:: New One Part UV and Heat Curable Epoxy System from Master Bond, Inc. (full
:: Nordson Asymtek Featured Product: DJ-9500 DispenseJet (full
:: Indium Corporation’s Director of Thin Film & Solar Products to Present at AIMCAL Web Coating and Handling Conference (full
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Only news about IMAPS Corporate Members will be published in this
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ANSYS is offering Two Seminars on Dimensions of Electronic Design
Santa Clara, CA, October 18th , Hyatt Regency, 5010 Great America Parkway, Santa Clara, CA 95054
The challenges of electronics design are numerous, and many can be formidable: packing greater functionality into smaller portable devices while extending battery life, integrating multiple antennas into a single platform or developing 3D-IC architectures. Join ANSYS and Apache as we introduce our latest electronics design technology and simulation breakthroughs that will help you to design next-generation electronics products.
Get technology updates on ANSYS HFSS, Apache RedHawk, ANSYS SIwave and more
See the latest advancements in high-performance computing (HPC) for simulation speed and capacity beyond your expectations
Learn how the integration of ANSYS and Apache products will revolutionize the design of chip−package−system
Listen to designers share how they meet power, performance and price targets for their most advanced electronic designs
There will be break-out sessions which will focus on the following areas:
Signal Integrity/Chip, Package, System Track:
Advanced Signal Integrity with CPS Methodology
CPS Co-Design and Thermal Mgmt of Electronics
SI Wave for Power Integrity
Serial Interconnect Design from Layout to PCIe Specifications
Advanced Simulation Techniques in HFSS to optimize form factor and performance
Large Scale Microwave EM from Layout
FEM-IE Hybrid Methods for Electrically Large Antenna System Design
Optimal Phased Array Modeling Using Domain Decomposition
Bi-directionally coupled full wave to thermal stress simulation
Who Should Attend: System architects, chip and package design engineers, simulation and modeling experts, engineering managers, technical project leaders and staff who must meet stringent design objectives and cost targets. Be sure to register so that they can get a count for breakfast and lunch (incuded).
Endicott Interconnect Technologies Names Raj Rai Chief Technology Officer
Endicott Interconnect Technologies, Inc. (EI) recently announced the promotion of Rajinder Rai to the position of Chief Technology Officer (CTO) reporting to James J. McNamara Jr., President and CEO. In his new position, Raj will be responsible for monitoring new technologies, overseeing the selection of research projects, generating a technology road-map and ensuring its progress and assessing the potential of new product introduction.
"Raj has demonstrated his sound knowledge of advanced electronics materials and packaging, process development and new product introduction. His combination of advanced degrees and knowledge of science, leading and managing key technical projects, activities in a highly creative environment and then converting those developments into commercialized products for market, has positioned him for his new role as EI's Chief Technology Officer. I have confidence in Raj's ability to lead his Research and Development Team and continue to move EI forward as a leading edge, high technology company," said Jay McNamara, CEO of EI.
Raj brings 16 years of experience in the high-tech electronics industry. He has held a variety of Senior Design and Development Engineering positions as well as various Senior Management and Executive roles, most recently as Vice President of Engineering at EI. Raj has been successful and possesses particular expertise in driving new business opportunities, most recently through EI's Integrated Circuit and Assembly Services (ICAS) business.
Raj holds a BS in Materials Science and Engineering from the University of Notre Dame and an MS in Materials Science from Stevens Institute of Technology. He has been issued 6 US Patents and authored more than 25 Technical Papers over the course of his career.
EI's former CTO, Voya Markovich, retired on September 28, 2012.
New One Part UV and Heat Curable Epoxy System from Master Bond, Inc.
Master Bond Inc. is pleased to announce the development of a special dual cure (UV/heat curable) epoxy system called UV15DC80. It is designed for bonding, sealing, coating and potting applications. This compound has a low viscosity, is easy to apply and requires no mixing. Environmentally friendly, it is 100% solid and contains no solvents or volatiles. UV15DC80 is not inhibited by oxygen and has low shrinkage upon cure.
Particularly noteworthy is that UV15DC80 can cure in shadowed areas by supplemental heat curing at 80°C for 15-30 minutes. Straight UV curing can be accomplished for thicknesses of .010”/.020” in seconds using UV light at 365 nm with 30-40 milliwatts per cm² of energy. Faster cures can be achieved at higher energy outputs. Post curing at 125-135°C for 15-30 minutes can increase the Tg from 90°C achieved by straight UV cure to over 130°C.
UV15DC80 has high physical strength properties. Adhesion to metals, glass, ceramics and most plastics is excellent. It has superior chemical resistance. Shore D hardness is >70 and its elongation after cure is 3-4%. UV15DC80 has a tensile strength of >4,200 psi and a tensile modulus of 120,000 psi. Its refractive index is 1.517.
Storage stability of UV15DC80 is 6 months at room temperature in the original unopened containers. It is available for use in half-pint, pint, quart, gallon, and 5 gallon pail containers. For ease of use, it also is available in syringe applicators.
Indium Corporation’s Director of Thin Film & Solar Products to Present at AIMCAL Web Coating and Handling Conference
Indium Corporation’s Thin Film & Solar Products Director, Bill Jackson, will present at the Association of International Metallizers, Coaters and Laminators (AIMCAL) Web Coating and Handling Conference on October 23 in Myrtle Beach, South Carolina.
Jackson’s presentation, The Future Supply of Indium and ITO, focuses on the availability of indium metal, as well as indium-tin oxide (ITO) and emerging alternatives.
Most of the world’s indium metal is used, in the form of ITO, to produce flat-panel liquid-crystal displays (FPDs). Indium metal is primarily a byproduct of zinc mining, with known reserves equivalent to more than 50+ years, at today’s usage rates. In addition, the FPD market has a mature reclaim stream which enhances the health of the indium market. The industry is investing in increasingly efficient extraction and refining processes to bring more indium to market. Extraction and refining have been, and can be further, expanded to meet the demand caused by emerging technologies and applications.
Jackson’s talk will focus on indium’s sourcing from regions throughout the world, the current supply chain, current demand and reserves, forecasted ITO demand, material properties, and comparisons to alternative technologies.
AIMCAL is a global nonprofit trade association representing converters of metallized, laminated, and coated flexible substrates and their suppliers. The conference brings together the converting community to advance the technologies of web processing, handling, and finishing.
Jackson is a 35-year veteran in the metals and materials industry and has worked for Indium Corporation for over 30 years, after spending five years in the aerospace industry. Prior to becoming director of Indium Corporation’s thin film & solar products line, he was director of corporate quality, director of operations, and managing director for Indium’s Singapore and UK facilities. Jackson is a member of the Society of Vacuum Coaters, American Management Association, and the American Marketing Society, as well as a past member of the American Society for Metals and the Society of Manufacturing Engineers.