NEWS | JOBS | FAST LINKS

MST

:: Corporate Member News ::

:: Amkor Technology partners with IPC to sponsor the "Conference on Component Technology: Closing the Gap in the Chip to PCB Process" (full story)

:: Hermetic 38999 Style Connectors With Integrated EMI Filters (full story)

:: New Silver Conductive, One Part Aqueous Based Sodium Silicate System Available for EMI/RFI Shielding From Master Bond (full story)

:: Palomar Technologies (full story)

:: TDK’s New N2 Purge FOUP Loadport Models Launched (full story)

:: News from PEI (full story)

:: News from Brewer Science (full story)

:: ES Components Announces Two New International Representatives in France and India (full story)

:: STATS ChipPAC Celebrates 1,000th U.S. Patent Milestone (full story)

:: Quik-Pak’s OmPP Packages Improve Time-to-Market for Design Engineers (full story)

:: New Product Release for the NorCom 410 Gross Leak Test System 8/1/13 (full story)

:: 115 Exhibits on Display at IMAPS 2013 - Only 32 Booths Still Available (full story)

Applied Materials

:: Job Openings ::

:: Application & Support Specialist - Semiconductor/SMT (full story)

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

NATEL
Brewer Science
TDK

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


Amkor Technology partners with IPC to sponsor the "Conference on Component Technology: Closing the Gap in the Chip to PCB Process"

Sept. 10-12 at the Hilton Phoenix Chandler, in Chandler, AZ.

With an emphasis on design and manufacturing of component technology to realize interconnection solutions, this event will tackle the latest advancements and discoveries to help the PCB supply chain and chip manufacturers address the technology challenges in IC to board-level interconnections. Don't miss this opportunity to learn from the experts - register today!

http://www.ipc.org/calendar/2013/component-conference/component-conference0913-brochure.htm
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Hermetic 38999 Style Connectors With Integrated EMI Filters

New EMI Filtered Option for SOURIAU PA&E's Lightweight, HighPerformance 38999 Style Connectors

SOURIAU PA&E has a long history of developing hermetic MIL-DTL compatible 38999 connectors optimized for high electrical performance, light weight and small footprints. Now, the company has added integrated EMI filtering capabilities into the mix, following the introduction of its filtered 38999 connector product line.

SOURIAU PA&E's filtered 38999 compatible connectors combine aluminum or titanium shells (that allow the connectors to be integrated into lightweight housings) with beryllium copper CDA Alloy 172/173 pins for high electrical performance. Each pin features individual L-, Pi- or C-section EMI filters that can be potted with silicone or epoxy or hermetically sealed with SOURIAU PA&E's rugged polycrystalline ceramic, Kryoflex.

These filtered connectors are custom configured to meet a range of EMI filter performance parameters. Connectors using C- and L-section filters can support 5-15 amps, working voltage of 50- 400 VDC with a minimum insertion loss of between 2 and 70dB, depending on configuration. Connectors using Pi-section filters support 10 amps and a working voltage of 50-300 VDC with a minimum insertion loss of between 2 and 70dB, depending on configuration.

They are available in all standard MIL-DTL pin counts and configurations and shell finish options include passivated nickel/gold plate or chromite conversion coating as applicable. Depending on configuration, these connectors can have a leak rate at less than 1X10-9cc/sec Helium at 1 atmospheric differential pressure. They provide greater than 5,000 Megohms at 400 VDC and exhibit no evidence of breakdown or flashover when tested in IAW MIL-STD-1344, Method 3003. SOURIAU PA&E hermetic filtered 38999 compatible connectors have a typical operating temperature range -55°C to 125°C.

For more information about this new hermetic connector family from SOURIAU PA&E, or to learn more about the company's other interconnect products, EMI filters, and integrated electronic packaging capabilities, contact SOURIAU PA&E at 855-285-5200 or visit us at http://www.pacaero.com.

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New Silver Conductive, One Part Aqueous Based Sodium Silicate System Available for EMI/RFI Shielding From Master Bond

Master Bond MB600S is an aqueous based sodium silicate formulated for coating applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required.

The energy emitted from various sources, including radios and appliances, can interfere with other electronic devices. Conductive coatings are often applied to the housings in order to protect the devices from these types of interferences. This silver gray colored system is used in a variety of aerospace and electronic applications.

Tested according to IEEE 299, 2006 methods, MB600S was as effective as the aluminum reference with a range of 95-105 dB, from 100 MHz to 2 GHz. Above 2 GHz, the shielding effectiveness of MB600S decreased to 80 dB and slightly below. Above 4 GHz, the effectiveness was 60-70 dB.

As the system is water based, it is relatively non-toxic and easy to handle. It can be brushed or sprayed with the proper equipment. If sprayed, the shielding effectiveness would be even greater than the values given above.

MB600S will cure at room temperature in 24-48 hours or in 1-2 hours at 80°C. It features high temperature resistance with a service temperature range of 0°F to 700°F. The compound is available in glass jars, and has a shelf life of 6 months in original, unopened containers at room temperature.

Read more about Master Bond’s electrically conductive adhesives, sealants, coatings and encapsulation compounds at http://www.masterbond.com/properties/electrically-conductive-adhesive-

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Palomar Technologies

Palomar Technologies has announced the launch of new products at SEMICON West 2013: the 8000i Wire Bonder with Intelligent Interactive Graphical Interface™ (i2Gi™) and VisionPilot™ for automated high-precision die attach. The 8000i Wire Bonder, i2Gi and VisionPilot were showcased through live demonstrations at SEMICON West 2013, July 9-11, at the Moscone Center in San Francisco, CA.

Read the full Press Release: http://www.palomartechnologies.com/news-room/press-releases/bid/116928/New-Products-at-SEMICON-West-2013-8000i-Wire-Bonder-with-i2Gi-TM-Technology-VisionPilot-TM-Software-For-Automated-Die-Attach.

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TDK’s New N2 Purge FOUP Loadport Models Launched

TDK developed and launched the 300mm and 450mm SEMI compliant loadports with HybridTM N2 Purge

TDK Corporation, featured HybridTM N2 Purge loadports for the next generation FABs at SEMICON West 2013 at the Moscone Convention Center in San Francisco, July 9-11.  TDK 300mm and 450mm N2 loadports will be on display at booth 913 located in the South Hall.  

TDK N2 purge loadports are an effective solution to reduce wafer cross contamination between processes and oxidation. TDK HybridTM N2 Purge uses a combination of bottom and front door purge systems to maximize process and cost benefits to the FAB.

The TDK N2 front purge loadport, which is currently being qualified by leading process tool manufacturers, has the advantage of large gas flow available for fast purge, purge nozzles located inside the EFEM, and capability to maintain low humidity and low particles inside the FOUP.  Front purge uses existing FOUPs and no mass flow controller is required for front N2 purge.

N2 bottom purge uses semi compliant N2 purge FOUPs. The FOUP door may be closed during N2 bottom purge. N2 purge is found to be effective to improve Cu interconnect reliability.  With the demands of ITRS for smaller nodes TDK Corporation with over 10 years’ experience with N2 purge systems is working to meet the market requirements with innovative mini environment solutions.

Main Features

  • Larger gas flow for fast purge
  • Maintains low humidity and low particles inside the FOUP
  •  
  • Uses existing 300mm or 450mm FOUPs for N2 front door purge

-----

Glossary

  • FOUP: Front Opening Unified Pod - a semiconductor wafer delivery pod standardized by SEMI, an industry organization for semiconductor production equipment makers
  • N2 Purge: Minimizes cross contamination and oxidation in wafers between semiconductor processes

Main applications

  • Automated transport of silicon wafers between semiconductor production equipment
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News from PEI

Custom-Designed Photo-Etched Lead Frames from PEI Meet Exacting Electrical, Thermal Conductivity and Strength Requirements of IC Manufacturers

Photofabrication Engineering (PEI) has expanded its manufacturing capabilities for custom-designed, photochemically-etched surface-mount and insert-mount lead frames for integrated circuit manufacturing. These lead frames are used in a wide variety of applications including semiconductors, glass-to-metal seals, and relays, as well as medical applications such as hearing aids.

Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEI can plate lead frames in their entirety or selectively. Lead-free plating materials include silver, nickel, gold, or tin, depending on the customer’s specific electrical and thermal conductivity requirements. Since the lead frame is the main conduit by which heat flows from the chip to the printed circuit board, PEI selects the manufacturing material to maximize the device’s operating life for any given application or environment.

PEI manufactures high-density lead frames with acute profiles and ultra-fine pitches, allowing for high pin counts. Single- or double-sided lead frames are etched without incurring the stresses associated with typical machining methods. More importantly, PEI’s process can be used for lead frames that are too complicated for stamping. Dimensions can be held to extremely tight tolerances, with no burrs or other surface irregularities.

PEI’s lead frames range in thickness from 0.5 mil [0.0127 mm] to 40 mil [1.575 mm], with features as small as 4 mil [0.10 mm] on 0.010 in. [0.254 mm] centers, creating lead frames that are strong enough to be handled yet flexible enough to allow bending when necessary.

A significant advantage of photochemical etching is the ability to reproduce large quantities of parts without tooling “wear”--the millionth part is exactly the same as the first part. Changes to tools can be implemented quickly, and phototools are significantly less expensive than traditional tools—ideal for manufacturing plates from prototype to production quantities with short turnaround times (about 10% of those for stamped frames).

For more information about PEI’s lead frames and other photoetched products, contact Chip Lehrer, President, Photofabrication Engineering, Inc., 500 Fortune Boulevard, Milford, MA 01757; telephone +(508) 478-2025; FAX+(508) 478-3582; e-mail sales(at)photofabrication(dot)com; or visit http://www.photofabrication.com.

Robert Ashman Joins Photofabrication Engineering (PEI)

Chip Lehrer, President of Photofabrication Engineering, Inc. (PEI), has announced that Robert Dean Ashman has joined the PEI team as National Sales Manager – Precision Products.  In this capacity, Ashman will be responsible for national and global sales for PEI’s Precision Products Division, working to expand PEI’s sales representative network, increase the depth and breadth of PEI’s market penetration, develop and implement new product programs. 

With almost 25 years of experience in product design, national and international sales development, and hands-on sales management, Ashman brings a wealth of expertise to PEI.  His prior work experience includes positions as a design engineering manager at Kilburn Isotronics (Chartley, MA); General Manager at Mini-Systems’ Electronic Packaging Division (Plainville, MA) and Director of Sales at HCC Aegis, Inc. (New Bedford, MA).  For the past seven years, Ashman served as Product Sales Manager for Electronic Packaging at SCHOTT North America, where he managed and grew key accounts, spearheaded new strategic growth projects, and collaborated with marketing, training, customer service, and R&D.  His vast background in all aspects of business management and development will help PEI gain global exposure and achieve new levels of sales coverage and market coverage.

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News from Brewer Science

Brewer Science Named To ‘Top Workplaces in St. Louis’ List

Survey Places Brewer Science Among Leading Medium-Sized Companies

For the second year in a row, Brewer Science has been named to a prestigious list of top workplaces in a survey conducted by the St. Louis Post-Dispatch.  Brewer Science, a leading global technology company headquartered in Rolla, Missouri, was recognized for its company culture and employee satisfaction.

“We work hard to create a company culture that makes Brewer Science a great place to work, and it’s rewarding to see that work validated with this survey,” said Dr. Terry Brewer, President and founder of Brewer Science. “We are inspired every day by our team for whom we provide a unique environment that encourages creativity and innovation that does change the world.”

Brewer Science received this recognition by the St. Louis Post-Dispatch following a review of the company that included an employee survey measuring the level of worker satisfaction in the following areas: opportunities for growth, teamwork, work/life balance, work environment, quality and customer focus, fairness, mission and purpose, respect for management, respect for employees, diversity, workplace resources, and communication.

Brewer Science made its mark in the area of microelectronics, creating processes and products that allowed smartphones and other electronic devices to become smaller, faster, and more powerful.  The company specializes in creating advanced materials critical for manufacturing next-generation high-tech smartphones, tablet computers, and other portable devices.

Brewer Science is also a leader in the emerging field of carbon nanotube technology, which has the potential to dramatically reduce power consumption, as well as a broad range of applications from health
care to national security.

The company recently announced a major expansion in Vichy, Missouri, that will result in the creation of 65 new Missouri jobs.

Brewer Science Expands High-Volume Manufacturing in Missouri,Bringing the State Additional High-Tech Jobs

Brewer Science, Inc., has announced plans to build a high-volume manufacturing facility in Vichy, Missouri, to produce materials for manufacturing next-generation smartphones, tablet computers, and other microelectronic devices.  The announcement means new jobs for Missouri and an expansion of the state's technology footprint. Brewer Science, one of the world's leading technology companies, is part of the emerging I-44 technology corridor in Missouri, spanning across the state from St. Louis to Joplin.

The new facility will be located at the Rolla National Airport, which is approximately 12 miles from Brewer Science’s headquarters in Rolla, Missouri.  This new investment in the growth of Brewer Science will provide increased capacity for high-volume manufacturing of specialty materials that meet the extremely stringent specifications required by today’s global microelectronics marketplace.

Brewer Science specializes in technology that has made electronic devices smaller, thinner, lighter, and more powerful. Under the leadership of Dr. Terry Brewer, founder and President, Brewer Science has become a major Missouri employer that has been designing and manufacturing new technology products since 1981.  The expansion will bring additional high-value manufacturing jobs to the state of Missouri.

“Brewer Science is excited to be growing and expanding Missouri’s manufacturing footprint as well as its technology footprint,” says Dr. Brewer.  “The expansion demonstrates our commitment to our customers by providing additional capacity and capabilities to support the complex product needs of the industry.  Brewer Science technology is a part of products such as smartphones, tablet computers, cameras, games, and many other electronic devices.  The new facility will provide the company with multiple manufacturing locations in Missouri and will bring additional jobs to the state.” 

Utilizing Leadership in Energy and Environmental Design (LEED) guidelines, the new facility will include geothermal systems for heating and cooling. Designed to be energy-efficient and environmentally sensitive, with attention to state-of-the-art safety specifications, the building will have the infrastructure to manufacture high-volume products that meet or exceed International Organization for Standardization (ISO) requirements. 

Brewer Science greatly appreciates the team effort put forth by the City of Rolla, the Rolla Regional Economic Commission, and the Rolla Community Development Corporation as well as the involvement of Intercounty Electric Cooperative and the Maries County Commission, all of which helped make this announcement possible.

Brewer Science now supports its worldwide customers through a service and distribution network in North America, Europe, and Asia.

To learn more about the exciting innovation at Brewer Science, we invite you to visit our website at www.brewerscience.com, follow us on Twitter @BrewerScience, or Like us on Facebook at http://www.facebook.com/BrewerScience.
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ES Components Announces Two New International Representatives in France and India

ES Components Inc., a franchised distributor of active and passive components used in hybrid and MCM assemblies, has signed on two new International Representatives, Isotope Electronics in Cedex, France and Sudarrshan Tech Services in Bangalore, India.

ES Components’ President, Ike Aubrey commented, “We are excited to expand our franchised product offering to potential customers in both India and France and look forward to developing new business opportunities in these markets.”

ES Components is already established internationally with representation in Israel and China.

ES Components is a Franchised Distributor of Bare Die Products for the Vishay Divisions including EFI, Siliconix, Vitramon, Dale, Sfernice, & Diode Products; Micrel, SEMICOA, Sensitron, Skyworks, NOVACAP, Alpha Electronics, Zetex and Gowanda.

ES Components is ISO9001:2008 and AS9120:2009 certified, ITAR Registered and is located in Sterling, Massachusetts.

For more information, please contact ES Components’ Director of Sales Curt Olsen (480-266-9737; colsen@escomponents.com).

Sudarrshan Tech Services
1/1, 1st Floor, Middle School Cross Road
V V Puram, Bangalore 560 004
Phone : + 91 80 26679071/2
Fax : +91 80 26605308

Isotpoe Electronics
6, rue de Norvège - Villebon sur Yvette
91953 Courtaboeuf Cedex
France
+33 (0) 1 69 86 97 97
+33 (0) 1 69 28 93 92

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STATS ChipPAC Celebrates 1,000th U.S. Patent Milestone

STATS ChipPAC announced it has been granted its 1,000th patent by the U.S. Patent and Trademark Office (USPTO). Since the inception of its Intellectual Property (IP) program in 2000, STATS ChipPAC has filed more than 1,500 patents and published patent applications with the USPTO and more than 900 patents and applications in other countries, of which more than 200 have been registered or allowed as patents in Singapore, South Korea, Taiwan and other countries. This is at least 400 more U.S. patents and applications than other companies in the global Outsourced Semiconductor Assembly and Test (OSAT) industry. STATS ChipPAC has concentrated its IP development on advanced or future technologies such as wafer level packaging, Post Wafer fab Processing (PWfP) or mid-end processing, Through Silicon Via (TSV), flip chip interconnect, integrated passive devices (IPD) and 2.5D/3D package integration. With this strategic focus, STATS ChipPAC has built up a patent portfolio in which advanced or future technologies comprise 60% of its IP.

“Our 1,000th U.S. patent is a milestone achievement for STATS ChipPAC. Over the last 5 to 10 years, we have demonstrated our commitment to technology innovation and built a high-quality, innovative IP portfolio.  In 2011, we became the leading patent holder among our competitors worldwide in terms of the number of U.S. patents granted and have continued to develop advanced technology and process improvements that will drive evolutionary packaging for our customers,” said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

STATS ChipPAC’s 1,000th U.S. patent is a strong representation of the priority the Company has placed on the development of advanced wafer level technology. U.S. Patent No. 8,456,002, “Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die for Stress Relief”, relates to innovations in the assembly of embedded Wafer Level Ball Grid Array (eWLB) devices in which an insulating layer provides stress relief during the formation of an interconnect structure in the device. This is part of a family of patents that includes five previously granted U.S. patents for eWLB and Wafer Level Chip Scale Packaging (WLCSP) inventions. 

For more information, please visit www.statschippac.com.

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Quik-Pak’s OmPP Packages Improve Time-to-Market for Design Engineers

For design engineers that are required to validate the performance of their devices as quickly as possible, Quik-Pak’s OmPP packages(Open-mold plastic packages) provide a cost effective solution.  These production quality open molded QFN and SOIC packages are available in a variety of outlines and can be assembled with your device in 24 hours or less. 

Some of the advantages of Quik-Pak’s OmPP include:

  • RoHs and REACH Compliant "Green" Molding Compound
  • Gold Plated
  • Superior Bondability
  • Custom Body Sizes and Lead Counts Available

Quik-Pak offers a variety of lid and encapsulation options, or the package can be left open for device inspection, testing, micro-probing, etc.  

For more information regarding Quik-Pak’s Open-molded Plastic Packages., visit www.icproto.com or contact 1-858-674-4676.

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New Product Release for the NorCom 410 Gross Leak Test System 8/1/13

NorCom Introduces Single Device Gross Leak Test System

NorCom Systems Inc. recently introduced the Model 410 single device gross leak test system. NorCom is known for its successful line of Model 2020 Optical Leak Test systems, which inspect the hermeticity of a full pallet of electronic packages for fine and gross leaks simultaneously. With the Model 410 gross leak test system, the company is responding to a market need for a fast, accurate, and economical pass/fail screen for gross leaking devices. 

The NorCom Model 410 inspects a single device measuring up to 3”x4”x2” for gross leaks in less than 15 seconds with air pressure only; there is no need for helium pressurization. A second mode of operation allows the user to obtain a leak rate on the device to a limit of 5.0 x 10-6 cc atm/sec air. The test time for this mode is dependent on the package geometry and volume, but the test time is typically a few minutes. NorCom offers an optional bar code reader with software for reading device serial numbers. The test results can then be networked via a built in Ethernet card for SPC or other part tracking functions.

The NorCom 410 uses no consumables, and does not require any part bombing with tracer gases.  The system eliminates the need for bubble leak testing, and the use of expensive fluorocarbons, radiation, or red dye. The unit can be used to inspect metal, ceramic, silicone and glass lidded devices.

The units comply with MIL-STD 883 TM1014 Condition C4 and MIL-STD-750 TM1071 Condition L1.

For more information please contact:
NorCom Systems Inc.
1055 W Germantown Pike
Norristown PA 10403

Phone: 610-592-0167 ext 16
Fax: 610-631-0934
Email: caubertin@norcomsystemsinc.com
Website: www.norcomsystemsinc.com


NorCom Model 410 Gross Leak Test System


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115 Exhibits on Display at IMAPS 2013 - Only 32 Booths Still Available

Exhibitor Contact name
Booth
Booth Type
Booth Category
3D Plus USA
Emond Mich
201
10 x 10
Corner
ACM Research, Inc.
Lee Michael
421
10 x 10
In-Line
AdTech Ceramics
Wade Jim
614
10 x 10
In-Line
Advance Reproductions Corp.
Robinson Don
522
10 x 10
Corner
Advanced Dicing Technologies
Eichhorn Mark
517
10 x 10
In-Line
AI Technology, Inc.
Boersig Charlie
400
10 x 10
Corner
Alabama Microelectronics Science & Technology Center
Hamilton Michael
627

10 x 10
Research Corridor

In-Line
ancosys Inc.
Pye Graham
805
10 x 10
In-Line
Besi North America, Inc.
Kok Alice
704
10 x 20
Corner
Binghamton University IEEC
Santos Daryl
726

10 x 10
Research Corridor

Corner
Ceradyne VIOX, Inc.
Brown Harlan
717
10 x 10
Corner
CeramTec North America
Christensen Robert
307
10 x 10
In-Line
Colorado Microcircuits, Inc.
Thalman Gary
315
10 x 10
In-Line
Conductive Containers Inc. (CCI)
Loggins Tom
313
10 x 10
In-Line
CVInc.
Collier Terence
317
10 x 10
In-Line
Deweyl Tool Inc..
Palmer Johanna
316
10 x 10
In-Line
DuPont Microcircuit Materials
Vernon Joan M
520
10 x 10
In-Line
East China Research Institute of Microelectronics
Wang Tony
311
10 x 10
In-Line
Element Six Technologies US Corp.
Obeloer Thomas
308
10 x 10
In-Line
Endicott Interconnect Technologies, Inc.
Orband James
200
10 x 10
Corner
ENrG, Inc.
Olenick John
215
10 x 10
In-Line
Epoxy Technology, Inc.
McCabe Joseph D
622
10 x 10
Corner
ESL ElectroScience
Chambers Drew
808
10 x 10
Corner
F & K Delvotec, Inc.
Bailey Rick
405
10 x 20
Corner
Ferro Corporation
Stadnicar Edward
615
10 x 20
In-Line
Finetech, Inc.
Gerard Adrienne
508
10 x 10
Corner
Fraunhofer Institute for Ceramic Technologies and Systems IKTS
Pohontsch Fanny
526

10 x 20
Research Corridor

Corner
Fraunhofer Institute for Reliability and Microintegration IZM
Weigelt Georg
426

10 x 20
Research Corridor

Corner
Gannon & Scott
Conway Raymond
207
10 x 10
In-Line
Geib Refining Corporation
Gervais Michael T
609
10 x 10
In-Line
Gel-Pak/Quik-Pak
Nunes Jennifer
518
10 x 10
In-Line
General Metal Finishing Co., a unit of Precision Engineered Products
Chatfield Stephen
310
10 x 10
In-Line
Haiku Tech, Inc.
De Moya Martin I
417
10 x 10
Corner
Harrop Industries, Inc.
Timmel Paul
714
10 x 10
In-Line
Hary Manufacturing Incorporated
Hary Paul
500
10 x 10
Corner
Heraeus Thick Film Division
Yin Yin
504
10 x 20
Corner
Hesse Mechatronics, Inc.
Bubel Joseph S
605
10 x 20
Corner
Hi-Rel Laboratories, Inc
Devaney Roger M
612
10 x 10
In-Line
IBM Microelectronics Division
Hochlowski Barry
418
10 x 10
In-Line
Indium Corporation
Cruz-Griffith Victoria
409
10 x 10
Corner
Infinite Graphics
Maitland Pete
206
10 x 10
Corner
Interconnect Systems, Inc.
Andrews Abby
406
10 x 10
In-Line
Kulicke & Soffa Industries, Inc.
Frese Sheila
705
10 x 10
Corner
Kyocera America, Inc.
Labadie Iris
616
10 x 10
In-Line
LINTEC of America
Campbell Stuart
521
10 x 10
In-Line
LORD Corporation
Greig Jim
600
10 x 20
Corner
Metallix Refining, Inc.
Woolley Micki
618
10 x 10
In-Line
Metalor Technologies
Imhof Howard
807
10 x 20
Corner
Micro Hybrid Dimensions, Inc.
Spradlin Greg
414
10 x 10
In-Line
MicroScreen LLC
Wise Wallace Holly
523
10 x 10
Corner
Micross Components
Smith Scott
721
10 x 20
Corner
Midas Technology, Inc.
Towl Kenneth
803
10 x 10
Corner
Minco Technology Labs, LLC
Cooper Kristi
309
10 x 10
In-Line
Mini-Systems, Inc.
Tourgee Craig
412
10 x 10
In-Line
NAMICS Corporation
Jensen Richard C
611
10 x 10
In-Line
Natel Electronic Manufacturing Services, Inc.
Angeloni James A
505
20 x 20
ISLAND
Neu Dynamics Corp.
Johnson Don
712
10 x 10
In-Line
Newport Corporation
Medernach Jon
416
10 x 10
In-Line
NorCom Systems, Inc.
Aubertin Chris
613
10 x 10
In-Line
Nordson DAGE
Kardjian Aram
701
10 x 10
Corner
nScrypt, Inc.
Brownell Beth
716
10 x 10
Corner
NTK Technologies, Inc.
Stoops Mariel
719
10 x 10
In-Line
Oneida Research Services, Inc.
McEwen James
422
10 x 10
Corner
Pacific Trinetics Corporation
Meshkin Neda
621
20 x 20
ISLAND
Palomar Technologies, Inc.
Sylvester Jessica
511
10 x 20
Corner
Perfection Products, Inc.
Vickery John
515
10 x 10
In-Line
Photofabrication Engineering, Inc.
Grande Judy
318
10 x 10
In-Line
Plasma-Therm, LLC
Messineo Nancy
111
10 x 20
ISLAND
Polysciences, Inc.
Gidzinski Ashley
620
10 x 10
In-Line
Prince & Izant Co.
Faulhaber Nancy
105
10 x 10
Corner
Reldan Metals Co.
Whitaker Kathleen
305
10 x 10
Corner
Riv, Inc.
Keefe Tania M
700
10 x 10
Corner
Royce Instruments, Inc.
Cox Diane
516
10 x 10
Corner
Rudolph Technologies
Pauling Amy
519
10 x 10
In-Line
Sales and Service, Inc.
Winn Chris
314
10 x 10
In-Line
SANTIER Thermal Management Solutions
Loomis Tom
420
10 x 10
In-Line
Sefar, Inc.
Potratz Christine
204
10 x 10
Corner
Semi Dice, Inc.
Minter Darin
707
10 x 10
In-Line
Semiconductor Equipment Corporation
Moore Donald I
410
10 x 10
In-Line
Sikama International, Inc.
Skeen Phil
816
10 x 10
Corner
SMART Commercialization Center for Microsystems
Apanius Matt
626

10 x 10
Research Corridor

Corner
Sonoscan, Inc.
Lykowski Janet
709
10 x 10
Corner
Souriau PA&E
Kalkowski Rick
610
10 x 10
Corner
SST International
Wilson Bruce A
304
10 x 20
Corner
Stellar Industries Corp.
Snook John B
401
10 x 10
Corner
TDK Corporation
Lambeth Sara
804
10 x 10
Corner
Technic, Inc.
Roza Drew
205
10 x 10
Corner
Teledyne Microelectronic Technologies, Inc.
Fletcher Sharon
501
10 x 10
Corner
Torrey Hills Technologies, LLC
Zhang Joyce
408
10 x 10
In-Line
Towa Corporation
Tripp Lloyd
312
10 x 10
In-Line
Trebor Instrument Corp.
Grzesiak Margaret
404
10 x 10
Corner
Tresky Corporation
Weil Allen
708
10 x 20
In-Line
West Bond, Inc.
Straight Randy
300
10 x 10
Corner
XYZTEC
Haley Tom
423
10 x 10
Corner
Zeon Corporation
Shoulders Kimberly
419
10 x 10
In-Line
Booth Count: 115
   ^ Top
 

 

 

:: Job Openings ::

Application & Support Specialist - Semiconductor/SMT

Growing Semiconductor/SMTequipment manufacturer. 

Join our Eastern North America sales and support team, based out of Manchester, NH. 

Responsibilities include:

  • Equipment demonstrations, application and process support for potential and existing customers.
  • Technical liaison with factory for all aspects of customer orders.
  • Equipment installations, all aspects of technical support, repairs and training.
  • Help maintain a small demonstration lab and demo equipment.

Requirements

  • 5+ years of experience in Semiconductor / SMT equipment operation & support.
  • Specific experience with die bonding equipment and advanced packaging is strongly desired.
  • Confident hands-on equipment operation and troubleshooting.
  • Includes varied travel typically up to 40%, with adaptability to schedule changes. Will involve travel primarily in Eastern N. America. Occasional travel to customer sites and tradeshows all over North America, as well as factory in Germany.
  • Must be self motivated and thrive within a small company “can do" atmosphere with minimal supervision. The ability to multi-task and take initiative is a must.
  • Excellent interpersonal and communication skills are essential.
  • Strong PC and organizational skills assumed.

About us:

Finetech offers innovative equipment solutions for nearly every kind of rework or micro assembly challenge, including the latest advanced packages. Come check us out:  http://www.finetechusa.com

Submit resumes to:  jobs@finetechusa.com

We thank all applicants in advance for their interest; however, only those applicants who are being considered for an interview will be contacted.

We thank all applicants in advance for their interest; however, only those applicants who are being considered for an interview will be contacted.

   ^ Top
 

 

 

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:: Issue 143 ::
August 2, 2013

Torrey Hills Technologies

Oneida Research Services

Metallix

F&K Delvotec

LORD Corporation