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:: Corporate Member News ::

:: Amkor Technology Licenses Proprietary Through Mold Via (TMV®) Technology to SHINKO (full story)

:: Kyocera Corporation Acquires LCB Manufacturer Optrex to Create Kyocera Display Corporation (full story)

:: DYCONEX is a founding member of iNEMI’s Defining Reliability Requirements for Implantable Medical Devices Project (full story)

:: MasterBond’s Low Thermal Expansion Epoxy Passes NASA Low Outgassing Tests (full story)

:: New Cost-effective LTCC Materials System From Ferro Electronic Materials Helps Devices Use Less Power (full story)

:: Indium Corporation Technology Expert Recognized at IPC APEX Expo (full story)

:: DuPont Microcircuit Materials Introduces Solamet® PV416 Photovoltaic Metallization for Thin Film Photovoltaics (full story)

:: Good Reviews for Sonoscan’s Gen6™ Acoustic Microscope (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

F&K Delvotec
Ferro
Dyconex

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

Palomar Technologies

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Amkor Technology Licenses Proprietary Through Mold Via (TMV®) Technology to SHINKO

Amkor Technology, Inc. has announced that it has granted SHINKO ELECTRIC INDUSTRIES CO., LTD. (Tokyo: 6967) a non-exclusive license to its proprietary Through Mold Via (“TMV®”) technology. The agreement provides for the transfer of Amkor’s TMV® technology to SHINKO and a license under Amkor’s patents to enable SHINKO to manufacture packages based on this technology. The license also permits SHINKO to use Amkor’s registered TMV® trademark in its sales and marketing activities.

Technology innovation has always been a key component of our success, and our proprietary TMV® technology has been widely adopted in the rapidly growing smartphone and tablet markets,” said Ken Joyce, Amkor’s president and chief executive officer. “We are pleased to license our TMV® technology to SHINKO, a respected outsourced assembly and test provider. This engagement will provide our customers the option of having multiple sources for TMV® packaging services.”

“This licensing agreement is significant for SHINKO,” said Fumio Kuraishi, SHINKO’s President and Representative Director. “The availability of Amkor’s innovative TMV® technology will provide SHINKO with a time-to-market advantage and enable us to provide our customers with state-of-the-art solutions for their 3D package stacking needs.”

Since their introduction, package-on-package (“PoP”) components have been rapidly adopted for 3D integration of logic and memory. Amkor’s TMV® technology enables leading-edge PoP designs for smartphone and tablet applications, delivering increased integration, miniaturization and performance without requiring the development of new surface mount stacking infrastructure or adding cost. Amkor’s TMV® technology improves warpage control, reduces package thickness, facilitates finer pitch memory interfaces, enables both wirebond and flip chip interconnects and supports stacked die or passive integration requirements.

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Kyocera Corporation Acquires LCB Manufacturer Optrex to Create Kyocera Display Corporation

Kyocera Corporation, Kyoto, Japan, has acquired LCD manufacturer Optrex Corporation, Tokyo, Japan, to form Kyocera Display Corporation.

The Kyocera Group includes over 200 companies worldwide that manufacture a wide range of products including industrial ceramic materials, semiconductor components, automotive components, communications equipment and liquid crystal displays (LCDs).
With the acquisition of Optrex and formation of Kyocera Display Corporation, Kyocera will expand its LCD product offerings and manufacturing capabilities for automotive and industrial applications.

Kyocera offers a wide range of active matrix TFT LCD panels in sizes from 3.5 to 12.1 inches diagonal and resolutions from QVGA to SVGA. Optrex, founded in 1976, has been focused on small and medium size LCDs in the automotive and industrial market sectors, offering a range of active matrix TFT and monochrome graphic and character LCDs.

Kyocera’s Gen 3 TFT LCD fabrication facility produces state-of-the-art polysilicon and amorphous silicon panels.  Kyocera Display Corporation will complement their high-volume front-end array production capability with Optrex’s back-end modularization capabilities.
The acquisition of Optrex will also enable Kyocera to complement its range of resistive and capacitive type touch screen panels with Optrex’s touch screen bonding capabilities.

The company’s acquisition of Optrex America in Plymouth, MI, USA (now Kyocera Display America, Inc.), as well its acquisition of Optrex Europe in Babenhausen, Germany (now Kyocera Display Europe GmbH), will enable Kyocera to expand its presence in the automotive and industrial LCD markets in the Americas and Europe.

“We are confident that there will be a strong synergy between the product offerings, manufacturing infrastructure, business strategy and market segments of Kyocera and Optrex,” said Akihiko Ikeda, President of Kyocera Display Corporation.  “It will benefit the customers of both companies and give us the capability for strong growth in the years ahead.”

“The change of ownership will not affect our relationship with Optrex’s customers and suppliers,” said Cynthia Ferrell, CEO of Kyocera Display America, Inc. “We remain committed to our business and to the continuity of supply to our longstanding and highly valued customer base.”

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DYCONEX is a founding member of iNEMI’s Defining Reliability Requirements for Implantable Medical Devices Project

We are proud to announce that DYCONEX is a founding member of a project being set up by the International Electronics Manufacturing Initiative (iNEMI) entitled «Defining Reliability Requirements for Implantable Medical Devices.

The proposed focus of the program is to identify the product testing required to ensure the reliability of active implantable medical devices such as pacemakers, defibrillators, cochlear implants and neurostimulators.

The project will be realized in three main phases:

• Phase 1: Review reliability standards relevant to active medical implants
• Phase 2: Analyze gaps and develop protocols
• Phase 3: Recommend applicable methodologies

Dedicated standardization for the testing of such devices will mitigate the risk factors and offer the industry a faster level of innovation and lower litigation risks while delivering reliable products to patients.

For over 15 years, DYCONEX has been a major player in the PCB market for medical implants. Based on that experience, we rate this project to be very significant. Dr. Hans-Peter Klein, Director Quality Management, will therefore join the project from our side. With his profound expertise in business excellence methods, he will be an important asset to this iNEMI initiative.

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MasterBond’s Low Thermal Expansion Epoxy Passes NASA Low Outgassing Tests

Formulated with a special blend of polymeric and inorganic materials, Master Bond EP30LTE-LO features unparalleled dimensional stability and sets new standards of performance for bonding, sealing, casting and coating applications in the aerospace, electrical, electronic, chemical, optical, and computer industries. This two component epoxy combines outstanding performance with a very low thermal expansion coefficient, a significant breakthrough from the high thermal expansion that is typical of most epoxy compounds.

Serviceable over the wide temperature range of -60°F to 250°F, EP30LTE-LO cures at room temperature with 85% of its maximum strength developed within 48 hours. Faster cures are possible at elevated temperatures. This 100% reactive epoxy features an exceptionally low coefficient of thermal expansion of 12x10-6 in/in/°C and a low shrinkage rate of less than 0.0002 in/in. It bonds well to metals, glass, ceramics, wood, vulcanized rubbers and most plastics, and produces bonds with a tensile strength over 5,000 psi.
This electrically insulative system resists thermal cycling and chemicals including water, fuels, and many acids, bases, salts and organic solvents. It has a long working life of up to 60 minutes for a 200 gram mass.

EP30LTE-LO has a 10 to 1 mix ratio by weight and can be easily applied with a spatula, knife, trowel, brush or paint roller. It can also be readily cast as thick as 1 inch without undue exotherm developing. EP30LTE-LO is available in half-pint, pint, quart, gallon and 5 gallon container kits.

Master Bond Low Outgassing Epoxy Systems

Master Bond's low outgassing epoxy, EP30LTE-LO, features a low thermal expansion coefficient with solid electrical insulation properties. Read more about Master Bond's low outgassing epoxies at http://www.masterbond.com/lp/tabs/tp_pp_lowoutgas.html.

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New Cost-effective LTCC Materials System From Ferro Electronic Materials Helps Devices Use Less Power

L8 Offers low loss up to 40GHz and ease of green and fired processing
Ferro Electronic Materials expands its low temperature co-fired ceramic (LTCC) portfolio, which includes industry-leading A6M and A6S, with a new line of cost-effective matched materials that offers better performance over a greater range of frequencies and easier manufacturability than market alternatives. The Company will introduce its new L8 LTCC product line in booth 9-212 at SMT Hybrid Packaging 2012, to be held May 8-10 in Nuremberg, Germany.

L8 Materials System
Ferro’s new L8 LTC C system has superior dielectric properties that provide significantly lower loss than competitive, price-sensitive LTCC products. L8 performs well at up to 40 GHz and its reduced loss enables manufacturers to design and build more energy-efficient parts that consume less power. The L8 system is suitable for cost-sensitive low- to mid-frequency telecommunications, automotive, and medical modules, components and sensors as well as higher frequency aerospace, satellite and other high reliability applications. The lead-free glass-ceramic formulation also provides very high strength and may be used in wire-bond, solderable, brazable, and plateable applications. The L8 system is RoHS compliant.

Ferro supplies L8 ceramic tape with a full complement of matched metallization pastes that include silver, gold, plateable silver, and mixed-metal formulations. Gold and nickel may be electrolessly plated onto silver surfaces to improve performance in harsh environments and for easier wire-bonding. L8 pastes have excellent printability and the material set has a broad processing window with multiple co-firing options with either belt or box furnaces.     

“L8 offers mid-frequency capabilities far beyond other cost-sensitive LTCC products,” said Ed Stadnicar, Jr., business manager, electronic packaging materials for Ferro Electronic Materials. “Its performance in the 30 to 40 GHz range enables high-performance applications such as aerospace and biomedical devices to lower overall manufacturing costs and to use silver or plateable gold instead of all-gold metallizations.” 

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Indium Corporation Technology Expert Recognized at IPC APEX Expo

Indium Corporation <http://www.indium.com> Product Manager of PCB Assembly Materials Tim Jensen <http://www.indium.com/corporate/bio/tim_jensen.php> was recently recognized at IPC APEX Expo for his contributions to the electronics manufacturing industry and for contributing his time and expertise through active IPC committee service.

The IPC-Association Connecting Electronics Industries presented Tim with a Distinguished Committee Service Award for his contributions to Amendment 1 of the Joint Industry Standard: Requirements for Soldering Fluxes (J-STD-004B), the standard used to classify and characterize soldering flux materials for PCB assembly.

As a product manager, Tim works with customers to troubleshoot and optimize SMT process lines. He specializes in SnPb and Pb-free solder paste, halogen-free soldering materials, wave solder fluxes, bar solder, rework fluxes, and flux-cored wire.

Tim is a certified process engineer and earned his bachelor’s degree in chemical engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. Tim also authors a blog, which can be found at <http://blogs.indium.com/blog/tim-jensen> .

For more information about Indium Corporation, visit <http://www.indium.com>

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DuPont Microcircuit Materials Introduces Solamet® PV416 Photovoltaic Metallization for Thin Film Photovoltaics

New Lower Temperature Processing Capability Expands Solar Substrate Options

DuPont Microcircuit Materials (MCM) has introduced DuPont™ Solamet® PV416 photovoltaic metallization, a new frontside silver paste material used to raise the efficiency of thin film photovoltaic cells. This new silver composition has the capability to be processed at temperatures less than 140°C, and provides improved contact resistance, conductivity, adhesion and fine line resolution when printed on Transparent Conductive Oxides (TCOs) - these are key properties for improved performance in Copper Indium Gallium (di)Selenide (CIGS), amorphous silicon (a-Si), and Organic Photovoltaic (OPV) cells and modules. The material has most recently been adopted at Midsummer AB, where it has demonstrated a 0.5 percent increase in conversion efficiency on stainless steel-based CIGS cells.

“DuPont continues to advance metallization technology for thin film photovoltaics, and Solamet® PV416 represents the latest generation of performance improvements,” said Kerry Adams, European business development manager- DuPont Microcircuit Materials. “Working in close collaboration with innovative module makers such as Midsummer gives us insights on how we can engineer materials to meet their needs for easier processing and increased efficiency that strengthen their competitive edge.”

“Midsummer offers a unique and cost-effective, turn key CIGS solar cell manufacturing solution with the DUO Line, and we have high standards for metallization paste performance on our stainless steel substrate,” said Sven Lindström, chief executive officer, Midsummer AB. “Solamet® PV416 enabled us to print fine lines with a high aspect ratio for greater conductivity and gave the best result of the five different brands we have tested, raising the conversion efficiency by half a percent. As we screen print every single cell, instead of scribing large modules, the performance of the metallization paste is of extra importance for Midsummer and its customers."

DuPont™ Solamet® PV416 photovoltaic metallization paste can be processed at lower temperatures than similar pastes used in crystalline silicon cells, and its special chemistry provides essential performance characteristics such as high conductivity, adhesion and line resolution. With excellent printed conductivity (10mOhm/sq@25micron), low contact resistance (3mOhm.cm2), and superior line resolution (<100 micron), it is ideal for solar cells built on thin film photovoltaic substrates whether flexible or stainless steel.

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Good Reviews for Sonoscan’s Gen6™ Acoustic Microscope

Last July, when Sonoscan introduced its Gen6 high-end laboratory acoustic microscope, the designers of the microscope were eager to see reports from the field. One innovation was Sonolytics™ software, an advanced and very smooth Graphical User Interface.

The reports are now coming in. “The big difference,” one user commented, “is that the Gen6 system allows me to concentrate on the parts I’m working with, and on getting data and images from those parts, rather than concentrating on the details of operating the microscope.” Another user called the software “precisely intuitive” in getting him the results he needs, while also saving time by cutting out unneeded tasks.

Users also remarked that it was very useful to be able to select any resolution from <1 megapixel to 268 megapixels, rather than being limited to prescribed values.

Also new in the Gen6 system was the PolyGate™ module , which lets the operator “slice” a part into as many as 200 thin slices and make an image of each slice during a single scan. Designers of the Gen6 system thought that PolyGate analysis  would be most useful in imaging multilayer samples and bulk materials such as ceramic.

What designers did not anticipate was the extent to which inventive users would make thin-slice images of plastic-encapsulated microcircuits in order to determine, for example, whether the die was tilted.

Another Gen6 system innovation is a 500MHz pulser having improved signal stability, important for example in 230, 300 or 400 MHz imaging of flip chip underfill, bumps and related features.

For more information,  please visit www.sonoscan.com.

 

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View the Corporate Bulletin Archives

 


:: Issue 120 ::
April 17, 2012

Master Bond

LORD Corporation

RGL Enterprises

EPP

RGL Enterprises

QSIC