MST
:: Corporate Member News ::

:: Hesse Mechatronics, Inc. Appoints Senior Business Development Manager (full story)

:: Master Bond’s Thermal Conductive Adhesive has Convenient One to One Mix Ratio (full story)

:: News from Indium (full story)

:: News from Kulicke and Soffa (full story)

:: Congratulations! Two Heraeus Teams Complete Their Six Sigma Black Belt Training (full story)

 

Applied Materials

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Qualcomm
Hesse Mechatronics
Intel

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH has appointed Michael McKeown as Senior Business Development Manager.

Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market. His broad knowledge and technical experiences will inform clients to the power and technical superiority of the 935, 939 and 931L fully automatic heavy wire bonders. Michael will also focus on promoting thin wire bonder sales.

Michael carries almost three decades of experience in the automotive and power electronics industry. Before joining Hesse Mechatronics, Michael oversaw sales territories in U.S. and Canada at Materion Technical Materials, where he managed market research and was involved with aluminum clad copper inlay for wire bondable leadframes. Prior to Materion, Michael was the Eastern Regional Sales Manager for Orthodyne Electronics, which manufactures ultrasonic wire bonders for the semiconductor and microelectronic industries.

“His extensive knowledge of customers’ heavy wire applications and process challenges will be a perfect fit for the needs of our customer base and the capabilities of our heavy wire product line,” noted Joseph S. Bubel, President of Hesse Mechatronics, Inc.

Michael is the author of more than a dozen technical papers and journal articles. He is currently working towards his Ph.D. at Leeds Metropolitan University.

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Master Bond’s Thermal Conductive Adhesive has Convenient One to One Mix Ratio

Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume.  Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates.  It has a low coefficient of expansion, low shrinkage and superb dimensional stability.  It also exhibits superior durability and chemical resistance.

EP21AO is easy to apply and is a self leveling paste.  It is 100% reactive and does not contain any solvents or volatiles.  It has a thermal conductivity of 10BTU/in/ft²/hr/°F and a dielectric strength of >400 volts/mil.  Its volume resistivity is >10¹³ ohm cm.  EP21AO has a Shore D hardness of >85 and a tensile  strength of 5,000psi.  Service operating temperature range is -60°F to +250°F.

Master Bond EP21AO is available for use in pint, quart, gallon and 5 gallon container kits.

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News from Indium

Indium Corporation Announces New PoP Solder Paste

Indium9.91 is a no-clean solder paste designed for use in package-on-package (PoP) applications 0.3mm and larger. Its rheology optimizes both dipping and package retention.

Indium9.91:

  • Eliminates defects due to package warping
  • Provides excellent solderability
  • Has a long pot life
  • Provides consistent solder paste volumes

Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys. 

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com

Indium Corporation Technology Experts Presenting at SVC 

Indium Corporation’s Jacques Matteau, Global Sales Manager – NanoBond® and NanoFoil®, and Jim Hisert, PV Applications Engineer, will present at the Society of Vacuum Coaters (SVC) Technical Conference April 23-24 in Providence, R.I.

Matteau’s presentation, High-Temperature, Pb-free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil, will compare traditional Sn-based solders typically used in physical vapor deposition processes, specifically comparing shear strength, void analysis, and cross-sectional analysis.

Hisert will present: Eliminating the Bond Stress of Sputtering Targets at Operational Temperatures. This paper explores the possibility of setting the “zero stress point” at different temperatures to minimize stress during sputtering target assembly caused by thermal expansion mismatches and deflection during operation.

Matteau is responsible for market development and sales of Indium Corporation’s NanoFoil® products to the target industry, where it is used to NanoBond® targets to the backing plate. His focus is on semiconductor, disk drive, and solar industries throughout Asia, Europe, and the U.S. Matteau has over 20 years of experience with thin-film technologies and the electronics industry.

Hisert is responsible for supporting Indium Corporation’s materials for the photovoltaic industry. He readily shares his expertise by authoring technical papers, presenting at professional seminars, and participating actively in the IPC subcommittee, “Acceptance Criteria for Tabbing and Stringing.” 

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News from Kulicke and Soffa

Kulicke & Soffa Launches Chinese-language Website

Kulicke & Soffa is pleased to announce the launch of their Chinese-language Website. Based on the www.kns.com website, the Chinese version, available by drop down menu on our website, is designed to provide easy access of information to the company’s existing and potential customers in a user-friendly and interactive way.

The website provides a broad range of Tchnology, Packaging and Productivity Solutions along with Product information. These help customers to find the most suitable solutions to achieve production efficiency
.
“K&S has a strong presence in Chinese language speaking countries, so it was the next logical step to provide customers in that region with up-to-date product information and news in their native language,” said Tong Liang Cheam, Vice President of Strategic Marketing and Business Development.

The new Chinese-language website began on March 19, 2013, the opening day of SEMICON China, to customers around the world. K&S also plans to provide other language capabilities to their website, with Japanese being the next language launched on the website.

 

Kulicke & Soffa Launches K&S Care: A Professional Service Designed to
Help Customers Operate their Machines at an Optimum Level

Kulicke & Soffa Industries, Inc. hasy announced the launch of its professional service, “K&S Care,” designed to help customers operate their machines at an optimum level under the care of K&S trained specialists.

Under K&S Care, customer machines are serviced by K&S trained engineers and technicians with the backing of the K&S engineering team who designed and developed the machines. They can leverage the knowledge gained from the K&S worldwide installed base to help optimize machine productivity and reduce cost. The service will be carried out using only K&S recommended tools and K&S parts to ensure long term machine reliability.

K&S Care has 3 different programs, offering different levels of service depending on customer needs: Basic, Professional, and Comprehensive.

K&S Care - Basic offers customers on-site scheduled preventive maintenance done by K&S trained engineers and technicians who will perform the regular maintenance based on customer usage patterns and factory recommendations.

K&S Care - Basic covers all monthly, quarterly, and yearly preventive maintenance and labor for
that maintenance.

K&S Care - Professional offers customers a way to control operation costs and minimize unscheduled
downtime. Customer machines are serviced by K&S trained and certified engineers using only K&S spare parts.

K&S Care - Professional provides an extended warranty after the standard warranty has expired. It covers maintenance labor and spares.

K&S Professional customers have priority in part availability with a 2-day
turnaround for machine down situations.

K&S Care - Comprehensive is a combination of both the Basic and Professional programs and is designed to provide customers a total solution in optimizing machine performance.

Nelson Wong, Vice President – Wire Bonding Solutions Business Unit, said: “K&S Care aims to provide customers peace of mind while reducing their total cost of ownership and ensuring continuous peak performance of all their K&S machines.”

K&S Care helps customers reduce administrative costs and assists in operational efficiency. Customers no longer need to worry about expertise and resources for machine maintenance. Customers will now be able to focus on core competencies and channel their energy into running a more successful operation and production.

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Congratulations! Two Heraeus Teams Complete Their Six Sigma Black Belt Training

Recently, two teams at Heraeus completed their Six Sigma Black Belt training. Part of the training involves the execution and successful completion of a complex project. Both teams were comprised of cross-functional members. Nick Rusch, Sean Lonsinger and Kurt Sparandero (pictured just below) were on the first team. Their project consisted of optimizing and controlling thick film paste properties for printability. The team evaluated a host of variables, from inorganic solids to organic content to paste processing. They successfully identified key parameters, but also learned about secondary effects. The team is continuing the project to better understand these secondary effects.

Eric Davis, Steve Grabey and Steve Herbert (pictured just below) were on the second team. Their project explored streamlining the scale-up process from R&D to production. The team investigated a number of variables to ensure that products produced in large volumes were equivalent in performance to products from original development. They identified a number of key processing levers that can impact the scale-up of a product. This work provided the engineering team with insights and a new tool to help minimize any issues during the scale-up process.

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View the Corporate Bulletin Archives

 

Quik-Pak
RGL Enterprises
QSIC

 


:: Issue 139 ::
April 15, 2013

F&K Delvotec

Master Bond

LORD Corporation

RGL Enterprises

EPP