NEWS | JOBS | FAST LINKS

ALLVIA

:: Corporate Member News ::

:: TechSearch International Study Details Renewed Interest in Embedded Components (full story)

:: News from Master Bond (full story)

:: High Temperature Expoxies from AIT (full story)

:: Indium Corporation Wins Global Technology Award (full story)

:: NuSil Technology Wins Mentor’s Inaugural Supplier Recognition Award (full story)

:: OrthoSensor Partners with Valtronic for the Manufacture of the Intelligent VERASENSE™ Knee System (full story)

:: Torrey Hills 10 Years in 2014 (full story)

:: i3 Electronics Now Accepting Printed Circuit Board QTA Orders (full story)

:: Hesse Mechatronics Appoints Representative for South America (full story)

:: Palomar Technologies (full story)

:: Nordson EFD's 781S Spray Valve System Applies Oils, Grease, & Lubricants (full story)

MST

:: Job Openings ::

:: Kyocera America - Sales Engineer, Fishkill, NY (full story)

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Accuratus
Solid State Equipment Corp.
Amkor Technology

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


TechSearch International Study Details Renewed Interest in Embedded Components

Almost every application space in the electronics industry has evolved around a single goal—increase functionality while improving cost/performance.  Many strategies and technologies have been introduced, including embedding components inside a printed circuit board or IC package.  What’s driving today’s renewed interest for embedded active and passive functions?


TechSearch International’s new study, Embedded Components:  Why Now? -- Markets, Applications, and Technologies, provides unparalleled analysis of the underlying developments and trends in the industry based on the company’s 26-year history of studying the market and critical infrastructure issues.

PCBs and IC packages with embedded passives have been in the market for many years.  Dai Nippon Printing started shipping PCBs with embedded passive devices in 2006 and cumulative shipments total hundreds of millions of parts. A smartphone board contains more than 230 passive devices in the main board.  Some modules also contain active devices. Casio shipped a power management module with an embedded WLP in its wristwatch in 2006, making it the first wearable electronics application with an embedded component. TI’s MicroSiPÔ is in volume production with its stand-alone power supply platform (DC-DC voltage converter) for portable applications.  Infineon is shipping its DrBlade low-voltage DC-DC voltage regulator for computing, telecommunication, servers (Blade and Rack), PCs, and gaming machines.

Formed resistors have been widely employed in the defense and aerospace industry. New applications in the consumer space, telecom, computing, and industrial areas are expanding the market.  Planar capacitance has been utilized in the high-performance computing and communication segments for many years.  With the higher capacitance levels now available, the market is expanding into IC packages and modules.

This report analyzes the expanding wide range of markets providing insight into the drivers, applications, and future growth. Fan-out wafer level packages are included in the analysis.  A discussion of the challenges posed by embedded solutions and the potential impact of the technology on the supply chain is included.

The 134-page report with full references provides an in-depth analysis of the activities of various companies explaining current and future products with specific examples of the use of embedded components. Forecasts are provided for the placed embedded active and passive components, as well as the markets for embedded formed resistors and capacitors.  A complimentary set of PowerPoint slides accompanies the report.

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News from Master Bond

New Epoxy Adhesive Serviceable at Cryogenic Temperatures

Master Bond Inc., Hackensack, N.J. has introduced a new two component epoxy adhesive/sealant for cryogenic applications.  Called EP29LPSP, this compound is able to withstand temperatures as low as 4K.  Additionally, it is able to resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).

Master Bond EP29LPSP has a mix ratio of 100 to 65 by weight.  It cures at room temperatures, but best results are obtained if heat cured at 130-165°F for 6-8 hours.  EP29LPSP features superior physical strength properties and excellent chemical resistance.  It bonds well to a variety of substrates including metals, glass, ceramics and many different plastics.  When curing, EP29LPSP has a low exotherm.

EP29LPSP has a low viscosity and is easy to apply.  Its mixed viscosity is 400 cps.  It has a tensile strength of 6,500 psi and a tensile modulus of >375,000 psi.  When cured, EP29LPSP is a superior electrical insulator.  Its volume resistivity is >1015 ohm-cm and its dielectric constant is 3.6.  It has a Shore D hardness of 80.

Master Bond EP29LPSP is optically clear.  It is available for use in pint, quart, gallon and 5 gallon kits.  It is also available in syringe applicators.

Toughened Two Component Epoxy Is Optically Clear and Resists Thermal Cycling
Master Bond EP38CL was developed for bonding, sealing, coating and encapsulation applications that require toughness and durability. With a Shore D hardness exceeding 75, its toughness is a unique property that imparts resistance to rigorous thermal cycling, impact and mechanical shock.

EP38CL cures at room temperature or more quickly at elevated temperatures and has low shrinkage upon curing. This low viscosity, two part epoxy has a 100:60 mix ratio by weight and a working life of 40-50 minutes. It bonds well to a variety of substrates including metals, ceramics, glass, composites, many rubbers and plastics. EP38CL features a tensile lap shear strength of 2,500 psi, a compressive strength of 8,000 psi and a tensile strength of 7,500 psi at room temperature.

Additionally, EP38CL is optically clear with a glossy appearance. It is serviceable from -60°F to +250°F. This electrically insulative compound is used in optical, aerospace, opto-electronic and specialty OEM applications. It is available for use in standard packaging options ranging from ½ pint to 5 gallon kits as well as premixed and frozen syringes.

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High Temperature Expoxies from AIT

AIT has seen a big increase in demand for high high temperature expoxies

Our epoxies have always been qualified for Mil Std 883H specifications for  -65C to 150C and are able to withstand 270C for up to a few minutes for Lead-Free Solder and Wire Bonding applications.
In some newer applications, customer demands have required AIT to formulate our epoxies to withstand temperatures up to 350C  continuous working life for various commercial and aerospace programs.
AIT has worked closely with our customers to molecularly engineer our epoxies for high temperature stability and low CTE with high moisture resistance.
The epoxies can be formulated to dispense out of a syringe and we can also make preforms out of adhesive films for larger areas and very thin bond line uniformity.
We have shipped out man samples and we are seeing more applications every day from our website and trade shows.

Please discuss your high temperature application with one of our technical sales team members so we can help to meet your needs for this challenging area.

 

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Indium Corporation Wins Global Technology Award

Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.

Sponsored by Global SMT & Packaging magazine, the award acknowledges outstanding innovations in the printed circuit board assembly and packaging industry. The award was presented to Tim Jensen, Product Manager - PCB Assembly Materials, and Brian Craig, Managing Director - European Operations.

SACM™ is a high-reliability solder alloy that provides the optimal combination of drop test and thermal cycling performance, at a cost which is below that of typical SAC solder alloys. SACM™ is doped with manganese, which impacts the solder grain structure to improve reliability and helps to slow intermetallic growth, reducing the loss of reliability after aging. SACM™ also contains less silver than traditional lead-free alloys. Reduced silver content provides a more stable cost structure, especially for cost-sensitive applications.

SACM™ offers superior drop test performance compared to SAC305 and SAC105, with the added benefit of thermal cycling reliability equivalent to that of SAC305. This development is especially meaningful for the manufacture of consumer electronics that normally see frequent handling and occasional misuse.

SACM™ is manufactured into solder paste using the Indium8.9 Series flux, making it ideal for miniaturized components and fine-pitch assembly. It is specifically designed for CSP, 0201, and 01005 components. Its first-class printing performance provides excellent print transfer through apertures with area ratios of less than 0.66.

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NuSil Technology Wins Mentor’s Inaugural Supplier Recognition Award

Mentor recognizes NuSil for exceptional technical competence, innovative ideas, and excellent customer service in silicone raw material supply. 
  
For superior service in silicone raw material supply, NuSil Technology LLC (http://www.nusil.com) recently received the Supplier Recognition Award from medical device manufacturer Mentor. With this inaugural award the stand-alone business unit of surgical care product organization Ethicon, under Johnson & Johnson (J&J), formally acknowledges outstanding suppliers who consistently provide high-quality materials and first-rate customer support. “The big picture of the Supplier Recognition Award for NuSil,” said Mark Anderson, Manager - QA Testing, NuSil Technology Texas; “is the visibility it gives us relative to J&J/Ethicon/Mentor and their supply chains. If a J&J company deems you a winner, you get a lot of positive attention."

“The Supplier Recognition Award evaluates suppliers for their work with Mentor in the areas of quality, delivery, cost, and continuous improvement efforts,” explained Neftalí Feliciano, Sr. Supplier Quality Management Engineer, and Simón De Castro, Process Excellence Leader, Mentor. “It is meant to emphasize and encourage strong partnerships between Mentor and its suppliers. NuSil stands out in the supply world based on its exceptional technical competence, innovative ideas, and excellent customer service in order to deliver on what Mentor needs.”

Silicone raw material supplier and medical device manufacturer mutually decide and coordinate strategic measures for optimum quality control and the best use of time and resources regarding silicone production, shipment, and cost. NuSil and Mentor’s collective work benefits from a process of silicone supply that is dynamic and inclusive of NuSil production locations and Mentor sites as pertinent to the case at hand. NuSil has manufacturing facilities in Carpinteria and Bakersfield, CA and Irving, TX; these maintain a close relationship with Mentor and collaboratively accommodate Mentor’s needs from development of specially designed silicone raw materials to time-sensitive product delivery.

Mark Anderson; Jeff Westfall, Manager - Manufacturing, NuSil Technology Texas; and Brian Nash, Vice President - Marketing and Sales, attended a special recognition event on December 3, 2013 at Mentor’s Irving, Texas campus to accept the Supplier Recognition Award for NuSil.

 

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OrthoSensor Partners with Valtronic for the Manufacture of the Intelligent VERASENSE™ Knee System

Valtronic, an electronic contract manufacturer, ships its’ first VERASENSE™ Knee System created by OrthoSensor™ from its new bioburden ISO Class 8 clean room.

Valtronic employees gathered together to celebrate the official release of the VERASENSE™ Knee System after months of preparation and planning.  This also marked the first product shipped from Valtronic’s new 288 Square Ft. bioburden ISO Class 8 clean room.  To mark the occasion, employees celebrated with a ribbon cutting ceremony. OrthoSensor™ and Valtronic employees were enthusiastic to ship the first VERASENSE™ Knee System.

Juan C Fernandez, EVP Operations for OrthoSensor, stated, “OrthoSensor is very excited about the partnership with Valtronic. Valtronic is a well-established contract manufacturer of medical devices and has demonstrated the ability to align with OrthoSensor’s Best in Class requirements.”

The VERASENSE™ Knee System is used during total knee replacement to quantify joint loading and soft tissue balance. Research has shown that soft tissue balance may aid in the reduction of pain, wear, and implant loosening – while also improving how the knee replacement feels to the patient. The OrthoSensor VERASENSE Knee System provides surgeons with real-time data that enables evidence-based intraoperative decisions regarding component position, limb alignment and soft-tissue releases to achieve soft tissue balance and stability through a full range of motion.

“VERASENSE™ is a great example of what an intelligent orthopaedic product can do to enhance the performance of an implant,” exclaims Jim Ohneck, Chief Marketing Officer at Valtronic. “The partnership with OrthoSensor™ is a perfect fit for our capability.”

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Torrey Hills 10 Years in 2014

In 2014, Torrey Hills Technologies will be celebrating its 10th year providing innovative products and services in relate to microelectronics packaging components and equipment.

One of our priorities for this year is to further improve HENGLI furnace products and make them high end choices for top customers. In 2013, a state-of-the-art furnace with all stainless steel panels attracted attention from a world-famous space agency, who intended to put it to laboratory use. In 2014, we will keep introducing such high-end furnaces to the market.

We also look to expand the furnace market for PMC (Post Mold Cure) application to meet the growing demands for high quality curing and energy consumption efficiency. Unlike batch furnaces, belt furnaces use conveyor belts to continuously move parts through the furnace. Customers are expected to enjoy advantages like superior art to part temperature uniformity, increased throughput, process combination, lower up-front investment, reduced changeover times and part loading flexibility. Our air convection heating function and belt control systems allow energy savings up to 70% over conventional ovens. We believe that our efforts will bring in a new era of belt furnaces for PMC process. 2014 is just a starting point.

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i3 Electronics Now Accepting Printed Circuit Board QTA Orders

In order to achieve our goal of further enhancing the service levels from our established PCB operations, i3 Electronics is now accepting PCB QTA orders.

i3's QTA operation builds advanced technology, high-performance and high reliability products with expedited cycle times for both existing and prospective customers. We are also dedicating new-product introduction resources to reduce lead times for products in the last stages of development and early stages of production.   Our customers will benefit by getting products to market more quickly.

Typical i3 QTA Turns:
* Based on core through composite builds
* Additional requirements could add 1/2 day and up

What Sets i3's QTA Apart From the Competition?
* On-site laminate manufacturing
* PCB design services
* Volume manufacturing capabilities
* PCB assembly capability
* Variety of laminate materials on hand
* A strong team of scientists, engineers and innovators
* A company at the forefront of continual technology advancement

For more information visit our QTA/PCB Fabrication webpage or fill out a contact us form.

www.i3electronics.com
*We are currently in the process of updating our website to reflect the acquisition of Endicott Interconnect by i3 Electronics, Inc.”

 

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Hesse Mechatronics Appoints Representative for South America

HTMG to support wire bonding equipment sales in RF, automotive and power electronics markets

Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, recently announced that it has appointed HTMG as the company’s sales representative for South America.

HTMG, led by Claudinei Martins, brings 20 years of experience with performance alloys used in high-end electronics and photonics components to Hesse Mechatronics’ business in South America.

“Given their experience with wire bondable metals, HTMG is uniquely qualified to serve the growing RF, automotive and power electronics markets in South America,” said Joseph S. Bubel president of Hesse Mechatronics, Inc. “We look forward to working with Claudinei and his team in Brazil and other areas of South America.”

For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com. For more information on Hesse Mechatronics’ training and applications support services, please e-mail info@hesse-mechatronics.us. To see wire bonding in action, visit www.wirebonddemo.com.

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Palomar Technologies

Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced a strategic alliance with SCI Automation Pte. Ltd. (Singapore). SCI Automation joins the ranks of Palomar’s alliance partners GPD Global Dispensing Systems, Hybond Manual Bonders, and Royce Instruments Bond Testers and Die Sorters. Effective immediately, Palomar will be offering the full line of SCI Automation products worldwide.

SCI Automation specializes in the design and manufacturing of integrated plasma (or vacuum) systems. These best-in-class systems are used around the world in vacuum and plasma applications where automation is required in vacuum, pressurized, or controlled atmosphere environments. Read the full Press Release: http://www.palomartechnologies.com/news-room/press-releases/bid/191830/Palomar-Technologies-Announces-Alliance-with-SCI-Automation-Plasma-Cleaning.

 

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Nordson EFD's 781S Spray Valve System Applies Oils, Grease, & Lubricants

Nordson EFD, a Nordson company (NASDAQ: NDSN), the world's leading precision fluid dispensing systems manufacturer, is working with manufacturers around the world to help them improve their lubrication process and control fluid costs with its 781S Spray Valve. This valve enables precise and consistent application of medium-viscosity oils, grease, reagents, marking inks, and adhesive activators .for many manufacturing processes in the electronics, automotive, cosmetics, food, and medical industries. The 781S valve uses low-volume low-pressure (LVLP) technology to accurately apply a fine, uniform coating of material without waste, mess, or overspray. Benefits include cleaner production areas and reduced rework, contamination, and overall fluid use. This technology has been used in many applications including applying adhesives onto automotive trim, marking inks onto circuit boards, spraying reagents onto medical test strips and grease onto door handle springs.

"Speed and throughput are critical factors in production and the 781S valve dispenses consistent fluid deposits, exactly where needed," said Claude Bergeron, global product line manager, Nordson EFD. "The combination of adjustable fluid flow, adjustable nozzle air, and post-air cutoff provides excellent spray control."

"When there are a large number of parts produced, even small cost reductions in labor or materials per part can represent significant savings," continued Bergeron. "Just eliminating over-deposits can reduce material waste by 50 percent or more. Nordson EFD's 781S spray valve system has helped manufacturers in numerous industries all over the world to improve their manufacturing process."

For more information, check out the 781S valve in action: http://www.youtube.com/watch?v=_Ev6c0Mklro, or visit Nordson EFD on the web at www.nordsonefd.com, www.facebook.com/NordsonEFD, or www.linkedin.com/company/nordson-efd, email at info@nordsonefd.com, or call +1 401.431.7000 or 800.556.3484.

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:: Job Openings ::

Kyocera America - Sales Engineer, Fishkill, NY
Experience a challenging and stimulating career at Kyocera America, Inc. (KAI). We are a global product technology leader seeking an effective sales professional for our Fishkill, NY Sales Office.

As a Sales Engineer, you will be responsible for managing and developing sales strategies for the Organic Products Division of KAI that provide products such as: FCBGA’s, FCCSP’s, PCB’s and chemicals for micro-electronic assembly applications.

The incumbent’s responsibility will be to increase business within an assigned territory and maintain a strong relationship with customers by conducting the following:

  • Create and support development activity within the customer base
  • Facilitate contract negotiations
  • Resolve customer complaints and other commercial requirements
  • Communicate and engage (internally & externally) with engineering, management, production, quality, & purchasing personnel at all levels. Strong communication skills are required as the Sales Engineer be the conduit for any information between the customers and other internal personnel (Production, Quality, Logistics, etc).
  • Interact with customers will be required regularly to identify customer needs, monitor competitive activity, conduct market analysis and provide feedback.
  • Provide updates to customers by presenting technical roadmaps and R&D activities. Therefore strong presentation skills and technical aptitude is required
  • Establish monthly sales goals (MSP) and guidance for annual (Master Plan) and 3-year sales plan within assigned account base

Requires a bachelor degree or equivalent job knowledge. Candidates with engineering degrees are preferred. A minimum of 3 years of on-the-job experience.

SPECIFIC KNOWLEDGE/SKILLS/ABILITIES:

  • Key skills and abilities include self-motivated with a proven track record in sales and influencing others
  • Semiconductor or technical manufacturing industry experience is required.
  • Strong written communication and verbal skills • Keen problem solving and analytical ability.
  • Travel to customer sites, Kyocera factories and trade shows as needed, approx 30%

To apply, email your resume to: kai.hr@kyocera.com please reference Job Code IMAPS on the subject line. EOE

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

 

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View the Corporate Bulletin Archives

 

EPP
F&K Delvotec
RGL Enterprises

 


:: Issue 150 ::
February 3, 2014

Torrey Hills Technologies

Oneida Research Services

Metallix

Petroferm

LORD Corporation