NEWS | JOBS | FAST LINKS

MST

:: Corporate Member News ::

THANK YOU IMAPS 2013 ORLANDO EXHIBITORS & SPONSORS!

 

:: Natel EMS on Display at IMAPS 2013 and Presenting Supplier of the Year Awards (full story)

:: Heraeus is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders to the hybrid microelectronics industry (full story)

:: Visit Metalor Technologies at Booth #807 to discuss Best in Class Gold, Silver, PGM Products, Precious Metal Powder and Flakes (full story)

:: Visit Micross Components on the Exhibit Floor or During their Industry Tour Highlighting Two Facilities in Orlando (full story)

:: Visit Hesse Mechatronics, Inc. in Orlando (full story)

:: Rudolph Tech. Introducing the NSX 320 Metrology Series, a combined 2D and 3D inspection and metrology system for advanced packaging applications (full story)

:: Kulicke & Soffa Launches New IConnPS ProCu PLUSTM And IConnPS ProCu PLUSTM LA Copper Wire Bonders (full story)

:: Stellar Industries Corp. at Booth #401 (full story)

:: Metallix Refining, Inc. on Display at IMAPS 2013 - Booth #618 (full story)

:: NOVA Integration Solutions Introduces a New Product Known as Enclosure Evaluation Service (E-Squared) (full story)

:: From the Palomar Blog (full story)

:: Indium Corporation Features High-Reliability Gold-Based Solders at IMAPS (full story)

:: Precision Engineered Products - Visiting IMAPS Orlando? Please see us at booth #310 (full story)

:: Minco Technology Labs. Exhibiting at IMAPS 2013 (full story)

:: Quik-Pak’s OmPP Packages (full story)

:: Visit Abington Reldan Metals, LLC at Booth #305 (full story)

:: ZEON Announces Development of two Innovative Packaging Materials - Learn More at Booth #419 (full story)

:: PEI's Lids and Covers for Microelectronic Applications (full story)

 

Applied Materials

:: Job Openings ::

:: Sikama Looking for Manufacturers Rep in Florida (full story)

:: Application & Support Specialist - Semiconductor/SMT (full story)

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver
Micross Components: CORPORATE Sponsor
Sikama - GBC Forum/Reception Sponsor
LORD - IMAPS Cafe Sponsor

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


Natel EMS on Display at IMAPS 2013 and Presenting Supplier of the Year Awards

Natel Electronic Manufacturing Services, Inc. - the leading manufacturer of LTCC/AlN Multilayer Substrates and Packages; RF/Microwave MIC(s), Hybrids, MCM's and Higher Level Assemblies for the Defense, Aerospace, Medical, RR/Microwave, Fiber Optic/Optoelectronic, Telecommunications and Test & Measurement Industries - will be on display at IMAPS 2013 Orlando in booth #505.

Premier Platinum Sponsor NATEL EMS will also recognize 13 of its best suppliers Monday evening with its Natel supplier of the Year awards during IMAPS 46th annual International Symposium. The awards presentation will be held at the Rosen Centre Hotel in Orlando, FL during the Welcome Reception, Monday, September 30, 2013.

“The Supplier of the Year award winners represents a partnership, dedication and commitment to consistently perform above expectations. This has played an important role in Natel’s success,” said Sudesh Arora, President of Natel EMS. “ We appreciate the efforts of these suppliers and look forward to a mutually beneficial continued relationship in the future.”

The awards recognize the significant contributions of Natel suppliers as part of the company’s product and performance achievement. The winners represent Natel’s view, as the best the microelectronics/electronics industry has to offer in innovative technology, superior quality, outstanding launch support, crisis management and competitive total enterprise cost solutions.

The suppliers of the Year winners are chosen by the Natel team of
purchasing, engineering, quality, manufacturing and logistics executives.

 

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Heraeus is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders to the hybrid microelectronics industry

Heraeus, IMAPS 2013 Premier Gold Sponsor, is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders to the hybrid microelectronics industry.  Featured this year are new products to showcase our commitment to push new technologies.  Some of the products we will be highlighting are our new materials sets for heater circuit construction for both low and high temperature heaters, a variety of conductors for use with AlN substrates and also a line of copper pastes for constructing circuits where high thermal and electrical conductivity are required. The Cu based pastes are designed to use simple thick film processing of high conductivity Cu for high power electronics. Come visit us at booth #504 in Orlando.

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Visit Metalor Technologies at Booth #807 to discuss Best in Glass Gold, Silver, PGM Products, Precious Metal Powder and Flakes

Metalor Technologies is proud to be the IMAPS 2013 Premier Silver Sponsor.  Metalor’ s Advanced Coatings Division has a number of competitive advantages in the market place: best in class gold, silver and PGM products and a Technology leader in Precious Metal powders and flakes. Metalor is positioning itself as a one-stop-provider of a comprehensive range of Precious Metal focused Products and Services for the Semiconductor, Die Attach, PV, Printed Electronics, Medical, Automotive, Connector and Lead Frame market segments.

We invite you to visit the Metalor booth, # 807, to discuss how we can be of service with your applications and business goals!

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Visit Micross Components on the Exhibit Floor or During their Industry Tour Higlighting Two Facilities in Orlando

Corporate Sponsor Micross Components will be exhibiting at IMAPS 2013 Orlando in booth #721. Micross will also provide a valuable industry tour that will highlight two of their facilities in Orlando.

Micross Components is a leading global provider of distributed and specialty electronic components for military, space, medical, and demanding industrial applications. Operating as a single source for high reliability and state of the art electronics, Micross’ solutions range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 35+ year heritage, Micross possesses the design, manufacturing and logistics expertise needed to support an application from start to finish.

The plant tour is set for Wednesday, October 2: bus leaving Rosen Centre at 11:30am and returning by 2:00pm (subject to change). Pre-registration is limited to 50 people, and will close on September 25. Contact Brian Schieman at bschieman@imaps.org if you wish to attend the tour.

The Micross Tour is open to US Citizens ONLY. Students and industry professionals are welcome to participate. Micross will manage the approved attendee list and communicate with registrants as the tour approaches.

Micross Components

 

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Visit Hesse Mechatronics, Inc. in Orlando

You probably know Hesse Mechatronics for developing and manufacturing the finest equipment in the world for thin wire and heavy wire wedge bonding. Did you know we also provide industry-leading wire bonding training and applications support? 

We have been busy developing our top-notch wire bonding team—and facilities—to serve you for all of your training and applications needs. Allan Camp joined us in June 2012 as technical training manager. Mike McKeown joined us this April as senior business development manager. Together Allan and Mike bring you the benefit of more than fifty years experience in microelectronic packaging technologies. We also recently opened our newest Training and Applications Lab and now have four convenient locations from coast to coast to serve you.

Please stop by and see us at IMAPS BOOTH 605 to learn more about how we can help you succeed in meeting your wire bonding challenges.

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Rudolph Tech. Introducing the NSX 320 Metrology Series, a combined 2D and 3D inspection and metrology system for advanced packaging applications

As advanced packaging process control becomes critical to manufacturers’ success and ability to compete, the NSX® Metrology Series offers a cost-effective and powerful solution for high volume manufacturers seeking defect inspection and metrology from a single, trusted supplier. Built on the foundation of the NSX Defect Inspection Series, the new NSX Metrology Series incorporates traditional defect inspection capability from the flagship NSX 320 System with fast, precise 3D measurements for a total defect inspection and metrology solution. Utilizing Tamar Technology’s precision metrology technology, the system provides thickness measurements for photoresist and polymers along with height and depth measurements for bumps, RDL traces and etched surface areas. Visit www.rudolphtech.com or Rudolph booth 519 for more information.

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Kulicke & Soffa Launches New IConnPS ProCu PLUSTM And IConnPS ProCu PLUSTM LA Copper Wire Bonders

For Copper Today, PLUS Tomorrow
Kulicke & Soffa Industries, Inc. has announced another extension of its highly successful K&S Power SeriesTM. The Company’s new Copper Wire Bonders, IConnPS ProCu PLUSTM  and IConnPS ProCu PLUSTM  LA, with proprietary upgraded and enhanced subsystems, is engineered to handle even the most challenging, leading edge copper bonding demands.

The new IConnPS ProCu PLUSTM and IConnPS ProCu PLUSTM  LACopper Wire Bonders come with the new ProCu5 process, which offers the highest level of Copper Process capability. The ProCu5 process enables robust copper wire bonding production for advanced wafer nodes below 28 nanometer.

The IConnPS ProCu PLUSTM  Copper Wire Bonder offers the standard 80mm bondable area with field upgradeability to an 87mm option. The IConnPS ProCu PLUSTM  LA model comes with a factory configured bondable area of 87mm.

Nelson Wong, Kulicke & Soffa’s Vice President, Wire Bond Solutions Business Unit, remarked, “Customers can rely on K&S in helping meet the process challenges of copper wire bonding at advanced silicon nodes.  As the global leader of the wire bond industry, K&S is committed to providing our customers with reliable, cutting-edge technology solutions that add value to their businesses. Our R&D team continues to innovate and develop new process techniques to improve portability, stability and reliability, offering our customers a cost of ownership advantage and high confidence in our products.

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Stellar Industries Corp. at Booth #401

50 Howe Avenue
Millbury, MA  01527
Phone 508-865-1668
Fax 508-865-5016
E-mail    snooky@stellarind.com

Stellar Industries Corp. announces a new developing process of Directly Bonding Copper {DBCu} to AlN material.  Thermal Management can now be addressed using our ‘patent-pending’ processes.  For more details, please contact us directly Toll free # 877-840-1884 or e-mail: sales@stellarind.com

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Metallix Refining, Inc. on Display at IMAPS 2013 - Booth #618

Environmental Health & Safety for Precious Metal Refining

Metallix Refining, Inc., has announced the release of its corporate social responsibility overview. The article discusses the environmental health & safety policies that are designed to protect the environment, reduce liability for customers and worker safety during the precious metal refining process.

“Scrap precious metals can be encased in tough materials, which may require use of chemical or thermal reduction processes to recycle and refine. Because of this, we take every precaution that must be made to ensure that the materials can be processed in a safe and environmentally sound manner,” said Metallix Refining, Inc. EH&S manager, John Forestell. “We understand the risks associated with recycling precious-metal-bearing scrap, and take our responsibility to protect our team and the environment seriously.”

Metallix works with the Environmental Protection Agency (EPA), Occupational Safety and Health Administration (OSHA), and International Standards Organization (ISO) to ensure that its policies directly comply with national and international standards of excellence.

In their latest article, Environmental Health & Safety: Metallix Refining–A Corporate Social Responsibility Overview, Metallix discusses the following topics:

  • Employee health and safety, including process training and medical check-ups.
  • Responsible neutralization of harmful gases and particulate capture.
  • Compliance with environmental rules and regulations.

For additional information about Metallix Refining, Inc., and their environmental health & safety procedures visit the EHS Department page on the Metallix Refining website, or contact them at 800-327-7938

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NOVA Integration Solutions Introduces a New Product Known as Enclosure Evaluation Service (E-Squared)

NOVA Integration Solutions, Inc. (NIS), known in the industry for their advanced electronic packaging, is announcing a new product offering known as their Enclosure Evaluation Service (AKA: E-Squared). Michael Martyniak, VP of Marketing states, “Many of our customers are experiencing enclosure problems and need a technology update. They may run too hot, weigh too much, have mechanical problems and often need an updated power supply. Our new product offering is intended to evaluate the enclosure and to detail these problems together with a comprehensive recommendation to implement the remedies.”

The new product offering is ideal for those customers who have a problematic chassis and are fearful on taking any next steps due to legacy issues with older equipment. Limited personnel resources are often assigned to higher priority projects leaving these problematic systems unattended and without remedy. Martyniak continues, “As a custom packaging specialist, NIS is ideally suited to “E-Square” the enclosure and will work in a co-engineering relationship with our Customers to deliver the needed solution.”

NIS will perform a full mechanical, electrical and thermal review of your enclosure to determine where it can benefit from any change or improvement. A broad range of Finite Element Analysis (FEA) simulations will be performed using our SolidWorks 3D analysis tool set to determine performance under routine and load conditions. Results are provided in a clear easy to interpret format.

Download product data sheet (PDF)

For further information, inquiries should be directed to:

NOVA Integration Solutions
Michael Martyniak, VP of Marketing
19 East 17th Street, Saint Cloud, FL 34769
mmartyniak@novaintegration.com, (407) 556-3934, www.novaintegration.com

 

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From the Palomar Blog

Integrating i2Gi™ onto an 8000 Wire Bonder
Computer and software performance is vital to maintaining peak production performance, especially for complex hybrid manufacturing. Intelligent Interactive Graphical Interface™ (i2Gi: pronounced “iggy”) was designed to enable application engineers, programmers and operating technicians to work smarter, faster and with more control. Current 8000 Wire Bonders can be upgraded to implement i2Gi through a Bonder Performance Upgrade (BPU). A BPU brings a bonder up to current software, hardware, and computer performance levels. Palomar Technologies offers many upgrades that will transform productivity by adding the latest and greatest features. Read more: http://www.palomartechnologies.com/blog/bid/117451/Integrating-i2Gi-onto-an-8000-Wire-Bonder.

Understanding the Relationship between Semiconductors, SMT, and Microelectronics
Today’s mainstream electronics manufacturing consists mainly of semiconductor packages and SMT processes. These two together make up the vast majority of readily acknowledged devices from cell phones to PC’s, tablets, and laptops. Even smart high-end toasters leverage these two technologies. These products also end up in automobiles, stereos, TV’s, and remote controls. A lesser known technology, however, is working its way into both of these markets – microelectronics. Read more: http://www.palomartechnologies.com/blog/bid/117936/Understanding-the-Relationship-Between-Semiconductors-SMT-and-Microelectronics

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Indium Corporation Features High-Reliability Gold-Based Solders at IMAPS

Indium Corporation will feature high-reliability gold-based solders at the International Symposium on Microelectronics (IMAPS) September 30 – October 3 in Orlando, Florida.

Gold-based solders provide superior thermal fatigue resistance, resistance to corrosion, and the highest tensile strength of any solder. They also have high melting points that are compatible with subsequent reflow processes.

Gold-based solders are ideal for use in high-reliability applications, such as medical products, aerospace, defense, package sealing, optics, and specialty MEMS packaging. They can be used in a variety of soldering applications, including vacuum solder, die-attach, laser soldering, vapor phase reflow, and manual soldering.

RoHS-compliant gold-based solders come in several forms, including preforms, ribbon, wire, paste, and spheres.

Additionally, Indium Corporation has some of the most experienced and knowledgeable technical support engineers in the industry. These engineers are available to work with you to support material evaluation, process upgrade, or new product introduction.

Indium Corporation will be exhibiting in booth 409.

For more information about gold-based alloys, visit http://www.indium.com/gold or email gold@indium.com.

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Precision Engineered Products - Visiting IMAPS Orlando? Please see us at booth #310

We are excited about exhibiting at IMAPS 2013 and would welcome the opportunity to speak to you about your specification plating and electropolishing needs. Stop by our booth to see how we can help with your most challenging requirements. We look forward to seeing you.

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Minco Technology Labs. Exhibiting at IMAPS 2013

HERMETICITY LAB SERVICES:

Minco’s Fine & Gross leak testing service for hermetically packaged semiconductor devices relies on the use of Krypton – 85 Radioisotope, a tracer gas, and the Radiflo® process. This highly sensitive method, initially developed in 1955 and benefiting from continuous enhancements and simplification of isotope handling, has delivered to the industry a highly accurate, sophisticated method for performing hermeticity validation testing. This method provides the benefit of being extremely fast, while providing improved leak rate detection to <10-12 atm cc/sec. Additionally, the Radiflo® process is currently one of very few methods which will perform both Fine & Gross leak, while mitigating risk for test escapees associated with Fluorocarbon masking. It therefore is considered a preferred method for components being sourced to critical Aerospace, Military and Medical platforms, including all components supplied to MIL-STD-750 and components supplied to MIL-STD-883 Class K & S. The Radiflo® process is listed as a “Reference-Standard” by the Defense Logistics Agency.

TEST PROCEDURE:

Devices to be tested for hermeticity are placed into a specialized test chamber, pressurized with purified dry air and small amounts of the Radioisotope, Kr85 gas. This pressurized radioisotope tracer condition is specified by the Krypton – 85 equation, which determines the pressure limit and length of bomb time based on the device’s cavity size and desired reject leak rate. After completion of the pressurization cycle, the devices are removed from the Radiflo® pressurization tank and taken to a counting station which utilizes a scintillation crystal to detect extremely small quantities of Kr85. If detected, the count will be registered, and based on the customer desired reject leak rate, a pass/fail criteria registered.

TECHNOLOGY:

Krypton – 85 is a radioactive inert gas that emits weak gamma rays and beta particles. The detectability of the gas is millions of times greater than the detection of helium in a mass spectrometer leak test; thus much shorter bomb times, greater accuracy with no negative impact issues due to use of fluorocarbon liquids as part of a Gross leak test. Additionally, test accuracies of extremely small cavities are improved for fine leak detection due to the properties of the tracer gas, thereby reducing risk that a fine leak device has escaped due to loss of helium contained within the ultra-small cavity prior to detection.

SUPPORTED TEST STANDARDS:

MIL-STD-750
Test Method: 1071.10
Test Conditions: A, B, G2 and GT

MIL-STD-883
Test Method: 1014.14
Test Conditions: B1, B2 and B3

MINCO SERVICES:

We currently provide our Radiflo® process on many of the standard hermetic semiconductor packages. Standard lead-times are currently one week but for our customer’s convenience, we can offer three day expedited services. Minco also offers our Radiflo® process on many additional standard & custom packages; please contact your sales professional for a quotation. For other packaging options including high I/O leaded devices and non-standard footprints please consult the factory.

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Quik-Pak’s OmPP Packages

Improve Time-to-Market for Design Engineers
For design engineers who need to validate the performance of their devices as quickly as possible, Quik-Pak’s OmPP packages (Open-mold plastic packages) provide a cost effective solution. These production quality open molded QFN and SOIC packages are available in a variety of outlines and can be assembled with your device in 24 hours or less.

Some of the advantages of Quik-Pak’s OmPP include:
• A vast array of open tooled packages meeting JEDEC standard outlines are kept in stock.
• Matching ceramic, plastic, and glass lids with epoxy seals are available.
• RoHs and REACH compliant "Green" molding compound used.
• Gold plated packages with superior bondability.
• Air cavity or encapsulation sealing options are offered with assembly services.
• Custom packages with unique body sizes and lead counts can be provided.

For more information regarding Quik-Pak’s Open-molded Plastic Packages., visit www.icproto.com or contact 1-858-674-4676.

Come visit us at Booth 518 during the IMAPS International Symposium on Microelectronics in Orlando

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Visit Abington Reldan Metals, LLC at Booth #305

Abington Reldan Metals, LLC refinery has been operating and handling precious metal scrap for over 30 years. Our New State of the Art facility is a LEED Certified e-Stewards Precious Metal Refiner and Recycler in the United States. The facility is also ISO 14001:2004 certified, zero-discharge, R2 certified, Chwmeg reviewed and ITAR registered.

The facilities sustainability initiative is to constantly look for ways to improve the environmental impacts. Over 70% of the energy used is from renewable energy. All water efficiency efforts have combined to reduce water consumption by 43.2% compared to standard buildings. As a recycler, it was important to integrate this philosophy in the building and our site. We have the capabilities to handle all types of scrap using various methods such as pyrometallurgical, hydrometallurgical, mechanical reduction, melting as well as others. We understand the different types of materials in the market place and know how to utilize the most efficient processes for Maximizing Value from Precious Metal Scrap.

Visit us at booth 305

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ZEON Announces Development of two Innovative Packaging Materials - Learn More at Booth #419

ZEON CORPORATION and Zeon Chemicals L.P. have developed two innovative state-of-the-art packaging materials:

1) “Ultra-Low Loss Build-Up Film” used for Build-Up substrate for IC packages, GPU, WLP, Si Interposer and any application requiring superior electrical properties, and

2) “Ultra-Low Loss PCB Materials” low loss laminate for both high k and low k applications such as milliwave radars, high speed servers and circuits, and RF/mobile applications for technology leading devices.

”Ultra-Low Loss Build-Up Film” provides high density, high speed, and reliable IC or GPU packages with properties such as low CTE, 4/4um L/S, low dielectric constant, low loss tangent, and low moisture absorption. In addition, it allows forming very fine copper lines on high smooth surfaces, with its Ra is around 70nm while maintaining superior peel strength performance.

”Ultra-Low Loss PCB Materials”  Both prepreg and Copper clad laminate are available to form multilayer printed circuit board with the strength of extremely low loss tangent, high modulus, 20/20um or even less L/S with ultra-smooth surface, and either high or low dielectric constant depending on the desired application. The low k variety is ideal for high performance servers, as well as milliwave applications where conventional products fall short either in signal integrity or challenges in high cost processing. The high k version is an ideal replacement for LTCC where high performance and miniaturization are roadmap items.

For further information regarding Ultra Low Loss Build Up Films or PCB Materials, call the number listed above, or visit

www.zeon.co.jp/business_e/enterprise/imagelec/imagelec.html.

 

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PEI's Lids and Covers for Microelectronic Applications

PEI specializes in manufacturing step lids, flat lids, domed lids and covers to hermetically seal high-reliability microelectronic devices using resistance welding.  We offer standard lid sizes and shapes to meet almost every common specification.  If you prefer, send us your existing file or drawing.  Or you can design your own custom lid by submitting the form at http://www.photofabrication.com/lid-generator-access.


Base materials: 

  • Kovar (Etching-grade iron-nickel-cobalt ASTM F-15, MIL-I-23011C, Class 1 alloy)
  • Nickel alloys
  • Stainless steel
  • Cold rolled steel
  • Titanium
  • Aluminum

Plating and finishing options:

  • Gold plate (MIL-G-45204B Type III, Class I or II)
  • Electrolytic nickel plating on steel, copper and copper alloys, and zinc and zinc alloys. (per QQ-N-290); watts nickel and sulfamate plating
  • Electroless nickel  (per MIL-C-26074)
  • Selective plating available upon request
  • Etched logos, part numbers, or serialization available upon request

PEI provides lids and covers to the microwave, aerospace, hybrid/OEM, defense/military, telecommunications/data communications, medical product manufacturing, and related industries. Our extensive history in producing microelectronic package components has made us one of the leading suppliers to microelectronic and semiconductor manufacturers. We can provide lids with moisture getters and absorbers, which greatly increase the product life span.

All of our products are made in the USA, and PEI guarantees the highest quality, short lead times and quick response to customer needs. PEI’s manufacturing/quality control processes also meet or exceed MIL-STD-45662,MIL-STD-105, and ANSI/SQC Z1.4 standards.  For more information, visit our web site at www.photofabrication.com, e-mail sales@photofabrication.com, or contact Photofabrication Engineering, Inc., 500 Fortune Boulevard, Milford, MA  01757, 508-478-2025, fax 508-478-3582.

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:: Job Openings ::

Sikama Looking for Manufacturers Rep in Florida

Sikama Intl www.sikama.com is looking for a Manufacturers Rep. The open territory is Florida and Puerto Rico. Are you a star performer? Do you live in Florida and have experience selling capital equipment? If you’d like to be part of our team please call or email Phil Skeen phil@sikama.com or Sig Wathne s.w@sikama.com at 805-962-1000.

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Application & Support Specialist - Semiconductor/SMT

Growing Semiconductor/SMTequipment manufacturer. 

Join our Eastern North America sales and support team, based out of Manchester, NH. 

Responsibilities include:

  • Equipment demonstrations, application and process support for potential and existing customers.
  • Technical liaison with factory for all aspects of customer orders.
  • Equipment installations, all aspects of technical support, repairs and training.
  • Help maintain a small demonstration lab and demo equipment.

Requirements

  • 5+ years of experience in Semiconductor / SMT equipment operation & support.
  • Specific experience with die bonding equipment and advanced packaging is strongly desired.
  • Confident hands-on equipment operation and troubleshooting.
  • Includes varied travel typically up to 40%, with adaptability to schedule changes. Will involve travel primarily in Eastern N. America. Occasional travel to customer sites and tradeshows all over North America, as well as factory in Germany.
  • Must be self motivated and thrive within a small company “can do" atmosphere with minimal supervision. The ability to multi-task and take initiative is a must.
  • Excellent interpersonal and communication skills are essential.
  • Strong PC and organizational skills assumed.

About us:

Finetech offers innovative equipment solutions for nearly every kind of rework or micro assembly challenge, including the latest advanced packages. Come check us out:  http://www.finetechusa.com

Submit resumes to:  jobs@finetechusa.com

We thank all applicants in advance for their interest; however, only those applicants who are being considered for an interview will be contacted.

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View the Corporate Bulletin Archives

 

EPP
F&K Delvotec
RGL Enterprises

 


:: Issue 146 ::
September 17, 2013

Torrey Hills Technologies

Oneida Research Services

Metallix

Petroferm

LORD Corporation