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:: Corporate Member News ::

:: Technic Releases New Goldeneye Barrier Layer System for High Speed Connector Electroplating (full story)

:: STATS ChipPAC Honoured with Second Consecutive Supplier of the Year Award from Cirrus Logic (full story)

:: New GORE® Protective Vent Improves Reliability of Small Electronic Displays (full story)

:: LORD Corporation Develops New Flame-Retardant Urethane Encapsulant (full story)

:: News from Heraeus (full story)

:: Master Bond’s Flexibilized, Thermally Conductive One Part B-Stage Epoxy Resists High Temperatures (full story)

 

MST

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Technic
Heraeus
LORD Corporation

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Technic Releases New Goldeneye Barrier Layer System for High Speed Connector Electroplating

Technic Inc. has announced the commercial release of its Goldeneye Barrier Layer System specifically engineered for improved corrosion resistance in high speed reel-to-reel connector applications. Goldeneye’s Barrier Layer System is a newly developed universal metal stack, designed to enhance functionality of subsequent precious metal deposits. The System enables the deposition of application specific options from a universal base electrolyte through the use of specifically designed additives.

Metal Stack options include:

1. Goldeneye Nickel – a low stress, highly corrosion-resistant nickel plating process capable of operating at high current densities from a proprietary electrolyte.

2. Goldeneye Nickel ORC – protects over-plated bright tin from discoloration during thermal exposure (e.g., reflow).

3. Goldeneye Level Nickel – enables deposition of a leveled, fully bright nickel deposit at high current densities. Deposit properties, such as hardness and corrosion resistance, are further enhanced with use of Goldeneye Level Nickel.

“Our Goldeneye technology platform continues to receive universal acclaim in our target markets. The Goldeneye Barrier Layer System is a significant step forward in providing superior end product performance in an extremely easy to use electrolyte platform. This technology enables significant advancement in precious metal reduction goals for high reliability applications.”

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STATS ChipPAC Honoured with Second Consecutive Supplier of the Year Award from Cirrus Logic

For the second consecutive year, STATS ChipPAC has been honoured with the “Supplier of the Year” award from Cirrus Logic, Inc., a leader in high-precision, analog and mixed-signal processing components.

"Cirrus Logic has been on a sharp growth trajectory in 2012, and STATS ChipPAC has continuously demonstrated its ability to deliver exceptional manufacturing performance, quality and responsiveness,” said Randy Carlson, Vice President of Supply Chain Management. “Their superior teamwork has allowed Cirrus to effectively and consistently deliver new products to the market and quickly ramp production volume to meet our customers’ expectations.”

Cirrus Logic’s innovative mixed-signal audio products can be found in a wide range of consumer applications, such as portable media players, smartphones and tablets, and the company’s new-generation of LED controllers is setting the standard for dimmer compatibility. STATS ChipPAC provides advanced wafer level packaging and test services for Cirrus Logic’s fastest growing portable audio solutions. 

"We share Cirrus Logic’s commitment to performance and innovation, and are very proud to be recognised as their Supplier of the Year for the second year in a row. STATS ChipPAC’s technology leadership in mobility solutions, proven manufacturing excellence and integrated turnkey solutions provide our customers with a sustained competitive edge in the market," said Hal Lasky, Executive Vice President and Chief Sales Officer, STATS ChipPAC. “It has been our honour to support Cirrus Logic as they continue to build on their leadership and success in portable audio devices for smartphones and mobile consumer electronics.”

For more information, please visit www.statschippac.com.

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New GORE® Protective Vent Improves Reliability of Small Electronic Displays

W. L. Gore & Associates has expanded its line of adhesive vents with a new product specifically engineered for small enclosures, such as displays for electric bikes, mobility aids, and heavy duty equipment. With the smallest footprint in the GORE® Protective Vent line, the VE80205 vent improves the integrity, reliability and safety of electronic components in harsh weather by equalizing pressure and reducing condensation.

Despite the limited amount of free space and air volume inside small enclosures, sudden changes in environmental conditions can cause internal pressure to build up, sometimes as much as 200 mbar (3 psi). This level of pressure differential can put significant stress on seals, eventually causing them to fail. The VE80205 vent rapidly equalizes the internal pressure by allowing air to flow freely into and out of the enclosure. In addition, the breathable membrane that is incorporated into the vent reduces condensation by allowing moisture vapor to escape from the enclosure. At the same time, this membrane protects the electronics from liquids and particulates by providing a durable barrier that meets IEC’s IP67 standard.

Available in standard packaging of five parts across a 41-millimeter wide carrier, the two-by-five millimeter (2.0 x 5.0 mm) VE80205 vent has a typical airflow of 103.62 ml/min/cm2 and is constructed with a robust adhesive that withstands challenging environments and adheres to different product surfaces. This durable construction enables the vent to be installed manually or with an automated process on either the internal or external wall of the enclosure without compromising its performance.

According to Jason Zambotti, Gore’s North American product specialist for GORE® Protective Vents, the VE80205 vent was engineered in response to the continuing addition of small motors and electronics to various means of personal transportation. “Today’s consumers expect more features in smaller enclosures that are used outdoors for personal transportation and heavy equipment,” explains Zambotti. “For more than 20 years, our global R&D and engineering support teams have collaborated with product developers to improve the reliability and performance of sophisticated electronics in some of the most rugged environments. Our experience and understanding of these challenges enables us to deliver reliable venting solutions that improve product quality and increase customer satisfaction.” For more information about Gore’s full line of venting products, visit www.gore.com/protectivevents.

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LORD Corporation Develops New Flame-Retardant Urethane Encapsulant

LORD Corporation has announced the availability of a new flame retardant urethane encapsulant for the electronic materials industry.

Specially designed for encapsulating and casting applications, LORD Thermoset UR-288 encapsulant cures at room temperature to produce a flame-retardant, semi-flexible material. This new urethane encapsulant exhibits low shrinkage and stress on components as it cures, and maintains a low viscosity for complete and void-free encapsulation. Suitable for curing at room temperature, Thermoset UR-288 produces low exothermic heat rise during cure. Further, it provides excellent thermal shock resistance.

According to Jim Grieg, Sales and Marketing Manager, Electronic Materials, Thermoset UR-288 was designed in response to increasing market demand for flame-retardant urethane materials.

More information on LORD Thermoset UR-288 can be found at http://www.lord.com/electronicmaterials.

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News from Heraeus

Celcion Reliability Study

In preparation for the growth of the Celcion product line, aggressive reliability testing was implemented to confirm the robustness of the system. Because traditional printed circuit boards (PCBs) are the norm in today's LED market, Celcion must perform as good or better to be a competitive player in all LED market segments. The goal of the Celcion product line is to offer customers unparalleled thermal performance along with reliable circuits.
Celcion is a thick film materials system that electrically insulates aluminum substrates. With Celcion, circuits can be built directly onto aluminum substrates, eliminating the need for thermal interface materials. This allows Celcion circuits to run 10°cooler than traditional PCBs.

The tests that were performed included 150°C Thermal Aging (1000 hours), 85% Relative Humidity/85°C Environmental Chamber (1000 hours), and -55°C to +150°C Thermal Cycling (1000 cycles). The materials that were tested included IP6075 (dielectric material) and C8829D (conductive material).

Because the goal was to test these materials under worst case scenario conditions, no solder mask was used to protect the materials during testing. All materials surpassed PCB market standards and have been accepted by multiple customers.

Full results are provided in the updated Celcion Design and Processing Guide upon request.

REACH Compliant End Terminations

Heraeus has started a meaningful step towards developing end terminations that are fully REACH/RoHS compliant. We offer many solderable end terminations with varying metal content that are Pb/Cd- and phthalate-free. In addition, Heraeus offers Pb/Cd- and phthalate-free, pure Ag plateable end terminations that can be fired from 500°C to as high as our standard firing temperatures.

Solderable End Terminations
ET1801B (Ag/Pd + 1%Pt)
ET1803B (Ag/Pd + 3% Pt)
ET1813 (Ag + 3% Pt)
ET1850 (Ag/Pd) 4/1
ET1812A (Ag + 1% Pt)
ET1845 (Pure Ag)

Plateable End Terminations
ET1893 Low temp (Pure Ag)
ET1894 (Pure Ag)
ET1895 (Higher viscosity version of ET1894)
ET1850 (Ag/Pd) 4/1

 

The benefits of our pure Ag plateable end terminations are better electrical conductivity, and excellent acid and solder leach resistance without the high cost of Pt or Pd in the end termination. Heraeus has made concerted efforts to provide the marketplace with end terminations that are fully REACH compliant in consideration of future environmental concerns.

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Master Bond’s Flexibilized, Thermally Conductive One Part B-Stage Epoxy Resists High Temperatures

Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. This flexible, heat resistant epoxy has superior mechanical properties.

Serviceable over the wide temperature range of -80°F to +500°F, EP36AO provides high performance in harsh conditions. Once cured, it features solid electrical characteristics including a dielectric strength of 400 volts/mil, a volume resistivity of 2-3 x 1012 ohm-cm and thermal conductivity of 9-10 BTU•in/ft2•hr•°F at 25°C. This system has a coefficient of thermal expansion exceeding 75 in/in x 10-6/°C at 60°C and a tensile strength of over 2,000 psi. EP36AO is a capable adhesive and coating that adheres well to both metallic and non-metallic substrates and it features long-term chemical resistance to an array of organic and inorganic chemicals.

As a one component system, EP36AO doesn’t require any mixing and offers the convenience of flexible cure schedules. A typical gel time is 30 minutes at 180°F, with full cures attained in 2-2½ hours at 300°F. This can be shortened further at higher temperatures. EP36AO will retain its liquidity as long as the temperature does not exceeed 180°F.  It is supplied as a solid and has a minimum shelf life of three months but can last as long as six months in its original unopened container. EP36AO is available in pints, quarts, gallons and five gallon containers. It is now also available in conveniently prepared 30 gram cookies.

Master Bond Thermally Conductive Compounds

Designed for demanding electrical, bonding, coating, potting and encapsulation applications, Master Bond EP36AO offers high temperature resistance, thermal conductivity, electrical insulation and flexibility. Read about Master Bond’s thermally conductive epoxies at http://www.masterbond.com/properties/thermally-conductive-epoxy-adhesives.

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View the Corporate Bulletin Archives

 

Quik-Pak
RGL Enterprises
QSIC

 


:: Issue 134 ::
December 17, 2012

F&K Delvotec

Master Bond

LORD Corporation

RGL Enterprises

EPP

Amkor