:: DuPont Displays Eye-Catching Material Innovations at SID (full
:: Nusil Technology Presents New Easy-to-Use Film Adhesive with Low Outgassing (full
:: New Demo Center & Expanded Spare Parts Depot to Further Support Palomar Customers in Asia-Pacific Region (full
:: Driven by Mobile Phones and Tablets, CSPs Show Strong Growth (full
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DuPont Displays Eye-Catching Material Innovations at SID
“DuPont continues to assert its leadership in solution printing process technology and advanced OLED materials that provide display manufacturers a clear path to achieve a significantly lower OLED manufacturing cost position,” said John Richard, president, DuPont Displays. “Two new materials from DuPont Teijin Films are being introduced, and the latest Vertak® optical bonding technologies also will be featured. Our goal remains to improve display performance and enable cost-effective, next-generation breakthroughs across a broad range of technologies, and we’re excited about bringing that message to life for the display industry at SID this year.”
Nusil Technology Presents New Easy-to-Use Film Adhesive with Low Outgassing
NuSil Technology LLC announces the release of CV-2681-12, an electrically conductive, controlled volatility (low outgassing) film adhesive designed for a wide range of applications, from tacking down wires to working with solar cells and mirrors.
Static-dissipative with controlled volatility, CV-2681-12 is ideal for electronics and space applications that require minimal outgassing in sensitive applications (e.g., satellites). On average, its volume resistivity measures 125 ohm.cm. This film adhesive can be die cut and has, approximately, a .012 inch controlled bond line for consistent bond thickness. A space-grade material, CV-2681-12 can maintain adhesion in a broad range of temperatures, making it suitable for RFI and EMI shielding in electrical space applications or, more generally, for applications in which temperature is a concern.
Simple to use, CV-2681-12 is a room temperature vulcanizing (RTV) adhesive and, therefore, does not require heat to cure. This two-part material consists of HCR sheeting reinforced with a mesh and a separate catalyst, known as the "activator," to induce curing.
“CV-2681-12 requires no mixing and no deairing before using,” said Brian Burkitt, Product Director – Engineering Materials. “Once the priming activator has been applied to the substrate, peel the adhesive from the backing and stick it on the prepared surface.”
CV-2681-12 meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A, and the European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%.
New Demo Center & Expanded Spare Parts Depot to Further Support Palomar Customers in Asia-Pacific Region
With the growing installed base of 3800 Die Bonder customers and the long-standing presence of 8000 Wire Bonders across the APAC region, Palomar Technologies has successfully expanded the Palomar Asia Spare Parts Depot and regional customer services infrastructure. Mr. PH Chan, director of Palomar Technologies Asia, recently confirmed the Palomar Asia Spare Parts Depot will be able to meet requests for overnight spare parts delivery to regional APAC customers.
In addition to the expanded Palomar Asia Spare Parts Depot, Chan has also led the development of a Singapore-based demonstration laboratory in order to support increasing demand for in-person 8000 Wire Bonder and 3800 Die Bonder demonstrations with APAC customers. Providing customer-focused private bonder demonstrations has always been part of Palomar Technologies’ niche identity. This unique one-on-one service is now available regionally to APAC companies.
“In 2010, Palomar Technologies launched the 3800 Die Bonder, designed for fully automatic, precision microelectronics assembly and die attach processes,” states Chan. “The 3800 continues to be a success with our customers worldwide; however, the greatest need for the 3800 Die Bonder has proven to be within the emerging markets in Asia. The 3800 Die Bonder utilizes a large work area and various presentation tools for epoxy dispense and steady state and pulsed heat eutectic die attach—proving to be the most versatile, high-accuracy die bonder in the market for advanced microelectronics assemblies and complex hybrids.”
The new Palomar Asia demonstration laboratory is outfitted with applications and process development capabilities for both wire bond and die attach. Expert Palomar Technologies Field Service Engineers and Technical Liaisons will continue to lead demonstrations.
Driven by Mobile Phones and Tablets, CSPs Show Strong Growth
TechSearch International has released its market forecast for BGAs and CSPs. The BGA market is divided into plastic, tape, and ceramic structures. The CSP market is divided into laminate (FBGA), flex circuit, leadframe (QFN), and stacked die packages. CSPs are forecasted to grow almost 8.6 percent over the next five years, not including wafer level packages. QFNs continue to show high growth rates with many companies reporting that demand is strong. TechSearch International’s survey shows that 600 million package-on-package (PoP) shipped in 2011. PoP and package-in-package (PiP) are expected to be replaced by 3D TSV stacks in the future, but process yield targets and logistics and infrastructure issues must be resolved. PoP is replacing PiP in new designs and growth for PoP remains strong with new players emerging. Details of 3D package stacking include developments in thinner PoP using embedded solutions and fan-out WLP. Stacked die packages are also seeing continued growth both in terms of unit shipments and number of die per package.
Estimates of the market for each package type are based on input from both captive and merchant assembly operations. Key applications and drivers for unit volume growth are highlighted. Also highlighted are some of the recent developments in embedded packages from ASE and Dai Nippon Printing.
TechSearch International’s analysis has just been published in a new 65-page Advanced Packaging Update report. The report includes an economic update for the semiconductor packaging industry and an analysis of the investment plans by OSATs.
TechSearch International, Inc., founded in 1987, is a market research firm specializing in technology trends, microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 15,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887, fax: 512-372-8889, or http//www.techsearchinc.com.