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:: Corporate Member News ::

:: Semiconductor equipment manufacturer Solid State Equipment LLC has announced the recent addition of industry veteran Dr. David K. Lam to its Board of Directors (full story)

:: Axus Technology Appointed as Exclusive North American Distributor For UIS Technologies (full story)

:: Heraeus Announces New Name, Celcion™, and New Web Site for Its Insulated Aluminum Materials System (full story)

:: Hesse & Knipps, Inc. to Discuss Wedge Bonding for RF and Microwave Devices at Advanced Technology Workshop on RF and Microwave Packaging (full story)

:: Indium Corporation’s Eric Bastow Named Assistant Technical Manager (full story)

:: Silicon Cert Laboratories receives 2nd DLA X-Ray Suitability Approval (full story)

:: Microelectronic Packaging Training from TJ Green Associates (full story)

:: DuPont and Suntech Sign Strategic Agreement Key Collaboration Seeks to Expand Solar Energy Adoption (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Plexus
Intel
ALLVIA

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

Palomar Technologies

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Semiconductor equipment manufacturer Solid State Equipment LLC has announced the recent addition of industry veteran Dr. David K. Lam to its Board of Directors

A pioneer in semiconductor manufacturing, Dr. Lam now consults and invests in the industry. According to Herman Itzkowitz, President and Chief Technical Officer of SSEC, "We are excited to have Dr. Lam on board to help our company grow. A visionary in the semiconductor industry with extensive technological knowledge and demonstrated business acumen, he will help to focus our efforts and direction in a rapidly-evolving environment."

A distinguished semiconductor industry veteran, Lam introduced the first fully-automated plasma etching system for semiconductor manufacturing in 1981. Under his guidance as CEO, the company in1982 established a strong presence in Japan through a marketing partnership. Lam Research went public in 1984 and remains a perennial leader in semiconductor process equipment.

Today, Lam uses his experience and expertise to provide guidance to emerging technology enterprises in sectors that include semiconductor and semiconductor equipment, micro- and nano-device manufacturing, computer hardware and software, medical devices, and energy infrastructure. Among the companies he also serves as a Board member are Multibeam Corporation, Xradia Inc., and MicroProbe.

Dr. Lam stated, "SSEC has demonstrated an exceptional track record in developing semiconductor capital equipment and advanced packaging processes, and the high efficiency in its operations. I am excited about the opportunity to further its success in the fast-growing advanced packaging market."

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Axus Technology Appointed as Exclusive North American Distributor For UIS Technologies

Axus Technology is pleased to announce their appointment as the exclusive North American distributor of CMP consumables manufacturer, UIS Technologies. UIS Technologies is an established ISO-certified manufacturer of carrier retaining rings and other CMP consumable parts.   UIS has an established and growing customer base throughout Asia and is anticipating similar success in North America. The first UIS products to be introduced into North America are retaining rings for the Ebara 200mm and 300mm CMP tool sets and include pre-conditioning of each ring, thereby reducing break-in time and increasing productivity. Additional products are scheduled to be introduced in this region by Q2 2012.

UIS Technologies' consumable products complement the current Axus Technology product line, which includes CMP tools, spare parts, and service. The Axus Technology customer base includes a wide range of users, including device and substrate manufacturers for silicon and alternative materials, as well as users with advanced packaging and bonded wafer applications.

"UIS Technologies has established a strong reputation for both cost-effectiveness and the highest quality products," stated Barrie VanDevender, Vice President of Sales & Marketing for Axus Technology.  "We are looking forward to adding these high quality products to our existing offering to better serve our current and future North American customers."

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Heraeus Announces New Name, Celcion™, and New Web Site for Its Insulated Aluminum Materials System

The Thick Film Division of Heraeus Precious Metals, a precious metals and technology company, has announced a new name, Celcion™, for its Insulated Aluminum Materials System.

Heraeus has also launched a new Web site, http://celcionled.com/, and will feature Celcion at Booth 508 during the Strategies in Light 2012 conference and exhibition, Feb. 7 - 9, Santa Clara, Calif.

Celcion, a Thick Film Materials System designed to insulate aluminum substrates, takes the same fit and form as traditional MCPCBs, while providing thermal conductivity and high dielectric breakdown strength. It is a simplified additive process that is faster, easier to use, and requires less materials than MCPCBs. The system allows circuits to be built directly onto aluminum substrates, eliminating the need for thermal interface materials. This allows Celcion circuits to run 10°C cooler than MCPCBs.

According to Mel Mehta, Sales and Marketing Manager at Heraeus, the Insulated Aluminum Materials System needed a name that conveyed the distinct advantage of the technology. “The process offers better thermal management and allows LED circuits to run cooler than MCPCBs,” said Mehta. “We named the technology ‘Celcion,’ from the word ‘Celsius,’ to define the process in a memorable brand.”

Traditionally, MCPCBs are constructed using a subtractive process – adding material and then removing the material. This can take several steps and is a waste of costly materials. Celcion features a selective additive process – applying material only where it is needed. It is a faster system that uses less material, and allows quick, inexpensive design changes.
Because Celcion circuits run cooler, designers can reduce the number of LEDs while providing the same light output, thereby reducing costs. It is ideal for high-power applications, such as LED substrates (˃1W input) found in general illumination, signs, signals and displays. It also offers increased performance benefits in power electronics, heaters and automotive manufacturing.  

“The new Web site (http://celcionled.com/) explains the features and benefits of Celcion, provides links to news articles about the technology, and lists tradeshows where Heraeus will be exhibiting,” Mehta noted. “You can also watch a video that describes the differences between the traditional MCPCB process and Celcion, and how LED performance is increased. For specifications and product information, a flyer can be downloaded from the site.”

At the Strategies in Light 2012 exhibition Heraeus will introduce the new name for its Insulated Aluminum Materials System. At Heraeus’ booth (#508), visitors will be able to “See Celcion in Action.” Through live, on-site product demonstrations, Heraeus will show how Celcion is used in manufacturing LEDs, and why it is a viable alternative to traditional MCPCBs.

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Hesse & Knipps, Inc. to Discuss Wedge Bonding for RF and Microwave Devices at Advanced Technology Workshop on RF and Microwave Packaging

Hesse & Knipps, Inc. (www.hesse-knipps.com), will discuss “Wedge Bonding for RF and Microwave Devices”  at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging  to be held February 7-8, 2012 in San Diego, CA.

RF and Microwave device interconnection requires demanding capabilities only wedge bonding can provide. Flat, extremely low loop shape, constant wire length and ribbon bonding are standard wedge bonding capabilities that cannot be produced by ball bonders. For high frequency electrical signals, conduction occurs in the “skin,” or outer 0.5µm of the wire cross-section. Ribbon wire has a much larger “skin” than round wire; thus, it is often required for RF and microwave devices. In addition, many high-speed devices require flat, short loops of the same wire length to match inductances of signals for proper performance.

The Hesse & Knipps technical presentation will provide an overview of how the latest wedge bonding equipment meets the highest demands of these RF and microwave devices, improving productivity and device quality.

A flexible wire clamp design on wedge bonding equipment enables both round and ribbon wire to be easily interchanged on the same bond head. The bond wedge feeds the wire from behind and under the face of the tool, naturally producing low loop heights.  Enhanced user-friendly software enables easy programming of low, stress-free loops, specification of constant wire length or constant loop height and precise control of ribbon deformation down to 1/4 mil. Enhanced tear routines also allow reverse bonding over raised structures (air bridges) on MEMS, RF and microwave devices. Advanced wedge bonders can also display looping profiles to aid in achieving the best electrical device performances.

Wedge bonders are noted for their greater flexibility on difficult to bond surfaces. Soft touchdown and multiple defined bonding interval profiles are used to successfully bond challenging RF materials such as GaAs and Duroid. The S-shape bond feature allows the user to stack bonds or in some cases place two bonds on the same pad and fan the second bonds to different locations.

For more information on this presentation, visit http://www.imaps.org/rf/index.htm.  For more information on wedge bonders, please visit the company’s website at www.hesse-knipps.com.

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Indium Corporation’s Eric Bastow Named Assistant Technical Manager

Indium Corporation announces the promotion of Eric Bastow to Assistant Technical Manager.

In this position, Eric provides oversight to the Technical Support Team through leadership, advice, technical knowledge, and support to product management. Eric continues to provide technical support for the Pacific Northwest (USA) and Western Canada.

Eric has been with Indium Corporation for over ten years, starting as a laboratory technician under the direction of Dr. Ning-Cheng Lee and then in the field of technical support, including serving as a Senior Technical Support Engineer. He is an SMTA-certified process engineer (CSMTPE) and is certified as a Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering. He is also a certified IPC-A-600 and 610D Specialist. Eric has an associate’s degree in Engineering Science from Herkimer County Community College and has authored several technical papers and articles.

Eric has experience in developing new solder paste flux chemistries, performing residual gas analysis of hermetic electronic packages, and developing electroless nickel-plating bath chemistries. Eric is based at Indium Corporation’s global headquarters in Clinton, NY. He also authors a technology blog, which can be found at blogs.indium.com/blog/eric-bastow.

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Silicon Cert Laboratories receives 2nd DLA X-Ray Suitability Approval

Silicon Cert Laboratories (SCL) has recently been added to the Defense Logistic Agency (DLA) Land & Maritime listing of suitable laboratories for MIL-STD-202, test method 209 “radiographic inspection”.  DLA (formerly known as DSCC) had also previously approved SCL for the MIL-STD-883, radiographic inspection test method 2012 in October of this year now making SCL only one of two DLA suitable laboratories in the U.S.A. approved for both TM 209 and TM 2012.

The radiographic inspection (real time x-ray) offered by SCL is the non-destructive method/procedure for detecting internal defects in small component parts which are not otherwise visible.

In addition to radiographic inspection, Silicon Cert Laboratories is also included on DLA’s laboratory suitability listing for other MIL-STD-883 reliability/qualification test methods such as for the mechanical and/or environmental testing of electronic components.

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Microelectronic Packaging Training from TJ Green Associates

TJ Green Public Training Course Schedule:

Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules 
Pasadena CA     April 10-13, 2012    
Bethlehem PA    September 25-28, 2012
This course is a must for process engineers, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of visual inspection criteria and materials and processes used to assemble Hybrids, Microcircuits and RF MMIC Modules for high reliability Military and aerospace  applications. Trained instructors with years of industry experience deliver the material in a straight forward and easy to understand format. 
Course Outline

Microwave Packaging Technology
Boston MA       May 9-11, 2012
San Diego CA    Sept 5-7, 2012
This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids.This three day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material trade offs and process selection are all covered in detail.
Course Outline

Wire Bonding Certification 
Bethlehem PA    June 25-27, 2012
This three-day course is a combination of classroom and "hands-on" exercises conducted at the wire bonder designed to teach the basics of manual gold ball and wedge wirebonding. The goal is to teach the process of wirebonding, which includes the wire, tool, machine settings and operation, work stage adjustments and operator skills. Especially important is how to troubleshoot a wire bond problem and get the process back on track. Students develop a functional understanding of the wire bond process along with important quality and reliability considerations for hi rel military and medical products.   
Course Outline

Visual Inspection Certification
Bethlehem PA    June 28-29, 2012
Hybrid Pre Cap Visual  June 28 (Full Day)
Incoming Visual Inspection  June 29 (Half Day)
The students are exposed to a variety of defects seen at both incoming and Pre Cap Visual Inspection. Checklists are used to simply the criteria and focus on the major problem areas. Students learn what to look for and how to interpret and apply MIL-STD-883 and 750 inspection criteria. Microscopes in the classroom allow for “hands-on” demonstrations.  The course is intended for quality assurance engineers, inspectors, lead operators and others responsible for inspection of the hardware prior to the final package sealing process.
Pre Cap Visual    Course Outline
Incoming Visual Inspection   Course Outline

To register for any of the above call 610-625-2158 or email tgreen@tjgreenllc.com

 

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DuPont and Suntech Sign Strategic Agreement Key Collaboration Seeks to Expand Solar Energy Adoption

DuPont and Suntech Power Holdings Co., Ltd. have signed a strategic agreement to help increase the supply of photovoltaic materials and technologies for the growing global market for solar energy.  The agreement focuses on technology advancements, supply chain optimization cost reduction initiatives, and DuPont™ Tedlar® polyvinyl fluoride film supply.  The companies also are pursuing co-marketing opportunities.  The companies’ goal is to achieve faster and broader adoption of solar energy to reduce the world’s dependence on fossil fuels.  They intend to achieve the goal by further improving the technology for solar energy and helping reduce its costs and building greater awareness of its benefits to consumers.

“We’re partnering with leading photovoltaic component suppliers around the world as we continue to make solar affordable for everyone, everywhere.  With innovative companies like DuPont, the United States is a major contributor to the global photovoltaic supply chain and a net exporter of solar products to China and global markets,” said Eric Luo, senior vice president of global supply chain, Suntech.  “Creating higher efficiency solar cells and further extending the long life of solar modules is critical to achieving affordable solar power, and we’ve worked closely and very successfully with DuPont in this regard. We’re taking our collaboration to the next level with this agreement.”

In November 2011, Suntech recognized DuPont with its annual Supplier Excellence Award for providing superior supply and technical service, product innovation and collaboration.  DuPont supplies DuPont™ Solamet® photovoltaic metallization pastes to help enhance the efficiency of solar cells made by Suntech, as well as DuPont™ Tedlar® polyvinyl fluoride film used in protective backsheets for Suntech solar modules.  These materials are part of DuPont’s broad and growing portfolio of products that improve the efficiency and lifetime of solar cells and modules, and help reduce overall system costs to make solar more competitive with traditional sources of energy.

“DuPont and Suntech have the highest standards for product quality, and sustainability is an important value for each of us.  With these shared values, we look forward to bringing our offerings to more consumers as the global industry continues to grow,” said David B. Miller, president, DuPont Electronics & Technologies.  “Global partnerships, such as our work with Suntech, have been central to the solar industry’s growth.  Our work together in Masdar is a prime example of the benefits of our collaboration, and of solar energy.”

November 2011, Suntech recognized DuPont with its annual Supplier Excellence Award for providing superior supply and technical service, product innovation and collaboration.  DuPont supplies DuPont™ Solamet® photovoltaic metallization pastes to help enhance the efficiency of solar cells made by Suntech, as well as DuPont™ Tedlar® polyvinyl fluoride film used in protective backsheets for Suntech solar modules.  These materials are part of DuPont’s broad and growing portfolio of products that improve the efficiency and lifetime of solar cells and modules, and help reduce overall system costs to make solar more competitive with traditional sources of energy.

“DuPont and Suntech have the highest standards for product quality, and sustainability is an important value for each of us.  With these shared values, we look forward to bringing our offerings to more consumers as the global industry continues to grow,” said David B. Miller, president, DuPont Electronics & Technologies.  “Global partnerships, such as our work with Suntech, have been central to the solar industry’s growth.  Our work together in Masdar is a prime example of the benefits of our collaboration, and of solar energy.”

The DuPont collaboration with Suntech was featured as part of a short documentary titled, “City of Science, City of Hope,” that recently aired during the BBC News “Horizons” program series.  The documentary highlights the role of DuPont materials that enable Suntech solar modules to help power the city of Masdar – one of the most sustainable communities on the planet, and a model of what green urban development can be.

Suntech Power Holdings Co., Ltd. (NYSE: STP) produces industry-leading solar products for residential, commercial, industrial, and utility applications. With regional headquarters in China, Switzerland, and the United States, and gigawatt-scale manufacturing worldwide, Suntech has delivered more than 20 million photovoltaic panels to over 1,000 customers in more than 80 countries.  Suntech's pioneering R&D creates customer-centric innovations that are driving solar to grid parity against fossil fuels.  Suntech's mission is to provide everyone with reliable access to nature's cleanest and most abundant energy source.  For more information about Suntech's people and products, please visit http://www.suntech-power.com

DuPont™ Solamet® photovoltaic metallizations and Tedlar® polyvinyl fluoride films are part of a broad and growing portfolio of products represented by DuPont Photovoltaic Solutions, which connects science and technology from across the company on a global scale to help support the dramatic growth in the photovoltaic industry.  To learn more about DuPont Photovoltaic Solutions, visit http://photovoltaics.dupont.com.

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View the Corporate Bulletin Archives

 


:: Issue 115 ::
February 1, 2012

LORD Corporation

RGL Enterprises

EPP

RGL Enterprises

QSIC