NEWS | JOBS | FAST LINKS

MST

:: Corporate Member News ::

:: Torrey Hills T65 Three Roll Mill Honored as Gold Prize Winner at the 5th Annual 2013 Golden Bridge Awards Presentation (full story)

:: Newport Corporation to Sell Micro Robotics Systems Business Unit (full story)

:: Master Bond’s Thermally Conductive, Electrically Insulative One Part Epoxy for Bonding, Sealing and Glob Top Applications (full story)

:: DYCONEX invests in Orbotech LDI equipment (full story)

:: Valtronic USA Adds a Bioburden ISO Class 8 Cleanroom (full story)

:: CVInc has implemented new plating technologies (full story)

:: Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica (full story)

:: News from Palomar Technologies (full story)

:: Grid Cut Foam from CCI – The New Material Handling Design for Effective Use of Workspace (full story)

:: Indium Corporation Introduces High-Reliability Low-Voiding Flux Coating for Solder Preforms (full story)

:: Invensas™ Enables Next-Generation Mobile Devices (full story)

 

Applied Materials

:: Job Openings ::

Please check back...

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Palomar Technologies
Indium Corp.
CCI - Conductive Containers Inc.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


Torrey Hills T65 Three Roll Mill Honored as Gold Prize Winner at the 5th Annual 2013 Golden Bridge Awards Presentation

Torrey Hills Technologies, LLC (THT) was honored as Gold Prize winner for the 2013 Golden Bridge Awards under the New Industrial Products and Services category for its remarkably successful T65 lab model three roll mill. Golden Bridge Awards are an annual industry and peers recognition program honoring Best Companies of all types and sizes in North America, Europe, Middle-East, Africa, Asia-Pacific, and Latin-America, Best Products, Innovations, Management and Teams, Women in Business and the Professions, and PR and Marketing Campaigns from all over the world.

“We are so deeply honored!” said Ken Kuang, President and CEO of THT. “These awards are a testament to Torrey Hills’ commitment to innovation and customer satisfaction, which inspired us on the design of a world class three roll mill that focuses on end-user experience including operation, cleaning, durability, maintenance, and operator safety. We love what we do and it's a blessing to win an award for it.”

THT started from the vision of a compact, robust, and continuously feeding mixing device that blends viscous materials. The new design represents maximized power, dispersing efficiency, and throughput. This mill is positioned as a leader in mixing tool for a wide range of industries including paints, inks, thick film pastes, adhesives, coatings, ceramics, cosmetics, food, and pharmacy compounding, with comparative advantages in mixing efficiency, continuous feeding capability, and quality control.

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Newport Corporation to Sell Micro Robotics Systems Business Unit

Newport Corporation (Nasdaq: NEWP) has announced it has signed a letter of intent to sell the assets of its Micro Robotics Systems advanced packaging business ("MRSI") to a private investment group led by the local management team.  In the trailing twelve month period ended September 28, 2013, MRSI generated revenue of approximately $12 million, although the business did not contribute materially to Newport's operating income or cash flows.

Under the terms of the proposed transaction, Newport would receive $5.35 million in cash at closing and an unsecured promissory note in the principal amount of $0.65 million, with a term of seven years and an interest rate of 5%.  The buyer is expected to sublease the facility from Newport and retain substantially all of the employees.  The parties are currently negotiating the definitive agreements relating to the transaction, which will be subject to normal closing conditions and is expected to be finalized before the end of the year.

Commenting on the divestiture, Robert Phillippy, Newport's President and Chief Executive Officer, said: "The MRSI business is focused on the development and manufacturing of turn-key die bonding and dispensing systems.  Our focus is on providing solutions that leverage lasers, optics and photonics technologies, and the MRSI business no longer fits within Newport's long-term strategy.  Therefore, we believe it is in our best interest to sell the business.  Doing so will allow Newport to more efficiently deploy management's attention and corporate resources to those areas that hold the greatest growth potential and best leverage the core capabilities of our company."

MRSI's net assets at the end of the third quarter of 2013 were approximately $9.5 million.  Therefore, in accordance with generally accepted accounting principles, Newport will record a charge of $4.5 million in the third quarter of 2013 relating to the pending divestiture, including transaction costs of $0.4 million.  More information on the transaction was provided during the company's third quarter earnings conference call, which was held Wednesday, October 30, 2013 at 5:00 p.m. Eastern time (2:00 p.m. Pacific time).

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Master Bond’s Thermally Conductive, Electrically Insulative One Part Epoxy for Bonding, Sealing and Glob Top Applications

Featuring the combination of electrical insulation properties and thermal conductivity, Master Bond Supreme 3HTND-2GT can be used for a variety of applications including bonding, sealing, glob top and die attach. This toughened epoxy system bonds well to a wide variety of substrates used in electronics, including metals, composites, ceramics and many plastics.

As a one component system, Supreme 3HTND-2GT does not require mixing and features a thicker viscosity with limited flow characteristics. Unlike many epoxies it can be readily and efficiently applied to a defined area. It cures quickly in 20-30 minutes at 250°F or in 5-10 minutes at 300°F with very low shrinkage. Supreme 3HTND-2GT can cure in thicknesses of up to 1/8 inch if needed.

Additionally, this dimensionally stable system is capable of withstanding rigorous thermal cycling and shocks. Thermally stable, the service temperature range for this system is first rate at -100°F to +400°F. It resists chemicals rather well, including water, acids, bases and many solvents. Particularly noteworthy is its low level of ionic impurities.

Supreme 3HTND-2GT is yellowish tan in color and is available in a variety of packaging including syringes, cartridges, pints, quarts and gallon containers.

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DYCONEX invests in Orbotech LDI equipment

In the first half of 2013 DYCONEX AG invested into several pieces of equipment that will further enhance production technology providing optimized PCB solutions for customers. The purchase of the field-proven Orbotech ParagonTM–9800 Laser Direct Imaging (LDI) system – as the third LDI system in production - is another step in pursuing our strategy to convert all exposure jobs to direct imaging. This standardization for all imaging steps results in a significantly faster and easier process flow.
 
For soldermask exposure the ParagonTM–9800 LDI system guarantees with its 16W power high throughput not only for LDI optimized soldermasks but as well for other well-established soldermask materials.

The system offers side-to-side registration and dynamic imaging modes to match the panel’s distortion for highest registration accuracy of better than 20 micron.

Furthermore, for high-reliability applications, like medtech implants, full traceability can be obtained by adding serial number stamps, date stamps, 1D or 2D barcodes recording various process parameters to each panel.

After having successfully transferred all artwork printing to LDI in 2012 the implementation of the ParagonTM–9800 LDI system denotes the passing of the next milestone for soldermask imaging.

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Valtronic USA Adds a Bioburden ISO Class 8 Cleanroom

Valtronic USA has recently qualified a new ISO Class 8 cleanroom.  Our 288 square ft. bioburden ISO 8 cleanroom is a modern facility with temperature, humidity, & contamination controls.  It provides us with the ability to package electronic and mechanical assemblies in a pouch ready for EtO (Ethylene Oxide) sterilization.   It completes the production chain for our customers’ products, and allows Valtronic to provide a complete contract manufacturing solution for active implants.

“The project began as a request from a new customer and we anticipate a very positive response from other implant manufacturers regarding this capability.  Our new facility has provided us with the space to add this capability with room to expand it when needed.” said Jim Ohneck, Global Vice President of Sales and Marketing, “We started preparing for expansion like this when we moved to our current facility last year and the right customer helped us complete it even earlier than expected.  Providing this capability saves customers production time and the vertical integration also offers cost efficiencies.”
Working with an independent lab for testing, the cleanroom has proven to meet ISO 8 = less than 3,520,000 particles greater than or equal to 0.5µm – particulate levels according to ISO 14644-1.  The qualification was led by two engineers and our Quality Manager.  Our technicians were trained on cleanliness controls in the ISO 8 cleanroom to ensure best-in-class production for today’s demanding medical device market.

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CVInc has implemented new plating technologies

CVInc has implemented new plating technologies. In addition to the standard ENIG and ENIPIG on copper and aluminum, CVI now offers electroless Cu on aluminum pads. ECu pillars provide an alternate to Ni for high frequency and other customer needing to eliminate the magnetic properties of Ni in its circuitry.

CVI also presented its process for selectively removing Au from aluminum pads for repackaged and reprocessed die. These die can be subsequently processed without the worries of gold embrittlement when using Sn based solders.

CVI continues to support quick turn bumping and WLCSP packaging solutions in 2-5 day cycle turns.

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Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Hesse Mechatronics, Inc. announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Hesse Mechatronics will demonstrate:

  • Large diameter copper (Cu) heavy wire capability on the Bondjet BJ935 Fully Automatic Heavy Wire Bonder
  • Heavy wire bonder full automation capabilities on the Bondjet BJ935, featuring the only heavy wire bondhead with non-destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time
  • Lead frame indexing on the Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder, meeting the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specialized bond heads that can be changed out in minutes
  • The industry standard for thin wire wedge bonding speed and accuracy with the Bondjet BJ820 High Speed Fully Automatic Fine Wire Wedge Bonder, offering speed of up to 7 wires/sec., accuracy of 1 μm at 3 σ axis repeatability, in addition to the largest work area

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News From Palomar Technologies

Hughes Aircraft: Pioneering High-Reliability Microelectronic Assembly Equipment & Processes
Hughes Aircraft is one of America’s great iconic companies and arguably the pioneer of the avionics, aerospace and defense industry we know today. As a former division subsidiary, Palomar Technologies is proud to be a former division of Hughes and continues to build upon the early equipment innovation. It is difficult to pinpoint a company that has contributed more to early military, avionics, and satellite communications than Hughes Aircraft. Read more: http://www.palomartechnologies.com/blog/bid/118782/Hughes-Aircraft-Pioneering-High-Reliability-Microelectronic-Assembly-Equipment-Processes.

Automated & Semi-Automated Die Sorting
As microelectronics device designs evolve, so must handling and assembly processes. Die sorting is used to separate die of one wafer into categories of varying qualities or other characteristics. Even when all die on a wafer are intended to be identical, this is almost never the case. Sorting the die according to their characteristics becomes necessary in order to achieve a cost effective, high yield device packaging production. Read more: http://www.palomartechnologies.com/blog/bid/118938/Automated-Semi-Automated-Die-Sorting.

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Grid Cut Foam from CCI – The New Material Handling Design for Effective Use of Workspace

In today’s world of populated circuit boards, engineers are working to utilize more of their available surface space. This results in fragile components ending up too close to the edge of the circuit boards. When these circuit boards are placed in the industry’s hard plastic stacking trays, components are being shearing off or damaged physically and cosmetically. These damages result in rework and board failure - both very expensive.

CCI

CCI’s engineers invented the Grid Cut Foam as a solution for customer’s struggle with the damage that “hard plas­tic” stacking trays were causing. The Grid Cut Foam features Firm Dissipative Foam, giving components contact with much softer substrate, and providing great material handling. CCI provides multiple stock sizes and options of the Grid Cut Foam, as well as “sheet stock” so that customers can buy the foam and cut it to the specific size needs for their workstations.

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Indium Corporation Introduces High-Reliability Low-Voiding Flux Coating for Solder Preforms

Indium Corporation introduces a new, high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0) material is especially suited for assembly processes in which the components don’t allow for proper outgassing of volatized flux.

LV1000 provides a durable, level, clear coating that does not clog pick and place equipment, even in automated assembly processes. It offers complete coverage, even with a weight percentage as low as 0.5%. Flux coatings provide consistent, uniform amounts of flux every time, with excellent control over the flux volume/weight percentage. Indium Corporation flux-coated solder performs come in a variety of packaging and can be color coded. The company’s flux coatings are applied to the outside of the preform where the flux is required, rather than in the core.

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Invensas™ Enables Next-Generation Mobile Devices

The next generation of consumer applications, such as video conferencing, 3D gaming, and streaming HD video are increasing the bandwidth requirements of mobile devices more than ever before. New innovative approaches are becoming critical to support these high-bandwidth applications. Invensas is a leader delivering high-bandwidth mobile solutions to the semiconductor market, with its Bond Via Array™ (BVA™) and 3DIC silicon interposer platforms addressing different interconnectology aspects of emerging performance requirements.

An Ultra-high bandwidth I/O Package-on-Package (PoP) mobile solution without TSVs, BVA has been ramped up to high volume market readiness in collaboration with leading industry partners. BVA technology delivers significantly greater bandwidth (up to 5 times that of competing solutions), and reduces battery drain while using existing manufacturing infrastructure in order to maintain low manufacturing costs. BVA was recently honored by Frost & Sullivan with its 2013 North American Customer Value Enhancement Award in 3D Packaging and 3D IC Market for Mobile Computing.

Invensas' leading edge silicon interposer (“3DIC”) platform technology is designed to provide ultra-high performance, low power, and cost-effective silicon interposer solutions to customers in mobile applications requiring power efficient performance. Invensas will present on Interposers for all of us: Reaching a low cost, manufacturable 2.5D technology on December 12, 2013 at 3D-ASIP.

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:: Job Openings ::

Please check back...

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

 

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EPP
F&K Delvotec
RGL Enterprises

 


:: Issue 148 ::
November 6, 2013

Torrey Hills Technologies

Oneida Research Services

Metallix

Petroferm

LORD Corporation