Heraeus TFD


:: Corporate Member News ::

:: Micro Systems Technologies expands its US organization (full story)

:: Valtronic Continues Investing in Manufacturing Equipment (full story)

:: Unisem to expand testing capacity with Teradyne UltraFLEX Test System in Sunnyvale, CA for Engineering and Production Services (full story)

:: MEMS Wafer Inspection System from Sonoscan (full story)

:: Recent Palomar Blog Posts (full story)

:: PacTech’s Asian subsidiary is ready for more wafers! (full story)

:: Nordson ASYMTEK Introduces New High-Speed, High-Accuracy, Precision Fluid Dispensing System for Cleanrooms (full story)

:: Job Openings ::

:: Commission-based Sales Agents (full story)

:: Finetech - Regional Sales Manager (Manchester NH) (full story)

:: Seeking 4 Engineers & Sr. Level Technician - Contact Pacific Rim Engineering (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

Micro Systems Technologies expands its US organization

The Micro Systems Technologies (MST) group, a global provider of innovative components and manufacturing services for the medical device industry has experienced strong market growth in recent years. The group’s customer focused strategy and growing demand have resulted in a decision to expand our US organization. MST is pleased to welcome Susan Bagen to the company.

Effective May 19, 2014, Susan Bagen was appointed Application Development Manager for Micro Systems Technologies, Inc. Prior to joining MST, Susan was Business Development Manager and Field Applications Engineer for i3 Electronics, formerly Endicott Interconnect Technologies. She began her career in a variety of process engineering roles with Texas Instruments, and has extensive experience as a process and product engineering consultant focused on electronic applications. She holds a Bachelor of Science degree in Chemical Engineering from Case Western Reserve University in Cleveland, Ohio and has 5 US patents.

Bringing a wealth of relevant industry technical experience to the company, Susan will focus her efforts on supporting customer technical development activities throughout the Americas.


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Valtronic Continues Investing in Manufacturing Equipment

Valtronic U.S.A. announced the acquisition of a performance reliable, water-soluble inline cleaner, the AKS Typhoon – T15-1. The additional investment in manufacturing technology follows the early spring 2014 purchase of two Surface Mount Technology lines. By continuously procuring new technology for manufacturing, Valtronic can certainly meet customer expectations in both quality and performance, as well, compete heavily in the marketplace.

The Typhoon –T15-1 sits at 15 feet in length, with horsepower of 10 HP wash and rinse pumps, two 15 HP turbine blowers and comes standard with a 24 inch wide belt, industry’s safest smart heater, adjustable pressure valves, easy access front drains valves and an advanced touchscreen software interface. In addition, the cleaner also offers analog pressure gauges by the adjustable valves and accessibility to the conveyor motor wash pump and dry blower for maintaining easy access for personnel.


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Unisem to expand testing capacity with Teradyne UltraFLEX Test System in Sunnyvale, CA for Engineering and Production Services

Unisem has announced the addition of a third Teradyne UltraFLEX Test System to its US-based test development center located in Sunnyvale, CA. 

The UltraFLEX is the most advanced tester for complex SOC devices in the mobile communication, processor and networking spaces.  It offers the highest performance Digital, RF, SERDES and DC instrumentation available on any ATE to provide the most precise characterization capability and highest production yields of any ATE in its class.  Unique architectural capabilities such as automatically backgrounded DSP and complete instrument control from digital patterns also provide the highest throughput.

“The addition of a third UltraFLEX machine to our Sunnyvale facility is another example of our strong partnership and collaboration with Teradyne,” said Marita Erickson, General Manager of Unisem Sunnyvale.  “We are pleased to be able to continue offering our customers best in class service, through our focus on providing optimal test solutions.”

“Teradyne is pleased to expand our relationship with Unisem," said Greg Smith, VP, SOC Marketing, Teradyne. "As OSATs continue to expand their range of services beyond just turnkey manufacturing, we feel it is important to partner with Unisem as they build a supply chain that encompasses the entire process from test development through volume manufacturing for the benefit of our common customers.”

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MEMS Wafer Inspection System from Sonoscan

Sonoscan has announced its AW322 200™ fully automated system for ultrasonic inspection of MEMS wafers. Based on Sonoscan’s C-SAM® technology, the system images and identifies internal gap-type defects down to 5 microns in size. It is especially useful for finding non-bonds, voids and other defects in the seals surrounding the MEMS wafer cavities.
AW322 200™ system features include:

  • Two loadports, two stages and multiple transducers, enabling it to image two 8-inch MEMS wafers simultaneously.  Other models in the AW series are available to accommodate wafer sizes from 100-300mm.
  • The SECS/GEM-enabled Robotic Handling Station includes alignment and drying operations.
  • Waterfall™ technology to minimize water exposure during scanning.
  • Sonoscan’s advanced analysis software for accurate application of the user’s accept/reject criteria.

In operation, the Robotic Handling Station counts and unloads wafers from the carriers, aligns wafers for scanning and positions wafers on the stage. The transducers travel over 1 m/s while pulsing ultrasound at frequencies up to 230 MHz and receiving thousands of return echoes per second.  Both the transducers and the 500 MHz bandwidth pulser/receiver were designed and manufactured by Sonoscan.

The key defects imaged in MEMS wafers are non-bonds of the seal to a wafer, voids within the seal material and other gap-type defects that can compromise the hermeticity of the cavity.

After scanning, both the acoustic wafer image and the wafer data can be used for accept/reject determination. Criteria are defined by the user with respect to acceptable defect counts and sizes.


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Recent Palomar Blog Posts

Answering the Question: “Does Your Die Bonder Perform Flip Chip?”
Palomar recently exhibited at two very high tech shows in Florida: Electronics Component and Technology Conference (ECTC) and the International Microwave Symposium (IMS). Both shows were very well attended and we had the opportunity to meet people from many different companies and areas of expertise. Inevitably the following question would get asked multiple times a day: “Does your die bonder perform flip chip?” The answer would always be a quick “yes”, but follow-up questions need to be asked in order to help understand exactly what process the system is needed for.
Read more:


Ball Bonding vs. Wedge Bonding
For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated circuit (IC) packages, RF microwave packages and optoelectronic packages. Read more:


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PacTech’s Asian subsidiary is ready for more wafers!


Since the shifting of supply chain focus in the semiconductor industry into Asia, PacTech has been working closely with our customers as strategic partner to enable both mass volume manufacturing and R&D across the continents not only in Europe and America, but also in Asia through the establishment of PacTech Asia at Bayan Lepas Industrial Zone in Penang, Malaysia.

With current production clean room area of 10,000 sq. ft. and capacity up to 20,000 wafers per month, PacTech Asia is bustling with the sub-contracting activities since it set foot in Asia in year 2008. The Asian subsidiary is not only offering our core technologies of wafer level electroless plating and solder bumping but also other newly installed processes such as wafer thinning, backmetallization and sawing to provide a turnkey solution to the customers.

PacTech Asia is expanding now in order to cater to the increasing demand in the semiconductor business. Phase 1 of capacity expansion plan is completed with extended clean room area adding up to 15,000 sq. ft. including 5,000 sq. ft. of class 1k area. The additional clean room area is now ready for Phase 2 expansion including the installation of the second PacLine 300 automatic electroless plating system in PacTech Asia. Manufactured by PacTech, the PacLine 300 is suitable for both Aluminum and Copper pads on 200mm & 300mm wafers, and creates additional capacity of 20,000-30,000 wafers per month!

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Nordson ASYMTEK Introduces New High-Speed, High-Accuracy, Precision Fluid Dispensing System for Cleanrooms

Spectrum II Cleanroom Series improves quality, reliability, and efficiency for fluid dispensing applications sensitive to contamination such as wafer-level packaging and mobile phone camera module assembly

Nordson ASYMTEK introduces high-speed, high-accuracy, scalable fluid dispensing systems with new Class 100 (ISO 5) compatible configurations. Nordson ASYMTEK’s new Spectrum™ II Cleanroom Series was specifically created for applications that are sensitive to contamination by submicron-sized particles, such as wafer-level packaging and mobile phone camera module assembly.

The award-winning Spectrum II family of fluid dispensers has a small footprint of only 600mm wide, maximizing floor space and productivity for high-volume production environments. The modular design allows for easy adaptation and upgrading to accommodate new applications and production requirements. The Cleanroom Series includes features like a stainless steel system enclosure for easy wipe-down and maintenance and ULPA filter for down-flow ventilation for work-piece cleanliness. New Fluidmove® v6.0 software features (running on Windows® 7 Operating System) reduce operator dependency and training requirements to achieve consistent machine-to-machine performance.
Extremely accurate and repeatable X-Y dispensing enables smaller keep-out-zones (KOZs) to accommodate high-density packages, while precision Z-axis control enables tighter dispense gaps for thinner lines and smaller dots. The dispensing system offers many built-in closed-loop process controls such as an integrated weight scale, software-controlled fluid and pressure regulators, the capability to manage up to six heating stations, and patented calibrated process jetting (CPJ) and mass flow calibration (MFC) to automatically ensure volumetric repeatability during long production runs. These controls guarantee a reliable dispensing process that maximizes the total cost of ownership.
“When dispense location, weight, and volume are critical in particle-sensitive applications, there are no better fluid dispensers on the market than the Spectrum II cleanroom systems,” said Garrett Wong, Spectrum Series product manager, Nordson ASYMTEK. "You won't need to purchase completely new equipment when production needs change because these flexible, scalable systems can be configured with options and features, such as pre- and post-queue stations, dual valve dispensing, and tilt jetting, to stretch your capital equipment dollars.”

The Spectrum II Cleanroom Series is ideal for dispensing processes that are often done in a cleanroom such as wafer-level underfill dispensing, 3D packaging, chip encapsulation, dam and fill, dispensing thermal compounds, and MEMS wafer capping.



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:: Job Openings ::

Commission-based Sales Agents

Alternate Finishing, Inc. is recruiting sales agents. The sales agents should be familiar with electronics in various areas such as defense, medical, high-tech, consumer product, industrial product, and R&D. The company ( has the tradition and know-how to produce high-quality plating on circuit boards and ceramic thick and thin films. It plates nickel, silver, and gold via electroplate and electroless methods.

Interested parties should contact Jim Zhao at

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Finetech - Regional Sales Manager (Manchester NH)

We are currently seeking an experienced, energetic and motivated technical sales manager with hands on experience in the semiconductor packaging or microelectronics market.
Location:  Manchester, NH

Responsibilities include:

  • Manage all aspects of driving new sales opportunities and maintaining and growing existing accounts in a defined Eastern US territory.
  • Qualify and prioritize all incoming sales leads  and follow through to closure.
  • Configure systems and tooling quotations, respond to formal RFQ’s.
  • Make technical product presentations to customers,  utilizing a consultative process approach.
  • Effectively communicate with and advise senior management, engineering, chief scientists, researchers, professors and students.
  • Assist with or lead hands-on equipment demonstrations.
  • Work with US and Germany Finetech teams to manage all details of system sales, from proposal through post installation.


  • Bachelor’s Degree (EE, ME, or Sciences preferred).
  • 5+ years of Regional Sales or Sales engineering experience in semiconductor/microelectronics related markets.
  • Specific experience with semiconductor equipment and advanced packaging is preferred. Experience in die bonding strongly desired.
  • Confident, hands-on approach to equipment sales and consultative skills a must.
  • Experienced traveler with willingness to travel 50%+, and adaptability to schedule changes.  Will involve travel primarily in Eastern North America.  Occasional travel to customer sites and tradeshows  throughout North America, as well as the factory in Germany.
  • Must be  capable of thriving in a small company “can do” atmosphere.  The ability to multi-task, problem solve and take initiative is a must.
  • Strong organizational, follow-up and communication skills a must.
  • Proficiency in MS Outlook, Excel, Powerpoint, sales forecasting is assumed.

Submit resumes to:

We thank all applicants in advance for their interest; however, only those being considered for an interview will be contacted.



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Seeking 4 Engineers & Sr. Level Technician - Contact Pacific Rim Engineering

Seeking 4 Engineers in the materials and Ceramic technology also a Sr. level Technician hands on in the Thick Film technology please send your resume to the following contact.

1. Material Scientist/Engineer, BS/MS/Ph.D. in materials science + 5 or more years of experience in paste formulation.

2. Process Engineer, BS in Engineering, 3+ years of experience in LTCC or MLCC cofired or hybrid processes.Thick Film knowledge helpful

Location is in Sunny San Diego, CA The positions are opened to the students who have US citizenship or green card.

Ray Petit
Pacific Rim Engineering
P.O. Box 230667 Encinitas, CA 92023


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:: Issue 160 ::
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