Crane AE Banner
:: Corporate Member News ::

:: Tom Green from TJ Green Associates LLC explains ….Why Three Monolayers of Moisture are Important (full story)

:: Master Bond’s Chemically Resistant, Optically Clear Adhesive Cures upon Exposure to UV Light (full story)

:: STATS ChipPAC Announces Expansion Plans in South Korea (full story)

:: TechSearch International Establishes Scholarship (full story)

:: Nordson YESTECH Wins New Contract with EBW Electronics to Supply Additional FX Series Automated Optical Inspection Systems (full story)

:: LORD Corporation Recognized as One of the Fastest-Growing Companies in the Research Triangle (full story)

:: Advanced Non-Etching Adhesion Promoter for Next Generation IC Packaging from Atotech (full story)

:: EV Group Completes Cleanroom Expansion, Opens New R&D Labs And Customer Training Center At Corporate Headquarters (full story)

:: Amkor, 45 Years of Innovation in IC packaging Enhanced in 3D Packaging (full story)

:: DuPont Microcircuit Materials Introduces New Low Cost Conductive Inks for Printed Electronics (full story)


:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

TechSearch International

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

Tom Green from TJ Green Associates LLC explains ….Why Three Monolayers of Moisture are Important

The deleterious effects of moisture on microelectronic components are well-known. Failure modes involving moisture include metallization corrosion, electrical leakage/device instability, stiction in MEMs, metal migration, fogging in electro-optics, performance issues in RF microwave modules, and vacuum deterioration in packages
sealed at reduced pressure.

Minimum thresholds of moisture required to activate the first four failure modes above depends on device type and design, composition and morphology of material surfaces, levels of surface cleanliness, and other factors.

It is frequently mentioned that three monolayers of adsorbed water molecules are the threshold condition for supporting electrical conduction across a surface.1-3 This kind of surface electrical effect can lead to parametric instability of devices, or galvanic action that corrodes and/or causes metal migration that physically damages critical metallization runs, contacts, or wire-bonded connections.

Three monolayers of water molecules do not seem like very much. Based on a typical diameter of about 2.8 Angstroms for a water molecule, three monolayers would be a layer of molecules only about 8 Angstroms thick. So there is a question as to how conductive three monolayers of water can be.

The initial work was done by Aaron DerMardrosian Sr, but was hard to trace. Bob Lowry and I pulled together Aaron's work and coupled it with others that describes the scientific basis and more importantly the references to back up this claim.

Click here to download a complete copy of the White Paper

Check out TJ Green’s complete line up of Public Training Courses for 2013

   ^ Top

Master Bond’s Chemically Resistant, Optically Clear Adhesive Cures upon Exposure to UV Light

Developed for demanding bonding, coating, and sealing applications, Master Bond UV15-7 produces non-yellowing, tough and durable bonds. This one component adhesive is 100% reactive and doesn’t contain any solvents or diluents. It offers excellent adhesion to a wide variety of substrates including glass, metals, ceramics and most plastics.  Particularly noteworthy is its superior bond strength to polycarbonates and polyester films.

Like many UV curable adhesives, UV15-7 offers fast cure rates, ranging from 5 seconds to 3 minutes upon exposure to a UV light source. Maximum UV absorption occurs in the 280 to 360 nanometer range using a 200 Watt/inch medium pressure, mercury vapor lamp. Unlike many UV curable products, UV15-7 is not inhibited by air and cures quickly at ambient temperatures, even in thickness up to 1/8 inch or more.  

Serviceable over the wide range of -60 to +300°F, UV15-7 features a tensile strength exceeding 5,000 psi, a refractive index of 1.55 and a Shore D hardness over 70. Resistant to chemicals and thermal shock, it features a thermal expansion coefficient of 65-70x10-6. With a volume resistivity of 1014 ohm-cm, this low viscosity adhesive offers excellent electrical insulative properties.

Master Bond Optically Clear Adhesives

Master Bond UV15-7 is optically clear, non-yellowing and produces tough, high-performance bonds, seals and coatings for an array of substrates. Read more about Master Bond’s optically clear adhesives at

   ^ Top

STATS ChipPAC Announces Expansion Plans in South Korea

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Company has signed a non-binding memorandum of understanding to invest in a new integrated facility in the Incheon Free Economic Zone, an international business district located in the Incheon metropolitan area that is adjacent to Seoul, South Korea.

The integrated facility will include approximately 95,000 square meters (1 million square feet) of land with options for future expansion. The integrated facility will be used for manufacturing, research and development, and administration. Construction is scheduled to begin in the third quarter of 2013 and the new facility is expected to be operational in the second half of 2015. STATS ChipPAC intends to integrate its existing facilities in South Korea into the new, larger facility to achieve a more efficient, cost effective manufacturing flow and provide flexibility for future expansion.

“STATS ChipPAC Korea is an important strategic manufacturing operation with an illustrious history of delivering the most advanced packaging and test technologies with proven manufacturing capabilities that extend back over 27 years to when the factory was first established. We are very confident that our expansion in South Korea will increase our overall competitiveness in advanced flip chip, advanced wirebonding and three dimensional (3D) packaging technologies where we have established a strong leadership position in the industry,” said Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC.

STATS ChipPAC Korea’s sizeable flip chip technology portfolio ranges from large single die fcBGA packages with passive components used for graphics, CPU and ASIC devices to smaller fcFBGA packages including single die, multi-die and stacked configurations that combine wire bond and flip chip technology within a single package.  In terms of 3D technology, STATS ChipPAC Korea provides advanced Package-on-Package (PoP), Package-in-Package (PiP) and System-in-Package (SiP) technologies that integrate one or more integrated circuits or passives into a single solution for mobile, digital consumer and data storage applications.

“We are proud of the leadership position we have in advanced packaging technologies and the extensive manufacturing experience we have demonstrated over the years.  We are excited to begin a new phase of expansion in South Korea with the opportunity to increase the level of manufacturing efficiency, capabilities and overall capacity for our customers,” said Sang-Jin Maeng, Managing Director, STATS ChipPAC Korea.

For more information, please visit

   ^ Top

TechSearch International Establishes Scholarship

TechSearch International, Inc. announces that in celebration of its 25th anniversary the company partnered with IEEE Women in Engineering Committee (WIE) to establish a scholarship for women going into the field of engineering.

The scholarship, named the IEEE Frances B. Hugle Engineering Scholarship, honors the memory of the distinguished engineer for whom the fund is named.  Frances Hugle graduated from the University of Chicago in 1946 with degrees in chemistry, physics, and philosophy and received her M.Sc. degree from the University of Cincinnati.  She co-founded Hugle Industries, Siliconix, Stewart Warner Microcircuits, Inc. and Opto-Electronics Devices, Inc.  In each of these companies she served as a director of R&D and as chief engineer.  She held 16 known patents in the field of electronics and was one of the pioneers in the invention of tape automated bonding (TAB).

To encourage young women to follow in Hugle’s footsteps, IEEE WIE will select one scholar annually to receive a $2,500 scholarship, beginning as early as 2013.  The scholarship will be presented to one female in her third year of undergraduate study in an engineering curriculum at an accredited university or college in the United States. Student membership in the IEEE is required.

TechSearch International, Inc. and its founder, E. Jan Vardaman, seeded the Scholarship with a $5,000 donation this year.  The objective is to raise $100,000 during the next few years.  We hope that others will join us in supporting young women entering the field of engineering by making a donation.

The IEEE Foundation, a tax-exempt 501(c)(3) organization in the United States, is accepting and managing the donations.  Donations can be made:

  1. Online at by selecting the Frances B. Hugle Memorial Fund
  2. By check payable to the IEEE Foundation – Frances B. Hugle Memorial Fund and mailed to IEEE Foundation, 445 Hoes Lane, Piscataway, NJ, 08854, USA.

To learn more about the IEEE Foundation, visit, call the IEEE Development Office at +1 732-562-3915 or email  For more information on IEEE WIE, visit

   ^ Top

Nordson YESTECH Wins New Contract with EBW Electronics to Supply Additional FX Series Automated Optical Inspection Systems

Nordson YESTECH has announced that it has provided newly upgraded FX Series automated optical inspection systems to EBW Electronics, a full-service contract electronics manufacturer. EBW Electronics will utilize Nordson YESTECH’s FX Series AOI for automated inspection of its printed circuit boards at their state-of-the art facility, located in Holland, Michigan.

Nordson YESTECH was awarded the new contract based on their advanced inspection technology, superior customer support and fast, reliable inspection. EBW Electronics serves a broad customer base in the automotive market and several industrial and commercial markets. EBWE focuses on electronic product design and manufacturing.  Their flexible, high-speed automation lines provide capabilities to support a wide variety of customers from low-volume-high-mix to high-volume-low-mix. The FX Series AOI system is a valuable tool within EBW Electronic’s quality assurance program. Utilized in-line, for post reflow solder inspection of 100% of the products produced, the FX systems allow process control feedback to minimize and contain defects.  Feedback from AOI goes directly back to solder stencil, pick and place, and solder reflow operations for immediate process enhancement. Nordson YESTECH’s user-friendly software was also a key factor in EBW Electronic’s decision, allowing for quick set up of new product inspection, with operators typically take less than 1 hour to create a complete inspection program, including solder inspection.

“The FX Series AOI has been very beneficial to our manufacturing process,” said Corey Steeby, President, EBW Electronics. “Key features of the system, such as the fusion lighting and the oblique cameras, provides us with the detailed inspection we require.  The simple and fast system programming allows us to utilize the equipment effectively for prototypes and during product launches without slowing down our schedules.  The FX has proven to be a very effective yield management and quality control tool for our organization.”

The FX series delivers a complete inspection solution, providing advanced automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. The FX Series AOI is equally well suited for high-volume or high mix manufacturing environments, providing fast throughput and high resolution for inspection of 01005 components. The system utilizes a standard package library to simplify training and ensure program portability across manufacturing lines. Nordson YESTECH’s Advanced Fusion Lighting™ and 5 megapixel image processing technology integrates several techniques, including color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.  And because the FX Series is configurable for all line positions, it is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

“The team at Nordson YESTECH provides us with excellent service,” said Corey Steeby, President, EBW Electronics. “The training was detailed and the installation was well supported. EBWE reviewed other systems for price versus performance and soon decided on the Nordson YESTECH system.  We place a high priority on technical support and felt very comfortable with the technical support they promised.  YESTECH backed their promise up with excellent support, onsite training at installation as well as phone support. All the support has proven valuable and effective. EBWE started 6 years ago with our first YESTECH system. We will continue to turn to Nordson YESTECH for our inspection needs in the future.”

“It is always a pleasure to work with organizations such as EBW Electronics,” said Troy Johnson, Nordson YESTECH Sales Manager. “We are pleased to have once again been selected by EBWE and are proud to be an important part of their quality assurance program.”

   ^ Top

LORD Corporation Recognized as One of the Fastest-Growing Companies in the Research Triangle

News Facts:

  1. LORD Corporation has been ranked No. 22 on Triangle Business Journal’s 2012 Fast 50 list.
  2. The company was honored for its growth and profitability over the past three years, as well as its contributions to the growth and success of the community.
  3. Triangle Business Journal hosted an event to honor the Fast 50 award recipients on Nov. 15.

LORD Corporation has been ranked No. 22 on Triangle Business Journal’s 2012 Fast 50 Award list. An acknowledgment of the fastest-growing privately held companies in the Triangle region of North Carolina, the Fast 50 winners were selected and ranked on a formula that analyzes revenue growth and profitability over the previous three years. The winning companies are also evaluated on their contributions to the growth and success of the community. LORD was honored at an awards dinner and ceremony at the Sheraton Imperial Hotel and Convention Center on Nov 15.

“The Triangle Business Journal’s Fast 50 Awards is an outstanding way to recognize ongoing entrepreneurial excellence and leadership among local companies,” said Rick McNeel, chairman, president and CEO of LORD Corporation. “LORD is honored to be recognized among the Fast 50 recipients, who have all led the Triangle in job growth and economic stability.”

With fulltime global employment increasing by 220 over the last 12 months, McNeel expects the company to continue to grow employment on a global basis over the next year. “The economic climate over the past three years has been challenging, and it is a testament to the hard work of LORD leadership and employees that we have not only maintained as an industry, but have excelled and prospered,” said McNeel. “We anticipate a continuing challenging global economic environment in 2013. Integrating our recent acquisition of the MicroStrain sensing systems into our business, and focusing on growth initiatives and controllable costs are the key themes we will be pursuing in this environment.”

   ^ Top

Advanced Non-Etching Adhesion Promoter for Next Generation IC Packaging from Atotech

The insatiable demand for greater computing power and the mission to fulfill Moore’s Law continue to drive technological advancement. As for the next generation IC-packaging industry, there is an undeniable need to satisfy the demands for finer lines and space on conductors. The new NEAP is one of the technologies that will overcome the obstacles the IC-packaging industry currently faces in trying to meet the requirements for future MPU architecture

The new NEAP

Major MPU (Micro Processor Unit) makers are starting to focus on the use of dielectric materials with low signal loss (low loss tangent). In order to meet the higher frequency specifications of the next generation MPUs, more exotic materials will come into use. These include, for example, cyanide ester and PPE (polyphenyl ether). To these exotic high frequency materials, the new NEAP (non etching adhesion promoters) can offer a reliable bonding capability.

“Unlike some of the other commercially available non-roughening adhesion promoters, the newly developed NEAP does not require an interposer layer such as a thin layer of tin,” explains Dr. Rami Haidar, Global Product Manager for Surface Treatment Technology at Atotech Deutschland GmbH in Berlin, Germany. “By avoiding the use of a metal interposer layer, the new NEAP process is more cost competitive and environmentally friendly.”

Mechanical versus Chemical NEAP

Most of the commercially available NEAP processes are based solely on chemical bonding that provides the adhesion between the smooth conductor surface and dielectric materials. The potential weakness of such chemical bonding is its adhesion performance, which depends highly on the type of material that the adhesive layer is bonded to.

“The new NEAP provides mechanical bonding,” states Dr. Haidar. “It propagates a nano-scale structure of copper oxide that forms a thin anchoring layer with increased surface area.” One of its most significant advantages over chemically bonded NEAPs is its independence of adhesion performance from various types of dielectric material.
The new NEAP process also adds surface area to the conductors. Furthermore, research findings show that copper oxide on the surface hardly contributes to surface roughness, which the Rq (root mean square) measured to be less than 250 nm.

Non etching adhesion promoters

The use of NEAP is one of the key technologies for inner and outer layer bonding between conductors and dielectric materials. It enables state-of-the-art IC-substrate manufacturing and meets the technical specifications of major MPU manufacturers.

For future packaging substrates, the L/S (Lines and Spaces) become increasingly finer, even below 8/8 μm. This poses a steep challenge for manufacturers in regard to etching such fine tracks, since the current PoR (Process of Record) for adhesion promoters in the packaging industry is still an etching-based system.

The NEAP systems offer a dependable solution to such difficulties. They manage to maintain the original conductor geometry while reliably providing sufficient adhesion.

   ^ Top

EV Group Completes Cleanroom Expansion, Opens New R&D Labs And Customer Training Center At Corporate Headquarters

Semiconductor Equipment Manufacturer Doubles Cleanroom Space and Advances on Long-term Growth Plans
EV Group has announced the completion of its newly expanded cleanroom IV facility at its corporate headquarters in Austria.  As part of the company's long-term growth strategy to address high-volume tool orders and speed time to market for its worldwide customer base, EV Group doubled its cleanroom space for process development and pilot production services.  On top of that, the company increased the size of its application labs, added new R&D facilities for internal tool development and testing, and opened a new customer and employee training center. 

In tandem with the new cleanroom expansion, EVG increased the number of fully automated high-volume manufacturing (HVM) systems (for different wafer sizes) to strengthen its customer demonstration and process development capabilities.  While manufacturing and product development are centralized at EV Group's corporate headquarters, technology and process development teams in Austria work closely with the company's subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; Seoul, South Korea; and Chung-Li, Taiwan where additional, state-of-the-art application labs and cleanroom facilities are available for onsite customer demonstration and technology process development.  EVG works closely with leading universities and R&D institutes worldwide, and plays a key role in numerous industry associations and consortia to contribute and continue the world's most advanced research and development for semiconductors, MEMS, light emitting diodes (LEDs) and other high-tech devices.

EV Group's new customer and employee training center at its corporate headquarters provides several new rooms for instructional training courses, as well as a large number of manual and automated EVG tools for training.  This new training center provides EVG with additional flexibility and increased capability for customers and employees worldwide who regularly attend training courses on EVG technologies, manufacturing processes, products and software, as well as equipment operation.

Earlier this year, the addition of an ultra-modern manufacturing facility doubling the production floor space marked the completion of the first phase of EVG's long term expansion plans.  Already positively contributing to EVG's continued, steady growth from the beginning of 2012, the company increased its order intake in fiscal year 2012 (ended September 30, 2012) by 5 percent over fiscal 2011—and increased its revenue by 20 percent within the same period.  Additionally, in the last 12 months EVG added more than 100 new employees (to a current total of approximately 600 worldwide) and continues to recruit new employees in all departments. 

   ^ Top

Amkor, 45 Years of Innovation in IC packaging Enhanced in 3D Packaging

Amkor Technology, representing 45 years of innovation in IC packaging, has collaborated with Yole Developpement on an "enhanced" issue of 3D Packaging! For the first time, Yole Developpement welcomes an industry player's contribution to 3D Packaging.

Both companies, Amkor Technology and Yole Developpement, have combined their expertise to offer a November issue brimming with added-value content: Amkor is a leader in IC packaging development and manufacturing, with more than 850 different IC packages. In this special edition of 3D Packaging, readers will have the opportunity to discover several of Amkor's current and upcoming technologies! Topics covered in this special issue include: OSAT perspective and positioning - MEMS packaging - Test in packaging - Copper wire bonding - 3D packaging solutions - FlipChip molded BGA (FCmBGA) and more.

Plus, an introduction to the new POSSUM™ Chip-on-Chip packaging methodology!

To receive this issue in your mailbox, please click here.


   ^ Top

DuPont Microcircuit Materials Introduces New Low Cost Conductive Inks for Printed Electronics

PE8XX Series Delivers 20 Percent or More Savings vs. Conventional Silver-based Conductors
DuPont Microcircuit Materials (MCM) is introducing a new series of screen printed conductive ink materials for the printed electronics market, designed to offset the rising cost of silver. Utilizing proprietary technology and under typical processing conditions used for many printed electronic applications, DuPont PE8XX series conductive inks can provide low resistivity with 20 percent or more potential cost savings for manufacturers. DuPont will highlight these and more innovations in its expanding portfolio of functional inks and pastes for the growing printed electronics industry during Printed Electronics USA 2012, December 5 – 6 in Santa Clara, CA at booth H03.

“Since 2005, the increased price of silver has created a challenge for printed electronics manufacturers - it’s a cost competitive market, yet, no one can afford to compromise performance and quality,” said Scott Gordon, business development manager -- DuPont Microcircuit Materials. “The new DuPont PE8XX series conductive inks represent breakthrough technologies with a balance of properties that can significantly reduce the impact of silver market fluctuations, while maintaining the performance characteristics required to help our customers successfully compete in today’s market.”

DuPont PE8XX conductive ink materials are designed for use with standard thermal curing techniques and for photonic curing equipment such as the NovaCentrix PulseForge® and Xenon Sinteron™ tools that provide manufacturers low temperature processing and fast drying for high speed roll to roll production capability. Materials in the PE8XX series are suitable for use in printed electronics applications such as membrane switches, RFID, electroluminescent lighting and other emerging applications including flexible displays. They also can be customized for other specialized applications.

During Printed Electronics USA 2012, DuPont MCM will exhibit at booth H03, featuring the PE8XX series and other new products including the newest DuPont™ Solamet® PV419 photovoltaic metallization for high efficiency thin film solar cells. DuPont MCM also will present a technical paper at the conference titled, “Recent Advances in Printed Conductors to Meet the Cost and Performance Needs of Emerging Printed Electronic Applications” from 12:05 – 12:30 p.m. on Thursday December 6th as part of the track three conference topic on Printed Conductors.

Additional DuPont offerings will be highlighted at the show. Dr. Marie O'Regan, OLED technology director, DuPont Displays will present a technical paper on Solution Processing for OLED TVs on Wednesday, December 5 from 5:10 - 5:35 p.m. And, DuPont Teijin films will co-exhibit at booth H03, featuring PET and PEN polyester films used as substrates for many of today's printed electronics applications.

DuPont MCM is an established high-volume supplier of electronic inks and pastes and offers a broad range of printed electronic materials commercially available today. This growing range of DuPont MCM functional inks is used for forming conductive traces, capacitor and resistor elements, and dielectric and encapsulating layers that are compatible with many substrate surfaces including polyester, glass and ceramic. MCM has over 40 years of experience in the development, manufacture, sale and support of specialized thick film compositions for a variety of electronic applications in the automotive, display, photovoltaic, biomedical, industrial, military and telecommunications markets. For more information on DuPont Microcircuit Materials, visit

Please click the thumbnail below to download a high resolution version of this image

A new series of conductive ink materials from DuPont Microcircuit Materials
is designed to reduce the impact of silver market fluctuations for printed electronics.
Image courtesy of


Please click the thumbnail below to download a high resolution version of this image

DuPont Microcircuit Materials is expanding its portfolio of functional inks for the
printed electronics industry with a new series of low cost conductive ink materials.
Photo courtesy of DuPont.
   ^ Top

View the Corporate Bulletin Archives


RGL Enterprises


:: Issue 133 ::
December 3, 2012

F&K Delvotec

Master Bond

LORD Corporation

RGL Enterprises