NEWS | JOBS | FAST LINKS

MST

:: Corporate Member News ::

THANK YOU IMAPS 2013 ORLANDO EXHIBITORS & SPONSORS!

 

:: Finetech FINEPLACER® femto Provides Advanced Packaging Capabilities at C2MI (full story)

:: Hesse Mechatronics, Inc. on Display at IMAPS 2013 (full story)

:: NOVA Integration Solutions, Inc. Joins IMAPS and Exhibits at the 46th International Symposium in Orlando, Florida USA (full story)

:: Be Sure to Visit Interconnect Systems, Inc. (ISI) in Booth # 406 (full story)

:: Palomar Technologies at IMAPS Orlando - Integrating i2Gi™ onto an 8000 Wire Bondery (full story)

:: Riv Inc. Thick Film Printing Screens - Visit Them at IMAPS 2013 (full story)

:: Kulicke & Soffa Launches New ACS ProTM Capillary - Hear More During IMAPS 2013 (full story)

:: LORD Corporation's Sears to Present at IMAPS 2013 (full story)

:: Come visit Advanced Dicing Technologies, Inc. at the Orlando, FL exhibition at booth #517 (full story)

:: Stop By DuPont Microcircuit Materials Booth in Orlando (full story)

:: Be sure to Visit Sefar Inc. (full story)

:: Visit NAMICS CORPORATION for underfills, encapsulants, adhesives, and more... (full story)

:: Visit ESL ElectroScience at Booth #808 (full story)

:: Visit Harrop Industries in Booth # 714 (full story)

:: Thank you IMAPS 2013 Exhibitors ! Last Chance to Book a Booth (full story)

Applied Materials

:: Job Openings ::

:: Application & Support Specialist - Semiconductor/SMT (full story)

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Harrop Industries
SEFAR
Stellar Industries
Nordson Dage
Deweyl
Advanced Dicing

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


Finetech FINEPLACER® femto Provides Advanced Packaging Capabilities at C2MI

Finetech, has announced that C2MI has installed a FINEPLACER® femto bonding system in its advanced packaging sector. This automated, sub-micron accuracy system is designed to position and attach small electronic or opto-electronic components on printed circuit boards or substrates.

C2MI, as a Centre of Excellence, provides a state-of-the-art infrastructure for the benefits of its members. This high-technology hub provides support so that innovative concepts can be promptly commercialized. C2MI is active in die-level packaging, complex microsystems, 3D design integration and micro electromechanical systems (MEMS) development.

With a wide base of systems installed at many prestigious institutions and research centers, Finetech‘s die bonders provide unmatched solutions for advanced technology environments utilizing diverse applications. The FINEPLACER femto is a fully automated, sub-micron bondingplatform that is ideal for product and process development of laser diodes,laser bars, VCSELs, photo diodes, sensors, LED bonding, MEMs, flip chip andmicro optics assembly. Bonding technologies supported by the system include thermocompression, thermosonic, ultrasonic, adhesives, curing and soldering (AuSn, C4, Indium, eutectic).

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Hesse Mechatronics, Inc. on Display at IMAPS 2013

We hear frequently from manufacturers that would like to delve into advanced technologies such as heavy wire and ribbon bonding with specialized materials. However, they don't have access to the advanced equipment needed for application development. Hesse Mechatronics can help - our applications experts are standing by to review your materials, support your application development and even handle small production runs. We welcome you to stop by BOOTH 605 at IMAPS 2013 and learn more about our Early Stage Product Development Services.

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NOVA Integration Solutions, Inc. Joins IMAPS and Exhibits at the 46th International Symposium in Orlando, Florida USA

NOVA integration Solutions (NIS) has recently joined the International Microelectronics Assembly and Packaging Society known as iMAPS, and will be exhibiting (booth 323) at the 46th International Symposium scheduled for September 29, 2013 at the Rosen Center located in Orlando, Florida.

As an engineering-based small business our involvement with iMAPS continues our commitment to provide advanced packaging to the ever expanding microelectronic market place. Our involvement consists of providing the co-engineering and the enabling packaging platform that may be required at the board, chassis and system enclosure level that tend to be unique and require innovative approaches to old problems. Our position to do so is further reinforced by our collaborative relationships with WaveTherm Corporation www.wavetherm.com (heat frames & conduction cooled PCB reference designs) and Rapid Composites, LLC www.rapidcomposites.com (carbon fiber materials).

For more information, please feel free to contact:

NOVA Integration Solutions, Inc., 19 East 17th Street, St. Cloud, FL 34769 | (407) 556-3934 | www.novaintegration.com |
Michael E. Martyniak, VP Marketing | mmartyniak@novaintegration.com | Cell (727) 415-0952

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Be Sure to Visit Interconnect Systems, Inc. (ISI) in Booth # 406

Interconnect Systems, Inc. (ISI) is a leading provider of advanced packaging and interconnect solutions with in-house design, process development, and extensive manufacturing capabilities.  ISI’s breadth of products includes miniaturized FPGA systems, high density modules, IC obsolescence adapters, and standard/custominterconnect solutions. Come visit us in Booth #406, IMAPS Orlando to learn more.

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Palomar Technologies at IMAPS Orlando - Integrating i2Gi™ onto an 8000 Wire Bondery

Integrating i2Gi™ onto an 8000 Wire Bonder
Computer and software performance is vital to maintaining peak production performance, especially for complex hybrid manufacturing. Intelligent Interactive Graphical Interface™ (i2Gi: pronounced “iggy”) was designed to enable application engineers, programmers and operating technicians to work smarter, faster and with more control. Current 8000 Wire Bonders can be upgraded to implement i2Gi through a Bonder Performance Upgrade (BPU). A BPU brings a bonder up to current software, hardware, and computer performance levels. Palomar Technologies offers many upgrades that will transform productivity by adding the latest and greatest features. Read more: http://www.palomartechnologies.com/blog/bid/117451/Integrating-i2Gi-onto-an-8000-Wire-Bonder.

Integration von i2Gi™ in 8000 Ball Bonder
Die Computer- u. Softwareleistung ist daher entscheidend um höchste Produktionsergebnisse vor allem bei der Fertigung von komplexen Hybriden zu erzielen - und genauso wichtig -  zu erhalten. Intelligent Interactive Graphical Interface™  (i2Gi: genannt “iggy”) wurde entwickelt damit Applikationsing., Programmierer u. techn. Bedienpersonal geschickter und schneller kontrolliert arbeiten können. i2Gi kann bei allen derzeitigen Ball Bondern 8000 mittels eines „Bonder Performance Upgrades“ (BPU) nachgerüstet werden. Dieser BPU bringt den Bonder auf den neuesten Stand bezüglich Soft- u. Hardware. Palomar Technologies bietet eine Reihe von Aufrüstsätzen mit allerneusten Funktionen bzw. Eigenschaften an, welche sich unmittelbar auf die Gesamtproduktivität auswirken und diese steigern.  Mehr lesen: http://www.palomartechnologies.com/blog/bid/117930/Integration-von-i2Gi-in-8000-Ball-Bonder-Integrating-i2Gi-onto-an-8000-Wire-Bonder.

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Riv Inc. Thick Film Printing Screens - Visit Them at IMAPS 2013

Riv Inc.  Since 1986 Riv has been a leading manufacturer of high quality Thick Film Printing Screens.  We cater to the Microelectronics, Flex Circuitry, Membrane Switches, RFID, Solar and other related industries.  We strive to help you "Print with Quality".  Using the highest quality mesh available in our industry and most durable emulsion that can hold .002" lines and spaces on a consistant basis.  If your process calls for screens, Riv is here for you.

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Kulicke & Soffa Launches New ACS ProTM Capillary - Hear More During IMAPS 2013

Kulicke & Soffa Industries, Inc. has announced the launch of its new ACS ProTM Capillary, for advanced copper wire bonding applications.

The new ACS ProTM Capillary provides excellent bond-ability control with fine wire diameters. Using advanced material development and an innovative design, the quality and strength of both the 1st (Intermetallic Coverage) and 2nd bond are maintained over the capillary’s usable life.

The ACS ProTM Capillary significantly improves design dynamics, and extends the copper process window with enhancement of process portability and response consistency. The consistent performance of the capillary eases the production fan-out process. The improved wear resistance material used for the new ACS ProTM Capillary also enhances workability to help drive productivity.

Nelson Wong, Kulicke & Soffa’s Vice President, Wire Bond Solutions Business Unit, remarked, “Kulicke & Soffa continues to leverage its strong R&D process knowledge and extensive experience in delivering copper capillaries. With ACS ProTM,customers will benefit from the excellent bond-ability control, consistent performance, while also lowering their cost of ownership. The ACS ProTM is designedto improve copper bond quality and process stability enabling process portability and response uniformity.”

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LORD Corporation's Sears to Present at IMAPS 2013

LORD Corporation – a leading supplier of thermal management materials, adhesives, pottings and encapsulants to the electronics, LED and solar industries – has announced George Sears, Senior Staff Scientist, will present a paper at the 2013 International Symposium on Microelectronics (IMAPS).

The event will take place Sept. 29-Oct. 3 at the Rosen Centre Hotel in Orlando, Fla. Sears’ paper will be presented on Tuesday, Oct. 1 at 10:25 a.m. The presentation is titled “LORD SolderBrace™ Wafer Applied Coating for Improved Reliability and Throughput in WLCSP.”

The presentation will address solder fatigue during thermal cycling and solder joint stress. Sears will present a new material from LORD Corporation – SolderBrace™ wafer applied coating – that can be used to partially underfill the WLCSP die at the wafer level. This type of technology can be applied using existing equipment and processing techniques making these materials a more cost effective solution. This new material technology has enabled thermal cycling reliability improvements by replacing the final passivation layer with a new low CTE material as the partial underfill.

This wafer applied partial underfill material technology has been successfully used to provide increased thermal cycling and drop shock reliability in WLCSPs using a number of different methods. The method to be discussed during the presentation is a production process using a screen printed, photo defined polymer system that does not require any in-process post cure.

Sears has been actively involved in materials development for the automotive and industrial electrical and electronic industries for more than 35 years. He has led groups working on the first vacuum encapsulation of high voltage electrical devices for both consumer electronics and the automotive industries. His teams have developed the first high temperature, low modulus urethane encapsulation for automotive controllers, the first ultra-high thermal interface materials for use in computer processors and the first wafer applied epoxy coating for chip packaging.

He is a graduate in chemistry from the University of North Texas and was the former VP of Technology at Thermoset Plastics. Sears is the holder of several patents and the author of many presentations and articles relating to the electronics industry.

For more information or to register for 2013 IMAPS, visit www.imaps.org.

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Come visit Advanced Dicing Technologies, Inc. at the Orlando, FL exhibition at booth #517

Come visit Advanced Dicing Technologies, Inc. at the Orlando, FL exhibition at booth #517.  We are announcing our new Dicing Saw Series Model’s 7120, 7130, 71TS and 71MD.  In addition we are pleased to announce our America’s expansion with a new full service facility for our West Coast customer’s.  Stop in for details!

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Stop By DuPont Microcircuit Materials Booth in Orlando

DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film and GreenTape(tm) low temperature co-fired ceramic (LTCC) compositions for a wide variety of printed electronic applications in the photovoltaic, display, automotive, biomedical, industrial, military, and telecommunications markets. We deliver solutions that lower the cost of ownership and improve performance, reliability and functionality. For more information on DuPont Microcircuit Materials and Solamet® metallization pastes, please visit http://mcm.dupont.com.

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Be sure to Visit Sefar Inc.

We make screens! Sefar, Inc. is the premier manufacturer of precision electronic screen printing screens. Along side our comprehensive and diversified mesh line, Sefar offers electronics screen fabrication services. Whether you're looking simply for stretched screens, coated or imaged screens or for help with artwork generation, using our 20,000 dpi photo plotter, Sefar can engineer your screen build specifically to your application.

Sefar, Inc. has three US facilities to serve you
-   Buffalo, NY – US Headquarters
-   Ontario, California – Screen fabrication and warehouse
-   Kansas City, Missouri – Screen fabrication and warehouse

More information about Sefar can be found on our website at www.sefar.us or stop by our booth #204 to find out more!

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Visit NAMICS CORPORATION for underfills, encapsulants, adhesives, and more...

NAMICS CORPORATION is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells.  NAMICS subsidiary, DIEMAT, Inc. located in Byfield, MA, is the Namics North American R&D center specializing in the development of innovative thermally conductive adhesives and specialty glasses.  Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore, Korea, Taiwan and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.

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Visit ESL ElectroScience at Booth #808

ESL ElectroScience specializes in providing solutions to enable customers to take technologies from concept through high volume production using thick film pastes and ceramic tapes. ESL products can be found in hybrid microcircuits, multilayer microelectronics, transformers, thick film heaters, sensors, and fuel cells. For more information visit us at www.electroscience.com

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Visit Harrop Industries in Booth # 714

Harrop designs and manufactures a complete line of continuous and periodic tape casters, dryers, burn-off ovens, and kilns to produce ceramic products for laboratory, pilot plant, and industrial applications.  Heat sources can be electric or gas-fired.  Microwave assisted heating is available.  Provide thermal analysis lab services and toll firing.

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Thank you IMAPS 2013 Exhibitors ! Last Chance to Book a Booth

Exhibitor Contact name
Booth
Booth Type
Booth Category
3D Plus USA
Emond Mich
201
10 x 10
Corner
ACM Research, Inc.
Lee Michael
421
10 x 10
In-Line
AdTech Ceramics
Wade Jim
800
10 x 10
In-Line
Advance Reproductions Corp.
Robinson Don
522
10 x 10
Corner
Advanced Dicing Technologies
Eichhorn Mark
517
10 x 10
In-Line
AI Technology, Inc.
Boersig Charlie
400
10 x 10
Corner
Alabama Microelectronics Science & Technology Center
Hamilton Michael
627

10 x 10
Research Corridor

In-Line
ancosys Inc.
Pye Graham
805
10 x 10
In-Line
Besi North America, Inc.
Kok Alice
704
10 x 20
Corner
Ceradyne VIOX, Inc., a 3M Company
Brown Harlan
717
10 x 10
Corner
CeramTec North America
Christensen Robert
307
10 x 10
In-Line
Coining Inc., an Ametek Company
Virissimo David
319
10 x 10
In-Line
Colorado Microcircuits, Inc.
Thalman Gary
315
10 x 10
In-Line
Conductive Containers Inc. (CCI)
Loggins Tom
313
10 x 10
In-Line
CVInc.
Collier Terence
317
10 x 10
In-Line
Deweyl Tool Inc..
Palmer Johanna
316
10 x 10
In-Line
DuPont Microcircuit Materials
Vernon Joan M
520
10 x 10
In-Line
East China Research Institute of Microelectronics
Wang Tony
311
10 x 10
In-Line
Element Six Technologies US Corp.
Obeloer Thomas
308
10 x 10
In-Line
Endicott Interconnect Technologies, Inc.
Orband James
200
10 x 10
Corner
ENrG, Inc.
Olenick John
215
10 x 10
In-Line
Epoxy Technology, Inc.
McCabe Joseph D
622
10 x 10
Corner
ESL ElectroScience
Chambers Drew
808
10 x 10
Corner
F & K Delvotec, Inc.
Nelson Kris
405
10 x 20
Corner
Ferro Corporation
Stadnicar Edward
615
10 x 20
In-Line
Finetech, Inc.
Gerard Adrienne
508
10 x 10
Corner
Fraunhofer Institute for Ceramic Technologies and Systems IKTS
Pohontsch Fanny
526

10 x 20
Research Corridor

Corner
Fraunhofer Institute for Reliability and Microintegration IZM
Weigelt Georg
426

10 x 20
Research Corridor

Corner
Gannon & Scott
Conway Raymond
207
10 x 10
In-Line
Geib Refining Corporation
Gervais Michael T
609
10 x 10
In-Line
General Metal Finishing Co., a unit of Precision Engineered Products
Chatfield Stephen
310
10 x 10
In-Line
Georgia Tech 3D Systems Packaging Research Center
May Karen
727

10 x 10
Research Corridor

Corner
Haiku Tech, Inc.
De Moya Martin I
417
10 x 10
Corner
Harrop Industries, Inc.
Timmel Paul
714
10 x 10
In-Line
Hary Manufacturing Incorporated
Hary Paul
500
10 x 10
Corner
Heraeus Thick Film Division
Yin Yin
504
10 x 20
Corner
Hesse Mechatronics, Inc.
Bubel Joseph S
605
10 x 20
Corner
Hi-Rel Laboratories, Inc
Devaney Roger M
612
10 x 10
In-Line
IBM Microelectronics Division
Hochlowski Barry
418
10 x 10
In-Line
Indium Corporation
Cruz-Griffith Victoria
409
10 x 10
Corner
Infinite Graphics
Maitland Pete
206
10 x 10
Corner
Interconnect Systems, Inc.
Andrews Abby
406
10 x 10
In-Line
Kulicke & Soffa Industries, Inc.
Frese Sheila
705
10 x 10
Corner
Kyocera America, Inc.
Labadie Iris
616
10 x 10
In-Line
LINTEC of America
Campbell Stuart
521
10 x 10
In-Line
LORD Corporation
Greig Jim
600
10 x 20
Corner
Metallix Refining, Inc.
Woolley Micki
618
10 x 10
In-Line
Metalor Technologies
Imhof Howard
807
10 x 20
Corner
Micro Hybrid Dimensions, Inc.
Spradlin Greg
414
10 x 10
In-Line
MicroScreen LLC
Wise Wallace Holly
523
10 x 10
Corner
Micross Components
Smith Scott
721
10 x 20
Corner
Midas Technology, Inc.
Towl Kenneth
803
10 x 10
Corner
Minco Technology Labs, LLC
Cooper Kristi
309
10 x 10
In-Line
Mini-Systems, Inc.
Tourgee Craig
412
10 x 10
In-Line
NAMICS Corporation
Jensen Richard C
611
10 x 10
In-Line
Natel Electronic Manufacturing Services, Inc.
Angeloni James A
505
20 x 20
ISLAND
Neu Dynamics Corp.
Johnson Don
712
10 x 10
In-Line
Newport Corporation
Medernach Jon
416
10 x 10
In-Line
NorCom Systems, Inc.
Aubertin Chris
613
10 x 10
In-Line
Nordson DAGE
Kardjian Aram
701
10 x 10
Corner
NOVA Integration Solutions, Inc.
Martyniak Michael
323
10 x 10
Corner
nScrypt, Inc.
Brownell Beth
716
10 x 10
Corner
NTK Technologies, Inc.
Stoops Mariel
719
10 x 10
In-Line
Oneida Research Services, Inc.
McEwen James
422
10 x 10
Corner
Pacific Trinetics Corporation
Meshkin Neda
621
20 x 20
ISLAND
Palomar Technologies, Inc.
Sylvester Jessica
511
10 x 20
Corner
Perfection Products, Inc.
Vickery John
515
10 x 10
In-Line
Photofabrication Engineering, Inc.
Grande Judy
318
10 x 10
In-Line
Plasma-Therm, LLC
Messineo Nancy
111
10 x 20
ISLAND
Polysciences, Inc.
Gidzinski Ashley
620
10 x 10
In-Line
Prince & Izant Co.
Faulhaber Nancy
105
10 x 10
Corner
Quik-Pak, San Diego
Nunes Jennifer
518
10 x 10
In-Line
Reldan Metals Co.
Whitaker Kathleen
305
10 x 10
Corner
Riv, Inc.
Keefe Tania M
700
10 x 10
Corner
Royce Instruments, Inc.
Cox Diane
516
10 x 10
Corner
Rudolph Technologies
Pauling Amy
519
10 x 10
In-Line
Sales and Service, Inc.
Winn Chris
314
10 x 10
In-Line
SANTIER Thermal Management Solutions
Loomis Tom
420
10 x 10
In-Line
Sefar, Inc.
Potratz Christine
204
10 x 10
Corner
Semi Dice, Inc.
Minter Darin
707
10 x 10
In-Line
Semiconductor Equipment Corporation
Moore Donald I
410
10 x 10
In-Line
Sikama International, Inc.
Skeen Phil
816
10 x 10
Corner
SMART Commercialization Center for Microsystems
Apanius Matt
626

10 x 10
Research Corridor

Corner
Sonoscan, Inc.
Lykowski Janet
709
10 x 10
Corner
Souriau PA&E
Kalkowski Rick
610
10 x 10
Corner
SST International
Wilson Bruce A
304
10 x 20
Corner
Stellar Industries Corp.
Snook John B
401
10 x 10
Corner
TDK Corporation
Lambeth Sara
804
10 x 10
Corner
Technic, Inc.
Roza Drew
205
10 x 10
Corner
Teledyne Microelectronic Technologies, Inc.
Fletcher Sharon
501
10 x 10
Corner
Torrey Hills Technologies, LLC
Zhang Joyce
408
10 x 10
In-Line
Towa Corporation
Tripp Lloyd
312
10 x 10
In-Line
Trebor Instrument Corp.
Grzesiak Margaret
404
10 x 10
Corner
Tresky Corporation
Weil Allen
708
10 x 20
In-Line
UTZ Technologies
Guidi Kristian
817
10 x 10
In-Line
West Bond, Inc.
Straight Randy
300
10 x 10
Corner
XYZTEC
Haley Tom
423
10 x 10
Corner
Zeon Corporation
Shoulders Kimberly
419
10 x 10
In-Line
Booth Count: 118
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:: Job Openings ::

Application & Support Specialist - Semiconductor/SMT

Growing Semiconductor/SMTequipment manufacturer. 

Join our Eastern North America sales and support team, based out of Manchester, NH. 

Responsibilities include:

  • Equipment demonstrations, application and process support for potential and existing customers.
  • Technical liaison with factory for all aspects of customer orders.
  • Equipment installations, all aspects of technical support, repairs and training.
  • Help maintain a small demonstration lab and demo equipment.

Requirements

  • 5+ years of experience in Semiconductor / SMT equipment operation & support.
  • Specific experience with die bonding equipment and advanced packaging is strongly desired.
  • Confident hands-on equipment operation and troubleshooting.
  • Includes varied travel typically up to 40%, with adaptability to schedule changes. Will involve travel primarily in Eastern N. America. Occasional travel to customer sites and tradeshows all over North America, as well as factory in Germany.
  • Must be self motivated and thrive within a small company “can do" atmosphere with minimal supervision. The ability to multi-task and take initiative is a must.
  • Excellent interpersonal and communication skills are essential.
  • Strong PC and organizational skills assumed.

About us:

Finetech offers innovative equipment solutions for nearly every kind of rework or micro assembly challenge, including the latest advanced packages. Come check us out:  http://www.finetechusa.com

Submit resumes to:  jobs@finetechusa.com

We thank all applicants in advance for their interest; however, only those applicants who are being considered for an interview will be contacted.

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View the Corporate Bulletin Archives

 

EPP
F&K Delvotec
RGL Enterprises

 


:: Issue 145 ::
September 4, 2013

Torrey Hills Technologies

Oneida Research Services

Metallix

Petroferm

LORD Corporation