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KYOCERA America, Inc. Doubles Flip-Chip Assembly Capacity with New State-of-the-Art Class 10,000 Clean Room
Company offers lead-free assembly services as one of America’s only QML-certified flip-chip providers
Kyocera America, Inc. has announced that it has doubled its flip-chip assembly capacity for microelectronic devices with a new $3.5 million Class 10,000 clean room, offering lead-free processes as one of North America’s only Qualified Manufacturer’s List (QML)-certified flip-chip assembly providers.
The new clean room offers the latest available technology, including fine-pitch flip-chip, multiple components within one operation, vacuum die-attach and vacuum-assembly sealings for flip-chip and multi-chip module assembly. The expansion also reduces overall cycle times for all levels of manufacturing.
“We can now support customers from prototype to high-volume production right here in San Diego, protecting intellectual property by not sending it offshore,” said Tim Roth, General Manager of Kyocera’s Assembly Technology Division. “Along with higher volume production, Kyocera now offers lead-free flip-chip assembly, ahead of federal RoHS regulations which take effect in 2014.”
Kyocera provides assembly services for diverse microelectronics markets, including high-speed digital communications, high-reliability applications, high-count I/O devices, high-end servers, multi-core processors and data transport infrastructure. The company recently increased its engineering staff to provide additional customer service, design and development expertise.
The expansion adds to Kyocera’s long history and commitment to the microelectronics industry. In 2011, Kyocera marked its 40th anniversary of U.S. microelectronic package manufacturing; it has also offered cost-effective manufacturing at Kyocera Mexicana since 1988; and it has performed assembly services in San Diego since 1991.
Bridge Announces embedded-package SiP for Portable Electronics Application
Bridge Semiconductor Corporation has launched an embedded-package SiP as one of its low cost solutions to better address thermal, EMI shielding, form-factor and signal integrity issues. Essentially, embedded-package SiP is a 3D module wherein pre-packaged device such as LGA/BGA or QFN is embedded in the carrier substrate and connected to the top stacking devices through micro-via, build-up circuitry and PTH.
The embedded device can be a known-good flip-chip package for high performance processors or sophisticated graphics. Or, it can be a low cost wire-bond RF module so that the much needed EMI shielding and thermal dissipation can be provided by a build-in metal film. The top devices, either memory or passives, can be attached to the embedded substrate by conventional surface mount assembly or through wire bonding process. If need be, molding compound can be add-on.for extra protection.
This 3D module design enjoys many benefits including less warpage, higher shock-resistance, and allowing multiple packages stacking on top. As the keep out area around embedded component is largely reduced by using PTH as the vertical connection channel, it also enjoys a better form-factor.
Unlike conventional FO-WLP or PoP approaches, Bridge embedded-package SiP solution leverages on existing circuit board manufacturing infrastructure and commercially available devices to resolve cost, time-to-market and business-ownership issues.
At the 8th International Conference and Exhibition on Device Packaging, 6-7 Mar 2012, Arizona USA, Bridge will show how this embedded-package SiP can allow “commercially available packages” as stacking unit to resolve supply chain and compound yield issues. Come visit us at the exhibition booth number 7 or drop us an email firstname.lastname@example.org to make appointment in advance or enquire.
Finetech’s Focal Plane Array Bonding using Fineplacer Lambda
Bonding a 10mm x 10mm die with more than 15k I/O indium bumps is an extremely challenging process. Doing this with a post-bond accuracy in the sub-3 micron range, and with a repeatable co-planarity specification of 1 micron, further complicates this process by a factor of 10!
The FINEPLACER® Lambda Die bonder, with its unique moveable optic slide, gives the user an excellent feature to align the small bumps simply and quickly. With an increased magnification, and not having to reduce the field of view (FOV) for alignment, positioning is a breeze. And using a passive method for adjusting the flatness of the tool relative to the surface of the die/substrate removes operator guess work. The result is a consistent, high accuracy bond with excellent flatness across the entire surface of the bond line.
For the Latest in Innovative UNDERFILLS, ENCAPSULANTS and ADHESIVES see NAMICS at Booth 39
NAMICS Corporation is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells. NAMICS subsidiary, DIEMAT, Inc. located in Byfield, MA, specializes in the development of innovative thermally conductive adhesives and sealing glasses. Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore, Korea and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.
3D InCites offers IMAPS Exhibitors and Presenters Promotion Opportunities
3D InCites, the premier online community devoted to stirring up interest in 3D integration processes and technologies, announced it will be offering this year’s exhibitors, sponsors, and presenters at IMAPs Device Packaging Conference whose products and services are targeting the 3D integration market an exclusive opportunity to shoot a 2 minute video infomercial at either their booth or at the 3D InCites booth, to be featured on the 3D InCites community home page. The videos will also be posted on the IMAPS website to help promote the 2012 conference.
Those who wish to participate will be charged a flat fee that includes the completed 2 minute spot and posting on 3D InCites with a link to the company’s home page. The video posts will be promoted via Social Media venues including LinkedIN groups, Twitter, and our sister site, www.3D-ICs.com. Appointments will be scheduled during sessions so as to not encroach on exhibitor’s networking time.
3D InCites is also offering short-term banner and text ad advertising opportunities to companies wishing to promote their company’s participation at the event. A dedicated eNL will be distributed to 3D InCites members on Thursday, February 23, which will give advertisers an added opportunity to promote their presence at the conference. Please contact Steve@3DinCites.com for details on video spots as well as other advertising opportunities on 3D InCites and in the special IMAPS DPC eNL.
DuPont and Yingli Green Energy Enter $100 Million Strategic Agreement
Commitment to Supply Growing Solar Market Underscores Aim to Reduce Global Dependence on Fossil Fuels
DuPont and Yingli Energy (China) Company Limited (“Yingli China”) have signed a $100 million strategic agreement for photovoltaic materials aimed at accelerating the adoption of solar energy to address one of the world’s biggest challenges – reducing dependence on fossil fuels. Yingli China is a wholly owned subsidiary of Yingli Green Energy Holding Company Limited (“Yingli”), a leading solar energy company and one of the world's largest vertically integrated photovoltaic manufacturers.
The agreement was signed in a ceremony today in Washington, D.C., which was organized by the U.S. Department of Commerce and the Ministry of Commerce People's Republic of China, and hosted by the U.S. Chamber of Commerce. Under the terms of the agreement, Yingli will purchase photovoltaic materials including DuPont™ Solamet® photovoltaic metallization pastes used in solar modules and protective backsheet for solar modules made with DuPont™ Tedlar® polyvinyl fluoride film.
“At Yingli, we have a long-standing commitment to global social responsibility to make solar energy an affordable option for everyone,” said Liansheng Miao, chairman and chief executive officer, Yingli. “The agreement we have signed with DuPont assures our supply of critical, high-quality materials and our continued collaboration on further technological advances to optimize the performance of our solar modules, which illustrates our mission to be a cost leader and provide the best product to customers at the same time.”
“This agreement expands a current commercial relationship between DuPont and Yingli into a more strategic relationship with long-term benefit to both companies, and to end users of solar energy,” said David B. Miller, president, DuPont Electronics & Communications. “Materials are key to solar module performance, and DuPont continues to advance the science behind them. They help increase efficiency, extend the lifetime of modules, and, ultimately, help reduce overall system costs to make solar increasingly more competitive with other forms of energy generation.”
According to industry estimates, over the next five years, 20 percent average annual growth is expected in solar installations globally.
DuPont achieved about $1.4 billion in sales to the photovoltaic market in 2011, and has set a goal to reach $2 billion in sales by 2014, based on continued, strong demand for its products.
Yingli Green Energy Holding Company Limited (NYSE: YGE), which markets its products under the brand “Yingli Solar,” is a leading solar energy company and one of the world’s largest vertically integrated photovoltaic manufacturers. Yingli Green Energy’s manufacturing covers the entire photovoltaic value chain, from the production of polysilicon through ingot casting and wafering, to solar cell production and module assembly. For more information, please visit http://www.yinglisolar.com.
DuPont™ Solamet® photovoltaic metallizations and Tedlar® polyvinyl fluoride films are part of a broad and growing portfolio of products represented by DuPont Photovoltaic Solutions, which connects science and technology from across the company on a global scale to help support the dramatic growth in the photovoltaic industry. To learn more about DuPont Photovoltaic Solutions, visit http://photovoltaics.dupont.com.
Liansheng Miao, chairman and chief executive officer of Yingli (left) and David B. Miller, president of DuPont Electronics & Communications (right), today signed a $100 million strategic agreement for solar materials and technology collaboration.
Dyconex - Launch of new information platform for the EC IMAGINE innovation project
Since 2010, DYCONEX has been actively participating in the FP7-SME-2008-1 IMAGINE Project, which is targeted at strengthening the research capabilities of SMEs and is funded by the European Union (Grant Agreement no.: 231997). This project aims to develop a low-cost/high-performance passive millimeter-wave (MMIC) camera front end that can be put to use in security-screening appli-cations such as airport body scanners.
DYCONEX has leveraged its state-of-the-art high-frequency LCP substrate technology as a re-placement for standard ceramic substrates, thus driving the development of manufacturing methods for compact high-performance broadband mm-wave antennas.
To provide a new platform for information, the consortium is introducing a new project website. It provides information about the IMAGINE Project in general, its participating partners and the tech-nologies being put to use. If you are interest in learning more about the IMAGINE Project and MMIC technology, or if you would like to get in contact with the consortium, please visit the official project website at www.acreo.se/IMAGINE
27% Lower Profile than Standard Micro-D Connectors
Design engineers who need to reduce component size and weight without compromising electrical performance have a new hermetic connector option, following the release of SOURIAU PA&E’s new Mini Micro-D Connector.
These new Mini-Micro-D connectors are designed for space, airborne, down-hole oil and any other hermetic applications where reducing size and weight are priorities. They have a 27% lower profile than standard Micro-D connectors and are designed to be laser welded into aluminum, titanium or kovar housings. These new hermetic connectors are MIL-PRF-83513/7 interface compliant and mate with connectors manufactured to MIL-PRF-83513/8.
SOURIAU PA&E’s Mini Micro-D connectors can be configured with 9, 15, 21, 25, 31 and 37 pin counts. Its beryllium-copper pins support 600 VAC and 3A per pin and each pin is hermetically sealed with SOURIAU PA&E’s polycrystalline ceramic, Kryoflex®. They provide greater than 5,000 megohms of insulation resistance at 500 VDC and exhibit no evidence of dielectric withstanding voltage breakdown when tested in accordance with MIL-STD-1344, Method 3003. These new hermetic Micro-D connectors have a leak rate of less than 1X10-9 cc/second of helium at one atmospheric differential pressure and will operate reliably at temperatures from -65º C to 200º C.
CAD models and detailed drawings for hermetic Mini Micro-D connectors are available here (part number 94594).
For more information about this new hermetic Mini Micro-D connector from SOURIAU PA&E, or to learn more about the company’s other interconnect products, EMI filters, and integrated electronic packaging capabilities, contact SOURIAU PA&E at 509-664-8000 or visit us at http://www.pacaero.com
SUSS MicroTec launches XBC300 Gen2: New Platform for permanent Wafer Bonding, Debonding and Cleaning
SUSS MicroTec has launched the XBC300 Gen2, a high volume manufacturing platform for advanced 3D processing. The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for production as well as process development.
Configurable with a wide selection of process modules, the new universal bonder platform is suitable for all major permanent bonding as well as mechanical debonding processes at room temperature. The corresponding cleaning processes for 3D integration and 3D packaging are also supported. The high force bonding processes that can be run on the XBC300 Gen2 include Cu-Cu, polymer, fusion and hybrid bonding.
When configured as a debonder and cleaner the XBC300 Gen2 is the complementary platform to SUSS MicroTec’s XBS300 temporary wafer bonder, which was launched in December 2011. Device wafers are temporarily bonded to a carrier in the XBS300 and are debonded on the XBC300 Gen2 after passing all the backside processing steps. The XBC300 Gen2 debonder / cleaner is configured for handling both, carrier wafers as well as film frames. It allows for room temperature mechanical debonding and subsequent cleaning of carriers and device wafers.
“The XBC300 Gen2 allows complete process flexibility with full automation and offers our customers a superior cost of ownership. While the first generation XBC300 only offered configurations with up to three process modules, the new generation can be equipped with up to six modules, enabling the high throughput required in volume manufacturing. ”, says Frank P. Averdung, President and CEO of SÜSS MicroTec AG. “With the XBS300 and the XBC300 Gen2 we offer our customers a complete, state-of-the-art set of automated equipment for thin wafer handling in 3D integration and 3D packaging processes.”
Pacific Rim Engineering will be presenting these companies at the Device Package Conference...
Micro-Coat Technologies provides specialized adhesives and coatings for
high-tech and high-reliability applications used in semiconductors, military, medical, aerospace, and solar products. The company's diverse offerings include UV, Thermal & Air Cure Coatings, and Adhesives for the Semiconductor and SMD/PCB Assembly (Die Attach, Lid Seal, and Board Coatings), Optoelectronics and LED’s (Optical coatings). They are headquartered in McKinney, Texas with satellite facilities in CT and NC. (http://www.m-coat.com/)
Microcertec has been for more than 30 years specialized in the Precision Grinding of advanced design ceramics. We are a human-sized company, committed to be a genuine partner capable of delivering a technical solution that meets customer expectations. Our unique expertise is to combine precision-grinding of 3D ceramics, thin-film metalizing and laser micro-machining to serve high-tech markets as photonics, electronics, aerospace, semiconductors, and analytical instrumentation. (http://www.microcertec.com/)
PNL INNOTECH Provides Glass and Ceramic-to-Metal hermetic components such as:
Metal brazing to ceramics (Alumina, Zirconia, B4C, AlN, SiC, Si3N4)
Glass to Titanium seals
Bakeable feedthroughs and connectors
Housing for Medical implants
U.H.V. viewports (Glass, Quartz, Sapphire, CaF2, BaF2)
Microcertec, Kerdry and PNL work collectively to provide integrated advanced ceramic solutions and assemblies for high tech markets worldwide!
UTZ Technologies principal products and services include solder printing stencils, thick-film print screens, metal masks, computer artwork generation and custom photoplotting. UTZ Technologies thick-film screens are manufactured for the hybrid industry which uses them to print miniature electronic circuits. These highly sophisticated circuits are utilized extensively by the computer, aerospace, medical, automotive, and defense industries. (http://www.utz.com
Tensky is a high volume advanced Taiwanese manufacturer of metalized ceramic substrates for Low (<1W) to Medium (1-3W) to High (10W) power applications. They can provide DBC substrates utilizing thin-film technology to meet product specifications for the LED industry. Tensky has a highly capable skilled engineering staff. They utilize the latest high volume, high accuracy process equipment for prototypes through to high volume manufacturing. They currently supply products to the LED/Optoelectronics, Microwave, Semiconductor and Solar markets. (http://www.tensky.com.tw)
Meet with Plexus at IMAPS Device Packaging, Booth 17
Plexus is pleased to announce that it will be exhibiting at IMAPS Device Packaging at the Radisson Fort McDowell Resort and Casino in Scottsdale, Arizona--March 6th-7th, Booth 17.
Visit our booth to discuss how we can enable microelectronic module solutions for your device, sub-system, full-system design and/or build.
Plexus has delivered optimized Product Realization solutions through a customer focused service model since 1979. This service model seamlessly integrates product conceptualization, design, commercialization, manufacturing, fulfillment and sustaining services to deliver comprehensive end-to-end solutions to customers in the Americas, European and Asia Pacific regions. Our flexible business model enables customers to choose any combination of services to realize their go-to-market strategies while focusing on their core competencies.
Plexus is the leader in mid-to-low volume, higher complexity programs, characterized by unique flexibility, technology, quality and regulatory requirements. Plexus offers services to electronics OEMs in the Defense/Security/Aerospace, Industrial/Commercial, Medical and Networking/Communications sectors.
Plexus’ unique microelectronics module and semiconductor packaging joins these service offerings as an enabling solution for applications requiring smaller, lighter, faster capabilities – not generally available as standard packages from conventional SATS providers. These services also provide a secure capability for customers requiring an ITAR environment, or microelectronic parts that must be built immediately, prior to further integration into board, system, or final box-build assemblies within the same site.
We look forward to seeing you at the show. Or visit us online at www.plexus.com.
Trace Labs has recently expanded ESS (Environmental Stress Screening) capability with the addition of some new thermal cycling chambers. We now have 8 thermal cycling chambers and 14 thermal shock chambers. This insures that you will be able to run your tests when you need to and without bottlenecks.
Top electronic packaging manufacturers are achieving significant gains in reliability through Environmental Stress Screening (ESS) at Trace. Using tools such as vibration, thermal cycling, thermal shock and Highly Accelerated Life Testing (HALT) we run final product through an accelerated profile which can improve confidence that a product will endure its intended life in the field.
The ESS process identifies unanticipated flaws in design and discovers issues related to daily variations in the manufacturing process. Different environmental simulations bring to light specific failure modes in the product. Here are some common techniques and their associated failures:
Common Failure Modes
Solder Joint Failure
Discontinuity due to Thermal Expansion
Solder Joint Failure
Cable Interface Issues
Solder Joint Failure
Testing can be performed on bare boards, populated subassemblies or full products, allowing focus on predetermined trouble areas. Depending on the level of reliability required, the number of test units can range from 100% to a few units from each vendor, manufacturing line or batch. Active monitoring can be used to track the shift in electrical properties as the circuits encounter the extremes of each test. If a measurement is found to be out of tolerance, a root cause analysis is conducted to determine the source of the problem and corrective action established. The end product is a clear understanding of how the samples will react in the defined range of conditions. Once satisfactory results are obtained, these products can be packaged and sent off to customers.
Give us a call today for a free design review and open a discussion on how Environmental Stress Screening can increase the reliability of your product! www.tracelabs.com
IPDiA gets the ISO 13485 Certification for Medical Devices
IPDiA, manufacturer of integrated passive components on silicon, confirms its major role in the medical market area by getting the ISO 13485 certification.
Since its creation, IPDiA has aroused the interest of medical devices manufacturers with its technology and electronic components that bring some essential benefits for the medical market segment: miniaturization, reduction of energy consumption and increase of the reliability.
IPDiA proves its ability to provide electronic systems for medical devices that comply with customers’ requirements. It confirms the company reliability and allows to start straight away some trusting relationships with all its partners.
Micross Components Hosts Stop on “Drive for Innovation” Tour
Micross Components is pleased to announce its participation in the “Drive for Innovation” tour, sponsored by Avnet Express and UBM Electronics. Included as a “pit stop “ during the tour’s recent swing through Central Florida, Micross was selected because of its role in powering innovation by companies driving technological advancements across defense, space, medical and other high-reliability industries.
The “Drive for Innovation” showcases electronics innovation in the US with a year-long, cross-county journey in an electric vehicle – a General Motors Chevrolet Volt – driven by Brian Fuller, Editorial Director of EE Times EE Life, a UBM publication. On his tour Fuller has been stopping at companies to highlight the innovations of the Volt, as well as the technological achievements being made by electronics companies across the country, blogging and posting video updates about his visits and experiences online.
“Micross Components was a natural stop on our trip through Central Florida,” says Fuller, “to highlight the role that specialty electronics firms play in advancing innovation.”
Many of Micross’ customers are constantly pushing their product designs to make them, among other things, smaller, faster or better suited for demanding or harsh environments. Advances that standard, off-the-shelf components often times can’t support. By recommending and providing customer-centric solutions, including bare die or packaging alternatives, such as Chip Scale Packaging and Chip on Board, or custom packaging, Micross enables innovation on many fronts.
As Micross General Manager Tony Hamby explains, “Our greatest achievements come in helping our customers realize theirs. To have the ‘Drive for Innovation’ recognize our contribution in furthering innovation in the US is a proud moment for our company.”
To follow the “Drive for Innovation” tour online and learn more about the visit to Micross Components, go to www.driveforinnovation.com.
Fan-out Wafer Level Packages Gain Momentum
TechSearch International conducted a survey to determine the market growth for fan-out wafer level packages (FO-WLPs) and the latest developments. FO-WLPs are a package option for devices with a large number of I/Os that cannot be accommodated by a fan-in design. The use of a fan-out solution provides the same low-profile advantage as the conventional WLP. In the fan-out process, singulated die are placed into a "reconstituted wafer" with enough space around each chip to accommodate second-level connections. FO-WLPs are offered (or are under development) in many companies, including ADL Engineering, Amkor, ASE, Deca Technologies (the new Cypress and SunPower funded start-up), Freescale Semiconductor, Fujikura, Intel (purchased Infineon’s wireless division), King Dragon International, NANIUM, Nepes (which purchased Freescale Semiconductor’s 300mm RCP line), Renesas Electronics, SPIL, STATS ChipPAC, and Teramikros (formerly Casio Micronics). While some companies plan to go to finer pitch (0.3 or 0.35mm pitch) to continue the use of conventional fan-in technology, others are planning to use fan-out methods. According to Tim Olson, president and CEO of Deca Technologies,” the promise of fan-out to eliminate the cost, inflexibility, and cycle time delays of tooling substrates is tremendous. The industry just needs to overcome the capital disadvantages and a few engineering challenges. We are close to a tipping point.”
IC Package Assembly Price Trends
Supply chain disruptions from Japan’s March 11, 2011 earthquake and tsunami have been mitigated, but traditional price declines for many substrates did not take place in 2011. In some cases there were price increases. Metal prices continue to have a major impact on the cost of semiconductor packaging and assembly. With gold prices remaining at near record levels, many companies continue to move to copper wire bonding to reduce cost. TechSearch International’s recent report also examines assembly price trends for a variety of packages. Companies continue to look for material saving measures and Amkor has announced its pin gate molding process for PBGA to aid in cost reduction. The report describes Xilinx’s 2.5D packaging solution with through silicon vias (TSVs) in the silicon interposer.
Thai Floods: Supply Chain Disruption
TechSearch International’s analysis includes an economic update for the semiconductor packaging industry and an analysis of the impact of the flooding in Thailand on the electronics industry. Plants that produce disk drives and subassembly suppliers to this sector were flooded and equipment will need to be replaced. In addition, some IC assembly facilities, automotive plants, and related suppliers also suffered flood damage.
Embedded Components Generate New Discussion
Embedded components—actives and passives—embedded in IC package substrates are generating renewed interest. TechSearch International’s recent Advanced Packaging Update provides an insight into the new developments at a variety of companies and the driving forces for these embedded devices.
The primary advantage of embedding active devices in a package substrate is reduced package height, but thermal advantages have also been reported. Several companies, including FlipChip International/Fujikura, Fujitsu Microelectronics, Shinko Electric, and STATS ChipPAC report that their embedded substrates can be used to assemble package-on-package (PoP) with a total package height of 1.0mm or less (including solder balls), and that there is significant interest from mobile manufacturers. Embedding the die also improves robustness in mechanical shock (drop test), and increases security by making the device more tamper-proof.
Embedded passives, primarily capacitors, have different drivers, and are used to improve decoupling and enable higher operating frequencies on the processor. There are two initial markets for this technology: the high-end networking and communication devices, and the low-power mobile application processors. It appears that mobile processors will be the first to use embedded capacitors in production.
Substrate Design Rules
TechSearch International’s annual survey on substrate design rules providing special coverage of substrate design rules from suppliers of organic flip chip substrates, PBGAs, and laminate CSPs (FBGAs) worldwide is highlighted. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish.
3D TSV Markets: Applications, Issues, and Alternatives
3D TSV is moving from PowerPoint engineering into real engineering. There is no question that 3D TSV will be adopted, but the timing for mass production depends on how the cost of the new technology compares with that of existing technologies. Analysts at TechSearch International are researching the applications, issues and alternatives to 3D TSV in a new report that will examine the manufacturing and infrastructure issues associated with the commercialization of 3D TSV. A new five-year market forecast for 3D TSV and silicon interposers will be included.
Coming Later in 2012 Medical Electronics: Packaging, Assembly, and Materials Trends
Flip Chip and WLP: Market Projections and New Developments
Asahi Glass Co. on Display at Device Packaging Conference
AQ substrates are synthetic Fused silica enabling an impressive new spectrum of products for wafer level packaging and stand-alone substrates from RF & Millimeter wave applications, up to TeraHertz frequencies. AQ has extreme low loss and low dielectric constant. These materials with quality as the driver, offer hermetic packaging for Microwave Integrated Circuits (MIC’s), hybrids, and microwave assemblies, with very stable dielectric constant and losses when exposed to wide ranges of temperature and humidity. The dielectric is homogenous, resulting in performance never before seen in the Microwave Industry; such as lowest loss tangent, stable Er, tight tolerances, and ideally suited for thin film processing.
AQ Product Features:
Extreme Low loss for “never before seen” high frequency performance
Ultra polished surfaces to virtually eliminate surface roughness effects
ZERO moisture absorption, No outgassing, and hermetic
Thermally & mechanically stable to up 1000° C
Wide range of thicknesses available to accommodate any design feature
> 99% optical transmisivity down to 200nm for Multi Mode Optical, Digital, and RF in a single substrate
Non-crystalline, resulting in no frequency resonances with applied voltages
Impervious to fluxes or any chemical used in typical manufacturing process.
AQ Product Applications:
Die Level Packaging down 25micron vias and 100micron pitch
RF Components with extreme high Q needs, such as filters, couplers, switches, etc
Antenna Elements that need a Low K, Low Loss structure
“Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs,” explains Donald Beck, General Manager of Palomar Technologies Assembly ServicesTM. “Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. Palomar Technologies’ Pulsed Heat System is a major contributor to this development, allowing our precision die attach systems to control LED exposure much more effectively than most other processes. The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management.”
Contact Palomar Technologies to arrange an on-site meeting at Device Packaging 2012.
Visit Mitsubishi Materials Corporation at Device Packaging 2012
Mitsubishi Materials Corporation has been manufacturing low alpha flux solders over 30 years. Recently Mitsubishi have developed the solder paste applied to substrate and wafer bumping for smaller pitch and low voiding. Also Mitsubishi can provide ultra low alpha lead free chemistry with high plating rate.