NEWS | JOBS | FAST LINKS

ALLVIA

:: Corporate Member News ::

:: Visit Premier Sponsor Solid State Equipment Corporation at Booth #38 (full story)

:: Amkor Technology invites you to join us at the IMAPS 10th International Conference and Exhibition on Device Packaging (full story)

:: ASE Group, Inc. on Display in Booth #50 (full story)

:: Ziptronix Technologies at Device Packaging (full story)

:: Be sure to Visit ALLVIA (full story)

:: SPTS on Display in Booth #17 (full story)

:: Visit Sikama at Booth #21 and During the Exhibit Hall Reception Sponsored by Them! (full story)

:: Jiro Hashizume Joins Hesse Mechatronics as Country Manager for Japan (full story)

:: XIA LLC - Come Visit Us at Booth #18 (full story)

:: AIT on Display at Device Packaging (full story)

:: Come see Micross Components in Booth #43 (full story)

:: Recent News from Palomar (full story)

:: Mitsubishi Materials Corporation at Booth #34 (full story)

:: CPS Technologies - AlSiC Pyrolytic Graphite Composites for Applications Requiring High Heat Spreading (full story)

:: SETNA Corporation Announces a New Application for its ONTOS7 Atmospheric Plasma System (full story)

:: Rudolph Technologies Exhibiting (full story)

:: Pure Technologies at Booth #37 (full story)

Heraeus TFD

:: Job Openings ::

:: Kyocera America - Sales Engineer, Fishkill, NY (full story)

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Solid State Equipment Corp.
Amkor Technology
DPC/GBC Premier Sponsor: ASE US, Inc.
SPTS - Corporate Sponsor
ALLVIA - Event Sponsor
Sikama - Coffee Break Sponsor

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


Visit Premier Sponsor Solid State Equipment Corporation at Booth #38

Solid State Equipment Corp.

SSEC 3300 Series, Single Wafer Wet Processors for Advanced Packaging (WLP and 3D). Metal etch for UBM/RDL with SSEC’s WaferChek - in-situ adaptive process control. Wafer thinning and stress relief. Combination batch immersion /single wafer spray processing for PR and dry film strip, lift-off, flux removal, post-etch residue and TSV clean. High efficiency cleaning tools. Spin Coat and develop processes. Visit us on-line at: www.ssecusa.com.

 

 

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Amkor Technology invites you to join us at the IMAPS 10th International Conference and Exhibition on Device Packaging

Amkor Technology

Amkor Technology invites you to join us at the IMAPS 10th International Conference and Exhibition on Device Packaging, March 11-13, 2014 at the Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona.

Ron Huemoeller, Senior Vice President of Advanced Product/Platform Development at Amkor is this year’s General Chair for the event.

Russell Shumway, Director of MEMS & Sensor Packaging at Amkor, is the Technical
Co-Chair of the Microsystems & Devices Workshop session, and Bob Kuo, Director of Package Development at Amkor is co-chair of the Photonics & LED Packaging Workshop session.

Amkor is pleased to be partnering with GLOBALFOUNDRIES and Open Silicon (co-authors) to present a paper on 2.5D Technology on Tuesday March 11th, 2-2:30 PM entitled:

ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via, by Mike Kelly, Amkor’s Senior Director of Package Development.

This paper will describe a System in Package (SiP) design utilizing two functional system-on-chip (SoC) ARM dual-core Cortex-A9 processors connected across a 2.5D silicon interposer. This is a pivotal demonstration of the heterogeneous die integration approach.

Amkor will also take part in the event exhibition with our technical staff on hand for product and services questions or discussions – please visit us at booth #47.

Further information about the event can be found at: http://www.imaps.org/devicepackaging/.

 

 

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ASE Group, Inc. on Display in Booth #50

DPC/GBC Premier Sponsor: ASE US, Inc.

ASE Group’s broad portfolio of technology encompasses IC test program design, wafer probe, wafer bump, wafer level package, and much more. Leading the OSAT market, ASE generated sales revenues of $4.4 Billion in 2012. For more on our proven copper wire bond capabilities and our advances in 3D & TSV technologies, please visit www.aseglobal.com.

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Ziptronix Technologies at Device Packaging

Ziptronix Technologies is accelerating the adoption of 3D IC technology.  Our technology enables advanced, low cost scalable 3D integration in emerging markets such as 3D Memory, Displays/Pico projector and 3D SoC.

Stop by and see us at Booth #48 for a demonstration of our 3D SoC Cost Savings Estimator tool.

Ziptronix: The Foundation of 3D !
www.ziptronix.com

 

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Be Sure to Visit ALLVIA

ALLVIA - Event Sponsor

ALLVIA provides Silicon Interposer and Through-Silicon Via (TSV) foundry services for Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects. 2.5D, 3D and System-in-Package (SiP) solutions. ALLVIA, a leader in TSV development provides design & processing for frontside (filled) and backside (conformal plated) through-silicon vias and offers services for prototyping as well as volume production runs.

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SPTS on Display in Booth #17

SPTS - Corporate Sponsor

SPTS Technologies designs, manufactures, sells, and supports advanced etch, PVD, CVD and thermal capital equipment and process technologies for the global semiconductor and micro-device industries, with focus on the MEMS, advanced packaging, high speed RF device, power management and LED markets. For more information on the company, please visit http://www.spts.com.

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Visit Sikama at Booth #21 and During the Exhibit Hall Reception Sponsored by Them!

Sikama - Coffee Break Sponsor

Sikama International designs, manufactures, and markets solder reflow & curing systems, wafer flux coaters and wafer washers. Our ovens feature a patented conduction plus convection heating technology and are used for Wafer Bumping, LED Die Reflow, BGA Re-balling, High Density Package Reflow, Lid Attach, Fluxless Gold Tin Reflow, Lead Frame Reflow and Curing among many other applications.

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Jiro Hashizume Joins Hesse Mechatronics as Country Manager for Japan

Hesse Mechatronics Japan Co., Ltd. to open new office

Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Jiro Hashizume recently joined the company to head up its new subsidiary, Hesse Mechatronics Japan Co., Ltd.

Mr. Hashizume has 17 years of experience in technical support, software design and sales management in the semiconductor equipment industry. For the past five years he served as territory manager for Japan and Korea for Kulicke & Soffa Industries, Inc. (K&S), where he gained extensive understanding of pre- and post-sales technical support, marketing and sales strategies to grow wire bonding equipment sales. Prior to his time at K&S, Mr. Hashizume worked for Orthodyne Electronics as senior field applications engineer and NEC Machinery Corporation as control system engineer.

“Jiro’s extensive experience with wire bonding equipment for the automotive, industrial power and semiconductor device industries provides a solid base for growing our business in Japan,” said Joseph S. Bubel president of Hesse Mechatronics, Inc. “Jiro’s sales and marketing expertise combined with his solid wire bonding equipment technical knowledge will greatly benefit our customers and we are thrilled to have him as a member of our Team.”

Mr. Bubel will expand his role as president for Hesse Mechatronics’ Americas subsidiary, to also oversee management of the new Japanese subsidiary. Customers may contact Mr. Hashizume by email at jiro.hashizume@hesse-mechatronics.jp. The company anticipates opening its new office in Japan later this year.

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XIA LLC - Come Visit Us at Booth #18

The UltraLo-1800 from XIA LLC is a next generation alpha particle counter designed to measure the alpha particle emissivity of solid materials. The UltraLo-1800 is a revolutionary new design for ultra-low background alpha particle counters that employs the patented technique of electronic background suppression to drive achievable background rates to 0.0001 alphas/cm2/hr and below. This is a factor of 50 or more better than can be achieved by the conventional proportional counter systems that are currently available. With the UltraLo-1800, it becomes feasible to measure samples having emissivities in the 0.001 to 0.0005 alphas/cm2/hr (ULA) range in fewer than 10 hours, and to measure emissivities below 0.0005 alpha/cm2/hr (sub-ULA) in fewer than 100 hours.

XIA will be exhibiting this new system at the IMAPS 10th International Conference and Exhibition on Device Packaging. Come visit us at booth 18 to learn more about alpha counting and the UltraLo-1800.

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AIT on Display at Device Packaging

AIT has seen a big increase in demand for high temperature epoxy applications over the past several months. 

Our epoxies have always been qualified for Mil Std 883H specifications for  -65C to 150C and are able to withstand 270C for up to a few minutes for Lead-Free Solder and Wire Bonding applications. 

In some newer applications, customer demands have required AIT to formulate our epoxies to withstand temperatures up to 350C  continuous working life for various commercial and aerospace programs. 

AIT has worked closely with our customers to molecularly engineer our epoxies for high temperature stability and low CTE with high moisture resistance. 

The epoxies can be formulated to dispense out of a syringe and we can also make preforms out of adhesive films for larger areas. We can meet very thin bond line requirements for applications demanding 25 microns and below.

We have shipped out many samples and we are seeing more applications every day from our website and trade shows 

Please discuss your high temperature application with one of our technical sales team members so we can help to meet your needs for this challenging area.

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Come see Micross Components in Booth #43

Semiconductor Die and Specialized Packaging Solutions for Medical Applications

Micross Components is a leading global provider of distributed and specialty electronic components for medical, aerospace, defense and demanding industrial applications. Operating as a single source for high reliability and state‐of‐the‐art electronics, Micross’ solutions range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 35+ year heritage, Micross possesses the design, manufacturing, and logistics expertise needed to support an application from start to finish.

Bare Die and Wafer Processing

Authorized by the industry’s major semiconductor manufacturers, Micross Components offers a vast range of technologies. With our complete wafer processing capabilities, we can provide the performance of Off-the-Shelf (OTS) products in the smallest form factor available – bare die – allowing increased miniaturization of your device.

Packaging Solutions

When OTS products cannot be used, and handling bare die is either impractical or too costly, we can provide the right solution through our multiple packaging options. Micross custom packages are have been used in class III medical devices.

  • Chip Scale Packaging (CSP) – a best fit for those seeking the smallest form factor with ease of handling. Because our CSP’s are designed in-house, features such as package thickness, leaded or lead-free balls, and signal routing can be customized to your device.
  • Multi-Chip Modules – a solution that provides the advantage of increased functionality and performance with overall space savings. By integrating multiple die into a single package, Micross Components can broaden design options and improve management of product life cycles.
  • Wafer Level CSP (WLCSP) – an option gaining popularity in the medical manufacturing industry for its size, weight, and cost savings once a device goes into production. WLCSP is not a “packaging solution” per se, but rather a modification of the bare die by a redistribution of the bond pads; hence the size savings.

Other options include, but are not limited to hermetic/ceramic packaging, custom packaging, high-reliability COTS/iPEMs/microSSDs, and robotic solder exchange from lead-free to SnPb finished terminal leads for tin-whisker mitigation.

Come see Micross Components in booth #43 at IMAPS Arizona March 11-13.

 

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Recent News from Palomar

Hughes Aircraft Industrial Products Division History Part 1: CRT Storage and Early Interconnection Technologies
This particular telling of the history will begin in the year 1958, in the small Southern California beach town of Oceanside, California. A company called Vacuum Tube Products, Inc. (VTP) was successfully building storage for CRTs, which were used in radar ground systems for the U.S. military. The cathode ray tube (CRT) is a vacuum tube containing one or more electron guns (a source of electrons or electron emitter) and a fluorescent screen used to view images. It has a means to accelerate and deflect the electron beam(s) onto the screen to create the images.
Read more: http://www.palomartechnologies.com/blog/bid/191557/Hughes-Aircraft-Industrial-Products-Division-History-Part-1-CRT-Storage-and-Early-Interconnection-Technologies.

 

Die Attach Voiding Requirements in Eutectically Bonded GaAs and GaN MMIC Power Amplifiers
Eutectic bonding of Au-backed MMIC (Monolithic Microwave Integrated Circuits) power amplifiers presents a unique challenge due to the thin, brittle nature of the device and the need for a virtually void free attachment of the backside of the device to the heat sink. Both scrub assisted processes and vacuum solder methods have been successfully employed throughout the industry. The question is: how good is good enough?
Read more: http://www.palomartechnologies.com/blog/bid/204636/Die-Attach-Voiding-Requirements-in-Eutectically-Bonded-GaAs-and-GaN-MMIC-Power-Amplifiers-Part-1.

Subscribe to the PTI Blog! Join the 4,021 industry peers who already have!
http://www.palomartechnologies.com/subscribe

 

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Mitsubishi Materials Corporation at Booth #34

Mitsubishi Materials Corporation (http://www.mmus.com/) has been manufacturing ultra low alpha lead free chemistry and solder paste.  Sn-Ag plating process and solder paste with finer particles for fine pitch assembly are two of our many successful works.  Mitsubishi advanced its research even further and developed Cu plating process for Cu pillar application with a high plating rate.
Come visit us at booth 34 or drop us an email mmusdivem@mmus.com for more details!

Cu Pillar(φ20um Cu: 10um+SnAg: 5um)

 

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CPS Technologies - AlSiC Pyrolytic Graphite Composites for Applications Requiring High Heat Spreading

CPS Technologies will be displaying AlSiC / Pyrolytic Graphite Composites for high heat spreading applications at the iMAPS Device Packaging Show, Booth52.
(http://www.alsic.com/pdf/CPS_AlSiC_Pyrolytic_Graphte_Composites.pdf ) .

The AlSiC structure provides a strong hermetic envelope for the low strength and environmentally sensitive pyrolytic graphite. The AlSiC and Pyrolytic Graphite yield a composite that has the thermal expansion properties, mechanical strength and stiffness of AlSiC, with the superior thermal heat spreading of the pyrolytic graphite.

Since these materials are combined in the AlSiC composite forming, both materials are bonded mechanical and chemically by a thin aluminum metal interface on the pyrolytic graphite heat spreading surfaces. These composites have been shown to have effective heat spreading capabilities of a material having a thermal conductivity value of 1000 W/mK.



AlSiC Pyrolytic Graphite Composite Properties


AlSiC
•Low thermal expansion compatible with electronics and dielectric substrates
•Lightweight, high strength and stiffness composite
•Functional net shape cast design
•Provides a hermetic, strong envelope material for low strength, environmentally sensitive pyrolytic graphite

Pyrolytic Graphite
•Lightweight material that provides high heat spreading, 1300 W/mK in X,Y plane; 30 W/mK in Z direction

AlSiC/Pyrolytic Composite
 •Has an effective thermal conductivity of 1000 W/mK1

Applications
•Radar systems
•Airborne & Space electronics
•Edge-cooled / Conduction-cooled electronics
•Lightweight passive cooling mobile applications

 

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SETNA Corporation Announces a New Application for its ONTOS7 Atmospheric Plasma System

SETNA Corporation announces a new application for its ONTOS7 Atmospheric Plasma System to enhance the wetting and wicking characteristics of many substrate and film types.  Using oxidizing, reducing or neutral chemistries in conjunction with the system’s scanning plasma head, the tool activates surfaces by increasing the surface energy.  This increases the hydrophilicity and the oleophilicity of organic, metal or semiconductor materials for better wetting with processes such as wet etching, rinsing and plating, as well as better wicking with underfills or adhesives.

A few representative photos show the effect on common materials.

Please visit us in Booth #58 at IMAPS Device Packaging to discuss how we can help with your bonding, wetting, or other surface preparation challenges.  www.setnacorp.com

 

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Rudolph Technologies Exhibiting

Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Additional information can be found on the Company’s website at www.rudolphtech.com.

 

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Pure Technologies at Booth #37

Pure Technologies manufactures low (0.02, 0.01 cph/cm2), ultra-low (0.005, 0.002 cph/2) and super ultra-low (<0.001 cph/cm2) alpha emitting Tin (Sn), Lead-Free (including all SAC) alloys, Pb,  Pb/Sn and virtually all alloys. These ALPHALO® products are available in various shapes and sizes – ingots, anodes, slugs, pellets, foil, rods, bricks, PbO and SnO powder, etc. for wafer-level packaging, interconnects, electroplating and sphere and powder/paste manufacturing.ALPHALO® reduces or eliminates soft errors from alpha particle emissions from solders, enhances performance reliability and reduces corporate liability. All materials are guaranteed and certified to be at secular equilibrium and are tested and retested over time before shipping to insure that the alpha emission rate is stable and will not increase over time.

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:: Job Openings ::

Kyocera America - Sales Engineer, Fishkill, NY
Experience a challenging and stimulating career at Kyocera America, Inc. (KAI). We are a global product technology leader seeking an effective sales professional for our Fishkill, NY Sales Office.

As a Sales Engineer, you will be responsible for managing and developing sales strategies for the Organic Products Division of KAI that provide products such as: FCBGA’s, FCCSP’s, PCB’s and chemicals for micro-electronic assembly applications.

The incumbent’s responsibility will be to increase business within an assigned territory and maintain a strong relationship with customers by conducting the following:

  • Create and support development activity within the customer base
  • Facilitate contract negotiations
  • Resolve customer complaints and other commercial requirements
  • Communicate and engage (internally & externally) with engineering, management, production, quality, & purchasing personnel at all levels. Strong communication skills are required as the Sales Engineer be the conduit for any information between the customers and other internal personnel (Production, Quality, Logistics, etc).
  • Interact with customers will be required regularly to identify customer needs, monitor competitive activity, conduct market analysis and provide feedback.
  • Provide updates to customers by presenting technical roadmaps and R&D activities. Therefore strong presentation skills and technical aptitude is required
  • Establish monthly sales goals (MSP) and guidance for annual (Master Plan) and 3-year sales plan within assigned account base

Requires a bachelor degree or equivalent job knowledge. Candidates with engineering degrees are preferred. A minimum of 3 years of on-the-job experience.

SPECIFIC KNOWLEDGE/SKILLS/ABILITIES:

  • Key skills and abilities include self-motivated with a proven track record in sales and influencing others
  • Semiconductor or technical manufacturing industry experience is required.
  • Strong written communication and verbal skills • Keen problem solving and analytical ability.
  • Travel to customer sites, Kyocera factories and trade shows as needed, approx 30%

To apply, email your resume to: kai.hr@kyocera.com please reference Job Code IMAPS on the subject line. EOE

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

 

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View the Corporate Bulletin Archives

 

EPP
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RGL Enterprises

 


:: Issue 151 ::
February 17, 2014

Torrey Hills Technologies

Oneida Research Services

Metallix

Petroferm

BIOSENSORS 2014