NEWS | JOBS | FAST LINKS

Heraeus TFD

Amkor

:: Corporate Member News ::

:: New technology considered the future of precious metals recycling (full story)

:: Tod Sladek Joins Hesse Mechatronics to Support Advanced Wire Bonding Process Development (full story)

:: Amkor Technology Receives Intel’s Preferred Quality Supplier Award (full story)

:: Interconnect Systems, Inc. (full story)

:: AI Technology, Inc. Increases Manufacturing Capacity of Advanced 10 Micron Wafer Level Die-Attach Film (DAF) (full story)

:: Kulicke & Soffa Launches IConnPS PLUS™ and IConnPS PLUS™ LA (full story)

:: i3 Electronics, Inc. Wins New Printed Circuit Board QTA Opportunity (full story)

:: Job Openings ::

:: Micross Components - Product Line Manager (full story)

:: Micross Components - Quality Assurance Manager (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

METALLIX REFINING
i3 Electronics
Interconnect Systems Inc.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


New technology considered the future of precious metals recycling

Precious metals refinery, Metallix Refining Inc., is proud to announce the launch of their new and unique advanced precious metals recycling furnace known as APR³.

Uniquely crafted, APR³ is the only precious metal recycling furnace of its kind. APR³ is specifically designed to meet the challenge of improving the processing of valuable “burnable” precious metal bearing scrap such as wipes & jars, pastes, filters, vacuum bags, and much more.

“We understand that certain types of scrap precious metals are too sensitive for the standard refining processes and need to be handled carefully.” says Maria Piastre, Sales Manager at Metallix, “That is why we (Metallix) designed APR³ to properly process these materials in our controlled nitrogen infused, oxygen starved, turbulent free furnace to minimize precious metal losses.”

Additionally, Metallix’ APR³ employs the most sophisticated air pollution control system that protects the environment.

For a more in depth look into how Metallix’ new APR³ technology can benefit your recycling needs, visit MetallixRefining.com/APR3 to watch their educational 3-D animated video today.

 

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Tod Sladek Joins Hesse Mechatronics to Support Advanced Wire Bonding Process Development

Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, recently announced that Tod Sladek has joined the company as Applications Engineer, Advanced Process Development & Demonstration.

In his new role, Tod will support Hesse Mechatronics’ customer requirements for advanced thin and heavy wire and ribbon bonding applications, demonstrate, install and maintain the company’s wire bonding equipment and train customers to operate and maintain their wire bonders.

Tod has over 30 years of experience with extensive expertise in test design and analysis, and backend semiconductor equipment technology. Prior to joining Hesse Mechatronics, Tod was with Orthodyne Electronics as senior field applications engineer.

“We are very pleased that Tod has joined our team,” said Joseph S. Bubel president of Hesse Mechatronics, Inc. “His expertise and track record for providing top notch support are a perfect fit for our customers’ advanced wire bonding requirements.”

Customers may contact Mr. Sladek by email at tod.sladek@hesse-mechatronics.us or by phone at (408) 436-9300.

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Amkor Technology Receives Intel’s Preferred Quality Supplier Award

Amkor Technology, has announced that it has been recognized as one of 18 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2013.  Amkor has demonstrated industry-leading commitment across all critical focus areas on which we are measured: quality, cost, availability, technology, customer service, labor and ethics systems and environmental sustainability. Amkor was recognized for their significant contributions in providing Intel with wafer probe, wafer bump, assembly, and final testing services that were deemed essential to Intel’s success.

"Amkor is pleased and honored to receive Intel's prestigious Preferred Quality Supplier Award," said John Stone, Amkor's executive vice president, global sales and marketing.  "Amkor and Intel have worked together for nearly 30 years and we deeply value this relationship.  This award is a result of the close collaboration between our companies and our ability to consistently meet Intel's high standards."

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Interconnect Systems, Inc.

Interconnect Systems, Inc. delivers molded multi-component modules (MMCMs) for miniaturized, rugged applications. This new MMCM product line improves cost and reliability for custom applications within a wide range of industries including military, telecom, aerospace, automotive and high performance computing.

MMCM solutions consist of bare or packaged die and passive electronic components overmolded with thermoset epoxy. These modules can be used as a rugged system in package, replacements for obsolete ICs, or high density memory modules. The use of thermoset epoxy to encapsulate the assembly provides good protection to withstand extreme heat, vibration, shock, and moisture for operation in harsh environments. In addition, overmolding prevents chemical exposure to components and reduces stress from thermal expansion. 

For more information, please visit:
http://www.isipkg.com/products/modules-and-adapters/molded-multi-component-modules

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AI Technology, Inc. Increases Manufacturing Capacity of Advanced 10 Micron Wafer Level Die-Attach Film (DAF)

AI Technology, Inc. (AIT has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices. 

Since the 1990’s, AIT has been known for manufacturing high performance die-attach film adhesives for stacked chips of over 20 layers with military reliability.  Now, AIT’s engineering team has successfully implemented an advanced automated line of DAF manufacturing and advanced PLC control for even better control of thickness and higher capacity.  This adoption of a higher capacity line under a clean room environment represents AIT’s commitment to provide the best products for its semi-conductor customers domestically as well as those located in Asia.  AIT’s new manufacturing line for DAF is able to make DAF for the newer 450mm wafer technology that will become more important in coming years.

Picture of 10 micron thick DAF for 450mm wafer applications.

AIT’s scientists created DAF, like the ESP7660-HK and ESP8660-HK series in response to market needs for higher glass transition temperature to allow for faster wire-bonding at temperatures as high as 250°C and molding operation up to 200°C.   AIT’s ESP7660-HK and ESP8660-HK also improve the reliability of larger devices of stacked chips with polymer molecular engineering which absorbs the interfacial stress of bonding.  Additionally, AIT’s ESP7660-HK and ESP8660-HK offers improved film integrity before tacking and curing.   With these developments, AIT was the first to produce 8-10 micron insulating DAF consistently for even the largest wafer dimension of 450mm.  For power devices requiring silver filled conductive DAF, AIT’s ESP8660-HK has been proven to work with thicknesses of 20 microns.

AIT’s DAF is used for various Commercial and Military applications such as in medical, RF and MW devices, as well as in stacked chip assemblies for memory devices.  For many applications very thin DAF is required to meet stacked chip heights in dense packages.  For example, in RF and MW devices the thickness of the DAF is critical to reach higher frequency signals required in many current applications.  In some cases very thin DAF is required to increase the thermal conductivity between the heat sink and the device.  However, if the film adhesive becomes too thin, voids are formed which produces poor wet out and decreased bond strength and electrical performance.   AIT’s DAF is not only thin but is formulated to be VOID-FREE so that bond strength, thermal conductivity and electrical performance perform as well or better than they do in much thicker films.

 

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Kulicke & Soffa Launches IConnPS PLUS™ and IConnPS PLUS™ LA

Kulicke and Soffa Industries, Inc. has announced the launch of the IConnPS PLUS™ and IConnPS PLUS™ LA, the Company’s latest leading edge fully automatic wire bonding equipment offering.

With upgraded and enhanced subsystems, the IConnPS PLUS™ machines are engineered to deliver all the capability needed for wire bonding today PLUS tomorrow.  The bonders were designed with new capabilities and enhanced features focusing on five key areas: process robustness, production portability, ease of use, strong hardware performance, and upgradeability. The IConnPS PLUS™ LA is the large area version which extends the bondable area to 87mm.

Nelson Wong, Vice President, Wire Bonding Solution Business Unit, said, “The five key areas that the IConnPS PLUS™ focuses on have made significant hardware improvements that sync well with advanced features to enhance user experience and deliver productivity improvements.  The IConnPS PLUS™ extends the Company’s position as the market leading provider of wire bonding solutions.”

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i3 Electronics, Inc. Wins New Printed Circuit Board QTA Opportunity

i3 Electronics, Inc. has announced that it has won a  new Printed Circuit Board (PCB), Quick Turnaround (QTA) opportunity from   a multinational semiconductor and communications company. i3’s PCB QTA operation will manufacture the PCBs, which contain micro vias and multiple subs, in only 15 days.

“i3’s QTA operation provides a distinct advantage to our customers and  allows them a rapid time to market for their products. i3 is fabricating  some very advanced PCBs at expedited cycle times,” said Jim Thornton, VP of Fabrications at i3.

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:: Job Openings ::

Micross Components - Product Line Manager

Job Description: Product Line Manager
Location: Hatfield, PA
Department: Sales
Reports To: General Manager of the Micross US Electromechanical division
Supervises: 5 – 7 reports

Job Summary:
Lead sales and marketing for the US Electromechanical division (EMC), which includes inside and outside sales personnel handling revenue generation, account management, customer service, pricing, and forecasting. Leverage strong strategic and analytical skills to understand market dynamics and production costs to devise an effective pricing strategy by channel and institute the requisite pricing controls. Work with the Manufacturing Manager to understand production capacity to effectively and dynamically manage quoted lead times – recognizing different quote turnaround and production lead times required by each product line/customer segment. Interface with customers on new business development. Cooperate with Process Engineering to solve customer issues, drive efficiency improvements, and develop new product/service offerings. Interact with the UK EMC division on trans-Atlantic service and technology transfers and sales activity. Matrix-report to Micross’ national Director of Sales to deploy an integrated “go to market” company strategy and CRM. Play a leadership role in successfully integrating sales and other functions from Micross’ Tempe, AZ facility into Hatfield, as the two locations are combined; including the evaluation, repositioning, and potential transfer of current personnel and recruiting of a PA-based outside sales resource. Devise and monitor commercial metrics including: new customer identification, customer retention, quote turnaround time/accuracy, quote win/loss ratios (overall and by channel), actual vs. quoted delivery times, and yield/quality standards.

Job Duties:

  • Manage all EMC sales resources (inside and outside sales representatives, strategic account managers, and customer service) to meet sales goals and grow profitability.
  • Evaluate sales and sales support personnel and provide training/recruit replacements to ensure EMC has the strongest sales team in the industry for its budget.
  • Maintain a viable outside sales force utilizing manufacturer’s representatives and normal distribution channels.
  • Provide necessary direction, resources, and training for the outside sales force to adequately represent the division/company to customers.
  • Ensure the outside sales force efforts and direction are coordinated with the inside sales support staff.
  • Provide a direct line of communication from the field to the factory.
  • Demonstrate the ability to interface with internal and external technical personnel.
  • Coordinate with Corporate Marketing to create new EMC marketing and promotional materials.
  • Champion a customer-centric culture within EMC.
  • Promote an agile sales force with quick-turn quoting capability for transaction-heavy service businesses.
  • Analyze divisional P&L to drive pricing and sales strategies.
  • Provide sales and pricing oversight and assistance for satellite operations in Austin, TX and Clearwater, FL.
  • Assist Micross’ Director of Sales with strategic and tactical business aspects of EMC sales and marketing, plus contribute to the sales growth for all Micross products and services.
  • Lead the EMC presence at trade shows.
  • Coordinate activities with manufacturing to meet the needs of and commitments to customers.
  • Track quote activity... provide win/loss report.
  • Track and report monthly bookings.
  • Participate as a member of the site’s senior management team.
  • Streamline sales support processes and document work instructions.
  • Implement customer surveys, as required within the Quality Management System.

Job Qualifications:

  • BS/BA from a fully accredited institution or equivalent work experience, MBA highly desirable.
  • Minimum of 5 years experience in outside sales and marketing management, including pricing and sales strategies.
  • Experience working in the electronics industry, preferred.
  • Experience within the military/aerospace industry, preferred.
  • Proven strategic and commercial skills.

Job Skills:

  • Demonstrated strengths in customer management... high “EQ”
  • Team player who can multi-task effectively in a fast-paced, lean environment… prior experience with private equity is a real plus.
  • Proven leadership and people development skills.
  • High-energy, results-focused self-starter with the capability to implement change.
  • Superior verbal and written communication skills.
  • Strong analytical ability and decision-making.
  • Excellent organization and planning skills.
  • Computer skills (spreadsheets and ERP system).
  • Ability to understand technical drawings.
  • Knowledge of MIL-Specs/Stds, ITAR, and export regulations.
  • Ability to travel extensively when necessary.

Salary and benefits commensurate with qualifications and experience.

Contact:
Stephen Tang, General Manager
Stephen.tang@micross.com

About Micross:
Micross Components is a leading global provider of specialty electronics solutions for defense, space, medical and demanding industrial industries. As a single-source supplier of advanced high-reliability electronics, we manufacturer and distribute a wide range of products, including integrated circuit and discrete bare die and wafers; passive components, distinctive devices such as solid state batteries and SiC devices; standard and custom packaged devices; and a comprehensive list of services spanning assembly, test, and mechanical component modifications.

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Micross Components - Quality Assurance Manager

Job Description: Quality Assurance Manager
Location: Hatfield, PA
Department: Operations
Reports To: General Manager of the Micross US Electromechanical division
Supervises: ~10, through 3 direct reports

Job Summary:
Provide strategic quality leadership and programs to ensure that the facility’s AS9100 registered Quality Management System is implemented, executed, and monitored. Direct, evaluate, and control the activities of the QA function (including production and office staff) to assure its work is accurate, timely, efficient, and compliant with company policies, industry standards, and government/military regulations. Proactively partner with the manufacturing and process engineering teams to continually improve operations through real time process control and lean manufacturing techniques. Work with the inside sales/customer service team to ensure timely completion of inspection to support on-time customer delivery and quality. Play a leadership role in successfully integrating the processes from Micross’ Tempe, AZ facility into Hatfield’s QMS, as the two locations are combined.

Job Duties:

  • Maintain, enhance, and enforce the facility’s AS9100 registered QMS:
    • Primary interface with registrar for AS9100 (and ISO9001).
    • Prepare for and lead the annual audit and close out findings in the allotted timeframe.
    • Maintain the division’s Quality Manual. Ensure the company’s Quality Policy is understood throughout the facility and that appropriate data is collected to support performance to the policy.
    • Lead quarterly management review meetings of the QMS, track performance metrics, and implement resulting corrective actions.
    • Define and maintain the division’s contract review system.
    • Maintain the quality records system.
    • Conduct internal department audits and external audits of suppliers/vendors.
    • Maintain CAPA system and continual improvement efforts.
    • Maintain document control system, including: work instructions, internal procedures, training records, tooling drawings, customer drawings/specifications, and industry/military standards.
    • Direct divisional training and certification program, performing training, as required. Partner with manufacturing team to ensure operators are properly trained and documented.
    • Maintain calibration control, ensuring equipment status is properly identified.
  • Supervise the work of quality assurance inspectors for production and receiving and office staff, who are responsible for measurement, analysis, and improvement including calibration control, preventive maintenance, process audits, and quality record maintenance and storage.
  • Lead customer interaction with regard to onsite audits, desk surveys, material returns, corrective actions and compliance issues such as REACH, RoHS, and conflict metals.
  • Collaborate with process engineering and manufacturing teams to identify root cause of quality issues. Execute product quality improvements through preventive or corrective actions.
  • Lead supplier interaction with regard to audits and incidents. Drive supplier quality improvements.
  • Ensure the containment or other control of nonconforming material.
  • Provide quality leadership and documentation support for ISO9001 and ANSI/ESD 20:20 registered satellite operations in Austin, TX and Clearwater, FL.
  • Collaborate with the Manufacturing Manager to institute a system for generating Certificates of Compliance at the time of test with quality sign-off for verification.
  • Support and adhere to annual plan for staff, expenses, and capital equipment to meet divisional goals and quality needs.
  • Participate as a member of the site’s senior management team.
  • Chair the material review board.
  • Primary interface with DLA and other authorities.
  • Provide technical assistance and support to manufacturing personnel and other departments, as needed.

Job Qualifications:

  • BS in engineering or physical sciences from a fully accredited institution or equivalent work experience.
  • Minimum of 5 years of quality assurance management/supervision in a manufacturing environment.
  • Minimum of 2 years experience working in an electronics manufacturing facility, preferred.
  • Experience within the military/aerospace industry (or other highly regulated industry), preferred.
  • Experience with process improvement and SPC, preferred.

Job Skills:

  • Team player who can multi-task effectively in a fast-paced, lean environment while maintaining quality standards.
  • Proven leadership and people development skills.
  • High-energy, results-focused self-starter with the capability to implement change.
  • Strong analytical ability and decision-making.
  • Excellent organization and planning skills.
  • Computer skills (spreadsheets and ERP system).
  • Ability to understand technical drawings.
  • Knowledge of MIL-Specs/Stds, ITAR, and export regulations.
  • Experience with AS9100 and ESD facilities, preferred.

Salary and benefits commensurate with qualifications and experience.

Contact:
Stephen Tang, General Manager
Stephen.tang@micross.com

About Micross:
Micross Components is a leading global provider of specialty electronics solutions for defense, space, medical and demanding industrial industries. As a single-source supplier of advanced high-reliability electronics, we manufacturer and distribute a wide range of products, including integrated circuit and discrete bare die and wafers; passive components, distinctive devices such as solid state batteries and SiC devices; standard and custom packaged devices; and a comprehensive list of services spanning assembly, test, and mechanical component modifications.

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

 

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:: Issue 155 ::
April 15, 2014

Metallix

Torrey Hills Technologies

Oneida Research Services

Petroferm

BIOSENSORS 2014