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:: Corporate Member News ::

This issue focuses on the Exhibiting Companies at Device Packaging 2012

:: Newport MRSI (full story)

:: Nordson ASYMTEK Featured Solution: CSP and BGA Underfill (full story)

:: Stop by to see what Axus Technology is up to at IMAPS Device Packaging, Booth 05 (full story)

:: SUSS MicroTec and GenISys Announce Cooperation on Mask Aligner Lithography Simulation Software (full story)

:: S-Cubed (Service Support Specialties, Inc.) (full story)

:: For the latest 3D packaging information visit STATS ChipPAC’s Booth #23 (full story)

:: Amkor will be highlighting a broad range of next generation packaging technologies at the upcoming IMAPS Device Packaging Conference 2012 (full story)

:: Hesse & Knipps, Inc. Opens Second Demo and Applications Lab on West Coast (full story)

:: Visit SET at Device Packaging (full story)

:: Visit with Palomar Technologies engineering experts at booth #41 at IMAPS Device Packaging! (full story)

:: Kyocera America, Inc. Exhibiting at Device Packaging (full story)

:: Pacific Rim Engineering will also be representing Micro Printing Systems (full story)

:: Endicott Interconnect Technologies displays new Advanced High Density Packaging and Medical Technologies (full story)

 

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Axus Technology
ASE Group
Newport Corporation
Kyocera America
Solid State Equipment Corp.
Endicott Interconnect

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

Palomar Technologies

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Newport MRSI

Part of Newport’s Integrated Solutions Business, the MRSI products have been supplying high precision dispense and assembly equipment solutions to the microelectronics industry for over two decades.  Newport MRSI supports the manufacture of Microwave, Optical, MCM’s and MEM’s devices, as well as the next generation of TSV and 3D packaging technologies. Newport products support multiple interconnect technologies, including epoxy die bonding, eutectic attach and flip chip. The ultra-precision Newport MRSI-M5 with 5 micron accuracy and MRSI-605 Assembly Work Cells specialize in GaAs handling.  Newport MRSI-175Ag Epoxy Dispenser is the leader for high precision conductive epoxy dispensing.

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Nordson ASYMTEK Featured Solution: CSP and BGA Underfill

To build electronic assemblies in high volume requires high-speed, precision dispensing. In many CSP applications, such as mobile phones and tablets, it is critical to dispense precise volumes of fluid to provide protection of the solder balls from vibration and heat without wasting expensive encapsulation material. The dispensing also needs to automatically compensate for changes in fluid viscosity over the pot life of the material.

Non-contact jet dispensing is ideal to underfill chip scale packages (CSPs) and ball grid arrays (BGAs) on board as well as package-on-packages (PoPs).

Nordson ASYMTEK's jetting systems automatically manage the critical processes related to underfilling with our Control Process Jetting (CPJ) software.

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Stop by to see what Axus Technology is up to at IMAPS Device Packaging, Booth 05

Axus Technology is pleased to announce that it will be exhibiting at IMAPS Device Packaging at the Radisson Fort McDowell Resort and Casino in Scottsdale, Arizona--March 6th-7th, at Booth # 05.

Visit our booth to discuss how we can deliver leading-edge CMP, wafer thinning and wafer polishing solutions for semiconductor, MEMS and substrate applications for your needs. Axus Technology is the industry expert in providing material processing and CMP foundry services, process tools, and custom configured upgrades that are designed to meet your process and production requirements. 
We specialize in foundry and process services such as:

  • CMP
  • Bonding
  • Polishing
  • Wafer Grinding
  • Thinning
  • Edge Grinding

Customer support services include tool upgrades, spare parts, and field service support for a range of CMP and wafer grinding tools, including installed legacy tools. Engineering services include process development, equipment modification and upgrade, and the value engineering of critical components.  Axus also manages surplus equipment transactions and the remarketing of excess spares and materials.  If it involves technical support for polish, grind or planarization, the engineers at Axus Technology have the experience to deliver results.

We look forward to seeing you at the show. Or visit us online at http://www.axustech.com.

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SUSS MicroTec and GenISys Announce Cooperation on Mask Aligner Lithography Simulation Software

SUSS MicroTec and GenISys GmbH, has announced a cooperation agreement to combine the SUSS MicroTec mask aligner tools with the GenISys simulation software Layout LABTM.

Within the cooperation GenISys Layout LABTM has been enhanced to accurately model all available SUSS MicroTec mask aligner exposure optics. Both parties join forces to market the SUSS MicroTec mask aligner technology with the GenISys lithography simulation software Layout LABTM. The combination of lithography equipment and matching simulation software is a key success factor for cost effective process and device development for the end user.

The sophisticated and latest SUSS exposure optics technology, MO Exposure Optics, enables the use of frontend technologies like illumination shaping and mask layout optimization on mask aligner equipment', said Frank P. Averdung, President and CEO of SUSS MicroTec AG. 'This in combination with GenISys simulation software is a key technology enabler as it allows easy modeling of large numbers of different source shapes.

Layout LABTM is a professional full 3D simulation platform for optical proximity lithography, which enables to optimize mask layout and exposure conditions by running a large number of simulations overnight. Besides saving direct costs, users are gaining time to market' said Nezih Unal, Vice President of GenISys.

 

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S-Cubed (Service Support Specialties, Inc.)

S-Cubed has recently signed an agreement with a major BEOL Wafer Level ChipScale packing firm in Asia for the provision of a Wafer Edge Exposure Tool (WEE).   The tool will be the sixth of a series of such tools delivered to Asian WLCSP packing firms. The tool is capable of both 200mm and 300mm wafers and is noted for its Low Cost of Ownership (Low COO) based upon small footprint, high throughput coupled with high reliability and low cost.  Additionally, S-Cubed has introduced its Force 300 tool as a Coater, Coater/Developer for both Photoresist and polyimides, the technology is based on its earlier Flexi line of 200mm tools designed and built specifically for BEOL and special customer needs involving self cleaning hot plates and spin modules. These feature are of particular importance when thicker films characteristic of BEOL applications are considered, and have the effect of substantially  lowering the COO of such tools.  The company's production tool platforms are useful across a broad spectrum of user applications including WEE, Coat, Develop, Bake, Chill, Etch (UBM and RDL) for all current wafer sizes up to and including 300mm. 

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For the latest 3D packaging information visit STATS ChipPAC’s Booth #23

STATS ChipPAC invites you to stop by booth #23 at the IMAPS Device Packaging Conference to discuss the latest information on advanced 3D packaging solutions including embedded Wafer Level Ball Grid Array (eWLB), low cost copper column flip chip PoP technology and stacked die integration of RF packages. Each of these topics will also be covered during the technical sessions at the conference. STATS ChipPAC’s 3D solutions provide customers with increased integration of multiple functions such as baseband processors, RF transceivers, power management components and application processors for improved system performance in thinner and smaller package dimensions.

We look forward to seeing you at the Device Packaging Conference. You may also visit our website at www.statschippac.com.

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Amkor will be highlighting a broad range of next generation packaging technologies at the upcoming IMAPS Device Packaging Conference 2012

Amkor will be highlighting a broad range of next generation packaging technologies at the upcoming IMAPS Device Packaging Conference 2012. 

Presentations include:

An overview of market demand and readiness for 2.5D & 3D packaging in
TSV based products,

Assembly challenges for large interposer based 2.5D packages with
TSVs,

In collaboration with Qualcomm, a methodology for chip package
interaction (CPI) modeling in 3D IC structures,
The evolving status of the 2.5 and 3D IC manufacturing
infrastructure,

Enhancements provided by molded underfill in CSP applications, and
In collaboration with Cadence, packaging improvements realized by
following a route planning methodology.

 

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Hesse & Knipps, Inc. Opens Second Demo and Applications Lab on West Coast

Chalman Technologies hosts Hesse & Knipps West Coast Demo and Apps Lab

Hesse & Knipps, Inc. recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region. 

The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep – Chalman Technologies – in Anaheim, CA.  Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, MA.

Hesse & Knipps’ western region customers can now more conveniently test and troubleshoot applications on Hesse & Knipps’ Bondjet BJ 820 High Speed Fully Automatic Fine Wire Wedge Bonder, the fastest wedge bonder on the market, while prospective customers can validate the capabilities and qualify Hesse & Knipps wedge bonders prior to making a purchase. Hesse & Knipps applications engineers staff the Demo and Applications Lab, working directly with customers.

“We are very pleased to partner with Chalman Technologies – one of the most professional rep organizations in the industry – to bring our new applications lab to western region customers and prospects. Rather than fly across the country, western region customers can now more readily test new and existing applications using our latest wedge bonder technology,” notes Joseph Bubel, president of Hesse & Knipps, Inc. “Chalman Technologies offered an ideal location that was close to our western region customer base and the growing RF and microwave market.”

For more information on Hesse & Knipps West coast demo and applications lab or to schedule a visit, e-mail info@hesse-knipps.us.

 

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Visit SET at Device Packaging

Discover on SET booth#50 the innovative FC300R Bonder which offers pilot production capabilities for Chip-to-Substrate or Chip-to-Wafer assembly as well as Chip Stacking. With the unmatched post-bond accuracy of ± 0.5 μm, across the entire force range of the machine (up to 4,000N), the FC300R is the ideal tool for 3D-IC applications using high density TSV.http://www.set-sas.fr/en/mpg6-398238--FC300R-Die---Flip-Chip-Bonder-with-Robotics.html?track=IMAPS&utm_source=Bulletin&utm_medium=Bulletin&utm_term=february&utm_campaign=IMAPS

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Visit with Palomar Technologies engineering experts at booth #41 at IMAPS Device Packaging!

Visit with Palomar Technologies engineering experts, Bradley Benton and Julie Adams, at booth #41 at IMAPS Device Packaging!

Get caught up on your reading before the show with hot topics from the PTI Blog:

Safe travels, and we’ll see you in Scottsdale, AZ!

Our best,
The Palomar Technologies Team

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Kyocera America, Inc. Exhibiting at Device Packaging

Kyocera America, Inc. (KAI) has been manufacturing ceramic packages in San Diego, CA since 1971. KAI offers an extensive array of semiconductor packages and complex modules for numerous applications including RF, millimeter wave, high-reliability, phased array radar, and telecommunications.  Packages are available in HTCC, LTCC, alumina, and BeO. KAI has state-of-the-art package design capability in-house that includes electrical and thermo-mechanical design, modeling / simulation and analysis to maximize package and circuit performance in your application. Our Assembly Technology Division accepts prototype to volume production orders for flip chip, wirebond, wafer dicing and vacuum soldering to provide a convenient one-stop-shop solution for customers.

 

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Pacific Rim Engineering (Ray Petit) will also be representing Micro Printing Systems

Micro Printing Systems is the worldwide manufacture and supplier of the MPS screen printers, Models TF100 and SP1500, to the hybrid, ceramic, micro-electronic and PC solder paste industries. They are also a major supplier of the leading squeegee materials in the industry. (www.mps-intl.com)

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Endicott Interconnect Technologies displays new Advanced High Density Packaging and Medical Technologies

Endicott's Dr. Rabindra Das presents "Development of Electronic Substrates for Medical Device Applications" on Wednesday March 7th at 11:00 AM and will also be participating in an interactive poster session on Wednesday March 7th in the Exhibit Hall at 2:00 PM to discuss "Package-Interposer-Package (PIP) Technology for High End Electronics."

Visit Endicott at Booth #64 to view our latest technology developments such as;

  • Multi (6) layer Rigid and Rigid-Flex LCP structures
  • Substrates manufactured with both Embedded passives (capacitance) circuits and active devices
  • Very fine linewidth Polyimide Medical Imaging flex substrate assemblies
    with  leading edge pitch Flip Chip semiconductors

Our popular multilayer medium and high performance CoreEZ and HyperBGA singlechip, MCM and SiP packages

 

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View the Corporate Bulletin Archives

 


:: Issue 117 ::
March 6, 2012

LORD Corporation

RGL Enterprises

EPP

RGL Enterprises

QSIC