Heraeus TFD


:: Corporate Member News ::

:: Spinning Gold (and Other Precious Metals) from No-longer-useful Products - at Gannon & Scott (full story)

:: Indium Corporation’s Andy Mackie Named President of IMAPS Empire Chapter (full story)

:: News from Crane Aerospace & Electronics (full story)

:: Latest News from Heraeus (full story)

:: Kyzen Introduces Its Latest Concentrated Aqueous Stencil Cleaner (full story)

:: XYZTEC has Recently Released Their W12 Multi-function Bond Tester (full story)

:: Master Bond Introduces New Catalog on Adhesives, Sealants and Coatings for the Electronic Industry (full story)

:: Nordson EFD Introduces Updated ValveMate Controller for Exceptional Spray Valve Control (full story)

:: LORD MicroStrain® Announces Series of Enhancements to SensorCloud™ Data Platform (full story)

:: STATS ChipPAC’s Encapsulated Wafer Level Chip Scale Package (eWLCSPTM) Delivers Superior Quality Benefits (full story)

:: Torrey Hills and Hengli Named as Finalist in the 2014 Golden Bridge Awards for Their NASA Endorsed Conveyor Belt Drying Furnace (full story)

:: Novel High Temperature Large Area Underfill with Proven Stress Absorption from AIT (full story)

:: News from Ziptronix (full story)

:: Job Openings ::

:: AEM has few immediate openings for two R&D engineers and few technicians - Contact Pacific Rim Engineering (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Canon USA

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

Spinning Gold (and Other Precious Metals) from No-longer-useful Products - at Gannon & Scott

CLEANING UP: Gannon & Scott is finding that its environmentally oriented business practices are in line with many industries, and support its growth plans. Pictured above at the company’s new $8 million processing facility in Cranston are, from left, company Executive Vice President and Chief Financial Officer John King, plant manager Brian Walker, President John Gannon and Engineering & Compliance Manager Matthew Fischer.
By Sarah Parsons  - Contributing Writer

Gannon & Scott Inc.’s business strategy can be summed up in two words: green growth.
Over the past 15 years, the precious metal recycler has expanded to two states, significantly grown its customer base and adopted a number of initiatives to make its operations more environmentally friendly. Most recently, Gannon & Scott opened a new $8 million dollar facility that will double the company’s processing capacity.

“Our approach is to go from being a local and regional service provider to being one of national and international capability,” said John King, Gannon & Scott’s chief financial officer. “Many large companies can now take advantage that we are bicoastal, can operate on a large scale and operate in an environmentally compliant fashion.”

Indeed, the refiner has come a long way since its inception in 1919. The family-owned, Rhode Island-based business initially catered mainly to the jewelry industry, harvesting precious metals like silver, gold and platinum from industrial waste materials. But in recent years, the company has focused on scaling up its operations – and its customer base.

In 2001, Gannon & Scott acquired a 42,000-square-foot refining facility in Phoenix, with the extra space and processing power allowing the company to expand beyond its traditional customer base. According to Dave Deuel, Gannon & Scott’s senior vice president of administration, the company now receives industrial material from equipment manufacturers from the automotive, medical, glass and computer industries; electronic wholesalers; jewelry manufacturers; other refiners; and more. After pulling out the precious metals contained within the industrial waste, the company harvests other metals, including copper and nickel, and sells them to primary refiners, or smelters. Any additional waste materials are compressed down and reused as filler for construction materials, roadways and other purposes.

“Everything gets reused in some way,” said Joe Peixoto, plant manager at Gannon & Scott. “We’re processing 100 percent of their material.”

After success with the Arizona plant, Gannon & Scott again set its sights on expansion. After five years of planning, the company just opened the doors of its second Rhode Island location, an $8 million, 93,000-square-foot facility in Cranston. Leaders say the expansion will increase the company’s workforce by about 20 percent and double its processing capacity.
“We’ve expanded our capabilities, which allows us to do more business,” said Ken Dionne, Gannon & Scott’s CEO.

The company’s leaders have specific requirements, though, in how they aim to do that additional business. Gannon & Scott’s motto is “Doing it Right” – and that means doing it green.

Staff members are quick to point out that Gannon & Scott’s entire business model is built on an environmentally friendly premise. “Our whole service is recycling and reclaiming,” said King. Over the past three years – even before the launch of the new Cranston facility – the precious metals refiner diverted more than 7.5 million pounds of waste from landfills.

The green commitments do not end there. The company invested in high-tech pollution-control technologies at both its Arizona and Cranston facilities. According to Peixoto, these pollution controls result in a zero-discharge process. So while the plants rely on thermal reduction – a fancy phrase for burning – to reclaim precious metals from industrial materials, all of the emissions generated during the process are captured and eliminated.

The company is also beginning to invest in renewable energy. The new Cranston plant features a $1 million solar array – a set of roughly 1,200 solar panels spanning one acre of the facility’s rooftop. The panels produce 406 kilowatts of electricity, enough to power about 50 houses for an entire year. While Gannon & Scott won’t use this solar power to fuel its own operations, it will sell it back to the grid to help provide clean power to the local community.

“Our company is focused on doing it green and doing it right,” said King. “We try to be conscious about our technologies.”

These green initiatives inevitably create environmental benefits – such as curbing air pollution and combating climate change. But leaders at Gannon & Scott are also finding that their environmentally minded practices benefit their own bottom line.

For example, the company plans to sell the solar power it produces back to the grid at a guaranteed rate for at least the next 15 years. This contract allows the company to offset its costs while generating “clean” energy for the local community.

Some customers are also seeking out Gannon & Scott’s services because of the company’s commitment to environmental stewardship.

“Initially it’s a tough sell, because [investing in green technologies] does cost a little bit more to operate, so we need to charge a little bit more to our customers,” said Dionne. “But when you explain the difference and larger corporations understand what that means, they’re willing to pay the small amount of extra fees.”

“Many corporations now have their own standards for green,” said King. “Our practices fit in with a lot of the evolving corporate standards outside of our industry.”

With three facilities under its belt, leadership at Gannon & Scott is now focusing on keeping the company moving forward.

“We’re continuing to expand our customer base, and we need to fill our new facility up and keep it going well,” said Peixoto. “And we’ll constantly continue to expand upon that.”



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Indium Corporation’s Andy Mackie Named President of IMAPS Empire Chapter

Indium Corporation announces that Andy C. Mackie, Ph.D., MSc, has been named president of the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS).

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

Dr. Mackie’s responsibilities as president include coordinating all activities for Empire Chapter members and organizing local technical meetings, tours, and networking activities with the members, corporate members, and universities and labs in the region. The Empire Chapter hosts meetings throughout upstate N.Y., including Binghamton, Corning, Syracuse, and Rochester. Dr. Mackie will also play a key role in helping organize the Nanotechnology International Workshop.

“We’re honored to have Dr. Mackie, who is a forward thinking individual dedicated to the advancement of microelectronics, join us as an organizational leader within the IMAPS community,” said Michael O’Donoghue, executive director of IMAPS. “Dr. Mackie’s endless commitment to learning will, no doubt, be of great value as president of our Empire Chapter.”

Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Andy has a doctorate in physical chemistry from the University of Nottingham, UK, and a Master of Science (MSc) in colloid and interface science from the University of Bristol, UK. Additionally, he is formally trained in Six Sigma – Design of Experiments.



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News from Crane Aerospace & Electronics

Interpoint® Products selected by JPL for Mars 2020
Crane Aerospace & Electronics announced that they have recently been awarded a multi-million dollar contract to supply power converters for the Mars 2020 mission. The contract was awarded by the Jet Propulsion Laboratory (JPL) in Pasadena, California. According to Ed Fuhr, Vice-President of Power Solutions, “We are very pleased with this contract selection and proud of our proven heritage on previous Mars missions.”

JPL will use a variety of space dc-dc converters and filters including the popular SMRT product, which features a built-in EMI filter, independent outputs and the ability to adjust the output voltage. Other models to be used include SLH, SMSA, SMHF, SMTR and SMFL as well as three different EMI filter models. The previous Mars rovers Opportunity, Spirit and Curiosity, have all used Interpoint space qualified dc-dc converters. Interpoint converters are available with a variety of screening options up to MIL-PRF-38534 Class K and a variety of radiation hardness assurance (RHA) options up to RHA R, 100 krad(Si) at both high and low dose rates.

JPL manages the Mars 2020 Project for NASA's Science Mission Directorate in Washington. The California Institute of Technology in Pasadena manages JPL for NASA. The 2020 mission will build on the achievements of Curiosity and other Mars missions, and offer opportunities to deploy new capabilities developed through investments by NASA's Space Technology Program, Human Exploration and Operations Mission Directorate, and contributions from international partners.

Steve Barr appointed Vice President, Electronics Group Operations
Crane Aerospace & Electronics has announced the appointment of Steve Barr as Vice President of Operations of the Electronics Group of Crane Aerospace & Electronics. In his role, Barr is responsible for Operations and Supply Chain for all of Electronics Group locations, including Beverly, Massachusetts, Chandler, Arizona, Ft. Walton Beach, FL, Redmond, WA, West Caldwell, New Jersey and Kaohsiung, Taiwan. He will be located in Redmond, WA.

Barr comes to Crane with a diverse background in many industries such as electrical distribution equipment, power generation and defense contracting. This included roles with companies such as Danaher, Cummins Engine Company and Hunter Defense Technologies. His career has progressed from Engineer to General Management.
Barr holds a Bachelor of Industrial Engineering from Cleveland State University and an Executive Master of Business from Case Western Reserve, Weatherhead School of Management. He is a certified Six Sigma Black Belt.

Mark Rohricht appointed Vice President, Human Resources of Electronics Group
Crane Aerospace & Electronics has announced the appointment of Mark Rohricht as Vice President of Human Resources of the Electronics Group of Crane Aerospace & Electronics. In this role, Rohricht will report directly to Bob Tavares, President of Crane Electronics Group. Rohricht will be responsible for Human Resources for all of the Electronics Groups locations including Beverly, Massachusetts, Chandler, Arizona, Ft. Walton Beach, FL, Redmond, WA, West Caldwell, New Jersey and Kaohsiung, Taiwan. His primary location will be Redmond.

Rohricht comes to us with an extensive background in Human Resources to include Organizational Design, Leadership Development and International Human Resources. He has been with Healthways for the last ten years serving two primary roles: the Vice President of Leadership & Organizational Development as well as the Vice President, International Human Resources. Prior to Healthways, Rohricht worked in various leadership roles at Kimberly-Clark Corporation including leading HR for one of K-C’s larger manufacturing sites.

Rohricht received his Bachelor of Arts double major in Economics and Psychology from Lawrence University in Appleton, Wisconsin and his PhD in Industrial and Organizational Psychology from the University of Tennessee.

Rockwell Collins Selects Crane Aerospace & Electronics ATRU for reliable power conversion on Embraer E-2
Crane Aerospace & Electronics, Power Solutions, will be supplying the Auto-Transformer Rectifier Unit (ATRU) to provide reliable power conversion for the Rockwell Collins Horizontal Stabilizer Control Unit (HSCU) supplied to Embraer. The HSCU will be utilized on the Embraer E2 E-Jet family of medium range aircraft, with introduction planned by 2018.

Ed Fuhr, Vice President Power Solutions for Crane Aerospace & Electronics said, “We are very pleased to have been selected by Rockwell Collins as a trusted partner and supplier of power conversion for their HSCU, and we are proud to be onboard the next generation of Embraer E-Jet.”

Crane’s ATRU is an AC-DC multi-pulse ATRU with power factor correction. The ATRU converts 115 VAC, 400 Hz, 3-phase input power to ± 135 Vdc, providing conversion efficiency of over 95% at a continuous load of 1.5kW.


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Latest News from Heraeus

Heraeus' Comprehensive Alternatives to Meet RoHS and REACH Requirements
Since the early 2000s, Heraeus has been a leader in RoHS-compliant and Pb-free materials. As the first company to market with Pb-free Hybrid systems, Heraeus continues this trend with the introduction of Pb-free resistors. Heraeus has also developed a line of Pb-free conductors for automotive applications that do not require the use of hazardous materials.

With the new SVHC list under the REACH regulations, Heraeus has already implemented a process that ensures all future product developments be made completely Pb-free, RoHS-compliant, and REACH-compliant.

In addition, Heraeus' compliancy department is dedicated to providing customers with the most up-to-date information on requirements and regulations in the Thick Film market. We have both the systems and the products that will work for you to meet your compliance needs.

Heraeus is ready to answer all of your questions related to our products and RoHS and REACH regulations. Please contact your local sales representative with any questions.

Heraeus offers a complete line of Pb-free and REACH/RoHS-compliant thick film material systems to meet customers' needs. Photograph courtesy of Norbitech AS

Heraeus' Policy on Conflict Minerals
As a family-owned company with more than 150 years of tradition, Heraeus is committed to the principle of sustainability. This is evident through the Heraeus Code of Conduct and by joining the United Nations Global Compact. The choice and control of Heraeus' suppliers, especially in precious metal trading and sourcing critical raw materials, is of key importance for a business focused on sustainability.

Our Sourcing Policy emphasizes developing and reshaping the already existing principles for the choice and control of suppliers, in particular for our precious metal trading and recycling businesses. Heraeus' worldwide efforts are focused on ensuring that precious metals come from legitimate, ethical sources, and that they have not been associated with crime, armed conflict or human rights abuse.

Heraeus will not tolerate any misrepresentation of taxes, fees and royalties paid to governments for the purposes of extraction, trade, handling, transport and export of precious metals. Establishing business relationships with suppliers that act against those principles is not tolerated.

In our continued effort to practice conflict-free operations, Heraeus successfully passed an independent third-party audit, confirming compliance with the London Bullion Market Association (LBMA) Responsible Gold Guidance - the international trade association that represents the wholesale over-the-counter market for gold and silver bullion. Read more information about the audit here.

Heraeus' focus on sustainability ensures that its precious metals and raw materials are sourced from legitimate, ethical sources.


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Kyzen Introduces Its Latest Concentrated Aqueous Stencil Cleaner

Kyzen introduces AQUANOX® A8820 Advanced Aqueous Stencil Cleaner. A8820 is an engineered Micro Cell Technology (MCT™) cleaning fluid designed to remove wet solder paste and uncured chip bonder adhesive from stencils used in surface mount printing processes.

AQUANOX® A8820 effectively removes common solder pastes and fluxes, and demonstrates a favorable compatibility profile with stencil cleaning systems. It works well with spray-in-air and select ultrasonic cleaning machines, and is effective on uncured adhesives. Additionally, the no-foaming property of A8820 is compatible with all materials commonly used in electronic assembly manufacturing and cleaning processes.

Kyzen’s AQUANOX® A8820 has been designed from the ground up for the tough challenges of cleaning no-clean, lead-free residue from small, 1005 apertures while being compatible with modern nano-coatings as well as with all of the modern offline cleaning equipment that is popular in the industry. A8820 is a quick drying product that also is rapidly rinsed if water rinsing is preferred. “Developed by Kyzen’s world-class Research & Development group, this is truly a modern product for the modern challenges facing our customers,” said Tom Forsythe, Kyzen’s Vice President. “This increased performance adds real value with better prints and modern, green technology that is better for the environment.”

AQUANOX® A8820 is available in one, five, and 55 gallon containers. In addition to A8820, Kyzen offers a full line of precision cleaning chemistries that meet any cleaning challenge.

Kyzen® and AQUANOX® are registered trademarks in the United States and other countries.


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XYZTEC has Recently Released Their W12 Multi-function Bond Tester

This tester is ideally suited for testing 300mm wafers.


  • Precision shear testing and Cold Bump Pull (CBP)
  • Bump sizes down to 20µm
  • XY mapping coordinates key in function
  • Grading run functionality
  • Easy positioning, alignment
  • High resolution cameras with high and low magnifications
  • Fastest throughput of wafer bump testing in the world
  • 500mm X-stage and 370mm Y-stage, throat depth 400mm
  • Integrated report editor and flexible data export
  • Reach 100% of the 300mm wafer without repositioning the wafer on the chuck
  • Blower and vacuum tool cleaning unit
  • Wafer chuck with safety interlocks and 360 degree rotation
  • Wafer carrier mechanically locked when vacuum is turned on
  • Complies with JEDEC JESD22-B117A, JEDEC JESD22-B115 and JEITA EIAJ ET-7407 standards
  • Also suitable for 200mm (8 inch) and other wafer sizes
  • 24 bit ADC resolution, 10kHz sampling frequency
  • Compatible with Revolving Measurement Unit (RMU) and single heads
  • Unparallelled 0.075% accuracy

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Master Bond Introduces New Catalog on Adhesives, Sealants and Coatings for the Electronic Industry

New, easy to read, 32 page catalog offers performance and processing data on Master Bond’s extensive line of epoxy, silicone, polyurethane, silicate based and light curing compounds. These products provide solutions to PCB assembly, die-attach, conformal coating, surface mount, lid sealing, chip and wire bonding applications. Convenient, efficient and reliable packaging options are also reviewed.

Products are available as liquids, pastes, films and preforms. Electrically insulative, thermally conductive and electrically conductive grades are listed. Pertinent mechanical, electrical, thermal and chemical resistant properties are shown. Additionally, information is provided on viscosity, cure speed, working life, color, etc.This catalog is available for immediate download in PDF format or in print. They can be requested at

Master Bond Catalog Library
Master Bond features convenient, user friendly catalogs for the medical industry, oil and chemical processing and electronic applications. Request copies or download digital versions at

Phone: +1-201-343-8983
Fax: +1-201-343-2132

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Nordson EFD Introduces Updated ValveMate Controller for Exceptional Spray Valve Control

Conveniently Program Radial Spray and Radial Spinner Systems

Nordson EFD introduces the 7160RA ValveMate™ controller. The controller provides an intuitive way to program Nordson EFD's 782RA internal Radial Spray Valve and 7860C-RS Radial Spinner System. The controller's unique microprocessor circuitry provides exact time control of the dispense cycle with an improved user interface.

"The valves used for dispensing are very important, but it is the controller that actually drives the consistency and reliability of the dispensing process," said Claude Bergeron, Nordson EFD global product line manager. "ValveMate controllers provide the primary control of the deposit size. They bring fluid dispensing control close to the dispense valve and provide numerous user-friendly features that simplify valve set-up and operation, maximizing automated assembly machine efficiency and convenience."

The ValveMate 7160RA controller is a fast, convenient way to make on-the-fly adjustments for Radial Spray or Radial Spinner system applications. Spray or dispense valve open time can be adjusted in increments as small as 0.001 seconds. For Radial Spray installations only, an air pressure regulator provides low-volume, low-pressure (LVLP) air to the nozzle, providing a high transfer efficiency without overspray. The result is an exceptional spray pattern definition without time-consuming programming or mechanical adjustments that could shut down the production line.

Nordson EFD's 782RA Radial Spray valve is a precision spray valve that produces a narrow radial output ideal for coating the interiors of cylinders using a rotating air cap. LVLP technology enables uniform coatings of lubricants, primers, and other low- to medium-viscosity fluids. When paired with the ValveMate 7160RA's built-in air pressure regulator, specially atomized nozzle air ensures high transfer efficiency without overspray. Instant fluid cutoff at the end of the spray cycle ensures that coatings are applied evenly from start-up to shutdown.

Similarly, Radial Spinner Systems apply consistent bands of low- to medium-viscosity fluids, such as lubricants, solvents, and silicone oils. During operation, the system dispenses a controlled amount of fluid onto a spinning disk. As the fluid leaves the edge of the disk, it is evenly distributed onto the production part. When controlled by the ValveMate 7160RA, the process combines precision with convenience to facilitate radial dispensing applications.

For more information visit Nordson EFD on the web at,, or, email, or call +1 401.431.7000 or 800.556.3484. For Nordson EFD LLC sales and service in over 30 countries, contact Nordson EFD or go to


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LORD MicroStrain® Announces Series of Enhancements to SensorCloud™ Data Platform

LORD Corporation MicroStrain® Sensing Systems has announced enhancements to its SensorCloud™ cloud-based sensor data platform (

Introduced in 2011, the SensorCloud™ platform is a unique sensor data storage, visualization, and remote management platform that leverages powerful cloud computing technologies to provide excellent data scalability, rapid graphing, and user-programmable online analytics. It is currently used by numerous LORD MicroStrain® customers across a variety of industries and disciplines, including aviation, defense, oil & gas, and manufacturing.

The new SensorCloud™ platform features are designed to significantly enhance users’ productivity and were largely driven by customer suggestions. Among the highlights:

  • Shared views of user data including embeddable FastGraph® charts, which provide simple embeddable graphs for web sharing of data with just one line of html code
  • OEM white label options (including both customized, embedded FastGraphs® and a full, standalone version)
  • MathEngine® iPython notebooks—real-time, cloud-based, data analytics platforms
  • GitHub repository with SDK\API\Example code and RESTful API, which allows any device or application to upload data to SensorCloud™. The API is implemented as a web service using standard HTTP request commands.
  • SensorCloud™ API, including libraries and example code for Python, Java, and C#

“We’re very pleased to offer our customers these great enhancements to our award-winning SensorCloud™ platform,” says Justin Bessette, LORD MicroStrain’s Manager of Software Engineering. “These new features will make SensorCloud™ users even more productive due to its improved ease-of-use and data collaboration tools for sharing data. When combined with MathEngine®, the SensorCloud™ data platform brings custom analytics to the cloud for a complete, end-to-end Internet of Things (IoT) solution.”

LORD MicroStrain® is also introducing a simplified pricing model for its SensorCloud™ data platform, including a complimentary “start now” option, which includes 10 million data points of storage per month.

Through its Sensor IoT platform, SensorCloud™ allows users to employ LORD MicroStrain's Wireless Sensor Data Aggregator (WSDA®) to directly and securely upload wireless and inertial data to the cloud. The Custom Alerts feature keeps users informed on their data 24/7 with email and SMS messaging options, and the ability to add custom information including time, threshold values, and links to the event data, helps set SensorCloud™ platform apart.

“We’re confident these features will be a game-changer for prospective SensorCloud™ platform users,” says Bessette. “The API and the CSV import tool allow users to upload their own data, making it easier than ever to immediately start experiencing the benefits.”

Call 1-802-862-6629 or email for product inquiries. To view the new features and for more information, visit


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STATS ChipPAC’s Encapsulated Wafer Level Chip Scale Package (eWLCSPTM) Delivers Superior Quality Benefits

STATS ChipPAC has announced new quality benefits for fan-in wafer level packaging made possible by its encapsulated Wafer Level Chip Scale Package (eWLCSPTM) solution. The combined benefits of superior quality, lower cost structure and the ease of conversion through a drop-in replacement have led to a strong demand for eWLCSP and an accelerated adoption across its customer base. 

An intrinsic feature of eWLCSP is the thin polymer casing formed on the back and four sidewalls of the die, providing mechanical robustness and resistance to chipping, cracking and handling damage as well as improved long term reliability compared to traditional bare die WLCSP. Mechanical damage has been an ongoing quality concern for WLCSP technology, necessitating special processes such as back side coating and additional inspection steps to manage outgoing quality and ensure a defect free product. As the industry transitions to more advanced silicon (Si) node products, the fragile, exposed Si structure in traditional WLCSP is expected to become an even greater concern. These issues are addressed with eWLCSP technology.

The encapsulation material that is a natural part of STATS ChipPAC’s FlexLineTM manufacturing process is used to form the protective polymer casing for the eWLCSP package. This provides mechanical and optical protection for the bare die, both during shipping and handling as well as socket insertion for electrical test. In addition to eliminating localized damage such as chipping and cracking, eWLCSP provides a measurable increase in overall component strength. Bulk mechanical testing of eWLCSP has revealed an increase in component break strengths of more than 50% over traditional WLCSP structures.

For more information, please visit


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Torrey Hills and Hengli Named as Finalist in the 2014 Golden Bridge Awards for Their NASA Endorsed Conveyor Belt Drying Furnace

Torrey Hills Technologies, LLC (THT) and Hengli Eletek, Co. Ltd were jointly named as a finalist for the 6th annual 2014 Golden Bridge Awards under the New Products and Services from all over the world category for their innovative model AST1003-0304N drying furnace. NASA, one of the earliest customers to take advantage of this pioneering furnace technology, endorsed THT/Hengli's entry into the Awards.

Concerned about the negative impacts of modern manufacturing on the environment, the Hengli/THT team invented a new volatile organic compound (VOC) removal / thermal oxidizing system for their model AST belt furnace. Connected to the furnace exhaust, this ground-breaking VOC removal system eliminates VOC emissions to outside air. Widely used in electronics manufacturing as solvents that are dried on a belt furnace and exhausted into the air, VOCs are one of the top causes for smog. The electronics manufacturing process contributes a significant portion of VOCs to air pollution, yet no other furnace manufacturers have approached this issue. By designing and implementing a coil-type thermo oxidizer in the exhaust stack, THT and Hengli are the first to achieve a green solution that allows VOCs to be oxidized into CO2 before being released into the ambient air.

“Our invention is a classic story of ‘Necessity is the mother of invention’,” said Ken Kuang, President and CEO of THT. “The 2013 Eastern China smog was a severe air pollution episode that affected East China and caused airports, highways, and schools to close. By eliminating VOCs so that they cannot be exhausted into the air, we can begin to reduce smog. It was a pleasure to collaborate with Hengli to design this much-needed invention, and to have NASA as the first customer to vouch for this technology.”

The coveted annual Golden Bridge Awards program recognizes and honors the world’s best in organizational performance, products and services, innovations, executives and management teams, women in business and the professions, case studies and successful deployments, public relations and marketing campaigns, product management, websites, blogs, white-papers, videos, advertisements, creativity, partner programs, and customer satisfaction programs from every major industry in the world. Learn more about The Golden Bridge Awards at

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Novel High Temperature Large Area Underfill with Proven Stress Absorption from AIT

AI Technology, Inc. (AIT) is proud to introduce a new generation of Flip-Chip Underfill solution that combines a High Tg of >240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices. MC7885-UFS is a proven unique underfill adhesive that fills under large area chips and cures without voids and internal stresses for ultimate reliability.  

MC7885-UFS is a novel underfill paste that underfills large area flip-chip components to provide an excellent thermal interface allowing high power devices to dissipate heat to both sides of the package. 

MC7885-UFS is designed for use in both chip-on-board underfill and standard flip-chip underfill component applications to reduce stress. MC7885-UFS can withstand temperatures up to 350ºC without thermal degradation.  Its unique chemistry results in very low moisture absorption and high strength protection. The cured underfill has less than 20ppm/°C in coefficient of thermal expansion and higher than 6 GPa in modulus.

The differences and benefits between MC7885-UFS and traditional underfills include:

  • More than 5 times higher thermal conductivity than that of traditional underfills
  • Tg at >240°C in comparison to traditional underfills with a Tg around 140°C
  • Tg close to lead-free soldering temperature reduces tensile and shear stress
  • Proven additional stress protection with outstanding engineered molecular stress absorption without compromising performance by using low glass transition underfills 

MC7885-UFS has an easy cure schedule.  Most curing can be done at 120°C, or the operator can increase temperature to 150°C to cure in less time.

Please speak to one of our Application Engineers about sampling AI Technology’s MC7885-UFS and put it on the top of your testing list for your new generation of flip-chip devices.


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News from Ziptronix

Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding

Enables fine-pitch connections for 3D applications,including image sensors, memory and 3D SoCs

Ziptronix Inc.and EV Group ("EVG") today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix’s DBI® Hybrid Bonding technology on an EVG Gemini® FB production fusion bonder and SmartView®NT bond aligner. This approach can be used to manufacture fine-pitch 3D ICs for a variety of applications including stacked memory, advanced image sensors and stacked systems-on-chip (SoCs).

“The performance of DBI Hybrid Bonding technology is not limited by connection pitch, but requires the right alignment and placement tool with an ability to scale that has been a challenge to find until now,” said Paul Enquist, CTO and VP Engineering at Ziptronix. “EVG’s fusion bonding equipment has been optimized to achieve consistent submicron post-bond alignment accuracy. This advancement in alignment accuracy provides a clear path to high-volume manufacturing (HVM) of our technology.”

Pitch scaling on next-generation 3D technologies is expected to continue for many years to come. Fine-pitch hybrid bonding is already in use in high-performance 3D memory products, and has been announced for HVM of 3D image sensors. DBI Hybrid Bonding can be used at the die or wafer level; however, wafer-level bonding enables a great cost benefit by bonding all the die at once. With much of the processing for DBI Hybrid Bonding taking place at wafer scale, there is the added benefit of low cost-of-ownership.

“Demonstrating submicron accuracy is critical to achieving fine-pitch connections in HVM for a wider variety of applications,” said Paul Lindner, Executive Technology Director at EVG. “As the industry pushes to realize 3D ICs, joint efforts such as our work with Ziptronix to develop manufacturing approaches offer customers a tremendous value-add.”

Ziptronix ZiBond® Technology Proven for Consumer Mobile Market

Ziptronix Licenses ZiBondto IO Semiconductor for RF Applications

Ziptronix Inc. has announced a limited exclusive patent licensing agreement with IO Semiconductor (IOsemi) for application of its ZiBond technology for use in RF front-end devices for consumer mobile products. The agreement also marks a new high-volume application market for Ziptronix’s proprietary ZiBond technology.

"This license agreement with IOsemi is an exciting win for us because it extends our reach into rapidly growing mobile markets by opening up a new high-volume application space for us," noted Dan Donabedian, CEO and president of Ziptronix. "It also demonstrates the value of licensing established technologies like ZiBond, which in this case enables IOsemi to deliver innovative RF front-end solutions with improved performance and lower cost."

IOsemi’s ZEROcap™ CMOS technology is based on a mature 0.18µm CMOS process. It provides best-in-class RF performance with lower insertion loss and better linearity than other available technologies. This performance is achieved while delivering smaller footprints and lower cost than competitive devices. Implementing ZiBond further enables the low-cost manufacture of RF switches using standard CMOS processes. Because the bond itself is as strong as or stronger than the bulk material, it stands up better to post-bond processes than other bonding technologies.

"Licensing ZiBond for use in RF front-end applications adds a highly manufacturable, high-volume bond to our technology arsenal," said Mark Drucker, CEO of IO Semiconductor. "It provides a key enabling technology that has allowed IOsemi to deliver better-performing, lower-cost RF solutions than our competitors. We have implemented this process with a top-tier manufacturing partner and have achieved world-class yields and reliability."

Ziptronix’s proprietary ZiBond process allows for the formation of low-temperature, direct, nonadhesive wafer-to-wafer and die-to-wafer bonds in a wide variety of semiconductor materials by using a very thin layer of materials such as silicon oxide or nitride to facilitate direct bonding. Already established in volume production for back-side illumination (BSI) image sensors, the license agreement with IOsemi takes ZiBond into high-volume manufacturing for RF front-end devices as well, further proving its value to the consumer mobile market.

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