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:: Corporate Member News ::

THANK YOU to our IMAPS 2012 Exhibitors and Sponsors...

:: Come Visit F&K Delvotec at IMAPS 2012 (full story)

:: West Bond on Display at IMAPS San Diego (full story)

:: Stop By the Quik-Pak Booth Next Month (full story)

:: Be Sure To Visit Newport During IMAPS 2012 (full story)

:: Stellar Industries Is Exhibiting at IMAPS 2012 (full story)

:: ALLVIA, Inc. provides Silicon Interposer and Through-Silicon Via (TSV) foundry services (full story)

:: Palomar at IMAPS 2012 and Offering a Complimentary Webcast: High-Reliability Component Attachment Process for <5µm Placement Accuracy (full story)

:: For the latest in innovative UNDERFILLS, ENCAPSULANTS and ADHESIVES see Namics at booth 214 (full story)

:: AI Technology Exhibiting at IMAPS 2012 (full story)

:: Interplex's Solderless SMT Card-Edge Connector (full story)

:: Hesse & Knipps Introduces 3 Mil Wire Capability for Heavy Wire Bonder (full story)

:: ESL ElectroScience Exhibiting in San Diego (full story)

:: Polysciences, Inc. produces a unique array of microelectronic grade encapsulants, adhesives, coatings and potting compounds (full story)

:: Zeon Corporation and Zeon Chemicals L.P., USA have developed two innovative state of the art packaging materials (full story)

:: NorCom Systems, Inc. manufactures Optical Leak Test (OLT) equipment (full story)

:: Hi-Rel Laboratories at IMAPS 2012 (full story)

:: Visit Royce Instruments at IMAPS 2012 Booth 308 to See How the New Royce 600 Series Bond Test Instruments Can Meet the Latest Testing Challenges (full story)

:: NDC is an ISO certified Tool, Mold and Die manufacturer specializing in tooling and equipment (full story)

:: High Accuracy, R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 (full story)

:: Interconnect Systems, Inc. (ISI) is a leading provider of advanced electronics packaging and interconnect solutions (full story)

:: Visit Kulicke & Soffa at Booth #111 at IMAPS 2012 (full story)

:: MASTERBOND - New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved (full story)

:: Metrigraphics supplies high precision custom components for designers and builders of medical and analytical instruments and devices (full story)

:: SOURIAU PA&E Announces New Hermetic Mini-Micro-D (full story)

:: Indium Corporation Focuses on Flux-Coated Solder Preforms at IMAPS 2012 (full story)

:: Dai Nippon Printing Co. Ltd. (DNP) exhibits following microelectronics products in IMAPS 2012 (full story)

:: East China Research Institute of Microelectronics (ECRIM) at IMAPS 2012 (full story)

 

MST

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

NATEL - Platinum Sponsor
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver
LORD - IMAPS Cafe Sponsor
Kyocera America - GBC Forum/Reception Sponsor
Sikama - GBC Forum/Reception Sponsor

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Come Visit F&K Delvotec at IMAPS 2012

F&K Delvotec offers unmatched technology leadership and unmatched customer service on our entire product line of CONVERTIBLE Auto and Semi-Auto wire bonders. We have a model for every wire bonding technology. Including, Heavy Wire, Heavy Ribbon, Fine Wire, Fine Ribbon, Ball Bonding, TAB, Deep Access, Hybrids, COB, RF Devices, Microwave Applications. Our table top convertible bonders offer 3 MINUTE quick change bond heads with no hand tools required. As an Industry leader offering unique solutions, we developed an auto bonder that converts to an auto pull/shear tester in 3 minutes. We also offer Ultrasonic/Transducer test equipment. Come visit the number one rated wire bond equipment supplier and learn what is possible. 

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West Bond on Display at IMAPS San Diego

Design and Manufacturer of Automatic, Semiautomatic, and Manual ESD Protected Microelectronic Assembly and Test Equipment, and Accessories, Since 1966.  Ultrasonic, Thermosonic, and Thermocompression Wire/Ribbon Bonders, Eutectic and Epoxy Die Bonders, Insulated Wire Bonders, and Pull Testers, LED Illuminators, Heated and Cold Workholders, Temperature Controllers, Ultrasonic Transducers, Ultrasonic Power Supplies, and Wire Despoolers.  Visit:  www.westbond.com

 

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Stop By the Quik-Pak Booth Next Month

Quik-Pak, a division of Delphon Industries, provides IC packaging and assembly services. The company’s newest offering is its OmPP package. These pre-molded QFN packages are cost-effective, come in a variety of sizes and are ideal for prototype or production volume applications. Quik-Pak also specializes in a variety of services that together provide a full turn-key solution including wafer preparation, die/wire bonding, remolding and marking/branding. Custom assembly services are also offered for Flip Chip, Ceramic Packages, Chip-on-Board, Stacked Die, MEMS, etc.

 

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Be Sure To Visit Newport During IMAPS 2012

Newport is a leading supplier of high precision dispense and assembly equipment for the microelectronics industry offering systems for the manufacture of Microwave, Optical, MCM’s and MEM’s devices. With over two decades of advanced packaging application experience, Newport products support multiple interconnect technologies, including epoxy die bonding, eutectic attach, flip chip and thermocompression. The ultra-precision Newport MRSI-M5 with 5 micron accuracy, the MRSI-M3 with 3 micron accuracy and the MRSI-705 Assembly Work Cells are scalable from R & D to volume production and provide the maximum in flexibility for all types of complex assembly.  The Newport MRSI-175Ag Epoxy Dispenser is the leader for high precision conductive epoxy dispensing including 125 micron dots.

 

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Stellar Industries Is Exhibiting at IMAPS 2012

A Fabricator of precision Submounts utilizing materials such as AlN, BeO and Al203.  Specializing in high conductivity copper used for all electronic packaging where high power and thermal performance are necessary.  Vapor deposited AuSn is also offered to assist in the assembly processes.

 

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ALLVIA, Inc. provides Silicon Interposer and Through-Silicon Via (TSV) foundry services

ALLVIA, Inc. provides Silicon Interposer and Through-Silicon Via (TSV) foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects.  2.5D, 3D and System-in-Package (SiP) solutions.  ALLVIA, a leader in TSV development, provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias.  With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

 

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Palomar at IMAPS 2012 and Offering a Complimentary Webcast: High-Reliability Component Attachment Process for <5µm Placement Accuracy

Complimentary Webcast: High-Reliability Component Attachment Process for <5µm Placement Accuracy

Listen in as Donald Beck, Palomar Technologies Assembly Services™ General Manager, presents a process solution for automating sub-5µm component attach specific to organizations requiring high-reliability device packaging. In this webinar, Mr. Beck will cover methods that have been proven through real-world experiences related to the high-reliability microelectronics industry.

http://imaps.org/webcasts/2012may_palomar.htm

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For the latest in innovative UNDERFILLS, ENCAPSULANTS and ADHESIVES see Namics at booth 214

NAMICS Corporation is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells.  NAMICS subsidiary, DIEMAT, Inc. located in Byfield, MA, specializes in the development of innovative thermally conductive adhesives and sealing glasses.  Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore, Korea, Taiwan and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.

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AI Technology Exhibiting at IMAPS 2012

The biggest concern in using thermal grease (traditionally made of silicone liquid as a binder) is the proven concern of “pumped out” or “dry out” over thousands of thermal cycles in computer processor applications.

A more reliable grease to use against such “pumped” out phenomenon is to use a thermal that is NOT SILICONE based and preferably binder liquid that has higher surface tension liquid polymers. COOL-GREASE™ series of silver (COOL-SILVER G3), ceramic blends (COOL-GREASE ZX) and diamond (CGR7019-LB) (available from AI Technology, Inc.) thermal greases are made of non-silicone and liquid resins similar to epoxy resins. These have been proven to have the best perforance in direct competition for the gaming communities that are looking for even the smallest difference in temperature rise on their CPU and GPU. Full White Paper.

 

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Interplex's Solderless SMT Card-Edge Connector

Interplex’s new Solderless SMT Card-Edge Contact is a discreet pick and place SMT component that creates a solderless edge card interconnection for PCB daughter card applications. These SMT Card-Edge contacts can be placed on a daughter card using standard SMT process technology and high-speed pick and place surface mount equipment.

http://www.interplex.com/global/index/card-edge-connectors-press-fit-landing

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Hesse & Knipps Introduces 3 Mil Wire Capability for Heavy Wire Bonder

Hesse & Knipps, Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, will demo a new 3 mil wire bonding capability on its BJ935 Fully Automatic Heavy Wire Bonder at the upcoming 45th International Symposium on Microelectronics (IMAPS) in Booth No. 210. Addressing the worldwide increase in demand for 3 mil wire, Hesse & Knipps enhanced the capabilities of its BJ935 Heavy Wire Bonder to process gold, aluminum and copper bonding wire with diameters from as small as 3 mil up to 20 mil (75 μm up to 500 μm).

 

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ESL ElectroScience Exhibiting in San Diego

ESL ElectroScience specializes in providing solutions to enable customers to take technologies from concept through high volume production using thick film pastes and ceramic tapes. ESL products can be found in hybrid microcircuits, multilayer microelectronics, transformers, thick film heaters, sensors, and fuel cells. Founded in 1962, ESL ElectroScience has continued to create manufacturable solutions for the past 50 years. For more information visit us at www.electroscience.com.

 

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Polysciences, Inc. produces a unique array of microelectronic grade encapsulants, adhesives, coatings and potting compounds

Polysciences, Inc. produces a unique array of microelectronic grade encapsulants, adhesives, coatings and potting compounds to meet the high performance requirements of the electronic and semiconductor industries.

Our expanded line of electronics polymers and chemicals includes underfills, liquid encapsulants, die attach and optical adhesives for advanced applications. These ultra pure materials offer a wide selection of performance criteria, including; viscosity, UV or thermal cure, low or high modulus, screen printable, low CTE, green fire retardant, lead free etc., for applications ranging from PBGA, QFP and solar film encapsulations to wafer level coatings.

Additionally, we can provide custom formulation and high purity monomer & polymer synthesis, as well as contract packaging services in ISO 9001 certified facilities.

 

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Zeon Corporation and Zeon Chemicals L.P., USA have developed two innovative state of the art packaging materials

Zeon Corporation and Zeon Chemicals L.P., USA have developed two innovative state of the art packaging materials: 1) “Ultra-Low Loss Build-Up Film” for high speed IC packages and WLP requiring superior electrical properties, and 2) “Ultra-Low Loss PCB Materials” for high speed servers and RF/mobile applications for technology leading devices.  Please visit booth 319 during IMAPS for additional information.

 

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NorCom Systems, Inc. manufactures Optical Leak Test (OLT) equipment

NorCom Systems, Inc. manufactures Optical Leak Test (OLT) equipment, which provides automated in-line, full matrix leak testing of hermetically sealed microelectronic and optoelectronic devices. These innovative systems, eliminate the need for helium mass spectroscopy and gross leak bubble testing by utilizing a patented laser interferometer to simultaneously measure gross and fine leaks in hermetic devices. The equipment provides quantitative leak test results in the industry standard of cc-atm/second helium and is MIL STD approved. The NorCom 2020 is ideal for testing optoelectronic, semiconductor, and PC board mounted devices for military, aerospace and telecommunication applications.

New for 2012, NorCom is introducing their Model 410 gross leak inspection system. This economical system inspects a single device in seconds for gross leaks, eliminating bubble leak testing, and expensive fluorocarbon usage.

Come visit us in Booth 306

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Hi-Rel Laboratories at IMAPS 2012

Hi-Rel Laboratories, Inc. is an independently owned and operated corporation whose main concentration of activity is in the materials evaluation of the micro-electronic oriented phases of commercial, aerospace and defense industries.  We specialize in the solution of process, production and application problems requiring knowledge and experience in such diverse fields as microelectronics and materials technology.  Using proven analytical techniques such as metallography, light and scanning electron optics coupled with energy dispersive spectroscopy, FTIR and FIB, we are able to isolate and solve your materials related issues.

The largest activity in the laboratory is the performance of DPA testing for a wide variety of commercial, civil, and military space programs.  Hi-Rel was the first commercial test lab in the U.S. to perform DPA testing in a support role to "in house" OEM Laboratories beginning in 1972.  We also have over 40 years of experience in performing root cause failure analysis of electrical and electronic components; from passive components like resistors, inductors and capacitors, to transistors, integrated circuits and hybrids.  In response to industry requests, Hi-Rel also offers non-electrical testing upgrade services such as  P.I.N.D., Real-time Radiography, Hermeticity testing, and Dot Marking. All operations are carried out in our 100% ESD protected Upgrade services Lab.

 

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Visit Royce Instruments at IMAPS 2012 Booth 308 to See How the New Royce 600 Series Bond Test Instruments Can Meet the Latest Testing Challenges

Royce Instruments’ launch of the new 600 Series bond test instruments brings unparalleled networking capability and scalability to the bond test market.  With a choice of three bond testers (610, 620, and 650), Royce offers an instrument solution to meet the evolving needs of manufacturers and institutions worldwide.  Building upon over 20 years of experience in bond tester design, the Royce 600 Series combines the latest networking technology with the precision and performance customers have come to trust.

The Royce 610 Dedicated Wire Pull Bond Tester offers an affordable option for wire pull testing up to 100 gf, while the Royce 620 Multitest Bond Tester provides the functionality for today’s most common tests performed quickly on a manual manipulator platform.  The Royce 650 Universal Bond Tester provides a robust platform upon which to perform the widest range of applications, including custom tests.

The new centralized database option allows multiple Royce 600 Series instruments to operate from a single database stored on a standalone Royce SurePC with Windows 7.  This provides one access point for data back-up, as well as the flexibility to begin testing on one system and resume testing or access data on another.  Any combination of Royce 600 Series instruments can operate from the centralized database, which can be connected to a corporate network for easy access of data.

To see a demonstration of the Royce 620 Multitest Bond Tester and discuss how the Royce 600 Series can meet the challenges of your bond test application, please visit Royce Instruments in Booth 308 at IMAPS 2012.  Can’t make the show? Please contact Royce Instruments via email at sales@royceinstruments.com, phone at +1-707-255-9078, or online at www.royceinstruments.com.

 

 

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NDC is an ISO certified Tool, Mold and Die manufacturer specializing in tooling and equipment

NDC is an ISO certified Tool, Mold and Die manufacturer specializing in tooling and equipment used in building Semiconductors, Electronic components and a wide variety of the devices used in automotive, telecommunications, solar and medical applications.

We offer specializing equipment built for today’s high-tech semiconductor, assembly processes.  Find out what the NDC companies can do to make your products better and your life easier.

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High Accuracy, R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012

FINETECH will showcase the sub-micron accuracy FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS Exhibition, scheduled for September 11-13 in San Diego, California.

The FINEPLACER® Lambda is ideal for low-volume, prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding placement accuracy (down to 0.5 µm). This versatile system can be used for precise placement, die-attach and advanced packaging utilizing various bonding technologies -- soldering (Eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, gold/tin laser bar bonding, adhesives and UV curing. Options are available for inert atmosphere and forming gas.

Applications include flip chip, 3-D packaging, MEMS, wafer level packaging (C2W), optoelectronic and micro optics bonding and assembly, sensors and more.

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Interconnect Systems, Inc. (ISI) is a leading provider of advanced electronics packaging and interconnect solutions

Interconnect Systems, Inc. (ISI) is a leading provider of advanced electronics packaging and interconnect solutions for top-tier OEMs in a wide range of industries including military/aerospace, computing/telecom, medical, industrial, and automotive. ISI pioneered the concept of Next Level Integration, an alternative design path that integrates at the module level rather than the silicon level, resulting in lower production costs and faster time-to-market. ISI’s breadth of products includes miniaturized FPGA systems, 3D packaging, high density modules, IC obsolescence adapters, and standard/custom interconnect solutions. The company’s in-depth design and process development knowledge and extensive manufacturing capabilities allow it to quickly execute on Next Level Integration projects and thus provide a comprehensive turnkey solution for its customers.  Come visit us in Booth 211 at IMAPS 2012!

 

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Visit Kulicke & Soffa at Booth #111 at IMAPS 2012

K&S is exhibiting at the conference and also presenting two papers: “Copper Wire Bonding: R&D to High Volume Manufacturing” and “Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing.”

Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of power hybrid and semiconductor assembly equipment. As one of the pioneers of the industry, K&S has provided customers with market leading packaging solutions for decades. In recent years K&S has expanded its product offerings through strategic acquisitions, adding die bonding, wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation devices.

For additional information, you may also visit our website at www.kns.com.

 

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MASTERBOND - New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved

Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMED epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications.

This silver-filled epoxy adhesive/sealant has remarkable electrical conductivity with a volume resistivity less than 0.001 ohm cm. Serviceable over the wide temperature range of -60°F to 400°F, EP3HTSMED is resistant to severe thermal cycling and many chemicals including water, fuels, oil, and most organic solvents.

EP3HTSMED is a thixotropic paste and has a specific gravity of 2.90 at 77°F. It requires no mixing and needs only contact pressure during a simple heat cure of 20 to 40 minutes at 300°F or 40 to 90 minutes at 250°F. With minimal shrinkage during cure and a Shore D hardness of 60 to 80, EP3HTSMED bonds well to a variety of substrates including metals, glass, vulcanized rubbers, ceramics, and many plastics.

Silver in color, this one component adhesive is packaged in syringes or glass jars. EP3HTSMED has a shelf life of 6 months in a glass jar and a shelf life 3 months when stored in a syringe at room temperature.

Master Bond High Strength, Electrically Conductive Adhesives

Master Bond EP3HTSMED offers exceptional thermal and electrical conductivity while fully meeting USP Class VI requirements. This no mix epoxy adhesive has versatile, rapid cure schedules. Read more about Master Bond’s electrically conductive adhesives at  http://www.masterbond.com/properties/electrically-conductive-adhesive-systems or contact Master Bond’s Technical Support Team by phone at +1-201-343-8983, by fax at +1-201-343-2132 or by e-mail at techinfo@masterbond.com. 

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Metrigraphics supplies high precision custom components for designers and builders of medical and analytical instruments and devices

Metrigraphics supplies high precision custom components for designers and builders of medical and analytical instruments and devices. They apply their core technologies of electroforming, photolithography and thin-film sputtering to help customers increase the performances, accuracy, and reliability of state-of-the-art products. Their process technologies are used to fabricate microflex circuits, induction coils and precision mechanical components.

 

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SOURIAU PA&E Announces New Hermetic Mini-Micro-D

27% Lower Profile than Standard Micro-D Connectors

Design engineers who need to reduce component size and weight without compromising electrical performance have a new hermetic connector option, following the release of SOURIAU PA&E’s new Mini Micro-D Connector.

These new Mini-Micro-D connectors are designed for space, airborne, down-hole oil and any other hermetic applications where reducing size and weight are priorities. They have a 27% lower profile than standard Micro-D connectors and are designed to be laser welded into aluminum, titanium or kovar housings. These new hermetic connectors are MIL-PRF-83513/7 interface compliant and mate with connectors manufactured to MIL-PRF-83513/8.

SOURIAU PA&E’s Mini Micro-D connectors can be configured with 9, 15, 21, 25, 31 and 37 pin counts. Its beryllium-copper pins support 600 VAC and 3A per pin and each pin is hermetically sealed with SOURIAU PA&E’s polycrystalline ceramic, Kryoflex®. They provide greater than 5,000 megohms of insulation resistance at 500 VDC and exhibit no evidence of dielectric withstanding voltage breakdown when tested in accordance with MIL-STD-1344, Method 3003. These new hermetic Micro-D connectors have a leak rate of less than 1X10-9 cc/second of helium at one atmospheric differential pressure and will operate reliably at temperatures from -65º C to 200º C.

CAD models and detailed drawings for hermetic Mini Micro-D connectors are available here (part number 94594).

For more information about this new hermetic Mini Micro-D connector from SOURIAU PA&E, or to learn more about the company’s other interconnect products, EMI filters, and integrated electronic packaging capabilities, contact SOURIAU PA&E at 509-664-8000 or visit us at http://www.pacaero.com.

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Indium Corporation Focuses on Flux-Coated Solder Preforms at IMAPS 2012

Indium Corporation will be exhibiting at the 45th IMAPS Symposium on September 9-12 in San Diego, California.

In addition to their full line of engineered solder products, Indium Corporation will focus on solder preforms with superior flux coatings that minimize voiding, and gold and gold alloy solder preforms that offer superior flatness in high-power die-attach applications. Indium Corporation’s experienced technical support engineers will be available to help customers design customized solutions for unique applications.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, performs, and fluxes; brazes; sputter targets; indium, gallium, and germanium metals and inorganic compounds; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

Indium Corporation will be exhibiting in booth number 329.

 

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Dai Nippon Printing Co. Ltd. (DNP) exhibits following microelectronics products in IMAPS 2012

Embedded B2itTM PWB:
DNP is the world first embedded PWB supplier who started the production since 2006.  Active and Passive devices embedded B2itTM Printed Wiring Board (PWB) are applicable for 3-D jisso electronic products. DNP Embedded B2itTM PWB has advantages on miniaturization, performance improvement and function multiplying.

Advanced Lead Frames for Leadless Packages:
DNP provides lead frames for leadless packages such as Dual-row QFN and LGA which are used to reduce those package sizes for semiconductor products from LSI to discrete devices to LED. DNP is advantageous on fine and accurate processing technologies to work out thin and fine packages.

Advanced Microstructure using 3-Layer Material (SST-PI-Cu):
DNP provides advanced microstructure using thin 3-layer material, which consists of stainless steel, polyimide and copper. All the 3 layers can be processed with subtractive method. It has excellent spring characteristics with SST, Cu trace design flexibility and electric isolation between SST and Cu with polyimide.

 

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East China Research Institute of Microelectronics (ECRIM) at IMAPS 2012

East China Research Institute of Microelectronics (ECRIM) was founded in 1968 and has more than 40 years experience in developing, manufacturing and sales of variety products engaged in Microelectronics and Packages. ECRIM has more than 1000 employees which includes 500 engineers. ECRIM is known for its technical strength, proven product reliability, innovative solutions, quick response, competitive pricing and overall value. We have seven product lines including LTCC, AIN/HTCC, Thick Film, Thin Film, Metal Hermetic Package and Furnace

ECRIM has been certified by quality management systems ISO9001, ISO14001 and ISO28001. Our products and services have being highly recognized by customers from more than 30 countries/regions.

 

 

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View the Corporate Bulletin Archives

Quik-Pak
RGL Enterprises
QSIC

 


:: Issue 127 ::
August 16, 2012

COHERENT

Master Bond

LORD Corporation

RGL Enterprises

EPP

Amkor