Kulicke & Soffa Launches New LED Package Singulation Blades -
OptoTM Ceramic & OptoTM PCB
Kulicke & Soffa Industries, Inc. has announced the launch of its new OptoTM
ceramic and OptoTM PCB Package Singulation Blades for the LED
OptoTM Hub and Hubless Blades significantly improve LED package singulation quality, precision and productivity, by providing improved stability and longer blade life.
Highlighted features of the new OptoTM blades include: attractive cost of ownership through consistently longer blade life, 100% pre-dressed to
shorten on-site dressing steps, and an optional kerf control feature to meet special application requirements. Significant UPH improvement has been observed in some applications by enabling higher feed speeds.
The new OptoTM ceramic blade utilizes unique electroplating technology to achieve up to 3 times theblade life of traditional resin/metal bonded blades, with minimal kerf change and blade wear. The new design minimizes machine downtime for blade changes, achieves the highest cut quality, and allows
higher feed speeds, increasing productivity.
The new OptoTM PCB blade for PCB & composite material substrates has an optimized design which provides uniform vertical wear, maintaining cutting power and consistent sawn package dimensions, thus eliminating in-process dressing steps. The optional ‘slits’ feature improves blade cooling, achieving high
singulation quality without typical whisker issues.
Nelson Wong, Vice President – Wire Bonding Solutions Business Unit, said: “The OptoTM blades provide a significant CoO improvement and a ‘plug and play’ solution for most dicer spindle configurations. Moreover, the hub-type design provides flexibility to various dicer configurations for package singulation and enhances machine utilization and factory productivity.”
Kulicke & Soffa Extends Power Series to Wedge Bond with PowerFusionPS
Kulicke & Soffa Industries, Inc. has announced another extension of its highly successful K&S Power SeriesTM equipment. The Company’s new high performance Orthodyne wedge bonder, PowerFusionPS, is driven by a new powerful direct-drive motion system and
expanded pattern recognition capabilities which deliver industry leading productivity and performance.
The PowerFusionPS fits well into the Power Series of products, known for setting new standards for productivity, performance, advanced package capability, ease of use, configuration flexibility and reliability.
PowerFusionPS boasts increased UPH that is enabled by the direct-drive servo system and faster pattern recognition find times. It also shows higher MTBA due to the improved pattern recognition. The advanced package capabilities of PowerFusionPS improves the processing of high-density power packages, due to an expanded bondable area, wider leadframe capability and superior indexing accuracy and teach mode.
PowerFusionPS is available in two different models with single or multiple head configurations. The TL Model is the perfect choice for bonding single-row to four-row matrix TO- power discrete packages. The enhanced HL model is intended for advanced power package designs. When bonding high density power devices, like SO-8 & PDFN, or stretching the wire limits on a matrix D-Pak, the superior indexing accuracy and clamping capabilities of the HL Model deliver consistent performance. Both Models provide industry leading productivity that lowers cost of
ownership by improved uptimes and higher bond yields.
Matt Vorona, Kulicke & Soffa’s Vice President – Wedge Bond Business Unit, remarked, “Our state of the art PowerFusionPS series by K&S launches a product firmly in the tradition of Orthodyne wedge bonders, well known in the power semiconductor industry for leading edge innovation, productivity and performance. “