:: Amkor Technology Appoints New President of Amkor Technology Taiwan (full
:: Indium Corporation Technology Expert to Present at Printed Electronics Europe 2012 (full
:: NuSil Technology Presents New Coating for Enhanced Performance in Extreme Temperatures (full
:: Axus Technology Announces 300mm CMP Development & Foundry Services Agreement with Fraunhofer (full
:: Iris Labadie of Kyocera Teaching Electronic Packaging Seminar on April 10 at Lorain County Community College (full
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Crane Appoints Presidents of Aerospace and Electronics Groups
Crane Co. has announced the appointment of Robert (Bob) Tavares as President of the Crane Co. has announced the appointment of Robert (Bob) Tavares as President of the Electronics Group of Crane Aerospace & Electronics, and David Bender as President of the Aerospace Group of Crane Aerospace & Electronics. Crane Aerospace & Electronics is one of five segments of Crane Co., a diversified manufacturer of highly engineered industrial products with $2.5 billion in sales. Previously, Bender was president of both the Aerospace Group and the Electronics Group.
As President of the Electronics Group, Tavares’ responsibilities will include operations of Electronics Group locations and product solutions, including Power, Microwave and Microelectronics. He will be located in Redmond, Washington. Before joining Crane, Tavares was president of e2V, a leading global provider of technology solutions for high performance systems. Prior to that, he was Vice President of the Microwave Solutions for Crane Aerospace & Electronics. His background includes extensive experience in the Microwave and Defense Industries in many senior roles from engineering to general management.
As president of the Aerospace Group, Bender will be located in Lynnwood, Washington and is responsible for Aerospace Group site operations and product solutions, which include Fluid Management, Landing Systems, Cabin Systems and Sensing & Utility Systems. Bender joined Crane in January 2006 as President of the Electronics Group of Crane Aerospace & Electronics. Before joining Crane, Bender spent over 24 years with Aerojet General Corporation in progressively expanding roles and responsibilities in general management, after starting his career in engineering.
Endicott Interconnect Technologies, Inc. Appoints New CFO
Endicott Interconnect Technologies, Inc. (EI) has appointed David W. Van Rossum to the position of Chief Financial Officer effective immediately. In this role, Mr. Van Rossum is responsible for the financial plans and policies of the company including establishing and maintaining fiscal controls; preparing and interpreting financial reports; ensuring financial resources are available to meet strategic objectives and safeguarding company assets.
Mr. Van Rossum spent 20 years with Tyco International and was VP/CFO of Tyco Telecomm from 1997-2002. More recently, David was CFO at Russound as their Chief Financial Officer and Chief Operations Officer (COO) and is currently on the Board of Directors at Service Credit Union. Most of his financial experience has been in high tech manufacturing and in Government contracts. "David's broad and diverse financial and leadership experience will bring added value to the company as we continue to focus the organization on growth and operational excellence," said James J. McNamara, president and CEO at EI. "I am confident he will make a significant contribution in this complex environment."
David earned his Masters of Business Administration from the University of Southern New Hampshire. He also possesses a Bachelor's of Science in Business Administration from New Hampshire University.
Master Bond’a Silver Conductive Epoxy Meets NASA Low Outgassing Standards
Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries.
The adhesive cures at room temperature in 24-48 hours and in just 1-2 hrs at 200ºF, producing tough high strength bonds. It features a tensile shear strength of more than 1,800 psi, a T-peel of greater than 5 pli, and outstanding adhesion to similar and dissimilar substrates. The volume resistivity of the system is less than 10-3 ohm-cm. Serviceable over the exceptionally wide range of 4K to 275ºF, EP21TDCS-LO is suitable for cryogenic applications. It withstands thermal cycling and is resistant to chemicals, including water, oil and most organic solvents.
The epoxy offers a simple 1 to 1 mixing ratio by weight or volume. With its low drip formula, EP21TDCS-LO can be conveniently applied with a syringe, knife, spatula or trowel to vertical surfaces without sagging and only contact pressure is required for curing. Syringes have a 3 month shelf life and glass jars have a 6 month shelf life, if stored at room temperature. EP21TDCS-LO is available in premixed and frozen syringes, as well as in metal containers.
Master Bond Electrically Conductive Adhesives
Master Bond’s Polymer System EP21TDCS-LO was developed for high performance bonding and sealing where superior electrical conductivity and NASA low outgassing certification is required. Read more about Master Bond’s electrically conductive adhesives at http://www.masterbond.com/lp/tabs/tp_pp_eleccond.html or contact Technical support by e-mail at firstname.lastname@example.org.
Amkor Technology Appoints New President of Amkor Technology Taiwan
Amkor Technology, Inc, has announced that Mike Liang has joined the company as President of Amkor Technology Taiwan. Liang and his team are responsible for servicing our packaging and test customers and executing our strategies in Taiwan.
“Mike Liang is a seasoned manufacturing executive with a proven track record in operations, sales and marketing for semiconductor packaging, wafer processing and testing services” said JooHo Kim, Amkor’s executive vice president, worldwide manufacturing operations. “Mike’s extensive industry experience and proven leadership skills are a great fit for our manufacturing team.”
Liang joins Amkor Technology Taiwan from King Yuan Electronics Corporation in Hsin-Chu, Taiwan, where he most recently served as president and chief executive officer. Prior to King Yuan Electronics Corporation, Liang held various executive and operational roles at Phoenix Semiconductor International, AbelLink Technology, Mosel-Vitelix, Ti-Acer, and United Microelectronics Corporation. Liang holds a Bachelor of Science in physics from National Cheng Kung University and an MBA from National Taiwan University.
Indium Corporation Technology Expert to Present at Printed Electronics Europe 2012
Indium Corporation’s, Manager of Marketing & Technology Assessment Robert Ploessl, PhD, will present at Printed Electronics Europe 2012, April 3-4 in Berlin, Germany.
Robert’s presentation, The Future of ITO, describes indium’s ample availability, supply chain, reserves, and data on historic supply and demand. The presentation also explains the outlook for applications using indium, focusing mainly on ITO, and includes a short comparison to competing technologies involving transparent electrode.
Robert is the Product Manager for Metal Compounds and the Manager of Marketing and Technology Assessment for Indium Corporation. He provides customer support to a variety of high-tech industries that consume indium, gallium, germanium, and tin compounds.
Robert earned a doctorate in Physics from the University of Regensburg in Germany and an MBA from the S.C. Johnson Graduate School of Management at Cornell University.
NuSil Technology Presents New Coating for Enhanced Performance in Extreme Temperatures
Optically clear, easy-to-mix coating ideal for engineering applications
NuSil Technology LLC presents R-2183, a low-viscosity silicone elastomer dispersed in xylene. R-2183 retains elasticity at extremely low temperatures, as well as resists breakdown at elevated temperatures up to 300ºC.
R-2183 can be sprayed, knife coated, or spin cast to create a versatile, flexible coating with excellent physical properties. For instance, R-2183 exhibits a tear strength of 175 ppi (30.9 kN/m), a tensile strength of 1,550 psi (10.7 MPa), and an elongation of 800%. A tough, optically clear material, it is great for use as an encapsulant and can also be heat cured into a thin elastomeric film.
“R-2183’s broad operating temperature range of -140ºC (-220°F) to 300ºC (572°F) makes it an ideal coating in engineering applications involving extreme heat or cold,” said Brian Burkitt, Product Director – Engineering Materials.
R-2183 is a two-part, addition cure silicone dispersion with a 1:1 mix ratio for ease of use.
Axus Technology Announces 300mm CMP Development & Foundry Services Agreement with Fraunhofer
Axus Technology, an Arizona-based supplier of CMP and wafer thinning equipment and process services, has announced an agreement with the Fraunhofer IZM and Fraunhofer CNT technology centers, located in Dresden, Germany, that will provide advanced 300mm process development and foundry services for North American customers.
This exclusive arrangement is currently focused on process and metrology services for CMP, substrate thinning, and related process technologies for 300mm wafers, with additional processes being offered in the future.
As part of the agreement, Axus Technology will provide local process support to North American customers, defining the foundry or development work to be provided, and work directly with Fraunhofer engineering teams to complete the processing.
The Fraunhofer facilities offer state-of-the-art process capability along with high-level engineering expertise. Utilizing the Fraunhofer IZM and Fraunhofer CNT capabilities will now allow 300mm customers in North America to take advantage of the advanced equipment, technology, and level of expertise resident at these sites.
Process services range from the routine processing of small batches of 300mm wafers, detailed design and development services, through foundry processing of production lots of material. CMP process work will be accomplished in both facilities using Applied Materials Reflexion LK 300mm CMP tools, as well as the extensive metrology capabilities, ranging from defectivity analysis and film thickness measurements, through detailed analytical techniques, including various microscopy, spectroscopy and X-ray analysis tools.
The Axus Technology development and foundry facility delivers process services for a range of substrates and film technologies for diameters of 200mm down to die-size samples. This arrangement extends process capability into the 300mm scale and capitalizes on the Fraunhofer team's expertise in advanced manufacturing processes, especially as related to improved formfactor and 3D integration technologies.
"This agreement is the result of our growing work together in CMP and wafer thinning technologies," stated Barrie VanDevender, Vice President of Sales & Marketing for Axus Technology. "The technology experts within Fraunhofer CNT and Fraunhofer IZM deliver industry-leading expertise to the various projects they manage. Coupled with the experience and insight of the Axus Technology engineering team, this is a very promising opportunity for us to work together for the benefit of our customers."
Iris Labadie is a Market Development Specialist working in the Marketing and New Product Development Group for Kyocera America, Inc. She has held several engineering positions in the microelectronics industry in both defense and commercial companies. She has a B.S. in Information Technology and an MBA from the University of Redlands. Her current focus is on new semiconductor devices and materials and related future packaging technology and assembly methods.
I. Labadie / Kyocera America, Inc.
MORNING SESSION – 9:30AM TO 12:00PM
Material Choices for Electronic Packaging
1. Types of materials used in commercial and high-reliability packages
2. Cost vs. Performance
Manufacturing Technical Ceramics
1. Ceramic Basics
a. Ceramics compared to glass, metals, crystal (atomic, structural differences)
b. Ceramic fabrication
i. Raw material preparation – why it makes a difference in the final product
ii. Manufacturing methods: Pressed vs. Tape
iii. Firing Ceramic
2. Metallization of Ceramics
a. Post-fired vs. Co-fired
b. Types of Metallization and Inks Used
a. Brazing Ceramic and Metal Components (how and why it works)
b. Different braze material used for packages
c. Furnaces and Fixtures
a. How and why we need to plate packages
b. Plating process – electroless vs. electrolytic
5. Final Product & Utilization
i. Wirebond, Die Attach, Sealing, Test
LUNCH PROVIDED – 12:00PM TO 1:00PM
AFTERNOON SESSION – 1:00PM TO 3:30PM
Electronic Packages: Types and End Applications
1. Standard Outlines, Custom Packages, Hermetic
2. Telecom, High Frequency (RF & mmW), Hi-Rel, Automotive