Santier
:: Corporate Member News ::

:: Be Sure To Visit Solid State Equipment at Device Packaging Booth #38 (full story)

:: Visit Amkor Technology at booth #47 during the IMAPS Exhibition and don’t miss our packaging experts as they present eight relevant technical papers focused on our latest technology advances (full story)

:: Surfx Technologies on Display Next Month (full story)

:: Come visit F&K Delvotec at Device Packaging to see the number one rated wire bond equipment supplier and learn what is possible (full story)

:: Visit PURE Technologies at Booth #20 at the Device Packaging Conference (full story)

:: West Bond on Display in Arizona Next Month (full story)

:: For the latest in innovative UNDERFILLS, ENCAPSULANTS and ADHESIVES see Namics at Booth 42 at DPC (full story)

:: CleanLogix - Inventors of CO2 Composite Spray(TM) and Centrifugal CO2(TM) Cleaning (full story)

:: Need microelectronic packaging solutions for your small form factor, high reliability applications? See Micross at IMAPS Device Packaging 2013 in booth #64 (full story)

:: STATS ChipPAC’s Innovative Packaging Solutions Support China’s Rapidly Developing Smartphone Market (full story)

:: Atotech’s Economic Activator Neoganth 800 (full story)

:: Come Visit Endicott Interconnect (Booth #6) at the 9th International Conference and Exhibition on Device Packaging (full story)

:: Palomar Technologies on Display at Device Packaging - Recent PTI Blog Posts (full story)

:: Finetech to Exhibit Sub-micron Die Bonder at IMAPS Device Packaging (full story)

:: XIA Exhibiting New System at Device Packaging - Visit Booth #17 (full story)

:: Hesse Mechatronics to Exhibit Next Month (full story)

:: Come visit Mitsubishi Materials Corporation at Booth #24 (full story)

:: AI Technology Will Be On Display at Device Packaging (full story)

Applied Materials

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Solid State Equipment Corp.
Amkor Technology
ASE Group
ALLVIA
Applied Materials
NAMICS

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

MST

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


Be Sure To Visit Solid State Equipment at Device Packaging Booth #38

Solid State Equipment Corp.

SSEC 3300 Series, Single Wafer Wet Processors for Advanced Packaging (WLP and 3D). UBM/RDL etch with SSEC’s WaferChek™ in-situ endpoint control. Wafer thinning/stress relief. Combination batch immersion /single wafer spray processing for PR and dry film strip, lift-off, flux removal, post-etch residue and TSV clean. High efficiency cleaning tools and PR/Dry Film Develop tools. Full process development lab including metrology for support.

   ^ Top

Visit Amkor Technology at booth #47 during the IMAPS Exhibition and don’t miss our packaging experts as they present eight relevant technical papers focused on our latest technology advances

Amkor Technology

Amkor Technology will be presenting eight papers at this year’s IMAPS conference, including:

  • Thermal Modeling Approach for Enhancing TCNCP Process for Manufacturing Fine Pitch Copper Pillar Flip Chip Packages by Siddharth Bhopte
  • Groove Geometry and Mold Shrinkage Effects on Die Stress in Flip Chip Molded BGAs (FCmBGA) by Bora Baloglu
  • Assembly Challenges and Learnings for Large 2.5D TSV Products by Mike Kelly
  • CoC (Chip on Chip) or FtoF (Fact to Face) - POSSUM™ Technology for 3D MEMS and ASIC Eliminating the Need for TSV or Wire Bonding by Jemmy Sutanto
  • Effect of Substrate Layer Variation on Package Warpage by Brendan Wells
  • Adopt Advanced RDL Rule to Apply Flip Chip Packaging for Next Generation Si Technology: Feasibility Study by Shengmin Wen
  • A Process Dependent Warpage and Stress Model for 3D Packages Considering Incoming Die/Substrate Warpage and Assembly Process Impacts by Wei Lin
  • Innovative 3D Structures Utilizing Wafer Level Fan-Out (WLFO) Technology by Curtis Zwenger

Please visit us at booth #47 during exhibition to discuss our latest technologies and meet our technical staff.

   ^ Top

Surfx Technologies on Display Next Month

Surface treatment is critical prior to bonding and coating. Surfx Technologies Atmospheric Plasma system is able to clean and activate any surface to improve adhesion. Whether you need to treat Polymers, Metals, Ceramic or Silicon Surfx Technologies are able to offer fast, safe and reliable in line surface treatment with versatile plasma chemistry.

From research stations to turn key production tools Surfx Technologies with its 15 years of plasma chemistry experience offers products which will meet every applications needs. Bring some samples to Surfx Technologies booth at the upcoming device packaging trade show for a demonstration of the effectiveness of the plasma system.

   ^ Top

Come visit F&K Delvotec at Device Packaging to see the number one rated wire bond equipment supplier and learn what is possible

F&K Delvotec offers unmatched technology leadership and unmatched customer service on our entire product line of CONVERTIBLE Auto and Semi-Auto wire bonders. We have a model for every wire bonding technology. Including, Heavy Wire, Heavy Ribbon, Fine Wire, Fine Ribbon, Ball Bonding, TAB, Deep Access, Hybrids, COB, RF Devices, Microwave Applications. Our table top convertible bonders offer 3 MINUTE quick change bond heads with no hand tools required. As an Industry leader offering unique solutions, we developed an auto bonder that converts to an auto pull/shear tester in 3 minutes. We also offer Ultrasonic/Transducer test equipment. Come visit the IMAPS Device Packaging Conference in Scottsdale, AZ to see the number one rated wire bond equipment supplier and learn what is possible.

   ^ Top

Visit PURE Technologies at Booth #20 at the Device Packaging Conference

PURE Technologies, provider of low, ultra-low and super ultra-low alpha materials, invites you to see their new website at www.puretechnologies.com. Jerry Cohn, President/CEO will be at their exhibition booth (Booth # 20) at the IMAPS Device Packaging Conference and Exposition on March 12 and 13, 2013 at the Radisson Resort, Fountain Hills, Arizona. Pure Technologies’ ALPHA-LO® products, including tin (Sn), Lead-free alloys (including all SAC alloys), Pb, PbSn alloys are available in various shapes and sizes – ingots, anodes, pellets, foil, rods, bricks, SnO, andPbO powder, etc. for wafer-level packaging, interconnects and sphere and powder/paste manufacturing. ALPHA-LO® reduces/eliminates soft errors from alpha particle emissions from solders, enhances performance reliability and reduces corporate liability. All materials are guaranteed and certified to be at secular equilibrium and are tested and retested over time before shipping to insure that the alpha emission rate is stable and will not increase over time. Contact: jerry@puretechnologies.com Tel: (404) 964-3791

   ^ Top

West Bond on Display in Arizona Next Month

WEST•BOND offers a Wedge Bonder / Ball Bonder combination machine in three different configurations…Manual, Semi-automatic in motorized “Z”, and motorized “Z” & “Y”. WEST•BOND also manufactures a Die Bonder that combines both Epoxy and Eutectic methods in one chassis. Between these two series you can bond most any product in the microelectronic industry.

Since 1966, West Bond Inc. has been a Design and Manufacturer of Assembly and Test Equipment for the Microelectronic Industry here in Southern California. Including Automatic, Semiautomatic, and Manual ESD protected bonders, with Ultrasonic, Thermosonic, and Thermocompression Wire/Ribbon capability. Included in product line are Eutectic and Epoxy Die Bonders, Insulated Wire Bonders, and Pull Testers with our patented X-Y-Z, 8/1 ratio micromanipulator.

In addition, we design and manufacture accessories such as LED Illuminators, Heated and Cold Workholders, Temperature Controllers, Ultrasonic Transducers, Ultrasonic Power Supplies, and Wire Despoolers, as well as full a complement of machine shop services.

West•Bond Inc.
1551 South Harris Court

Anaheim, CA 92806-5932
Visit us at www.westbond.com

   ^ Top

For the latest in innovative UNDERFILLS, ENCAPSULANTS and ADHESIVES see Namics at Booth 42 at DPC

NAMICS

NAMICS Corporation is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells. NAMICS also specializes in the development of innovative thermally conductive adhesives and sealing glasses. Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore, Korea, Taiwan and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.

   ^ Top

CleanLogix - Inventors of CO2 Composite Spray(TM) and Centrifugal CO2(TM) Cleaning

CleanLogix
We use our patented CO2 Composite Spray Technology™ process for all the precision cleaning we do. CO2 as our precision cleaning agent lowers electrical power usage, reduces manufacturing wastes (time, labor, space, transport, defect, inventory, processing, equipment, raw materials) increases manufacturing productivity, and decreases the need for chemicals such as lubricant and solvents, among many other positive socioeconomic and environmental benefits.

CO2 is a very versatile manufacturing agent. It can be used as a:

  • Spray
  • Immersion solvent
  • Extraction solvent
  • Plasma in the forms of composite sprays and systems

Applications

Applications for CO2 CleanTech include precision degreasing, departiculation, outgassing, drying, disinfection, surface modification and funtionalization, cooling and lubrication, among many others:

  • Clean partially-assembled devices
  • Clean on the production line, in-line
  • Clean within production equipment (clean assembly)
  • Clean to higher levels (future) of cleanliness
  • Reduce production time, labor, space and materials
  • Provide a range of critical cleaning solutions
  • Reduce regulatory burdens
  • Reduce non-value-add (NVA) operations
  • Conserve water and energy
  • Reduce air and water pollution
  • Decrease global warming gas emissions

Our Clean Manufacturing Products/Services

We offer a variety of advanced clean manufacturing products supported by comprehensive testing and implementation services. Clean manufacturing products for your business include:
Products

  • Conveyorized CO2 Composite Spray™ Cleaning Systems
  • Robotic Clean-Assembly Cells
  • Clean Workstations and Benchtop Systems
  • Mobile Cleaning Systems
  • Centrifugal CO2™ Immersion Cleaning Systems
  • Pellet Blasting Systems
  • Atmospheric Particle-Plasma™ Surface Treatment Systems
  • Oxygenated Machining Fluid™ Systems
  • Thermal Control Systems
  • OSEE™ Surface Quality Monitors
  • Robotic Automation Tools

Services

  • Manual Composite Spray
  • Manual Composite Spray with Atmospheric Plasma treatment
  • Robotic Composite Spray
  • Robotic Composite Spray with Atmospheric Plasma treatment
   ^ Top

Need microelectronic packaging solutions for your small form factor, high reliability applications? See Micross at IMAPS Device Packaging 2013 in booth #64

Micross Components is a leading global provider of specialty electronics solutions for defense, space, medical and demanding industrial applications. As a single-source supplier of advanced high-reliability electronics, we manufacturer and distribute a wide range of products including integrated circuit and discrete bare die and wafers, passive components, distinctive devices such as solid state batteries and SiC devices, connectors, standard and custom packaged devices, and a comprehensive list of services spanning assembly, test, and mechanical component modifications.

With over 30 years’ experience and a quality system certified to applicable aerospace, military, and industrial standards, Micross possesses the design, manufacturing, and logistics expertise needed to support an application throughout the program life cycle. Today, we’ve attracted a growing roster of Blue Chip companies and leading semiconductor manufacturers who now rely on us as their primary supplier of high-reliability specialty electronics.

   ^ Top

STATS ChipPAC’s Innovative Packaging Solutions Support China’s Rapidly Developing Smartphone Market

STATSChipPAC - Coffee Break Sponsor

STATS ChipPAC recently announced the implementation of breakthrough performance and packaging innovation in multiple advanced chipsets for the rapidly developing smartphone market in China. Spreadtrum Communications, a leading fabless semiconductor provider in China, has adopted STATS ChipPAC’s packaging innovations for a number of its mobile chipsets. The combination of Spreadtrum’s advanced silicon design capabilities with STATS ChipPAC’s next generation embedded Wafer Level Ball Grid Array (eWLB) packaging technology offers increased performance and compact form factor at a competitive cost for the fast-growing China smartphone market.

eWLB is a powerful fan-out wafer level packaging (FOWLP) technology and integration platform that provides significant advantages including a more space-efficient package design enabling a smaller footprint, higher density input/output (IO) and a lower package height than is possible with laminate or flip chip semiconductor packages.

STATS ChipPAC will be sharing some of the latest information on its flip chip and wafer level technology at the upcoming IMAPS Device Packaging Conference. Presentations by the company include:

  • Flip Chip & Wafer Level Packaging Panel Discussion
  • Robust Reliability Performance of Large size eWLB (Fan-out WLP)
  • Integration of Passive Components into 3D PoP Fan-Out Packages
  • Electrical Characterization on a High-Speed Wafer-Level Package

We invite you to attend these presentations to learn more about STATS ChipPAC’s advanced technology solutions or visit booth #52.

   ^ Top

Atotech’s Economic Activator Neoganth 800

A major challenge for the PCB industry is to overcome the dependency on palladium spot prices by reducing the palladium content in the manufacturing process.

Atotech's business technology team for Plating Through Holes (PTH) developed a new and highly efficient activator and introduced it to the market in June 2012: Neoganth 800.

The new activator leads to less palladium consumption and thereby significantly reduces running costs.

Benefits of Neoganth 800

“Neoganth 800 is an activator for horizontal multi layer and HDI applications. It significantly reduces running costs since it consumes less palladium per produced m²,” states Lars-Eric Pribyl, Global Product Manager PTH at Atotech Germany GmbH in Berlin, Germany. “This ionic activator is fully compatible with Atotech’s existing conditioning concepts and therefore is a simple drop-in solution for all existing Uniplate LB lines.”

Highlights of this new activator include:

  • High cost-efficiency due to a significantly reduced palladium concentration of only 75 ppm and low consumption per m2
  • Same excellent coverage on all relevant base materials as standard activator Neoganth U
  • Enhanced bath life and stability due to improved complexing concept and reduced carbonate formation Electronics
  • Easier handling, since no separate sodium hydroxide dosing is required

Successful Beta Site Test
The beta site test of Activator 800 was conducted in early 2012 in a Uniplate P/LB mass production line at a customer in South China. The test plan included, amongst others:

  • Coverage on four different base materials (NP 140, IT 158, R 1755 C, IS 410)
  • Solder shock test (10s 3x dip and 10s 6x float at 288°C)
  • Interconnection Stress Test (IST, 2,000 cycles)
  • Bath performance & stability checks for a full lifetime (100 m² per liter) under mass production conditions
  • Fine tuning of dosing concept

“Neoganth 800 passed all tests successfully, even with slightly better results than the commonly used activator Neoganth U,” states Lars-Eric Pribyl. “We are happy that the beta site customer immediately continued mass production with Neoganth 800 and even converted a second Uniplate LB line to the new activator.”

Worldwide Rollout
The main benefit to customers is clearly the potentially massive saving in palladium consumption, which leads to significant savings in production running costs.  Atotech began the worldwide rollout of Neoganth 800 in June 2012

.

   ^ Top

Come Visit Endicott Interconnect (Booth #6) at the 9th International Conference and Exhibition on Device Packaging

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, automated test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation.

For more information about EI and its products, please visit www.endicottinterconnect.com

Ask about our cutting edge anti-tamper, anti-counterfeit and 3D Packaging technologies!

   ^ Top

Palomar Technologies on Display at Device Packaging - Recent PTI Blog Posts

Comparing Au, Pt, Ag and Cu Wire Bonding
With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the cost of ball bonding. IMAPS held their annual “Topical Workshop & Tabletop Exhibition on Wire Bonding” in San Jose, CA where a presentation was delivered on Silver (Ag) alloyed wire as an alternative to copper or gold wire. David Rasmussen, Assembly Services General Manager, provides benefits and drawbacks on Ag alloy wire bonding versus Au, Pt, and Cu wire bonding. Read more: Comparing Au, Pt, Ag and Cu Wire Bonding

Managing the Cost, Availability & Support of Bonders
Cost and availability of spare parts are of considerate interest to anyone who currently owns a piece of capital equipment or anyone contemplating to purchase a piece of capital equipment.. Allan Hass, Director of Engineering, discusses managing costs of spare parts, investing in new or refurbished bonders, and how to make the right investment for your company’s needs. Read more: Managing the Cost, Availability & Support of Bonders

Subscribe to the PTI Blog! Join the 3,048 industry peers who already have!
http://www.palomartechnologies.com/subscribe

   ^ Top

Finetech to Exhibit Sub-micron Die Bonder at IMAPS Device Packaging

Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder at the upcoming IMAPS Device Packaging conference and exhibition.

The FINEPLACER® Lambda is ideal for low-volume, prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding placement accuracy (down to 0.5 µm). This versatile system can be used for precise placement, die-attach and advanced packaging utilizing various bonding technologies -- soldering (Eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, gold/tin laser bar bonding, adhesives and UV curing. Options are available for inert atmosphere and forming gas.

Applications include flip chip, 3-D packaging, MEMS, wafer level packaging (C2W), optoelectronic and micro optics bonding and assembly, sensors and more.

For more information, visit Finetech at the show or on the Web at www.finetechusa.com.

   ^ Top

XIA Exhibiting New System at Device Packaging - Visit Booth #17

The UltraLo-1800 from XIA LLC is a next generation alpha particle counter designed to measure the alpha particle emissivity of solid materials. The UltraLo-1800 is a revolutionary new design for ultra-low background alpha particle counters that employs the patented technique of electronic background suppression to drive achievable background rates to 0.0001 alphas/cm2/hr and below. This is a factor of 50 or more better than can be achieved by the conventional proportional counter systems that are currently available. With the UltraLo-1800, it becomes feasible to measure samples having emissivities in the 0.001 to 0.0005 alphas/cm2/hr (ULA) range in fewer than 10 hours, and to measure emissivities below 0.0005 alpha/cm2/hr (sub-ULA) in fewer than 100 hours.

XIA will be exhibiting this new system at the IMAPS 9th International Conference and Exhibition on Device Packaging. Come visit us at booth 17 to learn more about alpha counting and the UltraLo-1800.

   ^ Top

Hesse Mechatronics to Exhibit Next Month

Heavy Wire Bonder Features Support Power Electronics Requirements

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will exhibit at Device Packaging 2013 next month.

Their BONDJET BJ93x Heavy Wire Bonders feature a heavy wire bond head with integrated pull test and large table travel (305 mm x 410 mm) that meets automotive electronics and power semiconductor requirements. “The BONDJET BJ93x Heavy Wire Bonders provide the large current carrying capacity and high reliability that power electronics manufacturers demand,” states Joseph S. Bubel, Managing Director of Hesse Mechatronics, Inc. “They are also the fastest heavy wire bonders available today.”

   ^ Top

Come visit Mitsubishi Materials Corporation at Booth #24

Mitsubishi Materials Corporation (http://www.mmus.com/), has been manufacturing ultra low alpha lead free chemistry and solder paste. Sn-Ag plating process and solder paste with finer particles for fine pitch assembly are two of our many successful works. Mitsubishi advanced its research even further and developed Cu plating process for Cu pillar application with a high plating rate.

Come visit us at booth 24 or drop us an email mmusdivem@mmus.com for more details!

   ^ Top

AI Technology Will Be On Display at Device Packaging

Besides pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology (AIT) has been one of the leading forces in the development of advanced material and adhesive solutions with over 30 US patents. AIT has the most comprehensive conductive and dielectric film adhesives in pressure-sensitive tacky or dry format including DDAF for 450 mm wafers. Proven die-attach and component attach; conductive and dielectric adhesives for high power CPU and LED applications. Thermal interface materials including the proven and patented compressible conformal phase change pads, gap-filling gel and gel-film, and of course thermal gels and greases with long proven highest measurable low thermal resistance. We also provide RFI/EMI shielding caulks, adhesives and coating and Insulated Metal Thermal Substrates with 2X thermal conductivity for metal core printed circuit boards. It is unique for high power LED sub-mount and modules. AI Technology’s ISO9001:2008 certified, 16 acre USA facility produces an extensive line of Mil-Std 883H 5015 & NASA-ESA Outgassing certified adhesives with service centers in China and more than 10 representatives in countries around the world.

   ^ Top
 

View the Corporate Bulletin Archives

 

Quik-Pak
RGL Enterprises
QSIC

 


:: Issue 136 ::
February 18, 2013

Amkor

F&K Delvotec

Master Bond

LORD Corporation

RGL Enterprises

EPP