MST
:: Corporate Member News ::

:: News from Palomar’s Blog (full story)

:: Main Street Capital Holdings Acquires the Hi-Rel Group (full story)

:: STATS ChipPAC Appoints James A. Norling as Chairman (full story)

:: Master Bond’s New Highly Flexible Silver Conductive Epoxy Adhesive (full story)

:: Environment Friendly Laser Processing in Advanced Packaging gains Pace - Leading US-American IDM places Order for Excimer Laser Ablation Tool from SUSS Micro Tec (full story)

:: Amkor Technology held their 2013 Customer Symposium: Solutions for a Connected World (full story)

:: Endicott Interconnect Technologies, Inc Announces The Retirement Of CEO Jay McNamara (full story)

:: Photofabrication Engineering, Inc. - Custom Etched Lids for Seam Sealed Hermetic Devices (full story)

Applied Materials

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Masterbond
Palomar Technologies
Photofabrication Engineering Inc.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian at 202-548-8715. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 202-548-8717.

:: To have your company logo included in an upcoming "Fast Links," contact Brian Schieman at bschieman@imaps.org or 202-548-8711.

:: For comments and questions about this e-mail newsletter, please contact Brian Schieman at bschieman@imaps.org or 202-548-8715.


News from Palomar’s Blog

Overcoming Placement Accuracy Challenges for Print Head Alignment
If you are a printer company and trying to eliminate or greatly reduce the alignment requirements of your print heads, Palomar has the solution for these issues. If you are not making print head, but see some of the same challenges in accuracy and repeatability in your process or part, Palomar can provide solutions to these predicaments as well. Read more: http://www.palomartechnologies.com/blog/bid/114485/Overcoming-Placement-Accuracy-Challenges-for-Print-Head-Alignment

Flexible Wire Bonding in Complex Hybrid Markets
Those of us in the microelectronic packaging world must get used to this state of constant change. What one needs and must have is a wire bonder that is flexible, evoking a very large working envelope that allows for very deep access bonding, in addition to resolution and repeatability beyond day-to-day needs. Read more: http://www.palomartechnologies.com/blog/bid/114784/Flexible-Wire-Bonding-in-Complex-Hybrid-Markets

Au Ball Wire Bonding with Heated Tool
Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel packaging designs to shrink both final product size and weight. This is affecting the downstream processes in more dramatic ways than we have seen before. Now more plastic packages are being utilized with embedded microelectronic circuits. Read more: http://www.palomartechnologies.com/blog/bid/114842/Au-Ball-Wire-Bonding-with-Heated-Tool

Mixed Attachment Technology in RF & Optoelectronic Packages
The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly process engineers.  Both eutectic and adhesive attachment processes are faced with smaller component sizes, more closely spaced components, and a need for lower voiding content. Read more: http://www.palomartechnologies.com/blog/bid/114972/Mixed-Attachment-Technology-in-RF-Optoelectronic-Packages

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Main Street Capital Holdings Acquires the Hi-Rel Group

Main Street partners with Richard Ferraid to acquire a leading manufacturer of highly specialized microelectronic components

Main Street Capital Holdings, LLC, a private investment firm specializing in acquisitions of growth-oriented companies, announced that it has acquired the Hi-Rel Group, a leading manufacturer of precision metal components for the microelectronic packaging industry. The acquisition was completed in partnership with Richard (Rick) L. Ferraid, former President and Chief Executive Officer of HCC Industries, Inc. Terms of the deal were not disclosed.

Founded in 1976 and headquartered in Essex, Connecticut, the Hi-Rel Group, LLC is a leading manufacturer of highly specialized metal components for the microelectronic packaging industry. The Hi-Rel Group includes the following affiliates: Hi-Rel Products, LLC based in Essex, Connecticut, Hi-Rel Lids, Ltd. based in Harleston, Norfolk, England, and Hi-Rel Alloys, ULC based in Fort Erie, Ontario, Canada. The company provides a necessary enabling technology for the manufacture of hermetically sealed electronic components, which are used to support high reliability, mission critical devices and systems. Hi-Rel’s products include hermetic microcircuit packaging lids, ring frames, brazing alloys, thermal management products, getter assemblies, as well as other products and services for the aerospace, defense, telecom and medical industries.

Richard L. Ferraid was named President and Chief Executive Officer of the Hi-Rel Group immediately following the acquisition. Mr. Ferraid has over thirty years of experience in the hermetic electronic packaging industry. As the former President and Chief Executive Officer of HCC Industries, Inc., he gained extensive domestic and international executive experience. At HCC, he helped to deliver a strong track record of top-line growth both through organic initiatives and acquisitions. Mr. Ferraid has broad organizational and leadership development experience, as well as, a thorough understanding of how to integrate a variety of businesses.

“I have known Hi-Rel for many years and have always been a raving fan of both the company and the management team” said Mr. Ferraid. “Hi-Rel’s customer support values are very similar to my own. Tom (Dolan, Jr. of Hi-Rel Products), Tom (Ganzenmuller of Hi-Rel Alloys), Bob (Stroehlein of Hi-Rel Alloys), and Stu (Norris of Hi-Rel Lids) should be very proud of what they have accomplished. We look forward to working with them to grow the company and to bring it to the next level in terms of customer support and new product offerings and to create a market focus second to none in the industry. Main Street, who has extensive experience in the specialty metals industry through previous investments, is the right financial partner to help facilitate this growth for Hi-Rel.”

Tom Dolan Jr., the President of Hi-Rel Products, said “I am excited to team up with Main Street and Rick Ferraid. This offers Hi-Rel an opportunity to add additional resources while maintaining our industry leading reputation for putting our customers’ needs above all else. The management team will remain focused on operational excellence while working closely with our new partners on specific growth initiatives that complement our existing businesses. Hi-Rel’s customers, employees and suppliers are sure to gain from this relationship which was my objective since the beginning of this process.”
W. Ryan Davis, a Principal at Main Street Capital Holdings commented, “We’re very excited about the acquisition of Hi-Rel. The company comprises a fundamentally sound group of businesses that are all market leaders in their respective segments. We are thrilled to be partnering with Rick Ferraid and the existing management team and we intend to build on what the company has already accomplished in the market. Main Street intends to provide management with the resources needed to integrate the businesses and continue to grow top- line sales.”

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STATS ChipPAC Appoints James A. Norling as Chairman

STATS ChipPAC announced the appointment of Mr. James A. Norling to succeed Mr. Charles R. Wofford as Chairman of the Board of Directors with immediate effect. He was appointed to the Board of Directors at the Company’s Annual General Meeting held on 24 April 2013. Mr. Wofford will retire from over 15 years of service on STATS ChipPAC’s Board of Directors, including 11 years as Chairman of the Board.

Mr. Norling is presently the Executive Chairman of GLOBALFOUNDRIES Inc. and a Director of Harley-Davidson, Inc. A well respected electronics industry veteran, Mr. Norling served a distinguished 35-year career with Motorola Inc. from 1965 to 2000, where he was the president of the Personal Communications Sector. He was the former Chairman of Chartered Semiconductor Manufacturing Ltd (“Chartered”), from 2002 until the company was acquired by Advanced Technology Investment Corporation in 2009. Mr. Norling also served as interim President and Chief Executive Officer of Chartered during 2002.

For more information, please visit www.statschippac.com.

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Master Bond’s New Highly Flexible Silver Conductive Epoxy Adhesive

Master Bond EP21TDCSFL is a new two component, room temperature curing, silver filled, epoxy adhesive developed by Master Bond Inc., Hackensack, N.J.  It exhibits high flexibility and has an elongation of >60%.  EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume.  It cures at room temperatures or more rapidly at elevated temperatures.  It can be applied on vertical surfaces with minimal sagging.  This compound is 100% reactive and does not contain any diluents or solvents.

EP21TDCSFL has a volume resistivity of <10-3 ohm cm.  It offers mechanical shock resistance and low outgassing properties.  Adhesion to metals, glass, ceramics, rubbers and many plastics is excellent.  It has a service operating temperature range of from 4K to +250°F.  Additionally EP21TDCSFL is particularly recommended for bonding dissimilar substrates that are being thermally cycled and shocked.  It has inherently low shrinkage which enables the cured system to exert very little mechanical stress on sensitive components and substrates.

EP21TDCSFL has a tensile shear strength of >1,500 psi and a T-peel of >30 pli.  It has a thermal conductivity of 11 BTU/in/ft²/hr/°F.  Highly flexible, EP21TDCSFL is well suited for repair applications.  Parts A and B are both colored silver.

Master Bond EP21TDCSFL is available for use in half-pint, pint, quart and gallon container kits.  It also is available in premixed and frozen syringes.

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Environment Friendly Laser Processing in Advanced Packaging gains Pace - Leading US-American IDM places Order for Excimer Laser Ablation Tool from SUSS Micro Tec

SUSS MicroTec has received a purchase order for their latest generation laser ablation stepper from a leading US-American IDM (Integrated Device Manufacturer). This important sale re-states the increasing importance of this technology in advanced packaging, adding to the recent shipments of the same platform to another IDM and a major Asian OSAT (Outsourced Assembly and Test Foundry). This ELP300 Excimer laser platform is designed for high volume manufacturing and processing of wafer sizes between 200 and 300mm, employing Excimer laser technology to directly create microstructures in lieu of traditional photolithography and wet etch approaches.

The advantage of this system is the ability to not only address the challenges in manufacturing next generation semiconductor packages, but also address a means to lower manufacturing costs. This technology is environment friendly as it eliminates the need for wet etching process steps utilizing toxic materials. Shipment of this system is scheduled for Q4 2013.

'The placement of the order underpins the rising importance of this new and innovative structuring technology for the semiconductor mid- and backend.', says Frank P. Averdung, President and CEO of SUSS MicroTec. 'We see high growth potential for this technology, especially in our core market of advanced packaging. Besides offering a considerable cost savings potential, this 'green' Excimer laser processing technology will enable our customers the ability to design and produce even more powerful microchips and packages in the future while reducing the burden on the environment.'

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Amkor Technology held their 2013 Customer Symposium: Solutions for a Connected World

Amkor Technology came in force to deliver a highly focused message to an estimated audience of 300 invited customers of Amkor as to exactly what is essential in the packaging & OSAT supplier's world. The Symposium was staffed by the senior executives, managers and technologists of the company. The mission was clear and the objective precise, it was to deliver the company's current and go forward mission.

The opening remarks by Ken Joyce, president and CEO, provided a broad based overview of the company's current state and new business initiatives. Ken addressed Amkor's CAPEX plan, specifically in Asia-Pacific, where the existing manufacturing facilities and new plants under construction provide 5.8 million sq/ft of facilities. The largest capacities will be centered in the Inchon, Korea area.

Scott Clifford, VP of Strategic Sales & Marketing meticulously detailed the market outlook and corporate initiatives. Technology developments and the challenges for the coming decade were thoughtfully delivered by Dr. ChoonHeung Lee, Corporate VP of Product Management, to the focused audience. Mike Lamble, Executive VP of Sales & Marketing, was the Symposium host and Deborah Patterson, Sr. Director of Product and Technology Marketing for Amkor skillfully organized and directed the event. A comprehensive report on the major trends shaping the future of the semiconductor industry was delivered by Bill McClean, President of IC Insights and the Symposium's Keynote speaker.

The morning session was wrapped up with a very interesting drill down to advanced packaging solutions and a comparative technology roadmap of Amkor's advanced packaging goals as currently viewed by the company and presented by Ron Huemoller, Sr. VP of Advanced Product Development.

Following a buffet style lunch, the afternoon sessions were comprised of 3 technology tracks: Miniaturization & All Things Mobile; Automotive, Industrial & Power; and finally a Networks, Wired Communications and Computing segment. As we sampled all of the break-outs, we studied the attention levels that clearly indicated the relevancy of the materials and topics for the individual tracks. All sessions and topics were articulated by VPs and Directors from all divisions of Amkor Technology. The broad range of materials included many wafer-level packaging strategies and solutions, MEMS trends and assembly processing, packaging requirements, modeling and predictive engineering, and testing concepts.)

In summary, Amkor Technology's presentation of the information was polished, accurate and skillfully delivered. We look forward to a repeat performance of this venue.

To close out the full day's activities, a casual networking cocktail hour provided appetizers and a few drinks for all.

left-to-right - Scott Clifford, Ken Joyce, Dr. ChoonHeung Lee, Mike Lamble

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Endicott Interconnect Technologies, Inc Announces The Retirement Of CEO Jay McNamara

Endicott Interconnect Technologies, Inc. (EI) announced today that CEO Jay McNamara retired as of Friday April 12, 2013. Mr. McNamara had been the President & CEO of Endicott Interconnect since its inception in 2002 as a divestiture of IBM's Microelectronics Division.

Mr. McNamara has taken EI from a company with only a few customers, in a couple of markets, to a company with dozens of customers, in a variety of markets including: High Performance Computing, Aerospace & Defense, Medical and Industrial. Mr. McNamara's leadership has been a critical factor in pushing the company forward and helping EI to become a respected name in the world-wide electronics industry.

"I've had the unique opportunity of working alongside Jay for a number of years and I've always been fascinated with his ability to really connect with both employees and customers alike. He's been the true visionary for EI over the past 10 years and the company would not be where it is today without his outstanding leadership and commitment to the organization. He will be truly missed," stated Chief Technology Officer Raj Rai.

"Jay's leadership has put Endicott Interconnect on the map as the leading interconnect technology company in the world. The company's dedication to customer service, quality, and delivery of mission critical products is a direct result of Jay's relentless focus on customers and their success in the marketplace. Jay's legacy at EI is a company culture based on these things", said Mike Hills, COO/Sr. VP of Worldwide Sales.

McNamara will be succeeded by Jim Matthews Jr.

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Photofabrication Engineering, Inc. - Custom Etched Lids for Seam Sealed Hermetic Devices

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:: Issue 140 ::
May 1, 2013

F&K Delvotec

Master Bond

LORD Corporation

RGL Enterprises

EPP