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:: Corporate Member News ::

:: Hesse & Knipps To Discuss “Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications” at IMAPS Advanced Technology Workshop (full story)

:: Hi-Rel Wire Bonder & Universal Bond Tester Demonstrations at SMT Nuremberg 2012 (full story)

:: Indium Corporation Technology Expert Recognized at IPC APEX Expo (full story)

:: Remtec Expands DBC Substrate Capabilities, Provides Fast Prototyping and Delivery of Low/Medium Volume DBC Substrates for Power Applications Worldwide (full story)

:: New Epoxy System From Master Bond has Exceptionally High Thermal Conductivity (full story)

:: DYCONEX Demonstrates 20-μm Line and Space Capability on Multilayer LCP Product (full story)

:: The NAMICS (Nature Art Mutual Prosperity Innovation Creativity Sensitivity) motto is to supply “Only One and #1” products (full story)

:: Ferro L8 LTCC System Image Captions (full story)

:: DuPont™ Solamet® PV17x Photovoltaic Metallization Enables Lightly Doped Emitter Technology (full story)


:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Hesse & Knipps

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

Hesse & Knipps To Discuss “Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications” at IMAPS Advanced Technology Workshop

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH will discuss Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012. Hesse & Knipps’ presentation is included in Session 3: Wire Bonding and Interconnects from 8 a.m. to noon on Wednesday, May 23.

In the electronic assembly of high current automotive engine control modules and other under-the-hood devices, wedge bonding using large diameter aluminum or copper round or ribbon wire is the most suitable method of interconnection. Bonding large diameter wire and ribbon, however, requires significantly more energy than bonding fine wire, in addition to other higher bond parameters and metallization thickness on leads or substrates. As a result, the dynamics of bonding heavy wire are very different from fine wire bonding. Relative stiffness for 20 mil wire is 160,000 times that of a 1 mil wire, so significant looping forces are applied to both the first bond and underlying metallization while bending the wire. Looping strategies relating to loop profile and trajectory that minimize bond stress are also important since they affect bond quality.

The Hesse & Knipps presentation will discuss the use of heavy wedge bonding for automotive applications, focusing on metallization requirements, wire properties, bonder parameters and bond strength testing. Lee Levine, Distinguished Member of the Hesse & Knipps Technical Staff and owner of Process Solutions Consulting, Inc., will conduct the presentation. With more than 4 decades of engineering experience in the semiconductor industry, Mr. Levine has been involved in the development of major innovations including copper ball bonding and loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) as well as the introduction of statistical techniques for understanding assembly processes. He is also an IMAPS Fellow and former IMAPS V.P. Technology.

For more information on this presentation, visit

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Hi-Rel Wire Bonder & Universal Bond Tester Demonstrations at SMT Nuremberg 2012

Palomar Technologies exhibited at SMT Nuremberg 2012 (May 8-10) and showcased an 8000 Wire Bonder and a Royce 650 Universal Bond Tester.

The 8000 Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

Palomar Technologies offers several complementing die bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the ultra flexible 3800 Die Bonder, which supports up to three channels of adhesive dispense, component placement, epoxy and eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.

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Indium Corporation Technology Expert Recognized at IPC APEX Expo

Indium Corporation Product Manager of PCB Assembly Materials Tim Jensen <> was recently recognized at IPC APEX Expo for his contributions to the electronics manufacturing industry and for contributing his time and expertise through active IPC committee service.

The IPC-Association Connecting Electronics Industries presented Tim with a Distinguished Committee Service Award for his contributions to Amendment 1 of the Joint Industry Standard: Requirements for Soldering Fluxes (J-STD-004B), the standard used to classify and characterize soldering flux materials for PCB assembly.

As a product manager, Tim works with customers to troubleshoot and optimize SMT process lines. He specializes in SnPb and Pb-free solder paste, halogen-free soldering materials, wave solder fluxes, bar solder, rework fluxes, and flux-cored wire.

Tim is an SMTA-certified process engineer and earned his bachelor’s degree in chemical engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. Tim also authors a blog, which can be found at

For more information about Indium Corporation, visit or email

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Remtec Expands DBC Substrate Capabilities, Provides Fast Prototyping and Delivery of Low/Medium Volume DBC Substrates for Power Applications Worldwide

Remtec®  has significantly expanded its activity in the design and fabrication of DBC ceramic products for military and commercial applications in small to medium production volumes with fast prototyping and economic pricing.  This capability is supported by close cooperation with Rogers Corporation to provide Remtec with its standard curamik® brand mastercards.  Remtec facilitates fast turnaround by keeping an extensive stock of the most commonly used 5.5” x 7.5” Alumina and Aluminum Nitride DBC configurations ready for production.

Rogers and Remtec have agreed to a long term commitment that enables Remtec to stock curamik® mastercards and provide rapid response to customer needs around the world.  Remtec utilizes the well-known quality of curamik® DBC substrates coupled with high quality Remtec plating typical of its PCTF® products.

A combination of both technologies, with an added benefit of timely delivery and fast, comprehensive application engineering and sales support, results in unique, quick turnaround solutions meeting the growing demands of the power electronics market.  Remtec offers its customers versatile surface finish options such as selective gold, gold tin plating, and ENEPIG.  These processes along with various solder mask options allow for high reliability, low cost solutions suitable for any assembly technique.

Typical end products for DBC substrates are IGBT power modules, power hybrids, smart power modules, power supplies, solar cell and LED assemblies.  In addition to commercial products, Remtec is a registered ITAR complaint company, producing a variety of military and aerospace applications.
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New Epoxy System From Master Bond has Exceptionally High Thermal Conductivity

Master Bond Inc. has developed a new two part adhesive system called EP21AN with a thermal conductivity in excess of  22 (BTU•in/ft²•hr•°F).  It is an outstanding electrical insulator with a dielectric strength of >400 volts/mil and a volume resistivity greater than 1013 ohm-cm.  This easy to use adhesive has been formulated with a non-critical 1/1 mix ratio by weight or volume.  It cures readily at ambient temperatures or more quickly at elevated temperatures.

Master Bond EP21AN features excellent adhesion to a wide range of substrates including metals, ceramics, glass and many plastics.  Bonds exhibit outstanding dimensional stability and shrinkage upon cure is exceptionally low.  Master Bond EP21AN is available in 1/2 pint, pint, quart, gallon and 5 gallon kits.

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DYCONEX Demonstrates 20-μm Line and Space Capability on Multilayer LCP Product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!

The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.

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The NAMICS (Nature Art Mutual Prosperity Innovation Creativity Sensitivity) motto is to supply “Only One and #1” products

NAMICS “ADVANCED FLEXIBLE MATERIAL” SITE (NAS) was completed in the Fall of 2011. This location is one of our bases for creative R&D team and is designed to meet highly sophisticated and constantly changing customers’ needs. The facility includes an ideal environment for the development and production of our new ADFLEMA film products.

We emphasized the following in the design of this new facility;
1. A highly advanced research environment
2. Close cooperation in the development of high-volume-production processes and raw materials for the “Only One and #1” products
3. Harmony with the surrounding environment and nature

NAS is located next to NAMICS TECHNO-CORE (NTC) which has a very progressive R&D environment, highly advanced testing and analytical equipment, and a highly advanced security system. Through the utilization of NTC’s capabilities, NAS is well equipped to be very responsive to customer requests. Furthermore, based on the cooperative development of processes and raw materials, NAS will produce excellent film products with high performance and high quality. It will play a major role as the base for the development and production of this important new product line.

  1.  Location : Kita-ku, Niigata-city, Niigata-prefecture
  2.  Site area : 29,968.76m2
   3.  Building area : 3,704.69m2

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Ferro L8 LTCC System Image Captions

Loss performance of Ferro’s new L8 LTCC tape exceeds that of a comparably priced commercial alternative by more than three times at 3 GHz and more than seven times at 10 GHz and higher frequencies.

Ferro’s new L8 LTCC system enables printing of complex circuitry, stacking of perfectly flat layers, brazing or electroless plating of gold, and firing into precise packages with low loss at up to 40 GHz. (Parts for opto-electronic switching devices courtesy of Natel Engineering Co., Inc.)

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DuPont™ Solamet® PV17x Photovoltaic Metallization Enables Lightly Doped Emitter Technology

Novel Formulation Accelerates Further Efficiency Gains for Solar Cells

DuPont™ Solamet® PV17x photovoltaic metallization paste has become the leading frontside silver paste series on the market today due to its ability to raise efficiency in standard solar cell constructions and its unique properties which enable Lightly Doped Emitter (LDE) cell designs. LDE is a strong differentiator for solar cell producers as it can boost efficiency by up to 0.4 percent. DuPont Microcircuit Materials is taking steps to increase its supply capability for Solamet® PV17x to help meet the increased demand for higher efficiency solar cells.

“Solamet® PV17x series continue to advance technology to help meet the industry’s goal of 20 percent efficiency by 2012,” said Peter Brenner, photovoltaics global marketing manager, DuPont Microcircuit Materials. “This product has a two-stage advantage, since on its own it can raise efficiency by up to 0.2 percent, and when used to enable LDE, can raise efficiency by up to 0.4 percent. We’re very pleased to see such strong demand and are working to quickly increase supply capability for the growing customer base as it becomes qualified in stages through the next three months.”

Solamet® PV17x is the most advanced composition in the market allowing for contact to be made to the most lightly doped junctions. Doping diffusion optimization is a key area of experimental study in the photovoltaic industry for the design of high efficiency cells. Diffusion optimization has been significantly limited by the inability of traditional frontside photovoltaic silver pastes to contact lightly surface doped emitters. Prior to Solamet® PV17x being released, the industry had no real commercially available option for making a screen printed frontside metallization that could economically and practically enable an LDE. However, the excellent silicon to silver contact of DuPont™ Solamet® PV17x technology has demonstrated its capability to enable a wider range of diffusion optimization and higher cell efficiency.

Extensive testing is underway within DuPont and in collaboration with several research organizations as well as in customer trials to fully characterize and continue to advance this technology. For example, RWTH-Aachen University recently published a comparative study involving Solamet® PV17x and four competing metallization pastes. Solamet® PV17x outperformed four competing products, demonstrating its ability to contact 100 Ohm/sq emitters on multicrystalline cells – the first time this had been achieved - with lightly doped phosphorous surface concentration. This enabled an efficiency increase of one full percent versus the homogenous emitter base line and 0.4 percent higher efficiency was confirmed versus laser doped selective emitter technologies.

“We presented a characterization of POCl3 parameters influencing the electrically active phosphorus concentration profiles by electrochemical capacitance voltage measurements,” said Ali Safiei, (PhD researcher), Institute of Semiconductor Electronics at RWTH Aachen University. “For the first time we could demonstrate a successful direct contacting of an optimized high sheet resistance emitter at 100 Ω/sq by increasing the n++ layer and at the same time reducing the dead layer. Multicrystalline silicon solar cells were fabricated using five different silver pastes resulting in an absolute efficiency gain of Δη = 1 percent in comparison to a standard 55 Ω/sq emitter. Based on these investigations we evaluated a 160 Ω/sq emitter and could successfully demonstrate by laser doping that a n++ layer of up to 25 nm depth (a Lightly Doped Emitter) leads to high FF and an absolute efficiency gain of Δη > 0.6 percent.”

The breakthrough formulation of Solamet® PV17x also enables cell makers to use up to 15 percent less material, in line with the company’s intent to accelerate product developments that help the photovoltaic industry reduce its dependence on silver metals and offset some of the impact that rising silver prices have on the cost of producing solar cells and modules.

Continued development on next generation Solamet® metallizations is ongoing with the aim of continuing to improve efficiency and further integrating Solamet® pastes with complementary processes such as LDE and local back surface field (LBSF) cell architectures.

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RGL Enterprises


:: Issue 122 ::
May 17, 2012


Master Bond

LORD Corporation

RGL Enterprises