:: Corporate Member News ::

:: New Dual-Head Wedge Bonder Makes Americas Debut (full story)

:: Amkor Technology Receives 2012 Supplier of the Year Award from Altera (full story)

:: News from the Palomar Blog (full story)

:: New GORE® PolyVent XL Improves Reliability of Large Outdoor Electronic Enclosures (full story)

:: Newport Corporation Announces Joint Development Agreement with IBM for 2.5D/3D Thermo Compression Bonder (full story)

:: Custom-Designed Photo-Etched Lead Frames from PEI Meet Exacting Electrical, Thermal Conductivity and Strength Requirements of IC Manufacturers (full story)

:: LORD Corporation Technology to be Presented at SUSS Technology Forum at Semicon West 2013 (full story)

:: High Temperature Resistant B-Staged Adhesive Film Features Thermal Conductivity and Electrical Insulation from Master Bond (full story)

:: Nordson YESTECH’s BX-UV Automated Conformal Coat Inspection System Selected by Specialized Coating Services (full story)

:: DYCONEX implements Electronic Failure Catalog (EFC) with Customer Log-In (full story)

:: EV Group Enhances Wafer Debonding Solutions Portfolio With New LowTemp™ Room-Temperature Debonding Platform (full story)

Applied Materials

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at or 202-548-8715.

New Dual-Head Wedge Bonder Makes Americas Debut

Hesse Mechatronics to introduce and demo the new Bondjet BJ931L — ideal for lead frame power semiconductor packages — to attendees at SEMICON West

Hesse Mechatronics, Inc., announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.

The Bondjet BJ931L Fully Automatic Dual-Head Wedge Bonder enables simultaneous bonding of thin and heavy wire or ribbon for lead frame and matrix power semiconductor applications such as transistor outline (TO) packages and similar discrete devices with low pin counts.

The Bondjet BJ931L offers:

  • Small 1650 mm x 1200 mm footprint
  • Highest throughput on the market – up to 4500 UPH dependent upon application
  • Flexibility - Interchangeable bond heads for heavy wire, thin wire, ribbon wire and copper wire
  • Patented PiQC™ analyzes each bond in real time to ensure the quality of every device
  • E-Box™ optical tool adjustment

“The Bondjet BJ931L enables the fastest throughput available today for power semiconductor packages, and we are pleased to have a machine that directly meets the specific needs of this growing market segment,” notes Joseph S. Bubel, president of Hesse Mechatronics, Inc. “We look forward to demonstrating the BJ931L to the international audience at SEMICON West.” For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website

For more information on Hesse Mechatronics’ training and applications support services, please e-mail To see wire bonding in action, visit

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Amkor Technology Receives 2012 Supplier of the Year Award from Altera

Amkor Technology, Inc. has announced that it has received a 2012 Supplier of the Year Award from Altera Corporation (Nasdaq: ALTR).  

"Amkor has consistently met the high standards for packaging and test of Altera's most complex FPGA, CPLD, SoC and ASIC products in 2012, including the latest ramp of our 28 nm industry-leading Stratix, Arria and Cyclone FPGA families," said Bill Hata, Altera's senior vice president, worldwide operations and engineering.  "Amkor has been a long-time supplier for Altera, and regularly achieves high levels of quality and reliability for all Altera products, including automotive grade products."

"Winning Altera's 2012 Supplier of the Year Award is a great honor," said Mike Lamble, Amkor's executive vice president, worldwide sales and marketing.  "Amkor is fully committed to providing the advanced packaging and test services and superior customer experience that meet the stringent requirements set by Altera.  This award is recognition of the close collaboration between our two companies and the outstanding commitment shown by our teams worldwide."

The Altera OSAT (Off-shore Assembly and Test) Supplier of the Year Award is given to the supply chain partner that delivers the highest levels of performance in the categories of engineering, production, planning and quality. 

Bill Hata, Altera's Senior Vice President, Worldwide Operations and Engineering presents the 2012 Supplier of the Year Award to Mike Lamble, Executive Vice President of Sales and Marketing at Amkor Technology.

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News from Palomar’s Blog

Extending Bonder Life and Performance
Just as routine medical exams and checkups can help us live longer and healthier lives, routine checkups of bonders can extend the life of the equipment, which certainly provides a better return on investment. There are often new improvements, either through software or hardware, which can make your equipment more productive. Preventive maintenance and calibrations can improve quality and reliability as well as provide peace of mind that the equipment is performing as designed. Read more:

Knowledge is Power: Maximizing Your Bonder’s Capabilities
Often times a sophisticated technology’s performance is hindered by lack of training or not having access to an expert to guide you through efficient tips and tricks. This type of situation, in which performance was stunted by lack of training, is what a Palomar Technologies customer faced in the following case study with their die bonder. Read more:

RF Process & Production
“IMS is THE place to be for high reliability packaging!” was the IMS Insider tweet from Palomar Technologies—and a very true statement indeed. The IEEE MTT International Microwave Symposium (IMS) 2013 was another successful year for the annual international meeting for technologists involved in all aspects of microwave and radio frequency (RF) design, process and manufacturing. Read more:

High-Reliability Wire Bonding: Machines, Materials & Methods – Expert TechHUB SEMICON West 2013
SEMICON West 2013 attendees are just days away from over 50 hours of technical programs and focused access to over 600 exhibitors. As in years past, the technical talks have been highly timely and technical. New this year—and in addition to the typical conference sessions—is a chance for smaller, more engaging discussion talks in which an industry expert lends their time and knowledge to facilitate  some powerful dialogue…called Expert TechHUBs. Read more:

The 411 on Handlers
Handlers are bonder options that can bring great value and efficiency to your assembly process. Common applications that require a handler cover a wide variety of markets, from RF to automotive, as well as military to medical. The type of application requiring a handler could depend on volume or the desire to be “hands-off”. Read more:

Subscribe to the PTI Blog! Join the 3,399 industry peers who already have!

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New GORE® PolyVent XL Improves Reliability of Large Outdoor Electronic Enclosures

W. L. Gore & Associates has expanded its line of screw-in GORE® Protective Vents with a new vent specifically engineered for large outdoor enclosures with a volume in excess of 200 liters. The GORE® PolyVent XL improves the integrity, reliability and safety of these large housings in challenging environments such as found in the solar, telecommunications and exterior lighting industries.

Integrating the GORE® PolyVent XL into an outdoor enclosure results in improved reliability, increased safety and longer product life. This new vent is the latest addition to Gore’s full line of plastic and metal screw-in vents available in various sizes and thread types. Changes in environmental temperatures cause the air inside of large-volume housings to expand and contract frequently, which can lead to failure of the housing seals and compromised internal electronics. Integrating the GORE® PolyVent XL into the housing provides such a high airflow that internal pressure remains equalized, enabling the manufacturer to simplify its design and protect electronics without having to add stronger seals or additional bolts. The use of this unique vent results in substantial cost savings for the manufacturer.

Sudden changes in environmental conditions can cause pressure to build up inside the housing, sometimes even exceeding 200 mbar (3 psi). This level of internal pressure can put significant stress on seals and housing materials, which can cause them to fail, resulting in reliability and safety issues. Constructed of a unique breathable membrane, the GORE® PolyVent XL equalizes the internal pressure by allowing air to flow freely into and out of the housing at a rate of 16 liters per minute at 12 mbar. At the same time, the GORE® PolyVent XL prevents liquid ingress at a pressure of 0.3 bar for 60 seconds (equivalent to water immersion at three meters).

The GORE® PolyVent XL delivers reliable, long-lasting protection even in the harshest environments as proven by its compliance with multiple industry standards. The vent’s membrane protects the electronics from liquids and particulates by providing a durable barrier that even meets the challenging IP69K standard, which addresses protection from high-pressure, high temperature spray. Performing reliably in temperatures between -40°C and 125°C, Gore’s vent protects against harsh weather conditions as indicated by its passing performance standards such as the UL 746C ultraviolet test. The vent also increases housing life because of its durable welded cap, enabling the vent to pass the hail impact test specified in the IEC 62108 standard for the solar industry. After installation in the field, the GORE® PolyVent XL does not require any maintenance for the life of the electronics and the housing.

With offices and testing facilities located throughout the world, Gore application engineers are available to work closely with manufacturer’s design teams from initial product concept through rigorous testing and integration into the manufacturing process. 

For more information about Gore’s full line of venting products, visit vents.

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Newport Corporation Announces Joint Development Agreement with IBM for 2.5D/3D Thermo Compression Bonder

Newport Corporation  has announced that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of automated systems and processes for thermo compression bonding that will enable new methods of assembling semiconductor devices utilizing advanced electronics packaging technologies (including 2.5D/3D).

Under the agreement, Newport’s MRSI business unit will, with IBM Microelectronics, jointly develop optimal tool designs and process requirements for achieving successful (defect free) bonding conditions.  The companies will jointly develop prototype tooling and processes for fluxless thermo compression bonding of flip chip die, as well as capillary underfill dispensing. 

Newport’s MRSI unit, located in North Billerica, Massachusetts, is a leading supplier of high-performance, high-accuracy die bonding and dispensing systems to the microelectronics industry.  MRSI is now applying its deep expertise in these areas to address the significant technological challenges of sub-3 micron thermo compression bonding of 2.5D and 3D devices. 

“The increasing complexity and decreasing feature sizes of advanced semiconductor devices present significant challenges in the packaging process,” said Larry Parson, Senior Vice President and General Manager of Newport’s Optics Group.  “IBM has been a technology leader at the forefront of this emerging market, and has developed deep process expertise in thermo compression bonding techniques, while Newport-MRSI has been a leader in high precision die bonding and dispensing technology.  By entering into this joint development program, we will be able to develop advanced automated systems and processes to meet the cost, performance and form factor needs of the 2.5D/3D assembly market much more quickly and effectively than working separately.”

The work will be conducted both at Newport MRSI’s facility in North Billerica, Massachusetts and at IBM’s state-of-the-art Semiconductor Research and Development Center in East Fishkill.

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Custom-Designed Photo-Etched Lead Frames from PEI Meet Exacting Electrical, Thermal Conductivity and Strength Requirements of IC Manufacturers

Photofabrication Engineering (PEI) has expanded its manufacturing capabilities for custom-designed, photochemically-etched surface-mount and insert-mount lead frames for integrated circuit manufacturing. These lead frames are used in a wide variety of applications including semiconductors, glass-to-metal seals, and relays, as well as medical applications such as hearing aids.

Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEI can plate lead frames in their entirety or selectively. Lead-free plating materials include silver, nickel, gold, or tin, depending on the customer’s specific electrical and thermal conductivity requirements. Since the lead frame is the main conduit by which heat flows from the chip to the printed circuit board, PEI selects the manufacturing material to maximize the device’s operating life for any given application or environment.

PEI manufactures high-density lead frames with acute profiles and ultra-fine pitches, allowing for high pin counts. Single- or double-sided lead frames are etched without incurring the stresses associated with typical machining methods. More importantly, PEI’s process can be used for lead frames that are too complicated for stamping. Dimensions can be held to extremely tight tolerances, with no burrs or other surface irregularities.

PEI’s lead frames range in thickness from 0.5 mil [0.0127 mm] to 40 mil [1.575 mm], with features as small as 4 mil [0.10 mm] on 0.010 in. [0.254 mm] centers, creating lead frames that are strong enough to be handled yet flexible enough to allow bending when necessary.

A significant advantage of photochemical etching is the ability to reproduce large quantities of parts without tooling “wear”--the millionth part is exactly the same as the first part. Changes to tools can be implemented quickly, and phototools are significantly less expensive than traditional tools—ideal for manufacturing plates from prototype to production quantities with short turnaround times (about 10% of those for stamped frames).

For more information about PEI’s lead frames and other photoetched products, contact Chip Lehrer, President, Photofabrication Engineering, Inc., 500 Fortune Boulevard, Milford, MA 01757; telephone +(508) 478-2025; FAX+(508) 478-3582; e-mail sales(at)photofabrication(dot)com; or visit

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LORD Corporation Technology to be Presented at SUSS Technology Forum at Semicon West 2013

LORD Corporation announced Duy Le, Senior Scientist, will present a paper at the SUSS Technology Forum at SEMICON West 2013.

The SUSS Technology Forum covers the latest in materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging. The event will take place July 9-11 at The Regis at San Francisco; San Francisco, Calif. Le’s paper will be presented on July 9 at 11 a.m. The presentation is titled “Increased WLCSP Device Reliability Using Improved Final Passivation Material.”

The presentation will describe the processing and improved reliability performance of a photo-definable wafer level coating with a low coefficient of thermal expansion (CTE). Le will demonstrate how the wafer level coating can be applied as a final passivation layer and is compatible with conventional processing methods. In addition to the advantages which are inherent to WLCSPs, the presentation will review how these materials demonstrate significant improvements in thermal cycling reliability and drop test analysis.

As a Senior Scientist at LORD, Le focuses on developing formulations for microelectronic applications. He has extensive experience in the synthesis of fine metallic particles, coatings, and polymers. Le holds a Bachelor of Science degree in chemistry and a Master’s of Science in colloid and surface chemistry from Clarkson University. Recently, Le earned his Ph.D. in polymer chemistry from the University of North Carolina at Chapel Hill.

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High Temperature Resistant B-Staged Adhesive Film Features Thermal Conductivity and Electrical Insulation from Master Bond

In an effort to mitigate the more complicated preparation associated with B-staged epoxies, Master Bond developed FLM36 for bonding and sealing applications in the aerospace, electronic, opto-electronic and specialty OEM industries. This B-staged film eliminates mixing and measuring and is easy to handle.

FLM36 can withstand temperatures up to 500°F and retains its high strength properties upon prolonged exposure to elevated temperature. It bonds well to a variety of substrates including metals, composites, glass and many plastics. Additionally, thermally conductive FLM36 is a superior electrical insulator.

Unlike other heat resistant epoxy systems, FLM36 possesses more flexibility and toughness, which enables it to endure thermal and mechanical shocks as well as thermal cycling. It also has good chemical resistance to water, acids, bases, fuels and oils.

The film has release paper on each side. After the substrates to be bonded are properly prepared, the release paper is removed to expose the adhesive. It’s carefully placed onto the part and pressure is applied. The assembly is lightly fixtured and cured for 1-2 hours at 350°F. The bonded parts should be returned to 75°F before removing the fixtures. FLM36 offers uniform bond line thickness and limited squeeze out during bonding.

This product is offered in three standard sizes: FLM36-4A is 4 x 4 x 0.008 inches, FLM36-8B is 8 x 8 x 0.008 inches and FLM36-12C is 12 x 12 x 0.006 inches. The film can be cut with a pair of sharp scissors into various shapes and sizes. The films are rugged, durable and not prone to cracking. Contrary to most thermoset films of this type, FLM36 does not require freezing or refrigeration.

Master Bond Thermally Conductive Epoxy Systems
Master Bond FLM36 is a B-staged film with a flexibilized epoxy chemistry that offers high temperature resistance, thermal conductivity, electrical insulation and the ability to withstand rigorous thermal cycling. Read more about Master Bond’s thermally conductivity formulations at  or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:

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Nordson YESTECH’s BX-UV Automated Conformal Coat Inspection System Selected by Specialized Coating Services

Nordson YESTECH has announced that it has been selected by Specialized Coating Services, a contract provider of conformal coating services, encapsulating (potting) and ruggedization of printed circuit boards, as their AOI supplier. Specialized Coating Services will utilize Nordson YESTECH’s BX-UV benchtop AOI for Conformal Coat inspection at their 38,000 square foot facility in Fremont, California.

Specialized Coating Services selected Nordson YESTECH based on their proven inspection capabilities, ease of programming, as well as their excellent reputation for customer service. With an emphasis on conformal coating all types of PCBs used in medical, military, aerospace, commercial and retail applications, as well as potting and encapsulating, Specialized Coating Services relies on the BX-UV to provide fast and accurate conformal coat inspection. “We conformal coat over 4,000 printed circuit boards per day with either silicone, urethane or acrylic resins,” said Rick Ramirez, Founder and President of Specialized Coating Services.  “Each of these materials has brighteners in them which “light up” under black light. This is how we can tell if there were any leaks or wicking into areas that are to remain coating free. We currently have a touch up and QC process, and then a final QC. Before, our inspection was done with black light and scope. Now that we have the BX-UV system, we can pass the boards through and be assured that there were no human errors in the final inspection process. The YESTECH system is a highly efficient way of inspecting, saving us valuable time.”

Nordson YESTECH’s powerful and user-friendly software was also a key factor in Specialized Coating Service’s decision.  “The BX-UV is incredibly easy to program and operate.” Added Ramirez. “Once the system is programmed, which is easy to do, inspection is simple to perform for any operator and provides dependable and accurate results. After the demonstration of the conformal coating model, we immediately made the decision to acquire the system.  It’s working great and takes a lot of the possibility of human error out of the inspection process. Overall, the BX-UV has proven to be a great asset to our QC process, and we will be turning to Nordson YESTECH again for our future inspection needs.”
The Nordson YESTECH BX-UV makes inspection of conformal coatings simple and convenient by automating the inspection process for quality, consistency and thickness of coatings under UV lighting, with the use of proprietary inspection algorithms. Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of quality inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. The BX-UV’s advanced inspection algorithms provide fast and completely automated inspection for coverage, selected areas of non-coverage, de-lamination, cracks and bubbles.

With minimal programming, the inspection set-up is fast and intuitive, typically requiring less than 30 minutes. A known good board is used by the system to learn the coverage and non-coverage areas. The automated inspection typically takes only a few seconds, with inspection results immediately displayed.  These results can be stored and reviewed off-line at any time. The BX-UV also reads all common barcodes and stores image based inspection results for traceability.  

“We are very pleased to be working with a quality organization such as Specialized Coating Services,” said Kevin Garcia, Nordson YESTECH Regional Sales Manager. “Our ultimate goal is to ensure our customer’s success by providing the best technology, with excellent service and support. We are delighted that the BX-UV system provides them with the accuracy and reliability they need, and look forward to working with them in the future.”
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DYCONEX implements Electronic Failure Catalog (EFC) with Customer Log-In

The newly implemented electronic failure catalog enables DYCONEX and its customers to use the same criteria for visual inspection of PCBs – either during in-process or final inspection at DYCONEX, or during incoming inspection at its customers' facilities. The goal is to synchronize inspection processes and outcomes for specific products with the intention of achieving dock-to-stock delivery.

At DYCONEX, all final inspection workstations have been equipped with touch screen computers to allow for the convenient use of a paperless system. The database contains a comprehensive collection of customer- and product-specific failure catalogues that can be displayed in different views. The operator easily finds pictures and corresponding captions of reference samples, thereby allowing him to assess each product feature and to categorize the part.
Users can choose either German or English as the system language. Furthermore, the system offers release loops with electronic sign-off capabilities and strict revision control to ensure that users are working with the latest released revision.

This system enhances the delivery of the highest PCB quality and reliability, anchored in all business and production processes, thereby making DYCONEX an extremely predictable partner for its customers.

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EV Group Enhances Wafer Debonding Solutions Portfolio With New LowTemp™ Room-Temperature Debonding Platform

Three high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enable greater manufacturing flexibility

ST. FLORIAN, Austria, July 1, 2013 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its LowTemp™ debonding platform, which features three different room-temperature wafer-debonding processes and an extended material supply chain.  The platform includes two new debonding processes that have been qualified for EVG's high-volume production temporary bonding/debonding (TB/DB) systems—UV laser debonding and multilayer adhesive debonding—in addition to EVG's ZoneBOND® technology, which has already been implemented into production across the compound semiconductor and advanced packaging markets.  EVG's LowTemp debonding platform is complemented by a supply chain of seven material suppliers, with a wide choice of qualified adhesives that support a variety of bonding applications and offer greater process flexibility for customers.


"For more than 15 years, EVG has provided leading-edge temporary bonding and debonding solutions to our customers," commented Paul Lindner, EVG's executive technology director.  "The experience and know-how that we've built up from our numerous installations in high-volume manufacturing has taught us that one solution doesn't fit all applications when it comes to temporary bonding/debonding.  Accordingly, EVG offers highly flexible and modular equipment, a wide choice of qualified materials to support customers' individual requirements and multiple source policies, and process development and implementation support through our worldwide application labs and cleanroom infrastructure across a range of applications—including interposers, stacked memory, memory on logic, power devices and compound semiconductors."

EVG's LowTemp debonding platform adds to the company's already comprehensive portfolio of temporary bonding/debonding and thin-wafer handling solutions based on tape debonding and thermal slide-off debonding technology.  The LowTemp debonding platform is available on EVG's full line-up of TB/DB systems, including the recently announced EVG850TB/DB XT Frame high-volume production platform, which can achieve a throughput of more than 40 wafer stacks per hour and features an optional, integrated in-line metrology module that takes up to 300,000 measurement points at unprecedented speeds to enable real-time monitoring of the bonding/debonding process for maximum yields.

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RGL Enterprises


:: Issue 142 ::
July 1, 2013

Torrey Hills Technologies

Oneida Research Services


F&K Delvotec

LORD Corporation