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:: Corporate Member News ::

Thank you to our Device Packaging 2014 Conference
Exhibiting & Sponsoring Companies!

Device Packaging Exhibition and Technology Showcase:

The exhibit hall has sold out again in 2014 – with more than 12 companies on a wait list this year! The following companies will be on display during Device Packaging 2014. Please follow the company link below to read more about their products and services. And be sure to visit the companies’ booths while attending the Conference, as well as their websites listed below for more information.

Company

Booth(s)

Company

Booth(s)

Company

Booth(s)

AGC Electronics America
www.agcem.com

12

FlipChip International, LLC
www.flipchip.com

45

Riv, Inc.
www.rivinc.com

20

AI Technology, Inc.
www.aitechnology.com

30

FRT of America, LLC
www.frtofamerica.com

07

Rudolph Technologies, Inc.
www.rudolphtech.com

32

ALLVIA, Inc.
www.allvia.com

42

Geib Refining Corporation
www.geibrefining.com

63

SAES Group
www.saes-group.com

10

Amicra Microtechnologies GmbH
www.amicra.com

64

Hesse Mechatronics
www.hesse-mechatronics.us

01-02

SETNA
www.set-na.com

58

Amkor Technology
www.amkor.com

47

i3 Electronics. Inc. (Formerly Endicott Interconnect Technologies)
www.i3electronics.com

27

Sikama International, Inc.
www.sikama.com

21

ancosys Inc..
www.ancosys.com

56

IMAT, Inc.
www.imatinc.com

05

Solid State Equipment Corporation
www.ssecusa.com

38

ASE Group
www.aseglobal.com

50

Infinite Graphics
www.igi.com

08

Sonoscan, Inc.
www.sonoscan.com

33

ASM Pacific Technology, Ltd.
www.asmpacific.com

26

Kyocera America, Inc.
www.kyocera.com/kai/semiparts

22-23

SPTS Technologies
www.spts.com

17

Atotech USA, Inc.
www.atotech.com/en/region/americas/usa.html

49

LINTEC OF AMERICA, INC.
www.lintec-usa.com

24

STATS ChipPAC, Inc.
www.statschippac.com

59

ATV Technologie GmbH
www.atv-tech.de

BSET EQ
www.bsetplasmas.com

15
(shared)

LTEC Corporation
www.ltecusa.com

53

Tango Systems, Inc.
www.tangosystems.com

11

Axus Technology
www.axustech.com

19

Micross Components
www.micross.com

43

TDI International
www.tdiinternational.com

14

Azimuth Electronics, Inc.
www.azimuth-electronics.com

40

Mini-Systems, Inc.
www.mini-systemsinc.com

44

TechSearch International, Inc.
www.techsearchinc.com

39

Boschman Technologies / Advanced Packaging Center
www.boschman.com

09

Mitsubishi Materials Corporation
www.mmus.com

34

Trace Laboratories, Inc.
www.tracelabs.com

06

Chalman Technologies, Inc.
www.cti-rep.com

03-04

NAMICS Corporation
www.namics.co.jp

61

Triton Micro Tech
www.tritonmicrotech.com

66

Colorado Microcircuits, Inc.
www.coloradomicrocircuits.com

57

Neu Dynamics Corp.
www.neudynamics.com

29

Unisem Group
www.unisemgroup.com

55

CPS Technologies Corporation
www.alsic.com

52

Pac Tech Packaging Technologies USA
www.pactech-usa.com

60

West Bond, Inc.
www.westbond.com

62

Dow Electronic Materials
www.rohmhaas.com/electronicmaterials

28

Palomar Technologies, Inc.
www.palomartechnologies.com

41

XIA, LLC
www.xia.com

18

DYCONEX AG
www.mst.com/dyconex

Micro Systems Engineering GmbH
www.mst.com/msegmbh

25
(shared)

Plasma-Therm, LLC
www.plasmatherm.com

54

XYZTEC
www.xyztec.com

TPT Wire Bonder / CWI Technical Sales
www.cwitechsales.com

51
(shared)

Dynaloy – Eastman Chemical
www.eastman.com

31

Polysciences, Inc.
www.polysciences.com

13

Yolé Developpement
www.yole.fr

65

F&K Delvotec, Inc.
www.fkdelvotecusa.com

36

Pure Technologies, LLC
www.puretechnologies.com

37

YXLON International, Inc.
www.yxlon.com

46

Finetech, Inc.
www.finetechusa.com

35

PVA TePla America, Inc.
www.pvateplaamerica.com

16

Ziptronix, Inc.
www.ziptronix.com

48

 

Heraeus TFD

:: Job Openings ::

:: Kyocera America - Sales Engineer, Fishkill, NY (full story)

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Solid State Equipment Corp.
Amkor Technology
DPC/GBC Premier Sponsor: ASE US, Inc.
Applied Materials - Corporate Sponsor
Hole Sponsor: NAMICS
3D Panel Sponsor: Invensas

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


Booth: #12
AGC Electronics America
18694 Caminito Pasadero
San Diego, CA  92128
Contact: Vern Stygar
(P): (858) 676-2580
(E): vstygar@agcem.com
www.agcem.com

AGC, a Fortune Global 1000 company, is a leader in glass materials and related technologies. Our world class electronic packaging products include: Fused silica; ideal for outstanding optical transmission; high thermal stability; IPD and wafer backgrinding substrate. Specialty glass frits provide solutions for MEMS, high frequency, PV and LED applications.

Booth: #30
AI Technology, Inc.
70 Washington Road
Princeton Junction, NJ  08550
Contact: Rich Amigh
(P): (609) 799-9388 (124)
(E): ramigh@aitechnology.com
www.aitechnology.com

AI Technology is an ISO9001 certified facility and manufactures flexible “Stress-free” adhesives, films, pastes and thermal films, gels/grease.  Products are available in syringes, jars, premixed & frozen or separated in Part A & Part B for ambient storage.   Film based adhesives with tack for ease of use can be shipped in sheets or in performs.  Adhesives are electrically conductive or insulating and applicable for die-attach, lid sealing, BGA, multichip modules, and wafer lamination.

Booth: #42
ALLVIA, Inc.
657 N. Pastoria Ave.
Sunnyvale, CA  94085
Contact: Natalie Sparrer
(P): (408) 212-3200
(E): nsparrer@allvia.com
www.allvia.com

ALLVIA provides Silicon Interposer and Through-Silicon Via (TSV) foundry services for Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects.  2.5D, 3D and System-in-Package (SiP) solutions.  ALLVIA, a leader in TSV development provides design & processing for frontside (filled) and backside (conformal plated) through-silicon vias and offers services for prototyping as well as volume production runs.

Booth: #64
AMICRA Microtechnologies GmbH
Wernerwerkstr. 4
Regensburg, D  D-93049
Germany
Contact: Johann Weinhaendler
(P): +49 941208209 (80)
(E): johann.weinhaendler@amicra.com
www.amicra.com

AMICRA is a supplier for high precision Die Bonder and FlipChip systems. The AFC system is designed for an ultra-high precision bonding of +/- 500 nm. The NOVA system offers the combination of a high precision bonding (+/- 3μm@3s) and high speed (< 3 sec).

Booth: #47
Amkor Technology
1900 S. Price Road
Chandler, AZ  85286
Contact: Debi Polo
(P): (480) 821-5000 (7776)
(E): Debi.Polo@amkor.com
www.amkor.com

Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for many of the world's leading semiconductor companies and electronics OEMs, providing a broad array of advanced package design, assembly and test solutions. Amkor's operational base encompasses more than 5 million square feet of manufacturing facilities, product development centers, and sales & support offices in Asia, Europe and the United States. Amkor offers a suite of services, including electroplated wafer bumping, probe, assembly and final test. Amkor is a leader in advanced copper pillar bump and packaging technologies which enables next generation flip chip interconnect.

Booth: #56
ancosys Inc.
100 Cooperative Way, Suite 201
Kalispell, MT  59901
Contact: Graham Pye
(P): (406) 270-0027
(E): g.pye@ancosys.com
www.ancosys.com

ancosys provides the most advanced automated precision monitoring and replenishment of both Electroless and Electrolytic chemical plating baths.

Booth: #50
ASE US, Inc.
1255 E. Arques Ave.
Santa Clara, CA  94086
Contact: Patricia Jane MacLeod
(P): (408) 636-6500 (572)
(E): patricia.macleod@aseus.com
www.aseus.com

ASE Group’s broad portfolio of technology encompasses IC test program design, wafer probe, wafer bump, wafer level package, and much more. Leading the OSAT market, ASE generated sales revenues of $4.4 Billion in 2012. For more on our proven copper wire bond capabilities and our advances in 3D & TSV technologies, please visit
www.aseglobal.com.

Booth: #26
ASM Pacific Technology, Ltd.
3440 E. University Dr.
Phoenix, AZ  85034
Contact: Donald Ream
(P): (602) 437-4688
(E): don.ream@asmpt.com
www.asmpt.com

ASM equipment for Semiconductor Assembly includes IC, LED, RFID, Image Sensor, Chip on Glass, Chip on Board  markets. 

Equipment: Die Attach; Wire Bond (AU,CU,AL); Cure Ovens; Solder Reflow; Encapsulation (liquid dispense / transfer mold); Ball Attach; Package Inspection; Die Sorting; Package Test Handlers; Integrated Lines.

Materials: Etched / Stamped Leadframes

Booth: #49
Atotech USA, Inc.
1750 Overview Drive
Rock Hill, SC  29730
Contact: Kevin Martin
(P): (817) 507-9843
(E): kevin.martin@atotech.com
www.atotech.com

With annual sales of $1.176 billion, Atotech is one of the world's leading manufacturers of processes and equipment for the printed circuit board, IC-substrate and semiconductor industries as well as the decorative and functional surface finishing industries. Committed to sustainability, Atotech develops technologies that minimize waste and reduce environmental impact.

Booth: #15
ATV Technologie GmbH    (Shared with BSET EQ)
Johann-Sebastian-Bach-Str. 38
Vaterstetten,   85591
Germany
Contact: Siegfried Kowalsky
(P): 49810630500
(E): Siegfried.Kowalsky@atv-tech.de
www.atv-tech.de

ATV manufactures:
IR VACUUM REFLOW/BRAZING/RTA/Lid Sealing/Getter Activation System: - 1 100°C
QUARTZ TUBE Furnaces: up to 300 mm, multipurpose, fast ramping
LTCC SINTERING Furnace/PRESS
HOT PLATES: < 450°C
DIAMOND SCRIBERS: up to 200 mm wafer
Manual Hybrid assembly/test and repair station

Booth: #19
Axus Technology
7001 W. Erie Street, Suite 1
Chandler, AZ  85226
Contact: Barrie VanDevender
(P): (480) 705-8000
(E): bvandevender@axustech.com
www.axustech.com

Axus Technology delivers leading-edge CMP, polishing, and substrate thinning solutions for advanced packaging, MEMS, 3D integration, semiconductor, and related applications to a wide range of end-users.

Products and services include:
- Foundry CMP and grinding process services,
- Customized process equipment,
- Installation, parts, and service support

Booth: #40
Azimuth Electronics, Inc.
2605 South El Camino Real
San Clemente, CA  92672
Contact: RoJean Hall
(P): (714) 492-6481
(E): rjhall@azimuth-electronics.com
www.azimuth-electronics.com

Azimuth Electronics, Inc. is a US manufacturer of Test and Burn-In Sockets providing innovative interconnect solutions for over 50 years.  Our broad experience with test and burn-in allows us             to tackle the challenges of a constantly evolving industry. Complete in-house services from design, prototyping, tooling fabrication, and production injection molding.

Booth: #09
Boschman Technologies / Advanced Packaging Center
34522 N. Scottsdale Rd, D-8
PMB 147
Scottsdale, AZ  85266
Contact: John H. Crane
(P): (480) 488-9898
(E): jhcrane@earthlink.net
www.boschman.nl

Boschman Technologies is the world leading supplier of automatic molding systems that use film for the encapsulation of Sensor and MEMS devices.  This process, called Film Assisted Molding is ideal for applications where sensing surfaces or bond pads or heat sinks must be exposed and free of mold compound bleed and flash.  This technology is used for MEMS, Sensor, Solar, and Optical molding applications with the transfer molding of epoxy or silicone based mold compounds, including clear materials.  APC, Advanced Packaging Center, serves as a one-stop shop for research, development, qualification, prototyping and small volume manufacturing services by focusing on MEMS, Sensors, and advanced IC and wafer level packaging applications.  By working closely with customer R&D departments to explore new packaging concepts, value from Innovation to Industrialization is provided

Booth: #15
BSET EQ    (Shared with ATV Technologie GmbH)
2545 West 10th Street, Suite L
Antioch, CA 94509
Contact: Bill Smith
(P): (925) 755-2300
(E): sales@bsetplasmas.com
www.bsetplasmas.com

BSET EQ Manufactures gas plasma systems and is a developer of key process technologies used throughout the industries. We have a worldwide install base backed by outstanding service and support for our customers. Back end semiconductor related applications include plasma cleaning applications for improvement of packaging yields, package decapsulation or delayering for failure analysis. Front end applications include wafer level etching , ashing or descum processes in single wafer or batch processes. We have also manufactured tools noted for high volume reclaim of 300 mm wafers having thick buildups of diamond like films. BSET EQ is the world leader in Package opening for failure analysis and counterfeit prevention using gas plasma technologies. Solar applications include advanced texturing and edge etch isolation of cells. This year we add thermal processing equipment and expertise to our product line through our North American representation of ATV Technologie GMBH.

Booth: #03-04
Chalman Technologies, Inc.
3150 E. La Palma Avenue, Suite K
Anaheim, CA  92806
Contact: Keith Chalman
(P): (714) 632-1724
(E): keith@cti-rep.com
www.cti-rep.com

Chalman Technologies, Inc. (CTI) is an engineering oriented manufacturers' representative organization experienced in semiconductor, fiber optic, and other microelectronics technologies. We specialize in materials and equipment for these industries, including assembly, rework, & test equipment as well as materials for electronic assembly. In addition, we also provide HEPA filters, laminar flow workbenches and other equipment to meet your cleanroom requirements.

Booth: #57
Colorado Microcircuits, Inc.
6650 N. Harrison Ave
Loveland, CO  80538
Contact: Gary Thalman
(P): (970) 663-4145
(E): gthalman@coloradomicrocircuits.com
www.coloradomicrocircuits.com

IC Contract Assembly company.  High volume, US based manufacturing, specializing in high frequency air cavity packaging.

Booth: #52
CPS Technologies Corporation
111 South Worcester Street
Norton, MA  02766
Contact: Bo Sullivan
(P): (508) 222-0614 (210)
(E): bsullivan@alsic.com
www.alsic.com

CPS Technologies Corporation is the worldwide leader in the design and high-volume production of AlSiC (aluminum silicon carbide) for high thermal conductivity and device compatible thermal expansion. AlSiC thermal management components manufactured by CPS include Hermetic electronic packages, Heat sinks, Microprocessor & Flip chip heat spreader lids, Thermal substrates, IGBT base plates, Cooler baseplates, Pin Fin baseplates for Hybrid Electric Vehicles (HEV), Microwave & Optoelectronic Housings and System in Package (SiP) Heat Spreader Lids that address multiple IC’s on a PCB with a single lid design.  

Booth: #28
Dow Electronic Materials
455 Forest Street
Marlborough, MA  01752
Contact: Jeremy Cole
(P): (508) 229-7047
(E): JFCole@dow.com
www.dow.com

Dow Electronic Materials is a global supplier of materials to the electronics industry, bringing innovation to the semiconductor, interconnect, finishing, display, photovoltaic, LED and optics markets. Through its Advanced Packaging Technologies business, the company offers metallization, dielectric, lithography and assembly products for WLCSP, flip chip, SiP, 3D and other semiconductor packages.

Booth: #25
DYCONEX AG    (Shared with MSE)
Grindelstrasse 40
Bassersdorf, CH  8303
Switzerland
Contact: Melanie Stutz
(P): 41432661206
(E): melanie.stutz@mst.com
www.mst.com/dyconex

Based in Switzerland, Dyconex has been in the PCB business for 50 years and delivers leading-edge interconnect solution in flex, rigid-flex and rigid technology. Dyconex core competence lies in the production of highly complex HDI, high-frequency and high-reliability circuit boards for medical, defense and semiconductor applications. DYCONEX is an MST company.

Booth: #31
Dynaloy - Eastman Chemical
6445 Olivia Lane
Indianapolis, IN  46226
Contact: Diane Scheele
(P): (317) 788-5694
(E): dianescheele@dynaloy.com
www.dynaloy.com

Dynaloy is a leading supplier of photoresist and residue removers in the Semiconductor Industry. We specialize in developing custom formulations for both organic film and residue removal applications.  Based on our proven technical abilities we have become a market leader in the Wafer Level Packaging arena.   As a subsidiary of Eastman Chemical Company, we are able to combine small company responsiveness with large company resources to provide timely and cost effective solutions to our customers. 

Booth: #36
F & K Delvotec, Inc.
27182 Burbank Avenue
Foothill Ranch, CA  92610
Contact: Farnaz Mehran
(P): (949) 595-2200 (247)
(E): farnaz.mehran@fkdelvotecusa.com
www.fkdelvotecusa.com

As VLSI's number one rated wire bond equipment vendor since 2009, we offer unmatched technology leadership and unmatched customer service on our entire product line of CONVERTIBLE Auto and Semi-Auto wire bonders. We have a Model for every wire bonding technology. Heavy Wire, Heavy Ribbon, Fine Wire, Fine Ribbon, Ball Bonding, TAB, Deep Access, Hybrids, COB, RF Devices, Microwave Applications. Our 56XX convertible bonders offer 3 MINUTE quick change bond heads with no hand tools required. The 56XX auto bonder even converts to an auto pull/shear tester in 3 minutes. Model 5600C offers Automatic non destruct pull testing. We also offer Ultrasonic/Transducer test equipment and the industries largest wire bonder with a 44"x28" bond area. Come visit the number one rated wire bond equipment supplier to learn more.

Booth: #35
Finetech, Inc.
560 E Germann Rd. #103
Gilbert, AZ  85297
Contact: Adrienne Gerard
(P): (480) 893-1630
(E): adg@finetechusa.com
www.finetechusa.com

Finetech supplies precision die bonders that provide sub-micron placement accuracy and process modularity for various technologies:  thermo-compression/sonic, eutectic, epoxy, ACF & Indium bonding, sensitive materials (GaAs/GaP), UV curing.    Applications include flip chip, opto / photonics packaging, VCSELs, RFID, MEMs, sensors, CoG. Engineering collaboration and customization for complex applications.

Booth: #45
FlipChip International, LLC
3701 E. University Drive
Phoenix, AZ  85034
Contact: Anthony Curtis
(P): (602) 431-4717
(E): anthony.curtis@flipchip.com
www.flipchip.com

FlipChip International – (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries.  FCI supports a wide range of customers from each industry with patented technologies spanning from Cu Pillar Bumping, Spheron™ Wafer Level Chipscale Packaging, ChipsetT™ Embedded Die Packaging, and FlipChip on Lead assembly.  

Booth: #07
FRT of America, LLC
1101 S. Winchester Blvd.
Suite L-240
San Jose, CA  95128-3904
Contact: Paul Flynn
(P): (408) 261-2632
(E): pflynn@frtofamerica.com
www.frtofamerica.com

FRT is recognized as a valued partner for non-contact, optical metrology systems and solutions. FRT of America serves you, our customers by providing high quality measuring tools and services, which fulfill your research,  inspection and verification needs. Delivering increased manufacturing yield, enhanced productivity, improved quality and product performance, because that’s what it’s about at the end of the day.

Booth: #63
Geib Refining Corporation
399 Kilvert St.
Warwick, RI  02886
Contact: Michael Gervais
(P): (800) 228-4653
(E): mike@geibrefining.com
www.geibrefining.com

ITAR registered and EPA compliant refiner of precious metal based scrap. We reclaim gold, platinum, palladium, silver, and iridium from production scrap. Scrap components include targets, boats, chamber scrappings, foil, sand blast media, solutions, wafers, and rejected parts. Payment can be in pure metal form, wire or pool account transfer, or check.

Booth: #01-02
Hesse Mechatronics, Inc.
225 Hammond Ave.
Fremont, CA  94539
Contact: Joseph Bubel
(P): (408) 436-9300
(E): joseph.bubel@hesse-mechatronics.us
www.hesse-mechatronics.us

Hesse Mechatronics designs and manufactures high-speed fine pitch wedge bonders and heavy wire bonders for semiconductor backend assembly. Equipment includes thin wire bonders that handle aluminum and gold round and ribbon wire; and heavy wire bonders that handle aluminum, gold and copper round and ribbon wire, including HCR™ (High Current Ribbon).

Booth: #27
i3 Electronics, Inc. (Formerly Endicott Interconnect Technologies)
1093 Clark Street
Endicott, NY  13760
Contact: James Orband
(P): (607) 755-8084
(E): James.Orband@i3electronics.com

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

Booth: #05
IMAT, Inc.
12516 NE 95th St. Suite D110
Vancouver, WA  98682
Contact: Eric Feigner
(P): (360) 256-5600 (16)
(E): ericf@imatinc.com
www.imatinc.com

Quality  Custom in-house silicon wafer processing. We offer a wide variety of custom films and Services. Processing on 50mm- up to 450mm wafers. Bump / RDL / and TSV patterning. Thick resist patterning. Metal Deposition. Thermal Oxidation. Warped wafer fabrication. Feel free to contact us for quotations: 360-256-5600 ext.16.

Booth: #08
Infinite Graphics, Inc.
4611 East Lake St.
Minneapolis, MN  55406
Contact: Pete Maitland
(P): (860) 459-5085
(E): pmaitland@igi.com
www.igi.com

Infinite Graphics is an end-to-end photolithography engineering and software provider you can count on for quality products and services. IGI offers a unique set of  photomask services including non-stick mask coating and photomask layout software designed to save you time and money. Visit booth #08 to see the world’s first 450mm bump mask.

Booth: #22-23
Kyocera America, Inc.
8611 Balboa Avenue
San Diego, CA  92123
Contact: Iris Labadie
(P): (858) 614-2592
(E): iris.labadie@kyocera.com
www.americas.kyocera.com

Kyocera is North America's largest producer of ceramic semiconductor packages. These packages house microprocessors in the world's leading brand-name personal computers and workstations. They enclose microwave and radio-frequency devices in digital PCS, cellular base stations and handsets around the world. They're hurled into space in satellites orbiting Earth or in probes heading for Saturn where reliability is critical. They are also being implanted in the human body in sophisticated new biotech applications. Today, Kyocera's San Diego Plant is one of the world's largest manufacturers of metallized ceramic packages for the wireless industry.

Booth: #24
LINTEC OF AMERICA, INC
4629 E. Chandler Blvd.
Suite 110
Phoenix, AZ  85048
Contact: Stuart Campbell
(P): (972) 687-9097
(E): stuart-campbell@lintec-usa.com
www.lintec-usa.com

LINTEC's semiconductor manufacturing related products include a wide array of adhesive tapes; Non UV and UV dicing tape, Back grind surface protective tape, and die attach specialty films (from underfill replacements to multi-die packages) supporting production of TSV, 3D packaging, MEMS and LED.

Booth: #53
LTEC Corporation
4-42-8 Higashi-Arioka, Itami
Hyogo,   664-0845
Japan
Contact: Louis Burgyan
(P): (408) 432-7247
(E): louis.burgyan@ltecusa.com
www.ltecusa.com

LTEC, Japan's dominant IP analysis service, is relied on by Asia's technology giants. Backed by the $600M Fuji Group, LTEC helps customers win IP research, analysis and protection challenges with deep expertise across all electronics sectors. Over 100 engineers and 30-years of customer relations flexibility, attracts growing worldwide customer interest.

Literature Table – Media Sponsor
MEPTEC
PO Box 222|
Medicine Park, OK 73557
Contact: Bette Cooper
(P): (650) 714-1570
(E): bcooper@meptec.org
www.meptec.org

MEPTEC (Microelectronics Packaging and Test Engineering Council) is a trade association comprised of semiconductor professionals committed to enhancing the competitiveness of the back-end portion of the semiconductor business. MEPTEC is concerned exclusively with assembly, packaging and test issues and is dedicated to the advancement of that segment of the industry, and relevant industries such as MEMS, medical electronics, etc.

Booth: #43
Micross Components
7725 North Orange Blossom Trl.
Orlando, FL  32810
Contact: John Riordan
(P): (407) 822-6304
(E): John.Riordan@micross.com
www.micross.com

Micross Components, a leading global provider of distributed and specialty electronic components for medical, aerospace, defense and other demanding applications, has operated as a single-source provider of high reliability, state-of-the-art electronics for 35+ years. Micross’ solutions range from bare die and wafer processing to custom packaging and component modifications. www.micross.com

Booth: #25
Micro Systems Engineering GmbH (MSE)    (Shared with Dyconex)
Schlegelweg 17
95180 Berg Oberfranken
Germany
Contact: Melanie Stutz
(P): 41432661206
(E): melanie.stutz@mst.com
www.mst.com/msegmbh

Micro Systems Engineering GmbH (MSE) is an important partner and specialist for the international Electronics Industry, providing sophisticated solutions for advanced electronics at the highest quality level. MSE is an European market leader for Low Temperature Co-fired Ceramics. LTCC substrates are well qualified for high frequency applications due to low dielectric constant and loss.

MSE covers the full range from design support, over substrate manufacturing, to advanced assembly and packaging out of one hand at the highest quality level.

For more than 25 years, MSE manufactures electronic modules for RF and microwave applications, space, avionic, medical implants and other industrial applications. MSE is an MST company.

Booth: #44
Mini-Systems, Inc.
Thick Film Division
20 David Rd.
P.O. Box 69
N. Attleboro, MA  02761-0069
Contact: Minh Tran
(P): (508) 695-0203 (1305)
(E): mtran@mini-systemsinc.com
www.mini-systemsinc.com

Mini-Systems, Inc. (MSI) has over 45 years of proven as a one of worldwide leader in manufacturing high precision, high reliability passive components and high performance electronic packages. Thick Film and Thin Film Divisions offer wide range selection of thin film and thick film chip resistors along with capacitors. Package Division offers the varieties of hermetic sealed packages operating from DC to 40+ GHz. ISO9001 registered. RoHS compliant products available.

Booth: #34
Mitsubishi Materials Corporation
11250 Slater Ave
Fountain Valley, CA  92708
Contact: Megumi Nagashima
(P): (714) 352-6157
(E): MNagashima@mmus.com
www.mmus.com

Mitsubishi Materials focuses on providing solutions in manufacturing process technologies. Our products are application-specific for customers’ processes. In-depth engineering and superior customer satisfaction are components of products we deliver to our customers. Electronic Materials supplies key products to the semiconductor industry, including sputtering targets, plating materials and soldering pastes.

Booth: #61
NAMICS Corporation
2055 Gateway Place, Suite 480
San Jose, CA  95110
Contact: Kevin McLaughlin
(P): (603) 560-5350
(E): mclaughlin@namics-usa.com
www.namics-usa.com

NAMICS CORPORATION is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells.  NAMICS subsidiary, DIEMAT, Inc. located in Byfield, MA, specializes in the development and manufacture of innovative thermally conductive adhesives and sealing glasses.  Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.

Booth: #29
Neu Dynamics Corp.
110 Steamwhistle Dr.
Ivyland, PA  18974
Contact: Kevin Hartsoe
(P): (215) 355-2460
(E): kevinhartsoe@neudynamics.com
www.neudynamics.com

NDC is an ISO certified company specializing in design, manufacturing and sales of Tooling, Molds, Die and special equipment used in building Semiconductors, electronic components and a wide variety of devices used in automotive, telecommunications, solar and medical applications.

Booth: #60
Pac Tech Packaging Technologies USA
328 Martin Avenue
Santa Clara, CA  95050
Contact: Mausumi Sarkar
(P): (408) 588-1925 (212)
(E): sarkar@pactech-usa.com
www.pactech-usa.com

Pac Tech’s facility in Santa Clara, California offers contract wafer bumping services using low cost electroless Ni/Au under-bump metallization, solder stencil printing and solder ball placement for quick-turn and mass-production. PacTech USA also provides product demonstrations, training and sales support.

Pac Tech designs and builds state-of-the-art wafer bumping and assembly equipment for flip-chip and chip-scale packaging. Pac Tech is the worldwide leader in laser reflow and heating technology as implemented in systems for solder jetting (SB2) and flip-chip attach (LAPLACE) for advanced packaging applications like HGA assembly, MEMS and optoelectronic packaging, LCD driver assembly, etc.

Booth: #41
Palomar Technologies, Inc.
2728 Loker Avenue West
Carlsbad, CA  92010
Contact: Janine Hueners
(P): (760) 931-3680
(E): jhueners@bonders.com
www.palomartechnologies.com

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. Assembly Services, located in Carlsbad, CA, is the contract assembly, process development, test and prototyping division of Palomar Technologies. Assembly Services provides process expertise with high-precision die attach, wire bond and component placement services, offering its customers an alternative route to meet complex packaging needs for without investing in capital equipment.

Booth: #54
Plasma-Therm, LLC
10050 16th St, North
St. Petersburg, FL  33716
Contact: Ed Ostan
(P): (727) 577-4999
(E): sales@plasmatherm.com
www.plasmatherm.com

Plasma-Therm® is a leading provider of advanced plasma processing equipment. Plasma-Therm systems perform critical process steps in the fabrication of integrated circuits, micro-mechanical devices, solar power cells, lighting, and components of products from computers and home electronics to military systems and satellites. Specifically, Plasma-Therm systems employ innovative technology to etch and deposit thin films. The company's Mask Etcher® series for photomask production has exceeded technology roadmap milestones for more than 15 years. Its new MicroDieSingulator™ systems bring the precision and speed of plasma dicing to chip-packaging applications. Manufacturers, academic and governmental institutions depend on Plasma-Therm equipment, designed with “lab-to-fab” flexibility to meet the requirements of both R&D and volume production. Plasma-Therm's products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Plasma-Therm’s status as a preferred supplier of plasma process equipment has been recognized with 15 consecutive VLSIresearch industry awards, including a #1 ranking for customer satisfaction in 2013.

Booth: #13
Polysciences, Inc.
400 Valley Road
Warrington, PA  18976
Contact: Ashley Gidzinski
(P): (215) 488-7498
(E): agidzinski@polysciences.com
www.polysciences.com

Offering innovative polymer products to meet the high performance requirements of the electronic and semiconductor industry. Our expanded line of electronics polymers and chemicals includes underfills, liquid encapsulants, die attach and optical adhesives for advanced applications. Additionally, we provide custom formulation, high purity monomer & polymer synthesis, as well as contract packaging services. ISO 9001 certified.

Booth: #37
Pure Technologies, LLC
177 US Hwy #  1, # 306
Tequesta, FL  33469-2737 
Contact: Jerry Cohn
(P): (404) 964-3791
(E): jerry@puretechnologies.com
www.puretechnologies.com

Pure Technologies manufactures low (0.02, 0.01 cph/cm2), ultra-low (0.005, 0.002 cph/2) and super ultra-low (<0.001 cph/cm2) alpha emitting Tin (Sn), Lead-Free (including all SAC) alloys, Pb,  Pb/Sn and virtually all alloys. These ALPHALO® products are available in various shapes and sizes – ingots, anodes, slugs, pellets, foil, rods, bricks, PbO and SnO powder, etc. for wafer-level packaging, interconnects, electroplating and sphere and powder/paste manufacturing. ALPHA-LO® reduces or eliminates soft errors from alpha particle emissions from solders, enhances performance reliability and reduces corporate liability. All materials are guaranteed and certified to be at secular equilibrium and are tested and retested over time before shipping to insure that the alpha emission rate is stable and will not increase over time.

Booth: #16
PVA TePla America, Inc.
251 Corporate Terrace
Corona, CA  92879
Contact: Andi Babcock
(P): (951) 371-2500
(E): andreab@pvateplaamerica.com
www.pvateplaamerica.com

PVA TePla’s Scanning Acoustic Microscopes are used for defect detection, quality control and nondestructive failure analysis of bonded wafers and packaged electronics. We specialize in high throughput production environments and fully automated handling systems. Our advanced Plasma Systems for cleaning applications include batch and single wafer systems for photoresist ashing, descum, and SU-8 removal during fabrication of power devices, HB-LED, MEMS, PLED, and photovoltaics.

Booth: #20
Riv, Inc.
31 Railroad Ave.
Merrimack, NH  03054-4121
Contact: Tania Keefe
(P): (603) 424-0510
(E): tania@rivinc.com
www.rivinc.com

Since 1986 Riv Inc has been a leading manufacturer of high quality printing screens catering to the Hybrid Microelectronics industry and other related industries.  We specialize in offering you the best combination of mesh and emulsion choices to help you print the finest and most accurate line and pattern definition you expect.

Booth: #32
Rudolph Technologies
4900 W. 78th St
Bloomington, MN  55435
Contact: Claire Cilip
(P): (952) 259-1650
(E): Claire.cilip@rudolphtech.com
www.rudolphtech.com

Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Additional information can be found on the Company’s website at www.rudolphtech.com.

Booth: #10
SAES Group
100 Westgate Drive
Watsonville, CA  95076
Contact: Sandra Petznick
(P): (831) 722-4116 (106)
(E): sandra_petznick@saes-group.com
www.saes-group.com

Hydrogen-free packages can be achieved through the integration of an economical and process friendly high capacity getter manufactured in Italy and the USA.  SAES Group provides an advanced getter solution, High Capacity Rel-Hy (HCRH), with sorption capacity above 10,000 cc-Torr/cm2.   Effective at ambient temperature and pressure activation is not required.

Booth: #58
SETNA Corporation
343 Meadow Fox Lane
Chester, NH  03036
Contact: Keith Cooper
(P): (215) 796-2754
(E): kcooper@set-na.com
www.set-na.com

To enable high-density interconnect, SET-NA offers a range of surface preparation and high-accuracy bonding tools with unparalleled performance.  For improving wetting or for removing native oxides, organics or other bond inhibitors, our atmospheric plasma prepares and passivates substrate surfaces, while our device bonders deliver sub-micron bonding at high temperatures and forces for a wide variety of chip and substrate sizes.

Booth: #21
Sikama International, Inc.
118 East Gutierrez Street
Santa Barbara, CA  93101-2314
Contact: Phil Skeen
(P): (805) 962-1000 (108)
(E): phil@sikama.com
www.sikama.com

Sikama International designs, manufactures, and markets solder reflow & curing systems, wafer flux coaters and wafer washers. Our ovens feature a patented conduction plus convection heating technology and are used for Wafer Bumping, LED Die Reflow, BGA Re-balling, High Density Package Reflow, Lid Attach, Fluxless Gold Tin Reflow, Lead Frame Reflow and Curing among many other applications.

Booth: #38
Solid State Equipment Corporation
185 Gibraltar Rd
Horsham, PA  19044
Contact: John Voltz
(P): (267) 615-0806
(E): jvoltz@ssecusa.com
www.ssecusa.com

SSEC 3300 Series, Single Wafer Wet Processors for Advanced Packaging (WLP and 3D).    Metal etch for UBM/RDL with SSEC’s WaferChek - in-situ adaptive process control.  Wafer thinning and stress relief.  Combination batch immersion /single wafer spray processing for PR and dry film strip, lift-off, flux removal, post-etch residue and TSV clean.  High efficiency cleaning tools.   Spin Coat and develop processes.

Booth: #33
Sonoscan, Inc.
2149 E. Pratt Boulevard
Elk Grove Village, IL  60007-5914
Contact: Janet Lykowski
(P): (847) 437-6400 (200)
(E): jlykowski@sonoscan.com
www.sonoscan.com

Sonoscan® is a leader and innovator in Acoustic Micro Imaging (AMI) technology.  Sonoscan manufactures acoustic microscope systems and provides laboratory services to nondestructively inspect and analyze products.  Our C-SAM® microscopes provide unmatched accuracy for the inspection of products for hidden internal defects in SMT devices, ceramic capacitors and resistors, hybrids, MEMs, etc.

Booth: #17
SPTS Technologies
1150 Ringwood Court
San Jose, CA  95131
Contact: Lisa Mansfield
(P): (408) 571-1400 (194)
(E): Lisa.Mansfield@spts.com
www.spts.com

SPTS Technologies designs, manufactures, sells, and supports advanced etch, PVD, CVD and thermal capital equipment and process technologies for the global semiconductor and micro-device industries, with focus on the MEMS, advanced packaging, high speed RF device, power management and LED markets. For more information on the company, please visit http://www.spts.com.

Booth: #59
STATS ChipPAC, Inc.
47400 Kato Drive
Fremont, CA  94538
Contact: Lisa Lavin
(P): (208) 867-9859
(E): lisa.lavin@statschippac.com
www.statschippac.com

STATS ChipPAC will present the latest information on wafer level packaging at the upcoming IMAPS Device Packaging Conference in Scottsdale/Fountain Hills, Arizona. Mark your calendars for the following presentations on Tuesday, March 11th:

• A Flexible Manufacturing Method for Wafer Level Packages
• Electrical Performance Comparison between fcBGA and eWLB Packages

Wafer level packaging, in both fan-in and fan-out configurations, provides significant performance, size and cost advantages in small form factor applications. STATS ChipPAC has been a leader in driving technology and manufacturing innovations for wafer level packaging as well as flip chip technology. For customers requiring high density, high I/O packages at a lower cost, STATS ChipPAC’s patented fcCuBE technology provides strong competitive advantages. Whether you are looking for wafer level or flip chip packaging technology, STATS ChipPAC provides customers the optimum solution across the full spectrum of IC designs and end applications.

We invite you to attend the wafer level manufacturing presentations or visit booth #59 to discuss your specific requirements. For more information, please visit www.statschippac.com.

Booth: #11
Tango Systems, Inc.
2363 Bering Drive
San Jose, CA  95131
Contact: Zal Dordi
(P): (408) 526-2330
(E): zdordi@tangosystems.com
www.tangosystems.com

Tango Systems, Inc. is a leading innovator in high performing, cost-effective PVD systems for Advanced Packaging, EMI Shielding, and other applications. Cutting-edge technology combined with a simple, flexible system design allows Tango's customers to achieve excellent process results across many applications, including conformal TSV coverage on 15:1 Aspect Ratio Vias.

Booth: #14
TDI International, Inc.
3351 E. Hemisphere Loop
Tucson, AZ  85706
Contact: Karen DeJean
(P): (520) 799-8000
(E): kdejean@tdiinternational.com
www.tdiinternational.com

TDI International is a major supplier of cleanroom and assembly equipment and precision handtools. We offer one of the largest inventories of tweezers, cutters, pliers, diamond scribes, pin vise handles and vacuum pickup tools in the industry. TDI, also supplies acrylic and stainless steel desiccator cabinets, acrylic gloveboxes, cleanroom and assembly chairs.

Booth: #39
TechSearch International, Inc.
4801 Spicewood Springs Road
Suite 150
Austin, TX  78759
Contact: Becky Travelstead
(P): (512) 372-8887 (16)
(E): becky@techsearchinc.com
www.techsearchinc.com

TechSearch International has a 26-year history of quality market research and technology trend analysis focusing on:  WLP, FC, BGA/CSPs, 3DICs, SiP, and embedded.  We partner with SavanSys Solutions to provide cost models for WB, FC, WLP, and 3D ICs. Our extensive network consists of more than 15,000 contacts in North America, Asia, and Europe.

Booth: #51
TPT Wire Bonder      (Shared with XYZTEC / CWI)
704 Ginesi Drive - Suite 11A
Morganville, NJ 07751
Contact: Jonathan Gold
(P): (201) 230-8498
(E): jgold@cwitechsales.com
www.cwitechsales.com

TPT Wire Bonders are used in many leading Universities, Institutes, and Semiconductor Laboratories around the world. These all digital table-top Manual & Semi-Automated systems are capable of both Ball and Wedge Bonding. Ideal for Gold, Aluminum, and Copper applications - Fine Wire & Ribbon - Heavy Wire & Ribbon.

Booth: #06
Trace Laboratories
1150 West Euclid Ave.
Palatine, IL  60067
Contact: Nicholas Pawluk
(P): (847) 348-8930
(E): npawluk@tracelabs.com
www.tracelabs.com

Trace Laboratories is an independent, internationally accredited, full service testing laboratory.  Trace performs environmental, mechanical, and electrical testing to Aerospace, Automotive, Electronics, Medical, Military, and proprietary standards. Trace is recognized for its ability to perform testing, monitoring, and failure analysis of high density electronic interconnects, such as, BGA’s, CSP’s, flip chip, and next generation electronic packages.

Booth: #66
Triton Micro Tech
2726 Loker Ave West
Carlsbad, CA 92010
Contact: Steve Annas
(P): (503) 260-2002
(E): sannas@tritonmicrotech.com
www.tritonmicrotech.com

Triton Microtechnologies is the leader in the design and manufacture of high-performance 2.5D and 3D Through Glass Via (TGV) interposers.

As we rapidly approach the barrier and performance limits of silicon, the need increases for a greater number of components in smaller package areas and the need for non-silicon based materials to better support this next generation assembly.

Triton's proprietary technology offers faster cycle times, KGD testing at higher packaging integration levels, and the lowest cost/unit in the marketplace.

Booth: #55
Unisem Group
1284 Forgewood Ave.
Sunnyvale, CA  94089
Contact: Jay Hayes
(P): (719) 481-6444
(E): jhayes@unisemgroup.com
www.unisemgroup.com

Unisem Group is a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies. Unisem provides high-volume semiconductor packaging and test services including wafer bumping, Cu Pillar, WLCSP, wafer probing, thinning and a wide range of leadframe and substrate IC Packaging including leaded, QFN, BGA, and FlipChip packages, and mixed signal and high-end RF test services.

Booth: #62
West Bond, Inc.
1551 South Harris Ct.
Anaheim, CA  92806
Contact: Lorri Witters
(P): (714) 978-1551
(E): lwitters@westbond.com
www.westbond.com

Design and Manufacturer of Automatic, Semiautomatic, and Manual ESD protected Microelectronic Assembly and Test Equipment and Accessories since 1966.  Ultrasonic, Thermosonic, and Thermocompression Wire/Ribbon Bonders, Eutectic and Epoxy Die Bonders, Insulated Wire Bonders, and Pull Testers, LED Illuminators, Heated and Cold Workholders, Temperature Controllers, Ultrasonic Transducers, Ultrasonic Power Supplies, and Wire Despoolers.  Visit: www.westbond.com

Booth: #18
XIA, LLC
31057 Genstar Rd.
Hayward, CA  94544
Contact: Brendan McNally
(P): (510) 401-5760 (13)
(E): brendan@xia.com
www.xia.com

XIA LLC is the manufacturer of the UltraLo-1800 -- a next generation alpha particle counter.  The UltraLo-1800 is a revolutionary new design for advanced alpha particle emission metrology systems, and is the worlds most sensitive instrument for measuring alpha particle emissions from materials.

Booth: #51
XYZTEC    (Shared with TPT Wire Bonder  / CWI)
36 Balch Ave
Groveland, MA  01834
Contact: Tom Haley
(P): (978) 880-2598
(E): tom.haley@xyztec.com
www.xyztec.com

XYZTEC, a leading global supplier of bond test equipment, offers the most flexible bond testing platform on the market today! The Condor series features a single platform with multiple test capabilities allowing end-users the added flexibility of performing many types of tests all on one system. In addition to standard bond testing applications such as wire pull, ball shear, die shear, the Condor series has the capability to perform peel testing, push testing, high impact testing, fatigue testing, and creep testing.

Booth: #65
Yole Développement
45 rue Sainte Genevieve
Lyon,   69006
France
Contact: Camille Veyrier
(P): +33 472 83 01 01
(E): veyrier@yole.fr
www.yole.fr

Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Développement group as expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfuidics & Medical, Photovoltaic, Advanced Packaging, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

Booth: #46
YXLON International, Inc.
3400 Gilchrist Road
Mogadore, OH  44260
Contact: Randy Floyd
(P): (480) 432-0840
(E): randy.floyd@yxlon.com
www.yxlon.com

Worldwide, YXLON International is the leading provider of X-ray inspection equipment for industrial applications. Whether operated manually, semi-automatically or on a fully automatic scale, we have the right solution to match nearly every application. For us, the highest priority is placed on quality: the quality of our inspection systems and, as a result, the quality of your products. Our years of experience and the pleasure we take in innovation have enabled us to gain the confidence and trust of the most renowned manufacturers in the automotive industry, aviation and aerospace, shipbuilding and vessel construction, electronics and other industrial sectors. Since 2007 YXLON International has been a member company of the COMET Holding AG (Suisse).

Booth: #48
Ziptronix, Inc.
5400 Glenwood Avenue
Suite G-05
Raleigh, NC  27612
Contact: Kathy Cook
(P): (919) 459-2400
(E): k.cook@ziptronix.com
www.ziptronix.com

A pioneer in the development of low-temperature direct bond technology, Ziptronix offers patented technology for wafer- or die-level bonding. Its ZiBond® and DBI® technologies deliver the industry’s most scalable, manufacturable and lowest total cost-of-ownership solutions for 3D stacking. The company's intellectual property (IP) has been licensed for a variety of semiconductor applications including backside-illuminated (BSI) sensors, RF front ends, pico-projectors, memories and 3D integrated circuits. Founded in 2000 as a venture-backed spinoff of RTI International, the company holds more than 35 U.S. patents and more than 20 international patents, with more than 45 U.S. and international patent applications pending. For more information, visit www.ziptronix.com.


 

 

:: Job Openings ::

Kyocera America - Sales Engineer, Fishkill, NY
Experience a challenging and stimulating career at Kyocera America, Inc. (KAI). We are a global product technology leader seeking an effective sales professional for our Fishkill, NY Sales Office.

As a Sales Engineer, you will be responsible for managing and developing sales strategies for the Organic Products Division of KAI that provide products such as: FCBGA’s, FCCSP’s, PCB’s and chemicals for micro-electronic assembly applications.

The incumbent’s responsibility will be to increase business within an assigned territory and maintain a strong relationship with customers by conducting the following:

  • Create and support development activity within the customer base
  • Facilitate contract negotiations
  • Resolve customer complaints and other commercial requirements
  • Communicate and engage (internally & externally) with engineering, management, production, quality, & purchasing personnel at all levels. Strong communication skills are required as the Sales Engineer be the conduit for any information between the customers and other internal personnel (Production, Quality, Logistics, etc).
  • Interact with customers will be required regularly to identify customer needs, monitor competitive activity, conduct market analysis and provide feedback.
  • Provide updates to customers by presenting technical roadmaps and R&D activities. Therefore strong presentation skills and technical aptitude is required
  • Establish monthly sales goals (MSP) and guidance for annual (Master Plan) and 3-year sales plan within assigned account base

Requires a bachelor degree or equivalent job knowledge. Candidates with engineering degrees are preferred. A minimum of 3 years of on-the-job experience.

SPECIFIC KNOWLEDGE/SKILLS/ABILITIES:

  • Key skills and abilities include self-motivated with a proven track record in sales and influencing others
  • Semiconductor or technical manufacturing industry experience is required.
  • Strong written communication and verbal skills • Keen problem solving and analytical ability.
  • Travel to customer sites, Kyocera factories and trade shows as needed, approx 30%

To apply, email your resume to: kai.hr@kyocera.com please reference Job Code IMAPS on the subject line. EOE

 

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

 

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:: Issue 152 ::
March 3, 2014

Torrey Hills Technologies

Oneida Research Services

Metallix

Petroferm

BIOSENSORS 2014