:: News from Heraeus: Different Color Versions for its Acid-Resistant Overglaze (full
:: Amkor Technology Receives Distinguished Supplier Performance Award from Freescale (full
:: Master Bond’s New Polymer System Cures by UV Light and/or Heat (full
:: Endicott Interconnect Technologies, Inc. Wins "ROG" Award (full
:: DYCONEX AG and MST Announce Changes in Management Structure (full
:: EV Group And Brisbane Materials Technology Introduce Breakthrough Anti-Reflective Coating Solution To Boost Power Ouput Of Photovoltaics (full
:: Indium Corporation’s Heat-Spring® Enhances Green Revolution’s CarnotJet™ Server Cooling System (full
:: Connecting Research to Industry at “R2i” ...The electronics industry version of Britain’s got Talent - meets the Dragon Den! (full
:: Nordson YESTECH Recognized by Celestica as Total Cost of Ownership (TCCO) Supplier (full
:: Nusil Technology Presents Easy-To-Use Film Adhesive with Low Outgassing (full
:: Palomar CEO Named Finalist in E&Y Entrepreneur Of The Year 2012 Award for San Diego (full
:: StratEdge Introduces Laminate Packages for High Power GaN Devices (full
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News from Heraeus: Different Color Versions for its Acid-Resistant Overglaze
The Thick Film Division of Heraeus Precious Metals has announced several new color versions for its IP9038A acid-resistant overglaze. The 520°C-firing overglaze minimizes resistance shift on refire and is resistant to plating solutions.
IP9038A is now available in different colors including blue, green, yellow, light brown, dark brown, black, white, and clear. The RoHS- and REACH-compliant overglaze is pinhole-free and can be applied in a single-coat.
“A number of our customers expressed interest in having various colors of our IP9038A overglaze to better identify their products for purposes such as decade values and other classifying requirements,” said Mel Mehta, Sales and Marketing Manager at Heraeus. “Our technology team developed an array of colors in a very short time frame to meet customer demand.”
The pastes cure at temperatures lower than 300 °C.
The pastes adhere well to a variety of substrates.
The Thick Film Division of Heraeus Precious Metals, has also announced the introduction of three new polymer-based heater pastes that cure at temperatures lower than 300°C and adhere well to a variety of substrates. The system consists of a dielectric paste, resistor paste, and epoxy-based silver conductor pastes.
The LTD5301 dielectric paste can be applied in three layers using a 230 mesh screen. The layers can be co-cured: Print Layer 1 cures at 150°C for 10-minutes, Print Layer 2 cures at 150°C for 10-minutes and Print Layer 3 cures at 250°C for 30-minutes. Target thickness is 40µm. This polymer insulator yields a chemically inert film that will not react with circuit components.
The TR43.08 resistor paste is recommended for screen printing on 280-325 mesh screen. This low-ohm polymer resistor (70-90 ohms/sq.) cures at 200°C-to-250°C peak temperature for 60-minutes and dries in 10-minutes at 150°C. Target cured thickness is 23-27 µm. Other resistor values can be developed depending on specific requirements.
The LTC3001 epoxy-based silver conductor paste is screen-printable using a 230-325 mesh screen. It offers multiple curing times: 150°C for 30-minutes, 200°C for 15-minutes and 350°C for 10 minutes. Cure thickness is 15-20 µm. The paste cures to a film that has low resistivity and excellent solvent resistance. Multiple layers will give a greater overall thickness and increase the leach resistance.
“The polymer heater paste system was developed to provide a low-temperature processing alternative for designing and manufacturing heater circuits,” said Mel Mehta, Sales and Marketing Manager at Heraeus. “The system’s low temperature processing allows a variety of substrates to be used.”
These products will be highlighted at Heraeus’ booth (#204) during the IMAPS 2012 conference taking place September 9-13 in San Diego, Calif.
Amkor Technology Receives Distinguished Supplier Performance Award from Freescale
Amkor Technology, Inc. has announced that it has received the Distinguished Supplier Performance Award from Freescale Semiconductor at the Freescale Supplier Day Event held in San Antonio, Texas. Greg Lowe, Freescale's chief executive officer, presented the award to Amkor.
“Amkor has provided exemplary performance over the past year in their service to Freescale,” said Bill McKean, Freescale’s vice president and chief procurement officer. “Amkor led the way among all of our suppliers in cost reductions beginning in the second part of 2011, out-performed their customer quality incidents allotment and had perfect scores on delivery throughout 2011. By consistently providing technical alignment with Freescale technology requirements and investing in the equipment required to support our business, Amkor continues to win new business with us. This award demonstrates Amkor’s commitment to Freescale and the continuing partnership between the two companies.”
“Amkor is honored to be recognized as a Distinguished Supplier by Freescale, a company that is a global leader in embedded processing solutions, innovation and product superiority,” said Mike Lamble, Amkor’s executive vice president, global sales and marketing. “We strive to consistently improve the product performance and service we provide our customers, and to meet their technology and capacity needs. This is a great example of how our focus on understanding the customers’ needs and exceeding their expectations helps our customers be more competitive.”
Master Bond’s New Polymer System Cures by UV Light and/or Heat
Master Bond Inc., Hackensack, N.J. has introduced a new one component, optically clear, non-yellowing UV and/or heat curable polymer system called UV15-7DC. This high performance system is designed for bonding, sealing and coating applications. It is 100% reactive and does not contain any solvents or other volatiles. UV15-7DC is not inhibited by air and exhibits a desirably fast UV cure at ambient temperatures. Typical cure times range from 5 seconds to 2-3 minutes depending upon the wave length, intensity of the UV light and the thickness being cured. Typical heat curing schedules are 10-30 minutes at 250-260°F. Heat curing is recommended for use in applications with “shadowed out areas”.
Master Bond UV15-7DC is easy to use and has a low viscosity. It has outstanding durability, toughness, thermal shock resistance as well as excellent adhesion to many different substrates. These substrates include glass, metals, plastics, polyester films and polycarbonates. It has a Shore D hardness of >70 and an elongation of 65-75%. Its tensile strength is 5,460 psi.
Master Bond UV15-7DC is available in pint, quart, gallon and 5 gallon containers. For ease of application it also is available in syringe applicators.
Endicott Interconnect Technologies, Inc. Wins "ROG" Award
Endicott Interconnect Technologies, Inc., (EI) was presented with a "ROG" Award for the "Most Challenging Board Build" by the Rogers Corporation. EI was recognized at a dinner during IMS 2012 on Wednesday, June 20th in Montreal, where Senior R&D Scientist, Mark Schadt, accepted the award on EI's behalf.
The "ROG" award was presented in recognition of Endicott Interconnect's exceptional contributions in developing and fabricating a challenging Printed Circuit Board, using Rogers Corporation's LCP material. "We applaud Rogers Corporation for their commitment to provide both consistent material quality and knowledgeable support, and wish to express our sincere appreciation for being recognized by them for our successful fabrication of high-reliability, multilayer circuits incorporating Rogers Ultralam® 3000 LCP dielectric," stated Mr. Schadt.
DYCONEX AG and MST Announce Changes in Management Structure
DYCONEX AG and the Micro Systems Technologies (MST) Group are pleased to announce important changes in their management structure.
The very favorable development of the MST Group as a global provider of mission critical components, services and products for the medical implants industry requires not only investments in technology and capabilities, but also in management capacity to allow for a further increase in customer focus across the organization.
Effective July 1, 2012, Mr. Michael Fink, who has been CEO of DYCONEX AG since 2005, was appointed President Sales & Marketing of the Micro Systems Technologies Group. Relying on many years of international management experience within the electronics industry and his strong personal network, he will focus on taking the Group to the next level of customer intimacy and business success. Mr. Fink holds a masters degree in optical engineering from the University of Applied Science, Cologne, Germany.
Also effective July 1, 2012, Dr. Hubert Zimmermann will assume Mr. Fink's former role as CEO of DYCONEX AG. Dr. Zimmermann contributes many years of international management experience in the metal-working and composites industry. He will focus on further developing DYCONEX with respect to its technology portfolio and capabilities. Dr. Zimmermann received a Master of Science in Electrical Engineering from the Swiss Federal Institute of Technology (ETH Zurich). In addition, he was awarded a Master of Business Administration (lic. oec. HSG) and a PhD in economics (Dr. oec. HSG) from the University of St. Gallen, Switzerland.
EV Group And Brisbane Materials Technology Introduce Breakthrough Anti-Reflective Coating Solution To Boost Power Ouput Of Photovoltaics
EV Group (EVG), a leading supplier of coating equipment for the photovoltaics (PV), nanotechnology and semiconductor markets, and Brisbane Materials Technology (BMT), a specialty materials company, today announced they are collaborating to provide a total solution for anti-reflective (AR) coatings for the PV market. Under a strategic cooperation agreement, EVG has optimized its large-area coating systems for BMT's unique materials and processes, enabling high-yield fabrication of AR coatings with industry-leading performance and cost.
The innovative technology enables the creation of a nano-porous silicon dioxide (SiO(2)) film from a liquid precursor at room temperature and atmospheric pressure, making this technology compatible with all existing PV-module and solar glass manufacturing lines. The SiO(2) film is covalently bonded to the glass surface to give maximum durability and field reliability. The coatings have undergone rigorous testing to IEC 61215 standards, and have successfully completed a 2.5-year accelerated aging test equivalent to more than 20 years of field application.
EVG has installed a pilot line for large-area coating demonstration at its Austria headquarters. The companies will provide further details on the materials technology and manufacturing equipment in their shared booth #5687 at Intersolar North America 2012, July 10-12, in San Francisco, Calif.
The International Technology Roadmap for PV (ITRPV) specifies the introduction of AR coatings on solar cover glass beginning in 2013, and then moving into mainstream production going forward. "Our AR coatings improve the peak power output of PV modules by 3 percent, at the industry's lowest cost per square meter," said Dr. Gary H. Wiseman, founder and CEO of BMT. "Our broadband AR coatings, with their excellent angular performance, should increase the energy output of a PV module by 5 to 6 percent or more when averaged over an entire day. Combining our unique materials technology with EVG's field-proven manufacturing systems allows us to provide a complete turnkey AR coating solution to customers."
Dr. Thorsten Matthias, EV Group business development director added, "Working with BMT will allow EVG to extend to the solar market the expertise in coating systems that we have built up over more than 15 years in the semiconductor and display industries. Together, we will be able to advance ITRPV requirements while quickly ramping to a high-volume manufacturing coating solution with greater flexibility, reliability and cost-effectiveness compared to competitive offerings."
Indium Corporation’s Heat-Spring® Enhances Green Revolution’s CarnotJet™ Server Cooling System
Indium Corporation's Heat-Spring® compressible soft metal thermal interface material is now being used in Green Revolution’s CarnotJet™ liquid server cooling system.
Green Revolution’s CarnotJet™ System is one of the most powerful and efficient computer server cooling systems in the world. With over 100kW of cooling potential per rack, it can reduce a data center’s total energy use by 50%. It is used by some of the world’s top supercomputer sites.
According to Indium Corporation’s Thermal Interface Materials Product Line Manager, Jordan Ross, “Green Revolution’s technology uses 100% liquid immersed electronics in a dielectric fluid. Polymer based thermal interface materials will not work in such an environment. Indium Corporation’s metal Heat-Spring® enables this technology by providing a stable and highly effective thermal interface.”
“The Heat-Spring maximizes the thermal efficiency of CPUs and GPUs installed in the CarnotJet system’s dielectric fluid cooling environment,” said David Banys, Director of Marketing at Green Revolution Cooling. “Indium Corporation’s product gives customers the freedom to submerge servers produced by any OEM.”
Green Revolution Cooling produces the CarnotJet™ fluid-submersion cooling system for data center servers. The technology reduces data center cooling energy use by 95% and has installations at five of the top 100 supercomputing sites worldwide.
Connecting Research to Industry at “R2i” ...The electronics industry version of Britain’s got Talent - meets the Dragon Den!
IMAPS-UK and IeMRC organised a unique event held at the Henry Ford College, Loughborough University on 19 June 2012. The “Research to Industry Conference: R2i” set about enabling academic researchers to network with industrialists and forge new links that could help move their work from academia towards commercial exploitation. This distinctive event allowed 35 academic presenters to show their research activities to potential developers from industry.
With over 100 delegates attending, R2i provided an insight into the excellent research work now going on in UK universities and there were some really exciting technologies on offer, from Electronic fabrics to Solar Power convertors and everything in between.
Each Academic presenter was allowed just 5 minutes to tell the audience what they were working on and what was so good about it. This allowed plenty of time for breaks when the industry “dragons” could access further details by looking at the posters on display and catching-up with presenters to discuss future opportunities.
At the end of the formal presentations the prizes were announced. The IEEE CPTM (UK & RI) gave the results of their assessment of the best student projects and awarded 4 of the presenters with prizes. Then it was the turn of IMAPS-UK to award a cash prize of £2,500 for use in taking forward what a team of five adjudicators considered to be the best overall project. This went to Sheffield University for work on Functional Oxides that offer interesting solutions for antennas, thermistors, actuators, Li-batteries, fuel cells, thermoelectrics, memristors and several other applications.
For those not able to attend, further details of the event can be found on either the IMAPS-UK or IeMRC websites.
IMAPS UK is continuing to support the work of the IeMRC and with backing from the IEEE, the ESP KTN and NMI, will undertake to organise next year’s event being held on 3rd July 2013, to be even more successful.
Nordson YESTECH Recognized by Celestica as Total Cost of Ownership (TCCO) Supplier
Nordson YESTECH, has announced that they have been recognized as Celestica’s 2011 Total Cost of Ownership Supplier for Best Indirect Services. The awards honor suppliers who provide the best TCOO performance to Celestica and its customers by demonstrating excellence in quality, delivery, technology, service, pricing and flexibility. Nordson YESTECH was presented with the award in a ceremony held in Toronto, Canada on June 7th
Nordson YESTECH was the only equipment supplier to be recognized in 2011, joining only five other equipment companies to receive this recognition in the last six years. Celestica’s TCOO system is focused on evaluating supplier performance by measuring the total cost to produce, deliver and support products and services beyond the supplier invoice price. This marks the sixth year of Celestica’s TCOO Supplier Awards program, which evaluates and recognizes the top performers in Celestica’s global network of over 3,000 suppliers. The Best Indirect Services Award recognizes a non-production supplier who has been pivotal in providing the necessary support and best-in-class service.
“Nordson YESTECH’s pro-active, can-do attitude and their best-in-class service earned this supplier a nomination, and now a win, in this award category,” said Tom Blaszczyk, Manager Operations Excellence, Celestica. “Their team of technical field service engineers is always quick to respond to problems and their equipment has helped to ensure quality control and consistency of inspection. They are truly collaborative, and work closely with Celestica’s global engineering team to define technical roadmaps for their future products,” he added.
“We are genuinely honored to be recognized by Celestica for our service“, said Don Miller, Nordson YESTECH's President and CEO. “One of YESTECH’s primary goals has always been providing exceptional service and support to our customers. This award is especially meaningful to our organization, acknowledging those efforts.” added Miller.
Nusil Technology Presents Easy-To-Use Film Adhesive with Low Outgassing
Film adhesive and activator duo requires no mixing or deairing.
NuSil technology LLC, announces the release of CV-2681-12, an electrically conductive, controlled volatility (low outgassing) film adhesive designed for a wide range of applications, from tacking down wires to working with solar cells and mirrors.
Static-dissipative with controlled volatility, CV-2681-12 is ideal for electronics and space applications that require minimal outgassing in sensitive applications (e.g., satellites). On average, its volume resistivity measures 125 ohm.cm. This film adhesive can be die cut and has, approximately, a .012 inch controlled bond line for consistent bond thickness. A space-grade material, CV-2681-12 can maintain adhesion in a broad range of temperatures, making it suitable for RFI and EMI shielding in electrical space applications or, more generally, for applications in which temperature is a concern.
Simple to use, CV-2681-12 is a room temperature vulcanizing (RTV) adhesive and, therefore, does not require heat to cure. This two-part material consists of HCR sheeting reinforced with a mesh and a separate catalyst, known as the "activator," to induce curing.
“CV-2681-12 requires no mixing and no deairing before using,” said Brian Burkitt, Product Director – Engineering Materials. “Once the priming activator has been applied to the substrate, peel the adhesive from the backing and stick it on the prepared surface.”
CV-2681-12 meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A, and the European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%.
Palomar CEO Named Finalist in E&Y Entrepreneur Of The Year 2012 Award for San Diego
Bruce Hueners, president and CEO, is a finalist for the Ernst & Young Entrepreneur Of The Year® 2012 Award in San Diego.
According to Ernst & Young LLP, the awards program recognizes entrepreneurs who demonstrate excellence and extraordinary success in such areas as innovation, financial performance and personal commitment to their businesses and communities. Mr. Hueners was selected as a finalist by a panel of independent judges in the “Technology and Software” category. From the original 85 semi-finalists, Mr. Hueners was one of 20 finalists recognized at the June 13, 2012, awards ceremony held at the Hyatt Regency in La Jolla, CA.
“It is an honor to have been selected as a finalist for the 2012 San Diego Ernst & Young Entrepreneur Of The Year® award. However, this recognition is truly a reflection of the ingenuity, innovation and achievements of the entire team at Palomar Technologies,” stated Mr. Hueners. “My fellow finalists are a remarkable group of San Diego’s top entrepreneurs, and I am proud to be included among them.”
StratEdge Introduces Laminate Packages for High Power GaN Devices
~ Copper-moly-copper packages dissipate heat ~
StratEdge Corporation, introduces a new family of high power laminate packages. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages handle applications through 6 GHz for use in RF radios for communications, radar, and high power millimeter-wave signals.
The series includes two laminate power packages, both with a ratio of 1:3:1 CMC, which provides a good thermal match for alumina-based materials and a GaN chip. The LL802302 is 0.8" (20.32mm) long x 0.39" (9.91mm) wide with 2 leads and a raised lid with an epoxy seal. This is a flange package with a bolt hole on each end so the package can be bolted to the printed circuit board. The LL362302 is a flangeless, fully hermetic version of the LL802302 package, and has a flat ceramic lid. StratEdge offers both flange and flangeless styles to accommodate manufacturing processes to either bolt down or solder the package. Hermeticity is especially critical in aerospace and defense applications.
"StratEdge's new laminate power packages solve thermal problems encountered when using GaN devices," explained Tim Going, StratEdge president. "The excellent thermal conductivity of the CMC base enables use of GaN devices in high power applications, and the flange package facilitates manufacturing. StratEdge is continuing to develop packages to handle the requirements of today's new materials and devices."