Crane AE Banner
:: Corporate Member News ::

:: Hesse & Knipps, Inc. to Demo Next Generation Fully Automatic Heavy Wire Bonder at APEC 2012 (full story)

:: EV Group Signs Collaboration Agreement with Eulitha to Establish Low-Cost-of-Ownership Nanopatterning Solution For HB-LED Manufacturing (full story)

:: Teledyne Microelectronic Technologies and Zephyr Photonics Join Forces to Advance Optical Interconnect Technology (full story)

:: STATS ChipPAC Expands Manufacturing Presence in Singapore with a New Factory (full story)

:: SSEC Adds Two Industry Veterans to Bolster Sales Force in Critical Regions (full story)

:: AI Technology to Present at RF/Microwave Packaging Workshop (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Stats ChipPAC
Solid State Equipment Corp.
ASE Group

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

Palomar Technologies

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

Hesse & Knipps, Inc. to Demo Next Generation Fully Automatic Heavy Wire Bonder at APEC 2012

Heavy Wire Bonder Features Support Power Electronics Requirements

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will demo its next generation BONDJET BJ93X Heavy Wire Bonder at APEC 2012 ( taking place on February 6-9, 2012 in Orlando, FL. 

The BONDJET BJ93x Heavy Wire Bonders feature a heavy wire bond head with integrated pull test and large table travel (305 mm x 410 mm) that meets automotive electronics and power semiconductor requirements. “The BONDJET BJ93x Heavy Wire Bonders provide the large current carrying capacity and high reliability that power electronics manufacturers demand,” states Joseph S. Bubel, president of Hesse & Knipps, Inc. “They are also the fastest heavy wire bonders available today.”

The BONDJET BJ920 handles aluminum, gold and copper heavy round wire and ribbon wire at speeds of 3 wires/sec. Patented PiQC Process Integrated Quality Control analyzes 5 critical measurements of bond quality in real time for every bond, ensuring that only reliable, high quality devices are produced.

   ^ Top

EV Group Signs Collaboration Agreement with Eulitha to Establish Low-Cost-of-Ownership Nanopatterning Solution For HB-LED Manufacturing

EV Group (EVG), has announced that it has signed a joint-development and licensing agreement with Eulitha AG, a pioneer and leader in the production of high-quality nanostructures using advanced lithography techniques.  EVG will integrate Eulitha's PHABLE™ mask-based ultraviolet (UV) photolithography technology with EVG's automated mask aligner product platform with the goal of developing a low-cost-of-ownership (CoO) nanopatterning solution to enable the production of high-brightness light emitting diodes (HB-LEDs).  With demo capabilities in place already, the first products are expected to ship later this year.

According to LED market research firm Strategies Unlimited (Mountain View, Calif.), the market for high-brightness LEDs is expected to grow from $11.2 billion in 2010 to $16.2 billion in 2014, driven by applications such as TV backlighting, mobile devices and increasingly by lighting.  To meet this increased demand, LED manufacturers need new manufacturing solutions that can increase the lighting efficiency of their products while keeping manufacturing costs down.  Through their joint-development agreement, EV Group and Eulitha will explore new manufacturing technologies that support LED manufacturers' cost and technology requirements. 

Combining Eulitha's full-field exposure technology with EVG's well-established mask alignment platform provides low-cost, automated fabrication of photonic nanostructures over large areas, and supports the production of energy efficient LEDs, solar cells and liquid crystal displays.  It combines the low cost, ease-of-use and non-contact capabilities of proximity lithography with sub-micron resolution—making it ideally suited for use in patterning sapphire substrates in order to enhance the light extraction (and thus the efficiency) of LED devices.  EVG plans to offer a PHABLE-enabled EVG620 system as an extension to its well-established mask alignment system platform—giving customers an even wider choice of configuration options.

"We look forward to working with EV Group to greatly accelerate commercialization of PHABLE through the integration of this novel technology with EVG's industry-leading mask aligner platform," stated Harun Solak, CEO of Eulitha.  "We believe the synergies of our respective technologies have great potential to provide the resolution and volume-production capabilities of lithography steppers at a fraction of the cost—enabling LED, optics and photonics manufacturers with extremely tight cost constraints the opportunity to extend their technology roadmaps to higher levels of performance."

Noted Hermann Waltl, executive sales and customer support director, EV Group, "Eulitha's expertise in nanofabrication makes them an ideal partner to collaborate with on new patterning solutions for the LED industry.  We are excited to embark on this relationship with Eulitha and advance our proven mask aligner platform for our LED customers."

   ^ Top

Teledyne Microelectronic Technologies and Zephyr Photonics Join Forces to Advance Optical Interconnect Technology

Partnership to develop and market high bandwidth, harsh environment optoelectronic solutions for the military, aerospace, commercial aviation, and oil and gas industries

Zephyr Photonics and Teledyne Microelectronic Technologies, a business unit of Teledyne Technologies Incorporated, today announced a partnership to develop and market optical interconnect technology solutions to meet the high bandwidth and harsh environment demands of the defense, aerospace, commercial aviation, and oil and gas industries. The partnership combines Zephyr Photonics’ proprietary vertical-cavity surface-emitting laser (VCSEL) technology with Teledyne Microelectronics Technologies’ five decades of experience designing and manufacturing multichip modules and ruggedized fiber optic assemblies for a variety of applications.

This is the first major commercial partnership for Zephyr Photonics, which recently transitioned to a commercial enterprise after more than 25 years as a research and development company. The agreement with Teledyne Microelectronic Technologies includes joint product development to address future market opportunities, provides a collaborative sales channel to reach more customers faster while opening new markets via Teledyne’s multiple divisions, and establishes a trusted partnership for government funding proposals for new technology development.

“This is a significant step for Zephyr Photonics as we work to establish our foothold as a trusted resource and partner for optoelectronic technology across a variety of markets and industries,” said Tom Steding, CEO of Zephyr Photonics. “Working with Teledyne Microelectronic Technologies provides credibility to our customers via a trusted manufacturing facility and further demonstrates our commitment to the defense OEMs, and ultimately, the warfighter.”

This joint manufacturing and product marketing collaboration will provide customers with advanced optical interconnect fiber optic products that can overcome harsh environment data communications obstacles and enable optical interconnect solutions that meet the requirements of national security and commercial applications.

“Together, we will deliver unparalleled and reliable solutions to system designers and improved SWaP for applications and environments where data communications is not just important, it is mission critical and potentially life-saving,” said Terry Thomas, Executive Vice President of Business Development for Zephyr Photonics. “Zephyr Photonics’ proprietary high temperature VCSELs can withstand temperatures over 155°C and are well suited for unmanned airborne vehicles, in addition to extreme heat conditions in down hole oil drilling applications.”

“Teledyne Microelectronic Technologies relationship with Zephyr Photonics expands our range of optoelectronic packaging solutions well beyond the competition’s,” said Albert Andry, Vice President and General Manager of Teledyne Microelectronic Technologies.  “By partnering with Zephyr Photonics, we can take our superior fiber optic packaging capabilities to the Oil & Gas sector, where extreme temperature requirements are driving technology to limits not seen before.”

   ^ Top

STATS ChipPAC Expands Manufacturing Presence in Singapore with a New Factory

STATS ChipPAC held a groundbreaking ceremony for a new factory in Singapore.  The new 197,000 square foot building will be located next to the Company’s current factory in Yishun, Singapore and will enable STATS ChipPAC to expand its manufacturing capabilities for advanced wafer level technologies including embedded Wafer Level Ball Grid Array (eWLB), Wafer Level Chip Scale Packaging (WLCSP), Integrated Passive Devices (IPD) and Through Silicon Via (TSV).

STATS ChipPAC had invested approximately US$250 million in Singapore over the last three years to expand its technology offering and manufacturing capacity. The Company expects to invest an additional US$220 million in Singapore over the next several years.

“We believe our technology leadership, manufacturing capabilities and new capacity in Singapore will provide a strong foundation for future expansion in our advanced wafer level package offering in eWLB, WLCSP, IPD and TSV. Advanced wafer level technologies are essential to support our customers’ requirements for increased performance and functionality in a smaller footprint for sophisticated mobile devices such as smartphones and tablets,” said Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC.  

Once the new building is completed, STATS ChipPAC’s combined manufacturing space in Singapore will increase from 595,000 to 792,000 square feet.  The new facility is expected to be operational by the fourth quarter of 2012.

For more information, please visit

SSEC Adds Two Industry Veterans to Bolster Sales Force in Critical Regions

Semiconductor equipment manufacturer Solid State Equipment LLC announced today the addition of two industry sales veterans to fuel the company's growth in currently under-addressed markets. Jim Murphy and Kojitsu Goto have joined SSEC as of January 1. Jim and Kojitsu (aka KG) will assist in expanding SSEC's presence in their respective areas.

Jim will be responsible for Strategic Accounts on a global basis, including coordinating the early adaption of 450mm wafers. "Jim comes with extensive industry experience and has a solid track record of accomplishment. We expect Jim to expand our presence at IDMs (Integrated Device Manufacturers) with the same success we are enjoying with foundries,” said John Voltz, Director of Field Operations at SSEC.

KG will be assuming the role of Country Manager for Japan and Korea – markets that represent an impressive percentage of capital expenditures for the types of equipment manufactured at SSEC. According to Voltz, "These are challenging and highly competitive markets with large global companies and small local companies vying for the business." Voltz continued, "Considering KG's past success, we are confident his perseverance will get us traction in these markets to help us grow."

According to Voltz, "We're thrilled to have Jim and KG on board as they add bench strength to our existing sales force and support the increasing number of customers that are choosing SSEC."

For more information on SSEC, please visit

   ^ Top

AI Technology to Present at RF/Microwave Packaging Workshop

Dr. Fred Lo, Chemist at AI Technology in Princeton Junction, NJ, will be giving a presentation at IMAPS RF/Microwave Workshop on Tuesday, February 7 at The Crowne Plaza San Diego. The talk will be on the development and manufacturing of dicing and grinding tapes with die-attach film adhesives that contain different modulus of elasticity and melt-flow to enhance the ease of electronic packaging including DDAF and FOW with thickness as thin as 10 microns and for various wafer sizes; 3" to 450mm in diameter. Details on the RF Workshop can be found online at .

   ^ Top

View the Corporate Bulletin Archives


:: Issue 114 ::
January 24, 2012

LORD Corporation

RGL Enterprises


RGL Enterprises