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IMAPS 2012 is here and F&K Delvotec will be exhibiting with the industry’s only Fully Automated Non Destructive Pull/Shear Tester - Model 5600C 2
This machine offers tremendous labor savings for those applications that require 100% non destructive pull testing. The 5600C also offers a patented feature which calculates and reports the corrected CPK values after determining the wire angles at first and second bond. Please visit with us during the IMAPS San Diego show to see the machine and learn more.
F&K Delvotec GmbH, the successful manufacturer of wire bonders based near Munich, won top prizes in the 2012 Customer Satisfaction Survey conducted by VLSIresearch. F&K Delvotec garnered the survey’s highest available award, placing first in the overall 10 BEST list for Focused Suppliers of Chip Making Equipment. For the first time, a German company heads the worldwide ranking – an impressive feat given the several hundred-strong competition. For the THE BEST rankings, all suppliers are additionally rated in four industry segments such as Wafer Processing and Assembly Technology. For over 15 years, F&K Delvotec has almost always placed in the top group of THE BEST Suppliers of Assembly Equipment, even managing to inch higher and higher in the ratings each year. In the last four years the German supplier topped this off by consistently being the the highest-ranked wire bonder manufacturer. F&K Delvotec increased its rating 7% this year to 8.51 against THE BEST Assembly Equipment Suppliers.
ALLVIA, Inc. provides Silicon Interposer and Through-Silicon Via (TSV) foundry services
Located in Silicon Valley, ALLVIA is the first Through-Silicon Via (TSV) foundry. We introduced the term “through-silicon via” in both a 1997 business plan and a January 2000 technical article. With a full spectrum of facilities, IP and equipment, ALLVIA offers services for prototyping and volume production of both front side and back side TSVs for use in 2.5D and 3D applications in semiconductor packaging as well as processing for MEMS and optoelectronic devices. www.allvia.com
Palomar Technologies is pleased to be presenting three technical sessions at IMAPS 2012. Stop by booth #322 between tech talks to say hello to the extended team!
Tuesday, September 11 - 8-11:15am session track
1. High-Reliability Component Attachment Process for <5μm Placement Accuracy
Speaker: Donald J. Beck, Palomar Technologies (Zeger Bok, Senior Applications Engineer & Dan Martinez, Senior Manufacturing Engineer)
2. Mixed Attachment Technology Studies in RF & Optoelectronic Packages Requiring High Accuracy Placement
Speaker: Daniel D. Evans, Jr., Palomar Technologies (Zeger Bok)
Tuesday, September 11 - 2-5:55pm session track
3. Gold Ball Wire Bonding with Heated Tool for Automotive Microelectronics
Speaker: David J Rasmussen, Palomar Technologies
IMAPS 2012 attendees are invited to take part in an engineering-led tour at the Palomar Technologies factory in Carlsbad (North San Diego County). Any questions about the factory tour or to secure a spot, please contact Jessica Sylvester at firstname.lastname@example.org.
Metrigraphics supplies high precision custom components for designers and builders of medical and analytical instruments and devices
Let Metrigraphics help you meet your precision component objectives of thin film sputtering, electroforming/plating and design assistance to manufacture components with feature sizes in the 5-10 micron range. Let us enable you to meet your projects design objectives through the implementation of our processes and services.
Innovation is our tradition! Come Visit BESI at Booth # 406
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries. Besi’s product lines Datacon, Esec, Fico and Meco combine unique knowledge in leading-edge assembly processes for leadframe, array connect and wafer level packaging applications. The high-technology assembly equipment thus guarantees high productivity and quality at low cost of ownership.
Device protection and contamination control begins at the wafer fab and extends to the assembly site. ePAK never forgets that the most valuable product in the semiconductor and electronics industry is also the most fragile and susceptible to mishandling and contamination. Not all wafers are created equal…with back-grinding, unique material sets, and exotic semiconductor processes, one product does not fit all wafers….
From ePAK's most advanced eLX wafer canisters to cost efficient wafer jars, ePAK tailor fits their products to meet your requirements.
Hesse & Knipps To Demo New 3 Mil Wire Bonding Capability on BJ935 Heavy Wire Bonder at IMAPS 2012
The BONDJET BJ935 is the only heavy wire bonder to offer 3 mil wire bonding capability
Hesse & Knipps, Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH will demo a new 3 mil wire bonding capability on its BJ935 Fully Automatic Heavy Wire Bonder at the upcoming 45th International Symposium on Microelectronics (IMAPS) in Booth No. 210.
Addressing the worldwide increase in demand for 3 mil wire, Hesse & Knipps enhanced the capabilities of its BJ935 Heavy Wire Bonder to process gold, aluminum and copper bonding wire with diameters from as small as 3 mil up to 20 mil (75 μm up to 500 μm).
“This new 3 mil capability has been in development over the last few months,” notes Joseph S. Bubel, president of Hesse & Knipps, Inc. “The Hesse & Knipps BJ935 is the only heavy wire bonder on the market to handle wire diameters in the 3 mil range.”
In addition to the new 3 mil heavy wire bonding capability, the BONDJET BJ935 offers ribbon bonding from 0.075 mm x 0.75 mm up to 0.3 mm x 2 mm on the same platform, plus both active and passive wire cutting. The new active slim wire cutter has been adapted for fine pitch and ensures increased cutter life and yield improvement compared to passive cutting. The slim active wire cutter enables precise, repeatable positioning nd programmable depth of the cutter and better access into dense, complex wire-bonded packages since it does not require a pusher. The new “air cut” passive cutting option offers touch-free front-cutting for use on highly sensitive chip surfaces.
IBM Microelectronics is developing world class semiconductor and packaging technologies that raise the bar on product performance, power efficiency, and reliability. Our products are becoming increasingly intelligent, interconnected and integrated. Advances in semiconductor device performance and the transition to environmentally friendly interconnects drive complexity in the design and implementation of appropriate packaging solutions. Increased use of multi-core processors that drive larger die size, greater I/O counts and enhanced cooling requirements have made the co-development of silicon and packaging solutions essential to the successful implementation of both.
In order to achieve these development goals, IBM Microelectronics has formed a Packaging Joint Development Ecosystem with leading assembly, materials, and equipment providers. This ecosystem leverages IBM’s research and development resources with synergistic skills from partner companies to solve shared challenges and drive industry leadership in semiconductor flip chip and stacked die (i.e. 3D) packaging; enhancements in technology development (design, performance and reliability); improvements in time to market; and definition of new industry standards.
If you are looking to differentiate your semiconductor packaging technology, join IBM Microelectronics’ Packaging Joint Development Ecosystem ….Smarter technology for a Smarter Planet.
What are the performance factors you seek in a die attach paste?
ALPHA® ATROX™ D800HT for exposed pad semiconductor packages
ALPHA® ATROX™ D800HT is a thermosetting conductive die attach adhesive with high thermal conductivity (>50 W/m-K) designed for high power semiconductors and exposed pad semiconductor packages. It has excellent adhesive strength to NiPdAu, Ag and MEP leadframes, low out gassing which minimizes oven contamination and is ideal for excellent MSL performance.
ALPHA® ATROX™ D800HT is formulated to be applied using a time pressure pump equipped on most die bonders. The material should be consistently dispensed over time. Equipment settings need to be optimized for desired material deposition response based on model and configuration.
For additional information about ALPHA® ATROX™ products, please contact your Alpha Representative, or go to alphaadvancedmaterials.com.
IMAPS 2012-45th International Symposium on Microelectronics - Make sure to stop by Endicott's Booth (#526)
As an attendee of IMAPS 2012- 45th International Symposium on Microelectronics in San Diego, CA, you'll want to stop by Endicott Interconnect's booth (#526).
EI's Dr. Rabindra Das will be presenting "Miniaturization of Electronic Substrates for Medical Device Applications" on Tuesday September 11th at 11:00 AM, Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration" on Wednesday September 12th at 10:30 AM and "Rediscovering Multilayer Rigid-Flex With Z-Interconnect Technology" on Wednesday September 12th at 4:00 PM.
EI, with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions, specializing in the fabrication and assembly of printed circuit boards and advanced semiconductor packaging, system integration and test, advanced materials, system-in-package and shrink, lab services and design, prototype and QTA.
EI unites advanced technology and technical know-how with a robust manufacturing environment to meet the current and emerging needs of the most demanding markets, including defense and aerospace, high performance computing, industrial, and medical, where highly reliable products are critical for success.
EI has sales locations across the U.S. and Western Europe and manufacturing facilities in Endicott, NY, Saxonburg, PA and Shenzhen, China.
Please take a moment to check out our website (www.endicottinterconnect.com), view our datasheets and download our white papers. We look forward to seeing you at the show!
Micropac Industries, Inc. manufactures microelectronic and optoelectronic components and modules for the hi-rel industrial, medical, military, aerospace and space markets. Certified to MIL-PRF-19500 and MIL-PRF-38534, Micropac offers both standard and custom products including optocouplers, LEDs and Displays, Proximity and Hall Effect sensors, solid state relays and power controllers, high temperature voltage regulators and multi-chip modules.
Innovations in Test and Burn-In Sockets - Azimuth Electronics
Azimuth Electronics is a US manufacturer of Test and Burn-In Sockets providing innovative interconnect socketing solutions for the electronics industry for over 50 years. Our broad experience with test and burn-in sockets allows us to tackle the challenges of a constantly evolving industry. Azimuth offers complete in-house services facilitating cost-effective solutions from engineering and design thru machine shop prototyping, tooling fabrication, production injection molding and manufacturing. Azimuth is committed to providing
state of the art concepts in socketry with a commitment to service and excellence.
Benchmark Electronics provides world-class global engineering and manufacturing services
Benchmark Electronics provides world-class global engineering and manufacturing services to multiple industries for product design, custom automation for any type of application such as packaging, automated or semi-automated assembly, and test equipment, precision technologies, microelectronics assembly, ruggedization of products, complete turnkey electromechanical manufacturing, and fulfillment services. Benchmark’s capabilities in Microelectronics range from an assortment of bonding applications, to precision placement and active alignment. Engineering expertise includes electrical, mechanical, software, test, and optical, award-winning Industrial Design and complete New Product Introduction process. Benchmark has implemented manufacturing processes and material handling methods which meet the environmental requirements for the European Directives, Waste Electrical and Electronic Equipment and Restriction of Hazardous Substances. Benchmark is also FDA Registered and QSR Compliant. Regulatory compliance is ensured with Web-based documentation control. The full life cycle of a product is achieved with worldwide design and manufacturing capabilities. Whatever your unique need is, Benchmark can provide optimized solutions.
Teledyne Microelectronic Technologies Lands on Mars!
Teledyne Microelectronic Technologies, is pleased to offer its most sincere congratulations to NASA and JPL on the successful deployment of the Mars Science Laboratory (MSL) rover "Curiosity" in Gale Crater on Mars. Curiosity is the largest rover ever launched by NASA, and it will be used to determine whether Mars is, or ever has been, hospitable to microbial life.
Teledyne Microelectronic Technologies is proud to contribute to the mission's success. Teledyne Microelectronic Technologies manufactured for JPL two complex radio frequency (RF) modules (Transmit/Receive and Up/Down Module) for the MSL. These modules are part of the terminal descent and landing unit which played a major role in the last critical 30 seconds of the lander's approach to Mars.
These RF modules represent only a part of Teledyne's overall contributions to the launch, landing, and operation of the mission. No fewer than five Teledyne companies contributed components crucial to the mission's success:
Teledyne DALSA built the image sensors for the Curiosity's Navcams and Hazcams, as were those on the previous Spirit and Opportunity rovers. The hazard avoidance cameras are installed on each corner of the rover and the 3D stereoscopic navigation cameras are part of the rover's camera mast.
Teledyne Energy Systems, Inc. (TESI) developed the thermoelectric system that powers the rover. TESI's Multi-Mission Radioisotope Thermoelectric Generator (MMRTG) converts the heat of plutonium decay into electric power with no moving parts. It can produce 125 watts of electrical power from 2000 watts of thermal power for up to 14 years. TESI is currently under contract to manufacture MMRTG units to power upcoming NASA missions to the outer planets.
Teledyne Relays supplied electromechanical relays used on Curiosity's communication suite. The company supplied similar components for the earlier Spirit and Opportunity rover.
Teledyne Impulse supplied electromechanical power transfer switches that were used on the Atlas V rocket that launched the mission.
"It gives me great pride to be able to contribute to a project that poses such technical challenges and holds such promise for the advancement of science and knowledge," observed Robert Mehrabian, chairman, president and chief executive officer of Teledyne. "I am also delighted to see how many ways and in how many places Teledyne contributes. From the deepest parts of this planet's oceans to the mountains of Mars and out past the edges of our solar system, Teledyne technology enables exploration, analysis, and communication."
Indium Corporation Features Gold-Based Alloys at IMAPS - Both 329
Indium Corporation gold-based solder alloys provide reliable joint strength and superior thermal conductivity, especially as compared to the standard SnPb or SAC solders. These alloys are well-suited for applications that require high reliability and high temperature, as well as a need for Pb-free.
Gold-based alloys offer a variety of advantages that offset the cost of gold, including superior thermal fatigue resistance and resistance to corrosion. In addition to its excellent wetting properties, AuSn exhibits one of the highest tensile strength measurements in the soldering world, and its shear strength provides a great alternative to brazing alloys when high strength is required at soldering temperatures. AuSn also provides an excellent seal, which works well in lid applications.
Indium Corporation’s casting process provides a cleaner alloy by minimizing impurities and oxides. Gold-based alloys are made to purities of either 99.9 or 99.99% with a standard tolerance of +/- 0.5% on gold content.
Gold-based solder alloys are used for medical products, as well as for aerospace, defense, package sealing, optics, and specialty MEMS packaging. Gold-based alloys can be processed in a variety of soldering applications, including vacuum solder, die-attach, reflow, laser soldering, vapor phase reflow, and manual soldering.
Indium Corporation offers gold-based alloys in a variety of forms, including solder paste, solder preforms, solder wire, and solder spheres.
Design and Manufacturer of Automatic, Semiautomatic, and Manual ESD Protected Microelectronic Assembly and Test Equipment, and Accessories, Since 1966. Ultrasonic, Thermosonic, and Thermocompression Wire/Ribbon Bonders, Eutectic and Epoxy Die Bonders, Insulated Wire Bonders, and Pull Testers, LED Illuminators, Heated and Cold Workholders, Temperature Controllers, Ultrasonic Transducers, Ultrasonic Power Supplies, and Wire Despoolers. Visit: www.westbond.com
Visit Interplex IEP at Booth #425 to explore all of our capabilities, including the new SMT Card Edge Contact system using solderless Press-Fit technology
Visit Interplex IEP at the IMAPS 2012
Conference & Symposium September 9-13, 2012 in San Diego, CA
Interplex Engineered Products (IEP) will be exhibiting its latest products and technologies at the International Microelectronics and Packaging Society (IMAPS) 45th International Symposium to be held at the Town & Country Convention Center in San Diego, CA from September 9-13 2012.
Interplex Engineered Products is a turnkey, vertically integrated world-class supplier of application-specific open cavity thermoplastic semiconductor and electronic packages across all major markets, including LED, RF power, MEMS, RF ID tag, Photovoltaic and other similar semiconductor packaging applications.
Visit Interplex IEP at Booth #425 to explore all of our capabilities, including the new SMT Card Edge Contact system using solderless Press-Fit technology.
Kulicke & Soffa Launches Next Generation Manual Wire Bonder Series
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“K&S” or the “Company”) today announced the launch of its next generation manual wire bonder series, the iBond5000TM. The advanced series is the next creation from the proven market leader with over 60 years of experience in wire bonding, and over 9000 manual machines installed worldwide. The series is based on the Company’s 4500, and integrates the proven legacy K&S mechanical design with advanced electronics to provide modern capabilities. The iBond5000 series includes ball, wedge and dual-capability bonding options.
Improved features of the iBond5000 include the addition of a multi-core ARM based processor, proven operating system and 7” touch screen. With the improved electronics management, there are also more ways to connect to the iBond5000 via two USB ports for a mouse, keyboard or disk on key; or via Ethernet which allows for centralized management, access to an applications backup server, and capability for remote support and profile sharing. For those that prefer working with physical controls, an optional analog panel is available. The system enables saving and loading of custom files, along with factory preconfigured profiles, for storing, cataloging, and re-using golden processes. The K&S bonding profiles internal library, which includes a bonding wires database, will enhance the ease of use and cater for various applications. The iBond5000 has an abundance of advanced options for improved efficiency and expertise, while also lowering cost of ownership.
Aviram Shubeli, Kulicke & Soffa’s Manual Wire Bonding Business Unit Manager, remarked, “The iBond5000 offers customers important advancements, features and increased benefits – all of which leverage K&S’ market leadership, R&D strength and process knowledge. We designed the iBond5000 to embody today’s modern digital technologies, while expanding upon the proven high standards from our existing wire bonder solutions.”
Quik-Pak, a world leader in Microelectronic Packaging and Assembly, offers it’s exclusive Open-molded Plastic Package (OmPP)™. The product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective solution for your IC packaging and assembly needs.
Quik-Pak’s Ni/Au plated QFN‘s are offered in a broad assortment of body sizes from 3x3mm to 12x12mm with pitches including 0.40mm, 0.50mm and 0.80mm. Custom designs are available. For more information visit www.icproto.com or stop by Quik-Pak’s booth #109 at the upcoming IMAPS International Symposium.
Zeon Corporation and Zeon Chemicals L.P., USA have developed two innovative state of the art packaging materials:
1) “Ultra-Low Loss Build-Up Film” used for Build-Up substrate for IC packages, GPU, WLP, Si Interposer and any application requiring superior electrical properties, and
2) “Ultra-Low Loss PCB Materials” low loss laminate for both high k and low k applications such as milliwave radars, high speed servers and circuits, and RF/mobile applications for technology leading devices.
”Ultra-Low Loss Build-Up Film” provides high density, high speed, and reliable IC or GPU packages with properties such as low CTE, 4/4um L/S, low dielectric constant, low loss tangent, and low moisture absorption. In addition, it allows forming very fine copper lines on high smooth surfaces, with its Ra is around 70nm while maintaining superior peel strength performance.
”Ultra-Low Loss PCB Materials” Both prepreg and Copper clad laminate are available to form multilayer printed circuit board with the strength of extremely low loss tangent, high modulus, 20/20um or even less L/S with ultra-smooth surface, and either high or low dielectric constant depending on the desired application. The low k variety is ideal for high performance servers, as well as milliwave applications where conventional products fall short either in signal integrity or challenges in high cost processing. The high k version is an ideal replacement for LTCC where high performance and miniaturization are roadmap items.
Epoxy Technology announces our new PCB Applications Guide. This interactive tool allows users to select applications within a PCB in order to view each corresponding product recommendation. Each sheet provides mechanical and physical properties for each product to help in selecting the most appropriate epoxy.
ESL ElectroScience specializes in providing solutions to enable customers to take technologies from concept through high volume production using thick film pastes and ceramic tapes. ESL products can be found in hybrid microcircuits, multilayer microelectronics, transformers, thick film heaters, sensors, and fuel cells. Founded in 1962, ESL ElectroScience has continued to create manufacturable solutions for the past 50 years. For more information visit us at www.electroscience.com.