NEWS | JOBS | FAST LINKS

Heraeus TFD

Amkor

:: Corporate Member News ::

:: Recent PTI Blog Posts – Palomar Technologies, Inc. (full story)

:: Amkor Technology and Carsem Jointly Announce Settlement (full story)

:: Optically Clear UV Curable System Offers High Bond Strength and Fast Cures from Master Bond (full story)

:: Rudolph Announces Record Installations of its Advanced Process Control Software (full story)

:: PacTech Announces 2X Capacity Increase for electroless Ni/Au and Ni/Pd Plating Services at Subsidiary PacTech Asia (full story)

:: Brewer Science Unveils Apogee™ Temporary Wafer Bonder at CS MANTECH (full story)

:: DuPont Microcircuit Materials Extends Printed Electronics Research and Holst Centre Collaboration (full story)

:: STATS ChipPAC Introduces Robust Encapsulated Wafer Level Packaging Technology (full story)

:: MetGold 3010 (HS) hard gold process is giving significant gold savings in high speed connector plating applications (full story)

:: Job Openings ::

:: Commission-based Sales Agents (full story)

:: Finetech - Regional Sales Manager (Manchester NH) (full story)

:: Seeking 4 Engineers & Sr. Level Technician - Contact Pacific Rim Engineering (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Triton Micro Tech
Indium Corporation
Brewer Science

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


Recent PTI Blog Posts – Palomar Technologies, Inc.

Automated Ribbon Bonding
As frequencies go up in traditional hybrid and optoelectronic packaging, the first level wire interconnect itself can become a problem. The main issue is reactive inductance, but reactive capacitance can be a problem as well. Changing the shape of the wire from round to ribbon can directly affect the main problem – reactive inductance. Read more:

http://www.palomartechnologies.com/blog/bid/206205/Automated-Ribbon-Bonding.

palomar

The Growth of the IoT and UV Curable Epoxies
There has been a resurgent growth in the fiber communications industry over the last few years. Much of this is to support higher bandwidth of internet traffic and the growth of the “Internet of Things”. You might be wondering, ‘what is the “Internet of Things”’? Cisco defines it this way… Read more:

http://www.palomartechnologies.com/blog/bid/206297/The-Growth-of-the-IoT-and-UV-Curable-Epoxies.

 

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Amkor Technology and Carsem Jointly Announce Settlement

Amkor Technology, Inc. (Nasdaq: AMKR) and Carsem (M) Sdn Bhd have jointly announced the settlement of the litigation initiated by Amkor against Carsem alleging infringement of Amkor’s MicroLeadFrame® (MLF) patents.   

The parties have entered into a settlement agreement to end all pending proceedings related to the dispute and Carsem will pay Amkor an agreed sum for such settlement.  

Under the terms of the agreement, Carsem and Amkor have granted each other non-exclusive licenses to their respective MLF and MLP patents worldwide.

“We are pleased that Carsem has agreed to take a license to our industry leading MLF patent family, and that we can finally close this long-running dispute,” said Steve Kelley, Amkor’s president and chief executive officer.  

“With this settlement, we are happy that the dispute is behind us and our customers will have the benefits of the license,” said Peter Yates, managing director of Carsem.

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Optically Clear UV Curable System Offers High Bond Strength and Fast Cures from Master Bond

Specially formulated to optimize bond strength, Master Bond UV15-42C is a UV curable system for bonding, sealing and coating applications. This smooth paste can be applied vertically without sagging. As an optically clear compound, it is often used in the fiber-optic, optical, electronic, aerospace and specialty OEM industries.

This one part system bonds well to a wide variety of substrates including glass, metals, composites, rubbers and most plastics. Adhesion to acrylic and polycarbonates is exceptional. UV15-42C also features a tensile strength of 5,000-6,000 psi and a tensile modulus of 250,000-300,000 psi at room temperature. Its toughness enables it to withstand thermal cycling as well as mechanical shock. UV15-42C is also resistant to chemicals such as water, oils, cleaning agents, acids and bases.

It cures readily in 10-30 seconds upon exposure to a UV light source emitting a 320-365 nm wavelength with an energy output of 20-40 milliwatts/cm2. UV15-42C is not oxygen inhibited and will cure in thicknesses up to ¼ inch. This electrically insulative, dimensionally stable system has low shrinkage upon curing.

UV15-42C is serviceable from -65°F to +300°F and is available for use in syringes and cartridges. It can also be purchased in ½ pint, pint and quart containers.

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Rudolph Announces Record Installations of its Advanced Process Control Software

Following a record number of Yield Management Software installations, Rudolph experiences increased demand for its Advanced Process Control Software as it becomes critical to customers in maintaining yield during high-volume manufacturing

Rudolph Technologies, Inc. (NYSE: RTEC) has announced that it has completed a record number of installations for its ARTIST® fault detection and classification (FDC) and ProcessWORKS® advanced process control (APC) software solutions from manufacturers in USA, Japan and Europe during the first quarter of 2014.

Wins include multiple customers in the mobile communications supply chain, hard disc drive (HDD) and the burgeoning power device market. Expanding on nearly 800 tools connected in 2013, recent wins will add another 1,000 tool connections in 2014. With FDC and APC software in place, customers are making plans to install Rudolph’s advanced yield analysis and data mining applications to further optimize their manufacturing operations.

According to Richard Beaver, director of APC product management in Rudolph’s Data Analysis and Review Business Unit, “This is a very competitive market and we are delighted that customers recognize and appreciate the unique value proposition that our advanced process control systems provide. In each account, the ARTIST and ProcessWORKS software solutions were selected through competitive evaluations. We were selected, in large part, because of our ability to deploy the systems into our customers’ manufacturing lines within days, where they will run 24-7, to help improve the manufacturing process and increase yield. Our expertise in equipment integration and extensive equipment model libraries developed over the last decade further differentiated us from the competition and provided demonstrable value to our customers.”

Mike Plisinski, vice president and general manager of Rudolph’s Data Analysis and Review Business Unit, added “The Rudolph team has done an excellent job improving time to value for our customers and offering clear paths to adopting additional Rudolph products as their needs grow.  Each sale represents a long-term relationship with our customer. Our customers will roll out our product to multiple process areas, then multiple sites. After which, we work with them to identify further opportunities for yield improvements by leveraging our broad product portfolio and low integration costs. As we continue to roll out our solutions to new process areas and new factories, we identify additional opportunities to help our customers improve yields and productivity.” 

Rudolph’s ARTIST FDC software helps customers increase yield by detecting equipment fault conditions before they can destroy product wafers, damage equipment or cause extended downtime for repairs. The ProcessWORKS APC software improves process performance and overall yields by making run-to-run adjustments based on measurements of process results. The systems are fully integrated with each other and can be quickly and easily deployed in any factory, process or tool.

For more information about Rudolph’s ARTIST and ProcessWORKS software solutions, please visit www.rudolphtech.com.

 

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PacTech Announces 2X Capacity Increase for electroless Ni/Au and Ni/Pd Plating Services at Subsidiary PacTech Asia

PacTech GmbH has announced that subsidiary PacTech Asia (Penang, Malaysia) is now doubling capacity for electroless Ni/Au and Ni/Pd wafer level plating services.  The additional clean room area is now ready for installation of a new PacLine 300 automatic electroless plating system. Manufactured by PacTech, the PacLine 300 is suitable for both aluminum and copper pads on 200mm & 300mm wafers, and creates additional capacity of 20,000-30,000 wafers per month!

Dr. Thorsten Teutsch, President and COO of PacTech USA and COO of PacTech Asia commented, “We are experiencing huge success in MOSFET, RFID, LED, MEMS, and other key product areas with both major IDM’s and fabless customers.  PacTech Asia and PacTech USA work closely together to insure their mutual success! Over 80% of the volume demand results from our successful qualifications and product transfers from PacTech USA to PacTech Asia.  Additionally, PacTech Asia continues to invest in more automation, inspection and test capabilities, including wafer back metal services growing to 10,000 wafers per month.”

PacTech USA’s Silicon Valley facility located in Santa Clara, CA is not only PacTech’s Equipment Sales and Demonstration Centre for the Americas, but also provides rapid support on new designs and early production volume demands. Expedited chip design cycles on first silicon and multi-project wafers are critical to successful design wins with key end customers. Once proven, customers are ready to ramp up production volumes, and rely on their Asia- based external foundry management teams. The “Copy Exact” process transfer from PacTech USA to PacTech Asia insures the seamless transition handover.

Mr. Heinrich Lüdeke, CEO of PacTech – Packaging Technologies GmbH said, “We continue to commit more investments in 2014-2015, supporting both our advanced equipment manufacturing unit and foundry services operations. Plans include electroplated copper capabilities, embedded die packaging solutions, and next generation high-speed solder jetting machines, as well as laser-assisted bonding equipment. With over 800 production machines in the field and over 115 patents granted, the combination of PacTech’s technologies allows our three locations to provide the widest product offering in the industry; servicing the ASIC, Foundry, Government, Medical, Aerospace, Consumer, Telecommunication, Memory, MEMS, Probe Card, and Hard Disc Drive industries.”

 

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Brewer Science Unveils Apogee™ Temporary Wafer Bonder at CS MANTECH

Brewer Science, Inc. has unveiled the Brewer Science® Apogee™ bonder for temporary wafer bonding applications. This marks an industry milestone in leveraging Brewer Science’s unique ability to combine processing equipment, high-temperature temporary adhesives, and process integration into a seamless thin-wafer handling solution.

The Apogee™ bonder supports multiple temporary bonding/debonding technologies including thermal slide, mechanical peel, and laser release debonding. The Apogee bonder completes the Brewer Science thin wafer handling tool suite for low-volume compound semiconductor production of RF filters, analog power devices, LEDs, and solar devices.  This collection of tools provides reduced time to market for ultrathin wafer technologies using Brewer Science’s integrated material and process solutions.

The Brewer Science® Apogee™ bonder delivers exceptional accuracy, interface capabilities, and process flexibility. Industry-leading features include:

  • Substrate size range of 50-300 mm
  • Dual rigid platens heat wafer stack from both sides, minimizing thermal defects
  • Ultraflat self-leveling platens minimize total thickness variation (TTV)
  • Evacuated bond chamber eliminates voids
  • Carrier and device are separated during pre-bond evacuation
  • Total thickness variation: <10%
  • Real-time access and control to process data and push notifications

Brewer Science

Brewer Science processing equipment allows customers to cost-effectively enter new areas of product development and low-volume manufacturing. The equipment product suite can be used to develop process technologies for compound semiconductor, ultrathin CMOS, and MEMS manufacturing as well as thin films, sensors, and advanced packaging. The compact footprint, intuitive design, durability, and experience add up to years of high-performance processing that makes this tool suite perfect for low-volume production or R&D lab environments.

Brewer Science

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DuPont Microcircuit Materials Extends Printed Electronics Research and Holst Centre Collaboration

Advancing OLED Lighting, Wearable Electronics and Smart Packaging Technologies

DuPont Microcircuit Materials (DuPont) and Holst Centre have extended their collaboration focused on advanced materials for the printed electronics industry. The collaboration is expected to advance technology specifically in the area of Organic Light Emitting Diode (OLED) lighting, wearable electronics, in-mold electronics, sensors and smart packaging.

DuPont

DuPont Microcircuit Materials is collaborating with Holst Centre to extend research into OLED lighting and other printed electronics applications.  Photo courtesy of Holst Centre.

“DuPont is pleased to continue its collaboration with Holst Centre to enhance the potential for significant new materials for printed electronics,” said Kerry Adams, European marketing manager, DuPont Microcircuit Materials. “Continued innovation will be key to unlocking new opportunities in this market as we have seen with our recent advances in nano-silver conductor inks for OLED lighting.”

DuPont will continue as a partner in Holst Centre’s research on printing technologies and will additionally contribute to the prototype development of wearable, formable and stretchable electronics in order to help accelerate the uptake of new materials in real applications. The work will concentrate on optimizing printed metallic structures on flexible substrates in terms of conductivity, fine line deposition and low energy sintering. A variety of roll-to roll compatible printing techniques will be studied including screen, flexography and ink jet. Alternative conductor metallurgies will be studied as well as reactive systems for depositing conductive traces.

“Holst Centre and DuPont have had a longstanding and successful collaboration,” said Pim Groen, program manager, Printed Structures on Flexible Substrates. “It is exciting to extend that into new areas of technology.”

Holst Centre is an independent open-innovation R&D centre that develops generic technologies for Wireless Autonomous Sensor Technologies and for Flexible Electronics. A key feature of Holst Centre is its partnership model with industry and academia around shared roadmaps and programs. It is this kind of cross-fertilization that enables Holst Centre to tune its scientific strategy to industrial needs. Holst Centre was set up in 2005 by imec (Flanders, Belgium) and TNO (The Netherlands) with support from the Dutch Ministry of Economic Affairs and the Government of Flanders. It is named after Gilles Holst, a Dutch pioneer in Research and Development and first director of Philips Research. Located on High Tech Campus Eindhoven, Holst Centre benefits from the state-of-the-art on-site facilities. Holst Centre has over 180 employees from around 28 nationalities and a commitment from close to 40 industrial partners.

 

 

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STATS ChipPAC Introduces Robust Encapsulated Wafer Level Packaging Technology

STATS ChipPAC, has introduced encapsulated Wafer Level Chip Scale Package (eWLCSPTM), an innovative packaging technology that raises the industry standard of durability for Wafer Level Chip Scale Packaging (WLCSP). eWLCSPTM features a thin protective coating on the four sidewalls of the die, achieving increased durability and reliability within the standard WLCSP size specification. The significant benefit of encapsulation is the light and mechanical protection for the bare die. The protective layer also safeguards the silicon during socket insertion for test.  eWLCSP delivers electrical performance that is equivalent to standard WLCSP with proven results in component level reliability (CLR), temperature cycle on board (TCoB) and drop test.

The encapsulation advantages in eWLCSP are the result of STATS ChipPAC’s new FlexLineTM manufacturing method. FlexLineTM is an innovative approach to wafer level manufacturing that seamlessly processes multiple silicon wafer diameters  in the same manufacturing line, delivering unprecedented flexibility in producing both fan-out and fan-in packages. FlexlineTM is based on STATS ChipPAC’s well established, high volume manufacturing process for fan-out wafer level packaging that provides the ability to scale a device to larger panel sizes for a compelling cost reduction compared to conventional wafer level packaging methods. The FlexLineTM process has been qualified at advanced silicon nodes down to 28nm, ball pitches down to 0.40mm and body sizes as small as 2.5x2.5mm.

For more information, please visit www.statschippac.com.

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MetGold 3010 (HS) hard gold process is giving significant gold savings in high speed connector plating applications

Metalor Technologies’ innovative high speed hard gold plating processes continue to provide connector plating customers with significant gold savings in a variety of different processes.

MetGold 3010 Series: Innovative Hard Gold Processes

“The MetGold 3010 (HS) process was developed, very specifically, to address our customers’ increasing performance and cost saving demands required for the next generation of high speed hard gold processes, particularly in situations where minimized immersion is paramount”, said Stewart Hemsley, Global Research and Development Manager (Plating) at Metalor. “Our customers have to deal with many issues and cost reduction is always top of the list, but they must also maintain quality and performance requirements”.

Key points raised by platers include:

· Costs: the high gold price, and general market consensus that the gold price will increase, is a focal point for cost saving.

· Reliability: thinner and thinner gold deposits at increasingly faster line speeds raise concerns regarding gold porosity and distribution.

· Environment: more stringent environmental compliance demands must be met.

“Given these demands, the MetGold 3010 (HS) process is producing excellent gold savings, quality deposits and is meeting environmental compliance demands at multiple global locations”, continues Stewart, “due to its innovative proprietary immersion reduction and rapid pore closure formulation”.

MetGold 3010 (HS) has yielded significant gold savings compared to a number of competitive processes when utilized in the high speed connector plant designs below.

· Spot/Jet 10 – 20 %

· Moving mask 10 – 15 %

· Brush 10 – 15 %

· Dip selective 10 – 15 %

With the gold price currently around $ 1300 - 1400/toz, the MetGold 3010 (HS) process enables very significant and real material cost savings achieved by minimizing gold wastage.

The core activities of Metalor’s business unit Advanced Coatings focus on the application of metallization technologies. Products include: highly engineered precious metal powders and flakes; chemicals, salts and additives for the electroplating of precious metals and solid precious metal formats (bars, wires, ingots etc.). Metalor products are incorporated globally into decorative, electrically conductive adhesive and inks, electronic devices and contacts, printed wiring boards (PWB’s), semiconductor fabrication and solar cell market segments. The knowledge and processes which Metalor has developed over the years, the exceptional quality of its products and the ability to anticipate market trends and requirements, have earned the company a reputation of excellence all over the world.

For more information regarding the MetGold 3010 (HS) process and how its industry leading cost of ownership can help your business, contact Tim Tubergen or Gary Nicholls at:

Metalor Technologies USA Corporation
255 John L. Dietsch Blvd.
North Attleboro, MA 02763
Tel: +1 508-699-8800
www.metalor.com

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:: Job Openings ::

Commission-based Sales Agents

Alternate Finishing, Inc. is recruiting sales agents. The sales agents should be familiar with electronics in various areas such as defense, medical, high-tech, consumer product, industrial product, and R&D. The company (http://alternatefinishing.com) has the tradition and know-how to produce high-quality plating on circuit boards and ceramic thick and thin films. It plates nickel, silver, and gold via electroplate and electroless methods.

Interested parties should contact Jim Zhao at jimz@alternatefinishing.com.

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Finetech - Regional Sales Manager (Manchester NH)

REGIONAL SALES MANAGER
We are currently seeking an experienced, energetic and motivated technical sales manager with hands on experience in the semiconductor packaging or microelectronics market.
Location:  Manchester, NH

Responsibilities include:

  • Manage all aspects of driving new sales opportunities and maintaining and growing existing accounts in a defined Eastern US territory.
  • Qualify and prioritize all incoming sales leads  and follow through to closure.
  • Configure systems and tooling quotations, respond to formal RFQ’s.
  • Make technical product presentations to customers,  utilizing a consultative process approach.
  • Effectively communicate with and advise senior management, engineering, chief scientists, researchers, professors and students.
  • Assist with or lead hands-on equipment demonstrations.
  • Work with US and Germany Finetech teams to manage all details of system sales, from proposal through post installation.

 Requirements:

  • Bachelor’s Degree (EE, ME, or Sciences preferred).
  • 5+ years of Regional Sales or Sales engineering experience in semiconductor/microelectronics related markets.
  • Specific experience with semiconductor equipment and advanced packaging is preferred. Experience in die bonding strongly desired.
  • Confident, hands-on approach to equipment sales and consultative skills a must.
  • Experienced traveler with willingness to travel 50%+, and adaptability to schedule changes.  Will involve travel primarily in Eastern North America.  Occasional travel to customer sites and tradeshows  throughout North America, as well as the factory in Germany.
  • Must be  capable of thriving in a small company “can do” atmosphere.  The ability to multi-task, problem solve and take initiative is a must.
  • Strong organizational, follow-up and communication skills a must.
  • Proficiency in MS Outlook, Excel, Powerpoint, sales forecasting is assumed.

Submit resumes to: jobs@finetechusa.com

We thank all applicants in advance for their interest; however, only those being considered for an interview will be contacted.

 

 

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Seeking 4 Engineers & Sr. Level Technician - Contact Pacific Rim Engineering

Seeking 4 Engineers in the materials and Ceramic technology also a Sr. level Technician hands on in the Thick Film technology please send your resume to the following contact.

1. Material Scientist/Engineer, BS/MS/Ph.D. in materials science + 5 or more years of experience in paste formulation.

2. Process Engineer, BS in Engineering, 3+ years of experience in LTCC or MLCC cofired or hybrid processes.Thick Film knowledge helpful

Location is in Sunny San Diego, CA The positions are opened to the students who have US citizenship or green card.

CONTACT:
Ray Petit
Pacific Rim Engineering
P.O. Box 230667 Encinitas, CA 92023
(949)285-6383
ray@pacificrimeng.com

 

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View the Corporate Bulletin Archives

 

EPP
F&K Delvotec
RGL Enterprises

 


:: Issue 158 ::
June 3, 2014

Metallix

Torrey Hills Technologies

Oneida Research Services

Petroferm