:: Visit with Palomar Technologies engineering experts at booth #41 at IMAPS Device Packaging! (full
:: Kyocera America, Inc. Exhibiting at Device Packaging (full
:: Pacific Rim Engineering will also be representing Micro Printing Systems (full
:: Endicott Interconnect Technologies displays new Advanced High Density Packaging and Medical Technologies (full
Corporate Fast Links ::
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More Information ::
Only news about IMAPS Corporate Members will be published in this
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Part of Newport’s Integrated Solutions Business, the MRSI products have been supplying high precision dispense and assembly equipment solutions to the microelectronics industry for over two decades. Newport MRSI supports the manufacture of Microwave, Optical, MCM’s and MEM’s devices, as well as the next generation of TSV and 3D packaging technologies. Newport products support multiple interconnect technologies, including epoxy die bonding, eutectic attach and flip chip. The ultra-precision Newport MRSI-M5 with 5 micron accuracy and MRSI-605 Assembly Work Cells specialize in GaAs handling. Newport MRSI-175Ag Epoxy Dispenser is the leader for high precision conductive epoxy dispensing.
Nordson ASYMTEK Featured Solution: CSP and BGA Underfill
To build electronic assemblies in high volume requires high-speed, precision dispensing. In many CSP applications, such as mobile phones and tablets, it is critical to dispense precise volumes of fluid to provide protection of the solder balls from vibration and heat without wasting expensive encapsulation material. The dispensing also needs to automatically compensate for changes in fluid viscosity over the pot life of the material.
Non-contact jet dispensing is ideal to underfill chip scale packages (CSPs) and ball grid arrays (BGAs) on board as well as package-on-packages (PoPs).
Nordson ASYMTEK's jetting systems automatically manage the critical processes related to underfilling with our Control Process Jetting (CPJ) software.
Stop by to see what Axus Technology is up to at IMAPS Device Packaging, Booth 05
Axus Technology is pleased to announce that it will be exhibiting at IMAPS Device Packaging at the Radisson Fort McDowell Resort and Casino in Scottsdale, Arizona--March 6th-7th, at Booth # 05.
Visit our booth to discuss how we can deliver leading-edge CMP, wafer thinning and wafer polishing solutions for semiconductor, MEMS and substrate applications for your needs. Axus Technology is the industry expert in providing material processing and CMP foundry services, process tools, and custom configured upgrades that are designed to meet your process and production requirements.
We specialize in foundry and process services such as:
Customer support services include tool upgrades, spare parts, and field service support for a range of CMP and wafer grinding tools, including installed legacy tools. Engineering services include process development, equipment modification and upgrade, and the value engineering of critical components. Axus also manages surplus equipment transactions and the remarketing of excess spares and materials. If it involves technical support for polish, grind or planarization, the engineers at Axus Technology have the experience to deliver results.
SUSS MicroTec and GenISys Announce Cooperation on Mask Aligner Lithography Simulation Software
SUSS MicroTec and GenISys GmbH, has announced a cooperation agreement to combine the SUSS MicroTec mask aligner tools with the GenISys simulation software Layout LABTM.
Within the cooperation GenISys Layout LABTM has been enhanced to accurately model all available SUSS MicroTec mask aligner exposure optics. Both parties join forces to market the SUSS MicroTec mask aligner technology with the GenISys lithography simulation software Layout LABTM. The combination of lithography equipment and matching simulation software is a key success factor for cost effective process and device development for the end user.
The sophisticated and latest SUSS exposure optics technology, MO Exposure Optics, enables the use of frontend technologies like illumination shaping and mask layout optimization on mask aligner equipment', said Frank P. Averdung, President and CEO of SUSS MicroTec AG. 'This in combination with GenISys simulation software is a key technology enabler as it allows easy modeling of large numbers of different source shapes.
Layout LABTM is a professional full 3D simulation platform for optical proximity lithography, which enables to optimize mask layout and exposure conditions by running a large number of simulations overnight. Besides saving direct costs, users are gaining time to market' said Nezih Unal, Vice President of GenISys.
S-Cubed has recently signed an agreement with a major BEOL Wafer Level ChipScale packing firm in Asia for the provision of a Wafer Edge Exposure Tool (WEE). The tool will be the sixth of a series of such tools delivered to Asian WLCSP packing firms. The tool is capable of both 200mm and 300mm wafers and is noted for its Low Cost of Ownership (Low COO) based upon small footprint, high throughput coupled with high reliability and low cost. Additionally, S-Cubed has introduced its Force 300 tool as a Coater, Coater/Developer for both Photoresist and polyimides, the technology is based on its earlier Flexi line of 200mm tools designed and built specifically for BEOL and special customer needs involving self cleaning hot plates and spin modules. These feature are of particular importance when thicker films characteristic of BEOL applications are considered, and have the effect of substantially lowering the COO of such tools. The company's production tool platforms are useful across a broad spectrum of user applications including WEE, Coat, Develop, Bake, Chill, Etch (UBM and RDL) for all current wafer sizes up to and including 300mm.
For the latest 3D packaging information visit STATS ChipPAC’s Booth #23
STATS ChipPAC invites you to stop by booth #23 at the IMAPS Device Packaging Conference to discuss the latest information on advanced 3D packaging solutions including embedded Wafer Level Ball Grid Array (eWLB), low cost copper column flip chip PoP technology and stacked die integration of RF packages. Each of these topics will also be covered during the technical sessions at the conference. STATS ChipPAC’s 3D solutions provide customers with increased integration of multiple functions such as baseband processors, RF transceivers, power management components and application processors for improved system performance in thinner and smaller package dimensions.
We look forward to seeing you at the Device Packaging Conference. You may also visit our website at www.statschippac.com.
Hesse & Knipps, Inc. Opens Second Demo and Applications Lab on West Coast
Chalman Technologies hosts Hesse & Knipps West Coast Demo and Apps Lab
Hesse & Knipps, Inc. recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region.
The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep – Chalman Technologies – in Anaheim, CA. Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, MA.
Hesse & Knipps’ western region customers can now more conveniently test and troubleshoot applications on Hesse & Knipps’ Bondjet BJ 820 High Speed Fully Automatic Fine Wire Wedge Bonder, the fastest wedge bonder on the market, while prospective customers can validate the capabilities and qualify Hesse & Knipps wedge bonders prior to making a purchase. Hesse & Knipps applications engineers staff the Demo and Applications Lab, working directly with customers.
“We are very pleased to partner with Chalman Technologies – one of the most professional rep organizations in the industry – to bring our new applications lab to western region customers and prospects. Rather than fly across the country, western region customers can now more readily test new and existing applications using our latest wedge bonder technology,” notes Joseph Bubel, president of Hesse & Knipps, Inc. “Chalman Technologies offered an ideal location that was close to our western region customer base and the growing RF and microwave market.”
For more information on Hesse & Knipps West coast demo and applications lab or to schedule a visit, e-mail firstname.lastname@example.org.
Kyocera America, Inc. Exhibiting at Device Packaging
Kyocera America, Inc. (KAI) has been manufacturing ceramic packages in San Diego, CA since 1971. KAI offers an extensive array of semiconductor packages and complex modules for numerous applications including RF, millimeter wave, high-reliability, phased array radar, and telecommunications. Packages are available in HTCC, LTCC, alumina, and BeO. KAI has state-of-the-art package design capability in-house that includes electrical and thermo-mechanical design, modeling / simulation and analysis to maximize package and circuit performance in your application. Our Assembly Technology Division accepts prototype to volume production orders for flip chip, wirebond, wafer dicing and vacuum soldering to provide a convenient one-stop-shop solution for customers.
Pacific Rim Engineering (Ray Petit) will also be representing Micro Printing Systems
Micro Printing Systems is the worldwide manufacture and supplier of the MPS screen printers, Models TF100 and SP1500, to the hybrid, ceramic, micro-electronic and PC solder paste industries. They are also a major supplier of the leading squeegee materials in the industry. (www.mps-intl.com)
Endicott Interconnect Technologies displays new Advanced High Density Packaging and Medical Technologies
Endicott's Dr. Rabindra Das presents "Development of Electronic Substrates for Medical Device Applications" on Wednesday March 7th at 11:00 AM and will also be participating in an interactive poster session on Wednesday March 7th in the Exhibit Hall at 2:00 PM to discuss "Package-Interposer-Package (PIP) Technology for High End Electronics."
Visit Endicott at Booth #64 to view our latest technology developments such as;
Multi (6) layer Rigid and Rigid-Flex LCP structures
Substrates manufactured with both Embedded passives (capacitance) circuits and active devices
Very fine linewidth Polyimide Medical Imaging flex substrate assemblies
with leading edge pitch Flip Chip semiconductors
Our popular multilayer medium and high performance CoreEZ and HyperBGA singlechip, MCM and SiP packages