NEWS | JOBS | FAST LINKS

Heraeus TFD

Amkor

:: Corporate Member News ::

:: M.S. KENNEDY (a subsidiary of Anaren) and CISSOID jointly announce a long term collaboration agreement for HiRel and High Temperature electronics modules (full story)

:: Materion Gold Products Validated as Conflict-Free (full story)

:: Updates from Quik-Pak (full story)

:: Remtec Develops New, Cost-Effective Gold Tin Plating Technique To Interconnect Minute Electronic Components and Parts On High Frequency Circuit Board Materials (full story)

:: Georgia Tech Packaging Research Center Partners with Finetech to Demonstrate New Copper Interconnection Technology Without Solders (full story)

:: The Latest from Palomar (full story)

:: Two Component, Thermally Conductive Epoxy Resists High Temperatures (full story)

:: Nordson EFD to Host Live Webinar TODAY: "12 Techniques to Get Better Fluid Dispensing Control in Today's Life Sciences Market" (full story)

:: Plexus Corp. Enhances Microelectronics Solution Offering by Expanding Capabilities in Boise, Idaho (full story)

:: Job Openings ::

:: Commission-based Sales Agents (full story)

:: Finetech - Regional Sales Manager (Manchester NH) (full story)

:: Seeking 4 Engineers & Sr. Level Technician - Contact Pacific Rim Engineering (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman - bschieman@imaps.org.

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Plexus Corp.
Alternate Finishing Inc.
Finetech

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at bschieman@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell, abell@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at abell@imaps.org or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at bschieman@imaps.org or 412-368-1621.


M.S. KENNEDY (a subsidiary of Anaren) and CISSOID jointly announce a long term collaboration agreement for HiRel and High Temperature electronics modules

CISSOID, the leader in high-temperature and extended lifetime semiconductor solutions and M.S. Kennedy, a leader in high-temperature and extreme environment modules jointly announce today they have signed a long-term collaboration agreement to develop high-reliability (HiRel) and high-temperature electronic modules. The agreement brings together Cissoid’s 14 years of experience in developing semiconductors that operate in extreme temperatures and harsh environments -- with M.S. Kennedy’s 43 years of expertise in developing complex high-quality / high-reliability multichip module solutions. Collaboration between the companies will address packaging multiple ICs into new, integrated, and highly compact standard multi-chip module products. Products introduced jointly will address new, high-temperature applications enabling customers to quickly develop their own solutions and reduce time to market.

Cissoid and M.S. Kennedy will shortly announce the details of their first jointly developed standard product based on Cissoid’s HADES® V2 -- a high-reliability, high voltage, and isolated gate driver solution that will provide a fully integrated solution to its customers. Both companies are also cooperating on custom modules, tailored to specific customer requirements.
                  
“M.S. Kennedy is very excited to be working with Cissoid on developing next generation ultra high temperature products,” said Bill Polinsky, Business Development Manager at M.S. Kennedy. “We see this relationship as key to pushing high-temperature, multi-chip module functionality beyond 232°C”

Dave Hutton, VP of Worldwide Sales at Cissoid, added that “Cissoid is very excited about this collaboration. We are working very closely with many market leaders in the oil and gas, aerospace, industrial and automotive markets. As we talk to our customers, we see an increasing requirement for more integrated solutions to address key application areas. The collaboration with M.S. Kennedy will allow us to bring together our combined expertise and excellence into solutions that addresses those market needs”.

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Materion Gold Products Validated as Conflict-Free

“All of our gold products are conflict-free,” confirmed Don Klimkowicz, President of Materion Advanced Materials Group, a Materion Corporation business. “We are proud of our long history of social and environmental accountability and our qualification as a Certified Conflict-Free Gold Refiner.”

In manufacturing its sputtering targets, evaporation materials and other products, Materion Advanced Materials Group has a long established practice of using 80% of the gold from its own reclaim and recycled facilities and the remaining 20% sourced from suppliers who have been validated as conflict-free under the requirements of the Conflict-Free Sourcing Initiative (CFSI).

In October 2013, Materion’s Buffalo, NY facility was successfully evaluated by the Audit Review Committee of the Electronic Industry Citizenship Coalition (EICC) and the Global e Sustainability Initiative (GeSI) and qualified for listing to the Conflict-Free Smelter (CFS) listing as a compliant Gold Refiner. This commits Materion to the CFS Gold Supply Chain Transparency Audit Protocol standards for which they need to re-certify annually.

Conflict-Free Products
Materion has established a conflict-free mineral policy that ensures that its products comply with the due diligence and reporting requirements of the U.S. Securities & Exchange (SEC) rule under the Conflict Minerals Rule (Section 1502 of the Dodd-Frank Wall Street Reform & Consumer Protection Act).  With more than 100 years of experience in refining precious metals, Materion is committed to responsible stewardship and the use of conflict-free minerals in all its products.

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Updates from Quik-Pak

Quik-Pak Promotes Casey Krawiec to Global Sales and Marketing Director
Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, announced that Casey Krawiec has been promoted to global sales and marketing director.

Mr. Krawiec joined Quik-Pak in 2011 as global sales and marketing manager and has been instrumental in setting the direction for the company’s growth.  His background includes extensive experience in engineering and sales within the semiconductor industry.  Previously, he held the position of vice president of North American Sales for StratEdge of San Diego and has held sales engineering and sales management positions at Kyocera America, San Diego, CA.  Mr. Krawiec holds a Bachelor of Science degree in Mechanical Engineering from University of Kentucky and a MBA from the University of Louisville.  “Casey will be a key player in directing Quik-Pak’s continued growth in the area of volume packaging and assembly services” said Darby Davis, vice president of sales and marketing for Quik-Pak’s parent company Delphon. 

Quik-Pak Selected to Provide Enhanced Molding and Assembly Services to Wireless Semiconductor and Solar Customers
Quik-Pak has expanded its transfer molding and assembly capabilities to accommodate the increased demands of innovative companies in the wireless electronics and solar industries.

Quik-Pak’s newly expanded manufacturing space, which is dedicated to its transfer molding operation, will be utilized to meet the volume demands of its customers.  The company has also expanded its wafer preparation facility to accommodate new equipment capable of supporting high-volume wafer backgrinding and dicing operations.

“This expansion comes in response to our customers’ demands for a reliable, US-based, mid-volume packaging and assembly provider,” said Casey Krawiec, Global Sales and Marketing Manager.  “Historically, Quik-Pak has been the go-to company for quick turn and prototype builds.  Our customers have increasingly asked us to provide packaging and assembly services in higher quantities.  With this expansion and purchase of new equipment, we now have greater capability than ever before.” ”The addition of an ISO class 8 molding room and the expansion of our ISO class 7 dicing area allow us to provide volume manufacturing of saw-singulated air-cavity and over-molded QFN and DFN packages to our customers,” says Steve Swendrowski.

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Remtec Develops New, Cost-Effective Gold Tin Plating Technique To Interconnect Minute Electronic Components and Parts On High Frequency Circuit Board Materials

Remtec Inc has adapted its Gold-Tin Plating Technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and Microwave electronic components, lead frames and other miniature parts on High Frequency PC boards.  The proprietary new process replaces the commonly used, labor intensive method of placing and fastening gold tin solder performs on organic boards. Remtec widely applied the same process to ceramic substrates, metals and metal alloys such as Kovar or Copper Tungsten.

Recent material advances with ceramic loaded organic boards (RO3000™ Laminates and others) that can withstand processing temperatures in access of   300C made gold tin application a possibility much like ceramic circuits, metal and metal alloy sheets. The use of Remtec’s time-proven gold tin plating capabilities to selectively apply solder on board materials makes electronic assembly significantly less costly and oftentimes  serves as an enabling solution for assembly of tiny parts and components on  "hard to get" places on circuit boards.

Remtec’s new process provides final products in multiple-image panels selectively gold tin plated on one or both sides ready for circuit etching and automatic assembly. Otherwise, parts can be etched and supplied in individual circuits. This method permits higher circuit density and lower cost assembly operations and aims to meet the continuing growing demands for miniaturization and higher performance required in today's' high density electronic applications.

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Georgia Tech Packaging Research Center Partners with Finetech to Demonstrate New Copper Interconnection Technology Without Solders

Finetech,  was selected by the Georgia Tech Packaging Research Center (PRC) to provide it's semi-automatic Matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine pitch copper interconnections and assembly technology.

The new Georgia Tech patented technology enables, for the first time, the ability to manufacture reliable copper interconnections at temperatures below 180°C. The process provides tolerance of bump co-planarity and substrate warpage, as well as surface roughness, to achieve ultra-fine pitch interconnections down to 30 µm.

The Finetech Matrix bonder facilitates Georgia Tech's research needs by featuring a proven placement accuracy of 3 micron, component size handling from 0.1 mm x 0.1 mm to 150 mm x 150 mm, substrate sizes up to 350 mm x 350 mm or 12" wafer. A modular design, and real-time contrast optimization with LED lighting, help to make the Matrix a low maintenance, flexible, easy-to-use system for R&D, prototype and multi-shift production.

"We have worked with Finetech bonders for many years and selected the new Matrix platform for our next generation of research and development at the PRC," says Dr. Vanessa Smet, the Program Manager for Interconnections and Assembly at Georgia Tech PRC. "The flexibility of the system to handle various bonding conditions, with large array of components and in panel form while maintaining co-planarity and 3 micron placement accuracy, was a very good fit for our research needs. Georgia Tech will present its findings using this tool at Electronic Components and Technology Conference (ECTC) in Orlando in May 2014."

finetech

Thermo-compression bonding with die-to-panel assembly process on 6"x6" ultra-thin
glass substrate (shown on the Matrix bonder stage)

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The Latest from Palomar

First Level Interconnects in the Complex Hybrid Market
Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated circuit/component down (or up) to a substrate/package. Most first level interconnects have been made in this way until recently. MIL-STD-883 does not allow tool impressions on an active device like an integrated circuit, so this has been the only method available until recently. Read more: http://www.palomartechnologies.com/blog/bid/205915/First-Level-Interconnects-in-the-Complex-Hybrid-Market.

palomar

Hughes Aircraft Industrial Products Division History Part 2: Pulsed Heat Technologies
This second installment of the history overview of the Hughes Aircraft Industrial Products Division series will cover developments of pulsed heat technologies to bonding wire and using pulse heating of a capillary to bond gold wire. Read more: http://www.palomartechnologies.com/blog/bid/206003/Hughes-Aircraft-Industrial-Products-Division-History-Part-2-Pulsed-Heat-Technologies.

Subscribe to the PTI Blog! Join the 4,288 industry peers who already have!
http://www.palomartechnologies.com/subscribe

 

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Two Component, Thermally Conductive Epoxy Resists High Temperatures

Formulated for bonding and sealing applications, Master Bond EP46HT-1AO is widely used in the aerospace, electronic and specialty OEM industries. Unlike most conventional two component epoxies, EP46HT-1AO cures with the addition of heat, which allows it to have a working life exceeding 24 hours. It has a forgiving 100 to 30 mix ratio by weight and bonds well to metals, composites, glass, ceramics and many plastics.

EP46HT-1AO combines thermal conductivity and electrical insulation properties. This dimensionally stable system provides a tensile strength over 7,500 psi, a compressive strength of 26,000 psi and a tensile lap shear strength greater than 1,500 psi at room temperature. EP46HT-1AO also withstands a variety of chemicals including oils, water, acids, bases and solvents.

This unique compound is serviceable over the temperature range of -73°C to +288°C (-100°F to +550°F) and offers a glass transition temperature of 215°C. It should be noted that EP46HT-1AO is relatively exothermic and should not be cured in sections greater than 20-30 thousandths of an inch thick and a bondline thickness is typically 2-7 thousandths of an inch.

This epoxy is available in ½ pint, pint, quart, gallon and 5 gallon container kits. Part A of this system is tan in color and Part B is moderately dark brown. EP46HT-1AO has a 6 month shelf life at ambient temperatures in original, unopened containers.

Master Bond Thermally Stable Adhesives

Master Bond EP46HT-1AO is thermally conductive and electrically insulative for bonding and sealing applications. This high strength, two component epoxy withstands temperatures up to +550°F. Read more about Master Bond’s heat resistant adhesives at http://www.masterbond.com/properties/high-temperature-resistant-bonding-sealing-and-coating-compounds or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

masterbond

 

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Nordson EFD to Host Live Webinar TODAY: "12 Techniques to Get Better Fluid Dispensing Control in Today's Life Sciences Market"

Live webinar to be held TODAY: Tuesday, May 20th at 2pm EDT

Webinar image can be viewed at: http://www.nordsonefd.com/images/ASM_Webinar_514.jpg   
  

Nordson EFD announces it will host a free, one hour webinar on Tuesday, May 20th, at 2pm EDT. This webinar will showcase the many ways in which manufacturers in the Life Sciences industry can significantly improve their process control by changing one or more of their fluid dispensing techniques in order to reduce waste, increase productivity, and get better return on investment.

"The right dispensing technique improves your process control and in the end, saves time and money. In fact, cost savings are all around you - you just need to take a closer look at your application, process parameters, and constraints," said co-presenter Amit Arora, Nordson EFD global market development manager. "This webinar will demonstrate several dispensing techniques, helping viewers develop their current procedures beyond the traditional processes."

Webinar participants will also have free access to the new Nordson EFD guide, "12 Techniques to Get Better Fluid Dispensing Control in Today's Life Sciences Market."
To register for free visit: http://www.nordsonefd.com/medical_webinar 

nordson efd

 

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Plexus Corp. Enhances Microelectronics Solution Offering by Expanding Capabilities in Boise, Idaho

Plexus’ Boise Microelectronics Center of Excellence to triple in size, further enabling product miniaturization solutions

Plexus Corp. (NASDAQ: PLXS), a global provider of optimized Product Realization solutions, today announced a $3 million investment to expand operations in its Boise Microelectronics Center of Excellence in Nampa, Idaho. This investment will triple the size of the ISO 7, Class 10,000 compliant, cleanroom facility and upgrade specialized manufacturing equipment.

Todd Kelsey, Executive Vice President and Chief Operating Officer, commented, “The sophistication and complexity of our customers’ products continue to evolve. One example of this evolution is the incorporation of microelectronics to reduce size while enhancing functionality. Plexus’ investment in our Microelectronics Center of Excellence further augments our ability to provide product miniaturization solutions developed over the past 10 years. Our microelectronics manufacturing expertise, combined with the remainder of our unique Product Realization Value Stream services, creates competitive advantages for our customers as they incorporate complex technologies within their products.”

Andy Edgin, Microelectronics Business Director, commented, “The expansion of our microelectronics capability not only increases our capacity to meet our customers’ demands, but also includes equipment upgrades that enhance our service offering. With this investment, we are implementing continuous flow manufacturing methods directly within the cleanroom and increasing the speed and accuracy of our equipment to align with the latest microelectronics technologies. In addition to our investment in facilities and equipment, we continue to enhance our team’s capabilities by adding talented engineering and technical resources that align with our product development engineers to offer a full suite of solutions. These changes will deliver significant gains in efficiencies and provide additional flexibility for our customers.”

As a committed partner to the communities in which Plexus operates, the local contractor, Stock Construction Management Services, has been selected to execute the microelectronics construction project. Construction of the facility expansion has begun with expected completion during the fiscal second quarter of 2014.

For further information, please contact:
Susan Hanson, Branding and Market Communications Manager 920-751-5491 or susan.hanson@plexus.com

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:: Job Openings ::

Commission-based Sales Agents

Alternate Finishing, Inc. is recruiting sales agents. The sales agents should be familiar with electronics in various areas such as defense, medical, high-tech, consumer product, industrial product, and R&D. The company (http://alternatefinishing.com) has the tradition and know-how to produce high-quality plating on circuit boards and ceramic thick and thin films. It plates nickel, silver, and gold via electroplate and electroless methods.

Interested parties should contact Jim Zhao at jimz@alternatefinishing.com.

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Finetech - Regional Sales Manager (Manchester NH)

REGIONAL SALES MANAGER
We are currently seeking an experienced, energetic and motivated technical sales manager with hands on experience in the semiconductor packaging or microelectronics market.
Location:  Manchester, NH

Responsibilities include:

  • Manage all aspects of driving new sales opportunities and maintaining and growing existing accounts in a defined Eastern US territory.
  • Qualify and prioritize all incoming sales leads  and follow through to closure.
  • Configure systems and tooling quotations, respond to formal RFQ’s.
  • Make technical product presentations to customers,  utilizing a consultative process approach.
  • Effectively communicate with and advise senior management, engineering, chief scientists, researchers, professors and students.
  • Assist with or lead hands-on equipment demonstrations.
  • Work with US and Germany Finetech teams to manage all details of system sales, from proposal through post installation.

 Requirements:

  • Bachelor’s Degree (EE, ME, or Sciences preferred).
  • 5+ years of Regional Sales or Sales engineering experience in semiconductor/microelectronics related markets.
  • Specific experience with semiconductor equipment and advanced packaging is preferred. Experience in die bonding strongly desired.
  • Confident, hands-on approach to equipment sales and consultative skills a must.
  • Experienced traveler with willingness to travel 50%+, and adaptability to schedule changes.  Will involve travel primarily in Eastern North America.  Occasional travel to customer sites and tradeshows  throughout North America, as well as the factory in Germany.
  • Must be  capable of thriving in a small company “can do” atmosphere.  The ability to multi-task, problem solve and take initiative is a must.
  • Strong organizational, follow-up and communication skills a must.
  • Proficiency in MS Outlook, Excel, Powerpoint, sales forecasting is assumed.

Submit resumes to: jobs@finetechusa.com

We thank all applicants in advance for their interest; however, only those being considered for an interview will be contacted.

 

 

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Seeking 4 Engineers & Sr. Level Technician - Contact Pacific Rim Engineering

Seeking 4 Engineers in the materials and Ceramic technology also a Sr. level Technician hands on in the Thick Film technology please send your resume to the following contact.

1. Material Scientist/Engineer, BS/MS/Ph.D. in materials science + 5 or more years of experience in paste formulation.

2. Process Engineer, BS in Engineering, 3+ years of experience in LTCC or MLCC cofired or hybrid processes.Thick Film knowledge helpful

Location is in Sunny San Diego, CA The positions are opened to the students who have US citizenship or green card.

CONTACT:
Ray Petit
Pacific Rim Engineering
P.O. Box 230667 Encinitas, CA 92023
(949)285-6383
ray@pacificrimeng.com

 

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:: Issue 157 ::
May 20, 2014

Metallix

Torrey Hills Technologies

Oneida Research Services

Petroferm

BIOSENSORS 2014