NEWS | JOBS | FAST LINKS

MST

:: Corporate Member News ::

:: Natel’s First Annual Supplier of the Year Awards (full story)

:: Hesse Mechatronics Opens Training and Applications Lab in Tempe, Arizona (full story)

:: Valtronic Introduces Glass Encapsulation for Active Implants (full story)

:: DuPont Display Enhancements Awarded Foundational Patent for Display Bonding Technology (full story)

:: Master Bond’s Two Component Room Temperature Curing Epoxy Meets UL 94V-0 Specifications for Flame Retardancy (full story)

:: Kulicke & Soffa to Appoint Yih-Neng Lee as Senior Vice President, Global Sales (full story)

:: TJ Green Associates LLC Announces Fall Training Schedule (full story)

:: Recent Palomar Blog Posts - Sourcing Process Expertise for High-Precision Assembly (full story)

:: Brewer Science Presents Innovative Material and Process Technologies Driving Device Fabrication and Performance at SEMICON Taiwan 2013 (full story)

:: LORD MicroStrain® Sensing Systems Introduces Cost-Effective Tactical-Grade GPS-Aided Inertial Navigation System (full story)

:: STATS ChipPAC and Nanyang Technological University Collaborate on New Innovative Packaging Technologies (full story)

:: Thank you IMAPS 2013 Exhibitors ! Less than 30 Booths Still Available (full story)

Applied Materials

:: Job Openings ::

:: Application & Support Specialist - Semiconductor/SMT (full story)

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Micross Components
Petroferm
NOVA Integration Solutions

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


Natel’s First Annual Supplier of the Year Awards

NATEL EMS will recognize 13 of its best suppliers Monday evening, September 30, 2013 with its Natel supplier of the Year awards during IMAPS 46th annual International Symposium. The awards presentation will be held at the Rosen Centre Hotel in Orlando, Fl.
           
 “The Supplier of the Year award winners represent a partnership, dedication and commitment to consistently perform above expectations. This has played an important role in Natel’s success,” said Sudesh Arora, President of Natel EMS. “ We appreciate the efforts of these suppliers and look forward to a mutually beneficial continued relationship in the future.”
           
This is the first annual award ceremony recognizing the outstanding performance of Natel suppliers.
           
The awards recognize the significant contributions of Natel suppliers as part of the company's product and performance achievement. The winners represent Natel’s view, as the best the microelectronics/electronics industry has to offer in innovative technology, superior quality, outstanding launch support, crisis management and competitive total enterprise cost solutions.
           
The suppliers of the Year winners are chosen by the Natel team of purchasing, engineering, quality, manufacturing and logistics executives.

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Hesse Mechatronics Opens Training and Applications Lab in Tempe, Arizona

Four Hesse Mechatronics labs focused on wire bonding process technology now open across the country

Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH recently opened its newest training and applications lab in Tempe, Arizona.

The new training and applications lab is located at 6105 S. Ash Avenue, Suite A-1, Tempe, AZ 85283. Customers can reach staff at the new facility by calling the company’s main number at (408) 436-9300.

The company has appointed Allan Camp, who joined the company as technical support manager in June 2012, responsibility for the new lab.

Allan’s role and the new lab are additional steps in Hesse Mechatronics’ strategy to improve customers experience and convenience in qualifying and learning about the company’s wedge bonding equipment and taking advantage of support services. The company also maintains west coast and east coast demonstration and applications labs in Fremont and Anaheim, California and Clinton, Massachusetts.

Allan will oversee technical support and training on Hesse Mechatronics’ family of semiconductor packaging equipment both at the new training facility and at customer sites. He will also conduct demonstrations of Hesse Mechatronics' wedge bonding equipment, including thin wire wedge bonders and heavy wire wedge bonders, so customers can validate and qualify wedge bonding equipment prior to making an investment in new technology.

Allan possesses more than two decades of experience in the semiconductor industry, including Eastman Kodak Company in microelectronics packaging and Xerox Corporation in wafer fabrication.

“Allan’s knowledge in wafer fab operations, microelectronics packaging and semiconductor process equipment will serve our customers well as he provides training that addresses their specific equipment and manufacturing requirements,” notes Joseph S. Bubel, president of Hesse Mechatronics, Inc. 

For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com. For more information on Hesse Mechatronics’ training and applications support services, please e-mail info@hesse-mechatronics.us. To see wire bonding in action, visit www.wirebonddemo.com.

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Valtronic Introduces Glass Encapsulation for Active Implants

Valtronic can now offer Glass Encapsulation to medical device companies who produce active implants.  Our first customer application for this product is for an ingestible pill.

Glass encapsulation has been used in other high-tech industries and is a proven technology. Hermetic glass encapsulation provides a totally leak-proof housing for an implant.  Glass-sealed packages are used mostly in critical components and assemblies solving several problems in the development and manufacture of active implants due to its strong properties and extended life.

Active Implants are Class III electromechanical medical devices functioning in the human body. Challenges of Active Implants include: electronic autonomy, the size, its imperviousness to body fluids and biological interfaces. To address these challenges active implants require a battery or power system, miniaturization of electrodes and encapsulation of the components to protect and preserve the properties and functions of the implant.

"This new capability provides Valtronic with a unique opportunity to reduce an implant’s power consumption and increase its functionality while reducing its size." states Jim Ohneck, Valtronic's Chief Marketing Officer. "We have exclusive rights to this technology for the medical industry worldwide and are excited about this great opportunity." 

In the past year as Valtronic has been developing this technology for use in implants we have identified some significant advantages. A few of these advantages include high density feed-through reliability, radio frequency transparency advantage vs a metal enclosure and greater opportunity for package miniaturization.  It is an excellent alternative encapsulation for long term implants.

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DuPont Display Enhancements Awarded Foundational Patent for Display Bonding Technology

Manufacturing Breakthrough Enables More Rugged & Readable LCD and Touch Screen Displays

DuPont Display Enhancements, Inc. (DuPont) has been awarded a new patent based on a manufacturing method for bonding Liquid Crystal Displays (LCD) and touch screens or cover glass.  U.S. Patent No. 8,468,712, entitled “Method for Bonding a Transparent Substrate to a Liquid Crystal Display and Associated Device,” covers a foundational process methodology for producing optically bonded displays, utilizing a dam and fill technique to apply DuPont™ Vertak® optical bonding adhesive.  Growth in the use of optical bonding has been dramatic over the past few years because it improves display durability, readability in bright lighting conditions and allows greater design flexibility.

The proprietary dam and fill technique DuPont developed is used to ensure a consistent, uniform bond gap and provides superior adhesive flow control resulting in a high-quality, high-yield bonding process.  DuPont was previously awarded a counterpart patent in China and is currently pursuing additional international counterpart applications. 

“We are very pleased to announce the issuance of this patent,” said William S. Bandel, global business director, DuPont Display Enhancements.  “It affirms our continuing commitments to driving innovation and maintaining our position of industry leadership for advanced optical bonding display technology.”

DuPont Display Enhancements is a global industry leader in direct bonding process methods and optical adhesive adhesives for bonding displays used in mobile phones, tablets, notebooks and other consumer electronics.  For more information please visit http://vertak.dupont.com


DuPont Display Enhancements was recently awarded a key patent for display bonding technology using DuPont™ Vertak® optical bonding adhesive to create more rugged and readable LCD and Touch Screen Displays.

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Master Bond’s Two Component Room Temperature Curing Epoxy Meets UL 94V-0 Specifications for Flame Retardancy

Featuring a non-halogen filler, Master Bond EP21FRNS-2 passes UL 94V-0 testing for flame retardancy in potting, encapsulation and casting applications. It produces very low smoke levels and is well suited for the computer, aerospace and related industries.

This two part epoxy features a convenient one to one mix ratio by weight and cures at room temperature or more quickly at elevated temperatures. EP21FRNS-2’s handling is further facilitated by color coding—Part A is black and Part B is off-white.

This tough and durable system bonds well to a wide variety of substrates including metals, glass, ceramics and many plastics. It can also withstand exposure to a range of chemicals, such as water, fuels, lubricants and acids, among others. As per the UL 94V-0 specification, EP21FRNS-2 is serviceable over the temperature range of -51°C to 90°C. Featuring a moderate viscosity, this epoxy maintains its flow and is a reliable electrical insulator.

EP21FRNS-2 is available in ½ pint, pint, quart, gallon and 5 gallon kits, as well as premixed and frozen syringes, bubble packs and gun dispensers.

Master Bond High Temperature Resistant Potting Compounds
Master Bond EP21FRSN-2 is a two component, flame retardant, toughened epoxy that resists high temperatures up to 90°C. Read more about Master Bond’s potting compounds at http://www.masterbond.com/applications/potting-and-encapsulation or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

 

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Kulicke & Soffa to Appoint Yih-Neng Lee as Senior Vice President, Global Sales

Kulicke & Soffa Industries, Inc.  will appoint Yih-Neng Lee as Senior Vice President, Global Sales. Mr. Lee will be based at the K&S Corporate Headquarters in Singapore, and report to the Company’s President and Chief Executive Officer, Bruno Guilmart. Mr. Lee will succeed T.C. Mak, Vice President of Global Sales, whose career at K&S spans more than 30 years. While the new appointment will be effective September 2, 2013, Mr. T.C. Mak will remain with K&S until the end of December 2013 to ensure a smooth transition.

Mr. Guilmart continued, “We thank T.C. for his many valuable accomplishments at K&S over a career spanning more than three decades. He has helped K&S build a premier global sales organization to expand our market leadership and achieve record breaking revenue. We are very pleased that T.C. will remain with us during a transition period in order to facilitate the transfer of responsibilities to Yih-Neng. I am also pleased to welcome Yih-Neng to the K&S team. Yih-Neng is a worldclass sales executive with proven experience in the industry and extensive relationships at OSAT companies and IDMs. His drive, leadership and experience will make him an excellent fit for K&S as we continue to execute on our business and growth strategy.”

Born and educated in Singapore, Yih-Neng Lee has more than 25 years of global sales experience in the technology industry. He has held global sales and marketing positions for the majority of his career with Advantest, Verigy (spun off from Hewlett-Packard/Agilent Technologies and later acquired by Advantest) and Hewlett-Packard/Agilent Technologies. Mr. Lee has served as Advantest’s President, South Asia Pacific based in Shanghai, China, from November 2011 to present. He was previously based in Santa Clara, California, where he served as Agilent Technologies’ Vice President, Sales, Marketing, Support, Worldwide Fabless Semiconductor Test Business, from November 2001 to August of 2005. In 1983, Mr. Lee joined Hewlett-Packard/Agilent Technologies, based out of Singapore, serving as Vice President and General Manager, Sales, Marketing, Support from February 1998 to November 2001, responsible for the company’s semiconductor test business. Mr. Lee received his Bachelor of Engineering and Master in Business Administration degrees from the National University of Singapore.
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TJ Green Associates LLC Announces Fall Training Schedule

Military Hermeticity Specs have changed!  This may effect your business click here for a white paper explanation …… http://www.tjgreenllc.com/Hermeticity-Spec-TM-1014+

Process Certification and Defect Recognition 
Hybrids, Microcircuits and RF/MMIC Modules:
  (4 Days)
Sept 24-27th     Bethlehem PA

Most companies struggle to introduce new lines and waste countless manhours and resources resolving old problems on the manufacturing floor. Much of this waste is directly tied to the knowledge and training level of the responsible individuals. This course is designed to teach the fundamental materials and processes used in microelectronics manufacturing and develop an understanding of the relevant visual inspection criteria. "Knowing what to do" is the first step towards lower costs, improved quality, and faster throughput. Multimedia PowerPoint presentations and video clips introduce the basics in a classroom setting over four days, and there is always plenty of time for questions and discussion as needed. Visual inspection and defect recognition is a critical part of the process certification. 

Microwave Packaging Technology  (3 Days)  
Sept 10-12th       San Diego CA

Microwave Hybrids, MICs, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material trade offs, process selection are all covered in detail with the goal of imparting useful information to the students so they can return to the workplace better equipped to assemble and manufacture reliable microwave hybrids for military, space, and other high reliability commercial and medical device applications. This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids.

Wire Bonding Certification  (3 Days)
August 27-29th   Bethlehem PA

This three-day course is a combination of classroom and "hands-on" exercises conducted at the wire bonder designed to teach the basics of manual gold ball and wedge wirebonding. The goal is to teach the process of wirebonding, which includes the wire, tool, machine settings and operation, work stage and operator skill. Especially important is how to troubleshoot a wire bond problem and get the process back on track. The instructor shares his numerous years of experience and provides insightful tips that help build confidence. Students develop a functional understanding of the wire bond process along with important quality and reliability considerations for hi rel military and medical products. In addition to bonding, the students also learn the important visual inspection criteria and how to properly perform wire pull/ball shear testing.

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Recent Palomar Blog Posts - Sourcing Process Expertise for High-Precision Assembly

Near-sourcing, out-sourcing, in-sourcing, crowd-sourcing, group-sourcing—which one is right for your organization? Palomar Technologies' has extensive experience as it relates to sourcing production solutions across many different markets and applications and what is nearly always the critical piece of the puzzle organizations must overcome to be successful. Read more: http://www.palomartechnologies.com/blog/bid/116821/Sourcing-Process-Expertise-for-High-Precision-Assembly.

Automated Flip Chip Assembly
Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method. Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. Read more: http://www.palomartechnologies.com/blog/bid/117331/Automated-Flip-Chip-Assembly.

Subscribe to the PTI Blog! Join the 3,543 industry peers who already have!
http://www.palomartechnologies.com/subscribe

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Brewer Science Presents Innovative Material and Process Technologies Driving Device Fabrication and Performance at SEMICON Taiwan 2013

Brewer Science, Inc., will present its latest innovative materials, processes, and wafer- processing equipment critical for enabling the advancement of lithography and 3-D IC integration at SEMICON Taiwan 2013 in Taipei, Taiwan. The company will present five different topics at this event. Dr. Terry Brewer, founder and President of Brewer Science, will address materials-driven process development as a new mode for industry collaboration during his keynote speech at the SiP Global Summit 2013 3-D IC Technology Forum on September 5, 2013.

Dr. Brewer explains, “For over 30 years, Brewer Science has consistently delivered many material solutions that have enabled the advancement of lithography processes and the creation of numerous generations of devices. Our proven materials-development expertise has widened process windows to prolong the productive lifetime of lithography equipment while lowering processing cost.” Dr. Brewer continues, “Our 3-D IC and thin-wafer-handling materials are developed to have a similar impact by opening process windows, increasing equipment versatility, and lowering processing costs. By utilizing our long experience with designing materials to increase process windows, it is possible to minimize capital investment and lower cost and time. Any wise investment in equipment sets must be carefully made based on process parameters and performance of the materials. The customer is best served when the customer and the material and equipment manufacturers work in tandem toward a solution.”

Dr. Douglas Guerrero, Senior Technologist at Brewer Science, will discuss extending lithography with advanced materials during the Litho/Mask Technology Symposium on September 6, 2013. Dr. Guerrero explains, “With the continued delay of extreme ultraviolet (EUV) lithography, even more importance is placed on versatile material and process solutions designed to extend existing lithography technology. In this presentation, Brewer Science will discuss how material evolution has been able to extend lithography nodes in the past, present, and future. Recent material innovation for multilayer patterning for positive- and negative-tone development (PTD and NTD), directed self-assembly (DSA), and EUV lithography will be discussed.”

Brewer Science will continue to share its innovative solutions at three TechXPOT sessions on the opening day of SEMICON Taiwan, September 4, 2013. Our technology experts will address advanced lithography and 3-D IC materials, processes, and equipment solutions at the TechXPOT.

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LORD MicroStrain® Sensing Systems Introduces Cost-Effective Tactical-Grade GPS-Aided Inertial Navigation System

LORD Corporation MicroStrain® Sensing Systems  has introduced its new tactical grade GPS-Aided Inertial Navigation System (GPS/INS): 3DM-RQ1™ -45. 

Designed to meet DO-160, the 3DM-RQ1™ -45 provides cost-effective ruggedized airborne navigation with 5°/hour gyro bias stability. Additionally, the innovative MEMS architecture achieves tactical-grade performance with the smallest and lightest package in its class.

The new 3DM-RQ1™ -45 GPS/INS is built on the MIP™ protocol, LORD MicroStrain’s standard inertial data architecture. With MIP™ users access a robust communication standard that ensures efficient long-term development, maximum versatility, and full forward compatibility.

“The 3DM-RQ1™ -45’s unique combination of performance, size and affordability makes it ideal for primary and/or secondary navigation systems, platform stabilization, antenna pointing, or unmanned systems,” said Michael Robinson, Manager, Sensing Systems Sales for LORD MicroStrain. “High-performance MEMS combined with rigorous calibration and sophisticated onboard estimation filtering allows LORD MicroStrain to offer tactical capabilities to markets that demand precision, but are sensitive to additional weight and integration costs. The new 3DM-RQ1™ -45 achieves airborne ruggedness in a miniature package that is 23mm tall and weighs only 205 grams. We look forward to working with customers to implement this flexible sensing solution at the leading edge of unmanned applications.”

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STATS ChipPAC and Nanyang Technological University Collaborate on New Innovative Packaging Technologies

STATS ChipPAC has announced a collaborative partnership with Nanyang Technological University (NTU) focused on generating breakthrough innovations in next generation packaging technologies. STATS ChipPAC and NTU will collaboratively focus on further advancement in wafer level packaging and interconnect technologies, and the acceleration of research on new materials and manufacturing processes. The partnership leverages the depth of resources in NTU’s academicians and researchers, and STATS ChipPAC’s experience in advanced semiconductor packaging technologies.

Based in Singapore, NTU is one of the world’s fastest-rising universities, with globally acknowledged strengths in science and engineering. NTU recently ranked No. 2 amongst the world’s top young universities aged 50 years and below by higher education information provider Quacquarelli Symonds (QS). NTU is also ranked among Asia’s top 10 universities by QS. The university has made substantial contributions to Singapore’s drive for research and innovation, as well as attracting top students and some of the world's best professors. The partnership is in full alignment with STATS ChipPAC’s ongoing commitment to Singapore as the Company’s global hub for advanced wafer level technology research and development (R&D), and Post Wafer fab Process (PWfP) for advanced mobile convergence devices.

“The semiconductor industry is evolving rapidly to meet the increasing device complexity and connectivity experience of today’s electronic consumers. We are constantly seeking to expand our technology and manufacturing innovations in order to deliver differentiated solutions for our customers’ next generation mobile convergence devices. We are excited to collaborate with NTU to harness semiconductor technologies that will drive the next generation of electronic devices,” said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

“NTU continues to be the choice partner for industry leading companies, a key trait of a world-class, research-intensive university. NTU has an established track record in research and development with key industry players and through such partnerships, we turn fundamental research into innovation, leading to commercialisation. NTU’s collaboration with STATS ChipPAC provides a great opportunity for NTU faculty and post graduates to leverage on our strong research culture and expertise to develop advanced packaging solutions. By continuing to work in tandem with industry leaders such as STATS ChipPAC, we can continue to be an important engine for innovation in Singapore,” said Dr Lim Jui, Chief Executive Officer, NTU Innovation.

For more information, please visit www.statschippac.com.

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Thank you IMAPS 2013 Exhibitors ! Less than 30 Booths Still Available

Exhibitor Contact name
Booth
Booth Type
Booth Category
3D Plus USA
Emond Mich
201
10 x 10
Corner
ACM Research, Inc.
Lee Michael
421
10 x 10
In-Line
AdTech Ceramics
Wade Jim
614
10 x 10
In-Line
Advance Reproductions Corp.
Robinson Don
522
10 x 10
Corner
Advanced Dicing Technologies
Eichhorn Mark
517
10 x 10
In-Line
AI Technology, Inc.
Boersig Charlie
400
10 x 10
Corner
Alabama Microelectronics Science & Technology Center
Hamilton Michael
627

10 x 10
Research Corridor

In-Line
ancosys Inc.
Pye Graham
805
10 x 10
In-Line
Besi North America, Inc.
Kok Alice
704
10 x 20
Corner
Binghamton University IEEC
Santos Daryl
726

10 x 10
Research Corridor

Corner
Ceradyne VIOX, Inc.
Brown Harlan
717
10 x 10
Corner
CeramTec North America
Christensen Robert
307
10 x 10
In-Line
Colorado Microcircuits, Inc.
Thalman Gary
315
10 x 10
In-Line
Conductive Containers Inc. (CCI)
Loggins Tom
313
10 x 10
In-Line
CVInc.
Collier Terence
317
10 x 10
In-Line
Deweyl Tool Inc..
Palmer Johanna
316
10 x 10
In-Line
DuPont Microcircuit Materials
Vernon Joan M
520
10 x 10
In-Line
East China Research Institute of Microelectronics
Wang Tony
311
10 x 10
In-Line
Element Six Technologies US Corp.
Obeloer Thomas
308
10 x 10
In-Line
Endicott Interconnect Technologies, Inc.
Orband James
200
10 x 10
Corner
ENrG, Inc.
Olenick John
215
10 x 10
In-Line
Epoxy Technology, Inc.
McCabe Joseph D
622
10 x 10
Corner
ESL ElectroScience
Chambers Drew
808
10 x 10
Corner
F & K Delvotec, Inc.
Bailey Rick
405
10 x 20
Corner
Ferro Corporation
Stadnicar Edward
615
10 x 20
In-Line
Finetech, Inc.
Gerard Adrienne
508
10 x 10
Corner
Fraunhofer Institute for Ceramic Technologies and Systems IKTS
Pohontsch Fanny
526

10 x 20
Research Corridor

Corner
Fraunhofer Institute for Reliability and Microintegration IZM
Weigelt Georg
426

10 x 20
Research Corridor

Corner
Gannon & Scott
Conway Raymond
207
10 x 10
In-Line
Geib Refining Corporation
Gervais Michael T
609
10 x 10
In-Line
General Metal Finishing Co., a unit of Precision Engineered Products
Chatfield Stephen
310
10 x 10
In-Line
Haiku Tech, Inc.
De Moya Martin I
417
10 x 10
Corner
Harrop Industries, Inc.
Timmel Paul
714
10 x 10
In-Line
Hary Manufacturing Incorporated
Hary Paul
500
10 x 10
Corner
Heraeus Thick Film Division
Yin Yin
504
10 x 20
Corner
Hesse Mechatronics, Inc.
Bubel Joseph S
605
10 x 20
Corner
Hi-Rel Laboratories, Inc
Devaney Roger M
612
10 x 10
In-Line
IBM Microelectronics Division
Hochlowski Barry
418
10 x 10
In-Line
Indium Corporation
Cruz-Griffith Victoria
409
10 x 10
Corner
Infinite Graphics
Maitland Pete
206
10 x 10
Corner
Interconnect Systems, Inc.
Andrews Abby
406
10 x 10
In-Line
Kulicke & Soffa Industries, Inc.
Frese Sheila
705
10 x 10
Corner
Kyocera America, Inc.
Labadie Iris
616
10 x 10
In-Line
LINTEC of America
Campbell Stuart
521
10 x 10
In-Line
LORD Corporation
Greig Jim
600
10 x 20
Corner
Metallix Refining, Inc.
Woolley Micki
618
10 x 10
In-Line
Metalor Technologies
Imhof Howard
807
10 x 20
Corner
Micro Hybrid Dimensions, Inc.
Spradlin Greg
414
10 x 10
In-Line
MicroScreen LLC
Wise Wallace Holly
523
10 x 10
Corner
Micross Components
Smith Scott
721
10 x 20
Corner
Midas Technology, Inc.
Towl Kenneth
803
10 x 10
Corner
Minco Technology Labs, LLC
Cooper Kristi
309
10 x 10
In-Line
Mini-Systems, Inc.
Tourgee Craig
412
10 x 10
In-Line
NAMICS Corporation
Jensen Richard C
611
10 x 10
In-Line
Natel Electronic Manufacturing Services, Inc.
Angeloni James A
505
20 x 20
ISLAND
Neu Dynamics Corp.
Johnson Don
712
10 x 10
In-Line
Newport Corporation
Medernach Jon
416
10 x 10
In-Line
NorCom Systems, Inc.
Aubertin Chris
613
10 x 10
In-Line
Nordson DAGE
Kardjian Aram
701
10 x 10
Corner
NOVA Integration Solutions
Martyniak Michael
323
10 x 10
Corner
nScrypt, Inc.
Brownell Beth
716
10 x 10
Corner
NTK Technologies, Inc.
Stoops Mariel
719
10 x 10
In-Line
Oneida Research Services, Inc.
McEwen James
422
10 x 10
Corner
Pacific Trinetics Corporation
Meshkin Neda
621
20 x 20
ISLAND
Palomar Technologies, Inc.
Sylvester Jessica
511
10 x 20
Corner
Perfection Products, Inc.
Vickery John
515
10 x 10
In-Line
Photofabrication Engineering, Inc.
Grande Judy
318
10 x 10
In-Line
Plasma-Therm, LLC
Messineo Nancy
111
10 x 20
ISLAND
Polysciences, Inc.
Gidzinski Ashley
620
10 x 10
In-Line
Prince & Izant Co.
Faulhaber Nancy
105
10 x 10
Corner
Quik-Pak, San Diego
Nunes Jennifer
518
10 x 10
In-Line
Reldan Metals Co.
Whitaker Kathleen
305
10 x 10
Corner
Riv, Inc.
Keefe Tania M
700
10 x 10
Corner
Royce Instruments, Inc.
Cox Diane
516
10 x 10
Corner
Rudolph Technologies
Pauling Amy
519
10 x 10
In-Line
Sales and Service, Inc.
Winn Chris
314
10 x 10
In-Line
SANTIER Thermal Management Solutions
Loomis Tom
420
10 x 10
In-Line
Sefar, Inc.
Potratz Christine
204
10 x 10
Corner
Semi Dice, Inc.
Minter Darin
707
10 x 10
In-Line
Semiconductor Equipment Corporation
Moore Donald I
410
10 x 10
In-Line
Sikama International, Inc.
Skeen Phil
816
10 x 10
Corner
SMART Commercialization Center for Microsystems
Apanius Matt
626

10 x 10
Research Corridor

Corner
Sonoscan, Inc.
Lykowski Janet
709
10 x 10
Corner
Souriau PA&E
Kalkowski Rick
610
10 x 10
Corner
SST International
Wilson Bruce A
304
10 x 20
Corner
Stellar Industries Corp.
Snook John B
401
10 x 10
Corner
TDK Corporation
Lambeth Sara
804
10 x 10
Corner
Technic, Inc.
Roza Drew
205
10 x 10
Corner
Teledyne Microelectronic Technologies, Inc.
Fletcher Sharon
501
10 x 10
Corner
Torrey Hills Technologies, LLC
Zhang Joyce
408
10 x 10
In-Line
Towa Corporation
Tripp Lloyd
312
10 x 10
In-Line
Trebor Instrument Corp.
Grzesiak Margaret
404
10 x 10
Corner
Tresky Corporation
Weil Allen
708
10 x 20
In-Line
UTZ Technologies
Guidi Kristian
TBD
10 x 10
In-Line
West Bond, Inc.
Straight Randy
300
10 x 10
Corner
XYZTEC
Haley Tom
423
10 x 10
Corner
Zeon Corporation
Shoulders Kimberly
419
10 x 10
In-Line
Booth Count: 117
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:: Job Openings ::

Application & Support Specialist - Semiconductor/SMT

Growing Semiconductor/SMTequipment manufacturer. 

Join our Eastern North America sales and support team, based out of Manchester, NH. 

Responsibilities include:

  • Equipment demonstrations, application and process support for potential and existing customers.
  • Technical liaison with factory for all aspects of customer orders.
  • Equipment installations, all aspects of technical support, repairs and training.
  • Help maintain a small demonstration lab and demo equipment.

Requirements

  • 5+ years of experience in Semiconductor / SMT equipment operation & support.
  • Specific experience with die bonding equipment and advanced packaging is strongly desired.
  • Confident hands-on equipment operation and troubleshooting.
  • Includes varied travel typically up to 40%, with adaptability to schedule changes. Will involve travel primarily in Eastern N. America. Occasional travel to customer sites and tradeshows all over North America, as well as factory in Germany.
  • Must be self motivated and thrive within a small company “can do" atmosphere with minimal supervision. The ability to multi-task and take initiative is a must.
  • Excellent interpersonal and communication skills are essential.
  • Strong PC and organizational skills assumed.

About us:

Finetech offers innovative equipment solutions for nearly every kind of rework or micro assembly challenge, including the latest advanced packages. Come check us out:  http://www.finetechusa.com

Submit resumes to:  jobs@finetechusa.com

We thank all applicants in advance for their interest; however, only those applicants who are being considered for an interview will be contacted.

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:: Issue 144 ::
August 16, 2013

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