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:: Corporate Member News ::

:: ANSYS is offering Two Seminars on Dimensions of Electronic Design (full story)

:: Endicott Interconnect Technologies Names Raj Rai Chief Technology Officer (full story)

:: New One Part UV and Heat Curable Epoxy System from Master Bond, Inc. (full story)

:: Nordson Asymtek Featured Product: DJ-9500 DispenseJet (full story)

:: Indium Corporation’s Director of Thin Film & Solar Products to Present at AIMCAL Web Coating and Handling Conference (full story)

MST

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

F&K Delvotec USA
Ansys
MasterBond

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

TJ Green Associates, LLC

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


ANSYS is offering Two Seminars on Dimensions of Electronic Design

  • Santa Clara, CA, October 18th , Hyatt Regency, 5010 Great America Parkway, Santa Clara, CA 95054
  • Los Angeles, CA, October 24th, Manhattan Beach Marriott, 1400 Parkview Avenue
    Manhattan Beach, CA 90266

Register   www.ansys.com/dimensions - (Free-of-Charge)

The challenges of electronics design are numerous, and many can be formidable: packing greater functionality into smaller portable devices while extending battery life, integrating multiple antennas into a single platform or developing 3D-IC architectures. Join ANSYS and Apache as we introduce our latest electronics design technology and simulation breakthroughs that will help you to design next-generation electronics products.

  • Get technology updates on ANSYS HFSS, Apache RedHawk, ANSYS SIwave and more
  • See the latest advancements in high-performance computing (HPC) for simulation speed and capacity beyond your expectations
  • Learn how the integration of ANSYS and Apache products will revolutionize the design of chip−package−system
  • Listen to designers share how they meet power, performance and price targets for their most advanced electronic designs

There will be break-out sessions which will focus on the following areas:

  • Signal Integrity/Chip, Package, System Track:
    • Advanced Signal Integrity with CPS Methodology
    • CPS Co-Design and Thermal Mgmt of Electronics
    • SI Wave for Power Integrity
    • Serial Interconnect Design from Layout to PCIe Specifications
    • DDR Compliance
  • Antennas/RF Track:
    • Advanced Simulation Techniques in HFSS to optimize form factor and performance
    • Large Scale Microwave EM from Layout
    • FEM-IE Hybrid Methods for Electrically Large Antenna System Design
    • Optimal Phased Array Modeling Using Domain Decomposition
    • Bi-directionally coupled full wave to thermal stress simulation

Who Should Attend:  System architects, chip and package design engineers, simulation and modeling experts, engineering managers, technical project leaders and staff who must meet stringent design objectives and cost targets.  Be sure to register so that they can get a count for breakfast and lunch (incuded).

Seminar Cost:  Complimentary
Register   www.ansys.com/dimensions

 

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Endicott Interconnect Technologies Names Raj Rai Chief Technology Officer

Endicott Interconnect Technologies, Inc. (EI) recently announced the promotion of Rajinder Rai to the position of Chief Technology Officer (CTO) reporting to James J. McNamara Jr., President and CEO. In his new position, Raj will be responsible for monitoring new technologies, overseeing the selection of research projects, generating a technology road-map and ensuring its progress and assessing the potential of new product introduction.

"Raj has demonstrated his sound knowledge of advanced electronics materials and packaging, process development and new product introduction. His combination of advanced degrees and knowledge of science, leading and managing key technical projects, activities in a highly creative environment and then converting those developments into commercialized products for market, has positioned him for his new role as EI's Chief Technology Officer. I have confidence in Raj's ability to lead his Research and Development Team and continue to move EI forward as a leading edge, high technology company," said Jay McNamara, CEO of EI.

Raj brings 16 years of experience in the high-tech electronics industry. He has held a variety of Senior Design and Development Engineering positions as well as various Senior Management and Executive roles, most recently as Vice President of Engineering at EI. Raj has been successful and possesses particular expertise in driving new business opportunities, most recently through EI's Integrated Circuit and Assembly Services (ICAS) business.

Raj holds a BS in Materials Science and Engineering from the University of Notre Dame and an MS in Materials Science from Stevens Institute of Technology. He has been issued 6 US Patents and authored more than 25 Technical Papers over the course of his career.

EI's former CTO, Voya Markovich, retired on September 28, 2012.
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New One Part UV and Heat Curable Epoxy System from Master Bond, Inc.

Master Bond Inc. is pleased to announce the development of a special dual cure (UV/heat curable) epoxy system called UV15DC80.  It is designed for bonding, sealing, coating and potting applications.  This compound has a low viscosity, is easy to apply and requires no mixing.   Environmentally friendly, it is 100% solid and contains no solvents or volatiles.  UV15DC80 is not inhibited by oxygen and has low shrinkage upon cure.

Particularly noteworthy is that UV15DC80 can cure in shadowed areas by supplemental heat curing at 80°C for 15-30 minutes.  Straight UV curing can be accomplished for thicknesses of .010”/.020” in seconds using UV light at 365 nm with 30-40 milliwatts per cm² of energy.  Faster cures can be achieved at higher energy outputs.  Post curing at 125-135°C for 15-30 minutes can increase the Tg from 90°C achieved by straight UV cure to over 130°C.

UV15DC80 has high physical strength properties.  Adhesion to metals, glass, ceramics and most plastics is excellent.  It has superior chemical resistance.  Shore D hardness is >70 and its elongation after cure is 3-4%.  UV15DC80 has a tensile strength of >4,200 psi and a tensile modulus of 120,000 psi.  Its refractive index is 1.517.

Storage stability of UV15DC80 is 6 months at room temperature in the original unopened containers.  It is available for use in half-pint, pint, quart, gallon, and 5 gallon pail containers.  For ease of use, it also is available in syringe applicators.

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Nordson/Asymtek Featured Product: DJ-9500 DispenseJet

The DispenseJet DJ-9500 supports a long list of jettable fluids for a wide range of applications.
It also offers the following speed and quality benefits:
Speed

  • Patented “Jet-on-the-Fly” technology. In operation, the jet “flies” over the part or substrate, and shoots precise volumes of fluid in dots, lines and patterns.
  • High flow rates up to 400 mg/second; high shot rate up to 200 dots per second; no Z-axis motion.
  • Closed loop fluid heating ensures constant viscosity throughout the fluid path, even at the highest flow rates.

Quality

  • Patented Calibrated Process Jetting (CpJ) closed-loop control maintains consistent dispense volume.
  • High wet-dispense accuracy; smaller wet-out areas; round, uniform dots; improved line quality with no “dog-bones” and improved knit line.

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Indium Corporation’s Director of Thin Film & Solar Products to Present at AIMCAL Web Coating and Handling Conference

Indium Corporation’s Thin Film & Solar Products Director, Bill Jackson, will present at the Association of International Metallizers, Coaters and Laminators (AIMCAL) Web Coating and Handling Conference on October 23 in Myrtle Beach, South Carolina.

Jackson’s presentation, The Future Supply of Indium and ITO, focuses on the availability of indium metal, as well as indium-tin oxide (ITO) and emerging alternatives.

Most of the world’s indium metal is used, in the form of ITO, to produce flat-panel liquid-crystal displays (FPDs). Indium metal is primarily a byproduct of zinc mining, with known reserves equivalent to more than 50+ years, at today’s usage rates. In addition, the FPD market has a mature reclaim stream which enhances the health of the indium market. The industry is investing in increasingly efficient extraction and refining processes to bring more indium to market. Extraction and refining have been, and can be further, expanded to meet the demand caused by emerging technologies and applications.

Jackson’s talk will focus on indium’s sourcing from regions throughout the world, the current supply chain, current demand and reserves, forecasted ITO demand, material properties, and comparisons to alternative technologies.

AIMCAL is a global nonprofit trade association representing converters of metallized, laminated, and coated flexible substrates and their suppliers. The conference brings together the converting community to advance the technologies of web processing, handling, and finishing.

Jackson is a 35-year veteran in the metals and materials industry and has worked for Indium Corporation for over 30 years, after spending five years in the aerospace industry. Prior to becoming director of Indium Corporation’s thin film & solar products line, he was director of corporate quality, director of operations, and managing director for Indium’s Singapore and UK facilities. Jackson is a member of the Society of Vacuum Coaters, American Management Association, and the American Marketing Society, as well as a past member of the American Society for Metals and the Society of Manufacturing Engineers.

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View the Corporate Bulletin Archives

Quik-Pak
RGL Enterprises
QSIC

 


:: Issue 130 ::
October 17, 2012

COHERENT

Master Bond

LORD Corporation

RGL Enterprises

EPP

Amkor