solutions to the semiconductor industry. By working closely with our customers, SET has raised process development, automation and flexibility of its high accuracy bonders to the highest level,” said Gilbert Lecarpentier, Director of Marketing & Business Development.
The FC300R can be equipped with an optional ultrasonic bonding head. A high force bonding head equipped with a confinement chamber which reduces oxide on bumps and bonding pads can also be installed. This configuration is especially interesting for Cu-Cu bonding applicable in 3D-IC integration.
Thanks to its unrivalled flexibility, the FC300R is able to support various applications on the same platform with a quick process-head reconfiguration:
High Force Bonding Head ->adapted to the thermo-compression bonding process,
Low Force Bonding Head -> for reflow bonding of all types of components including RF, Next generation of optoelectronics devices assembly,
UV-Curing Head -> adhesive bonding, UV-NIL process, etc.
The SET FC300R excels in demanding applications and accommodates a wide variety of processes and materials including extremely fragile crystals such as GaAs and HgCdTe. This easy-to-use platform adapts to all bonding techniques: fluxless reflow, adhesive joining, thermosonic, thermo-compression and direct metallic bonding. The unrivalled process flexibility, precision and repeatability of the FC300R, based on SET’s decades of bonding experience set new benchmarks for Chip-to-Chip and Chip-to-Wafer bonding.
Benchmark Electronics on Display at Booth # 333 at IMAPS 2011
Benchmark’s expertise in microelectronics assembly is ready to deliver solutions for your medical, industrial, defense or communications needs. Our extensive tool set, combined with our broad process development capability, provides a complete answer for the challenging demands of microelectronics assembly. We leverage our advanced skills across multiple industries to provide optimized solutions for your unique needs.
• Wire Bonding
• Precision Placement
• Epoxy Die Attach
• Eutectic Die Attach
IC Assembly Services Inc. to attend IMAPS 2011 Long Beach
IC Assembly Services Inc. would like to welcome you to IMAPS 2011 Long Beach and invite you to stop by booth #136 to learn about the fastest growing packing company in the world. See the latest in packaging technologies and pickup free giveaways while supplies last.
US based IC Assembly Services Inc. provides Ultra-fast turn, Leading-edge packaging technologies to Semiconductor Fabs & Foundries, Fabless Semiconductor Companies, IC Design & Development Firms and DOD & Aerospace Companies, in Engineering Prototype and QA volumes of 5 to 100 and Production Volume devices.
Technic Engineered Powders Completes Analytical Laboratory Renovations - Stop By To Hear More at Booth # 429 in Long Beach
Technic Engineered Powders has recently completed renovations to analytical laboratories at the Woonsocket, Rhode Island facility. The six month renovation represents a $200,000 investment in support of the company’s ongoing commitment to new product development and quality control. The newly renovated labs support a variety of state-of-the-art testing capabilities including: TGA, DSC, ICP and SEM. The renovations represent an expansion of current capabilities, providing for a more complete physical, thermal and chemical analysis of Engineered Powders and Flakes produced at the facility.
“Our new analytical laboratories reflect our commitment to maintaining our position in the industry as a world class provider of the highest quality precious metal powders and flakes.”
-- Ionel Halaciuga, Ph.D.
Research and Development Director, Technic Engineered Powders Division