Heraeus TFD


:: Corporate Member News ::

:: Recent News from Palomar (full story)

:: CCI Adds Corstat-Korrvu to Their ESD Packaging Offering (full story)

:: MRSI Systems Announces Formation of Advisory Board (full story)

:: One Part Epoxy from Master Bond Resists up to 500°F and Meets NASA Low Outgassing Specifications (full story)

:: Isola Completes Testing of Laminate Materials for Conductive Anodic Filament Resistance (full story)

:: Indium Corporation Expands Malaysia Technical Support, Adds Team Members (full story)

:: Remtec Expands LED Packaging Capabilities And Adds New Economical Metallization Technologies, Custom Tailored for Specific Customer Requirements (full story)

:: Heraeus Marks Successful Appearance at IMAPS Symposium and SGIA Expo (full story)

:: Job Openings ::

:: DfR Solutions is seeking a customer-focused engineer or scientist to join our Technical Staff (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.


All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

Recent News from Palomar

Steps for Automated Advanced Packaging and Assembly Lines
As a former subsidiary of Hughes Aircraft, Palomar Technologies has long been a supplier of fully automated advanced packaging and assembly lines. The core of these assembly lines is often—but not exclusively—a combination of die attach, ball bonding and wedge bonding. Other equipment in the line can include automated handling, optical inspection, curing ovens, wafer sorting, epoxy dispensing, testing and plasma cleaning equipment. The question is not, “Can this equipment be put together in an assembly line?”, but instead, “Does it make sense for your process today?". Read more:


Extended Service and Support in Palomar Technologies Asia
With any product, service is a key component. Where do you go when you need help with troubleshooting a product? What about training new people to use that product? How can the product be used more efficiently and effectively?

Over the past five years, Palomar service in Asia has experienced unprecedented growth. Palomar Technologies Asia (PTA) now has five times as many Field Service Engineers in Asia compared with five years ago. Read more:

Subscribe to the PTI Blog! Join the industry peers who already have!


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CCI Adds Corstat-Korrvu to Their ESD Packaging Offering

Excellent custom option for shipping a “high-mix” of static sensitive devices

Conductive Containers, Inc. has designed a new custom option for consumers looking for a versatile cushioning and retaining product. Introducing Corstat-Korrvu. This design provides the consumer with great static shielding protection with a static dissipative retention film design. This innovative design accommodates a variety of devices within a size range - making it very versatile for your needs. The Corstat-Korrvu contains no charge generators, making it suitable for both the shipping and handling needs of a high mix of static sensitive devices.

Corstat-Korrvu Features:

  • A shipping, handling, and storage solution
  • Package contains no charge generators
  • Eliminates the need for shielding bags
  • Retains and cushions static-sensitive devices
  • Saves on labor – easy to load and unload
  • Package stores flat and saves space.

Learn more about CCI and the Corstat-Korrvu product by following the link below!


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MRSI Systems Announces Formation of Advisory Board

The management team at MRSI Systems has announced the formation of an Advisory Board to provide expertise, advice and constructive feedback as part of the company’s growth strategyThe Board Includes:

Mike Chase – A 20 year veteran of the capital equipment industry and President of Tekcess International a consulting firm that helps capital equipment firms grow and compete.

Jim Clancy – A recognized expert on manufacturing performance, supply chain and operational improvement Mr. Clancy brings 25 years of experience with companies ranging from startups to middle market companies. Starting his career at General Electric Power Systems Business he is a sought after advisor working with companies like TRW and Ford Motor Company.  He is currently a partner at Blitzer, Clancy & Company, an M&A and Strategy Advisory practice. 

Peter Frasso – A member of AltaStream Consulting, Mr. Frasso is a former VP and Managing Director of FEI Company, a semiconductor inspections equipment company, a Sr. VP of Global Operations At Brooks Automation and a VP and General Manager of the Vacuum Products Division at Varian Associates, Inc.

Mike Luttati – An accomplished executive with over 30 years of experience in the semiconductor capital equipment industries with companies like Teradyne, Eaton Corporation and Axcellis Technologies, Inc.  He was also the CEO of Photronics Inc. and a board member at Allegro Microsystems until 2008. 

In a statement, Michael Chalsen, President of MRSI Systems said that the formation of this Advisory Board, comprised of experienced, equipment and technology-based, business executives will provide immediate and real value as we grow the company to its next level.  


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One Part Epoxy from Master Bond Resists up to 500°F and Meets NASA Low Outgassing Specifications

Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in the aerospace, electronic, electro-optic and OEM industries. This system fully passes ASTM E595 testing for NASA low outgassing and is well suited for vacuum environments.

As a toughened epoxy, Supreme 12AOHT-LO resists rigorous thermal cycling and shocks over the wide service temperature range of 4K to +500°F. It offers high thermal conductivity of 9-10 BTU•in/ft2•hr•°F and is a competent electrical insulator.
It bonds well to an array of substrates including metals, composites, glass, rubbers, ceramics and many plastics. This compound delivers high tensile lap shear, compressive and peel strengths exceeding, 3,500 psi, 22,000 psi and 5-10 pli, respectively. It is dimensionally stable and has low shrinkage upon cure. Supreme 12AOHT-LO is resistant to a variety of chemicals, particularly to water, oil, fuels and solvents.

Supreme 12AOHT-LO is a thixotropic paste with a smooth consistency that is easy to handle. As a single component epoxy, it doesn’t require any mixing and offers an “unlimited” working life at room temperature. It cures rapidly at elevated temperatures. This gray colored system can be stored at ambient temperatures, but maximum shelf life is achieved when it is refrigerated at 45-55°F. Supreme 12AOHT-LO is available in syringes, ½ pints, pints, quarts, gallons and 5 gallon containers.

Master Bond Adhesives for Aerospace Applications

Supreme 12AOHT-LO is thermally conductive, electrically isolating epoxy offering high strength, cryogenic serviceability and NASA low outgassing approval. This one component epoxy is well suited for a variety of bonding and sealing applications in the aerospace industry. Read more about Master Bond’s systems for aerospace at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:


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Isola Completes Testing of Laminate Materials for Conductive Anodic Filament Resistance

Data supports the development of CAF-resistant materials for electric vehicle applications.

Isola Group S.à r.l., has announced the successful completion of Class 2 testing of laminate materials for Conductive Anodic Filament (CAF) resistance; the laminate materials were constructed with glass fabric woven at Isola Fabrics, a subsidiary of Isola Group S.à r.l.

Within the scope of the three-year HELP project (an interdisciplinary team from industry and academia), Isola collaborated to develop reliable and cost-effective electronics for electro mobility-applications using high-temperature resin system PCBs and succeeded in developing CAF-resistant laminate materials. Electro mobility is the concept of using electric powertrain technologies, in-vehicle information, and communication technologies and connected infrastructures to enable the electric propulsion of vehicles and fleets.

CAF is a failure mode in PCBs that occurs under conditions of high humidity and high voltage gradients. The successful completion of Class 2 of CAF testing for Bosch is very promising for future applications for electric vehicles. The electrochemical migration testing was performed at 85°C and 85% relative humidity using a 100V bias. The test vehicle samples were produced at Schweizer Electronic AG and incorporated 120 via holes at a 0.65 mm hole-to-hole pitch using two different resin systems in a six-layer stack up and with glass styles ranging from 106, 1080, 2116 to 7628. Isola’s laminate materials exceeded the 1000-hour testing protocol with no evidence of any electrical issues or CAF failures. This successful test provides great insight for the development of optimal CAF-resistant materials for electric vehicle and other high-voltage applications. 

Tarun Amla, Executive Vice President and CTO of Isola Group, stated, “We are pleased to have such positive CAF results from our collaborative testing program with Bosch and Schweizer.”

Karl Stollenwerk, President of Isola Europe, added, “We have made significant investments at Isola Fabrics in recent years for both process technology and glass-finish chemistry. We are delighted with these results at Bosch, which validate our continued investment in the European PCB materials industry.”

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Indium Corporation Expands Malaysia Technical Support, Adds Team Members

Indium Corporation celebrated the grand opening of its newest tech hub and the expansion of its technical support team in Penang, Malaysia, with customers and officials on Monday, Nov. 10.


Indium Corporation’s new Malaysia Tech Hub expands the company’s physical presence to provide a convenient, regional center for the development of electronics assembly expertise and customer service. The areas of focus for the tech hub include PCB assembly materials, engineered solders and alloys, and semiconductor and advanced assembly materials.

“Indium Corporation was founded as a tech hub, a place where sophisticated, technical, and customer-minded people collaborate on applications that extend our customers’, our products’ or our factories’ technologies,” said Greg Evans, president of Indium Corporation. “Our new Malaysian Tech Hub gives our southeast Asian customers a convenient base from which they can access world-class technical support, knowledge, training, meetings, and more.” 

“Penang’s electronics history started in the 1970s,” said KL Lim, president of the SMTA Penang Chapter. “More than 40 years later, Penang is still a place of choice for electronics business, despite ODM migration to low-cost geography. Penang is a unique place for electronics. It has a well-established infrastructure and supply chain, and it is also easy to access.

The Penang population consists of multicultural talent that is well-educated and speaks multiple languages, is friendly and willing to learn. SMTA Penang is looking forward to working closely with Indium Corporation to continue to excel Penang as place of choice for electronics.”  In addition to the newly opened facility, Indium Corporation has also added three new team members to provide onsite technical support.

New team members include Kenneth Thum, senior technical support engineer; Kenny Chiong, senior technical support engineer; and Jeffrey Len, technical support engineer. These new team members join experienced Indium Corporation professionals, including Sze Pei Lim, Southeast Asia technical manager; Jonas Sjoberg, technical consultant; Damian Santhanasamy, Malaysia sales
manager; and Jeffrey Tan, assistant sales manager.

“The Malaysia Tech Hub enhances Indium Corporation’s ability to fulfill our promise to our customers,” Ross Berntson, Indium Corporation executive vice president and president of Asia holdings, said. “It will increase customer productivity through superior applications, support, and technical know-how of advanced materials and processes.” 

Lim, the manager of Indium Corporation’s Malaysia Tech Hub, joined Indium Corporation in 2007. She manages the company’s technical service teams throughout the Asia-Pacific region. She earned her bachelor’s degree in chemistry from the National University of Singapore, and has more than 20 years of experience in the SMT and PCB assembly industries. Lim is an SMTA-certified process engineer and has earned her Six Sigma Green Belt.

Santhanasamy’s technical expertise has been an integral part of Indium Corporation’s expansion and success in Asia since 2006. Based in Penang, Malaysia, he is responsible for the sales of Indium Corporation’s solder products, including solder paste and wire, engineered solders, thermal management materials, and semiconductor materials. Santhanasamy earned a diploma in electrical and electronics from the Institut Teknologi Negeri, Malaysia.

Sjoberg provides technical support to key customers. He has more than 20 years of technical experience in the electronics industry, including the deployment of leading-edge technologies for packaging and assembly, launching and managing research and development projects and facilities, and serving as a technical advisor to development and manufacturing sites worldwide.

Tan provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials in southern Malaysia, Vietnam, Singapore, and Indonesia. Tan has extensive experience in the SMT and semiconductor industries, primarily with reflow process equipment and troubleshooting. He also has customer service experience within the solar assembly industry. Tan holds a degree in computer and control engineering from Nanyang Polytechnic in Singapore. 

Thum provides technical support and process troubleshooting expertise to Indium Corporation’s customers for the company’s full product range. His experience involves delivering yield improvements and enhanced supplier quality. Thum holds a bachelor’s degree from University of Malaya in computer aided design and computer aided manufacturing. Additionally, he is an SMTA-certified process engineer.

Chiong assists customers in the optimization of manufacturing processes, including technical support for Indium Corporation’s full product suite. Chiong’s experience lies in providing technical support and design reviews for printed circuit board assembly to maintain quality, delivery, and optimal output. Chiong holds a bachelor’s degree in mechanical and manufacturing engineering from the Universiti Malaysia Sarawak. Additionally, he holds a Six Sigma Green Belt. 

Len provides comprehensive technical advice in the selection, use, and application of all of Indium Corporation’s products. Len has experience with process improvement to increase quality, and customer relationship management. Len holds a bachelor’s degree in pure chemistry from Universiti Sains Malaysia in Penang, Malaysia. 

For more information on Indium Corporation’s Malaysia Tech Hub, visit


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Remtec Expands LED Packaging Capabilities And Adds New Economical Metallization Technologies, Custom Tailored for Specific Customer Requirements

Remtec Inc., the leading manufacturer of substrates and packages using PCTF®  (Plated Copper On Thick Film) metallization, has expanded its LED substrate and submount design and manufacturing capabilities by adding new features such as bond-pad down (flip-chip)  packaging with a cathode-anode gap as small as 75-50 µm and selective gold-tin plating.  As a result, Remtec can now produce higher performance, lower cost metallized LED substrates and submounts using added benefits, each custom tailored to a specific customer requirement matching the required performance and power level or assembly methods.

Remtec LED substrates and submounts utilize a variety of metallization technologies on alumina, AIN and BeO ceramics: PCTF® (Plated Copper on Thick and Thin Film) with 20-75 µm copper, AgENIG® (Electroless Nickel and Immersion Gold over Silver) and DBC (Direct Bond Copper) with 125-250 µm copper. 

Remtec has developed LED substrates for bond-pad down devices allowing “narrow gap” capability for 50 µm wide gaps suitable for InGaN, GaAs and other LED devices. It enables direct eutectic die-attach, eliminating the need for wire bonds and ensures superior thermal and electrical performance for the next generation of solid-state LED devices.

Remtec’s lower cost, high performance gold tin plating that is selectively applied over basic metallization eliminates bulky solder preforms and ensures void-free solder joints in LED substrates and submounts.

Finally, using these new capabilities and refined manufacturing techniques, Remtec is able to offer LED assembly manufacturers reliable solutions, competitive pricing, low upfront tooling costs and fast turnaround times  without any compromise in quality or performance.

In addition to traditional LED lighting markets, Remtec is expanding LED substrates and submounts for non-invasive medical diagnostics, dental, printing and other industries requiring enhanced light extraction from LED chips.


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Heraeus Marks Successful Appearance at IMAPS Symposium and SGIA Expo

Last month, Heraeus exhibited at IMAPS, and presented papers at both the IMAPS Symposium and the SGIA Expo.  

The International Microelectronics Assembly and Packaging Society™s (IMAPS) show was held October 14-16 in San Diego, California. Heraeus was the Gold Premier Sponsor for this 47th International Symposium on Microelectronics. The show covered three tiers of electronics: Systems and Applications; Design and Related Measurements; and Materials, Process and Reliability. We showcased our thick print copper conductors for high power electronics and our new low-temperature polymer product line.


At the 2014 SGIA Expo,attendees learned about the latest technical advancements in the specialty printing and imaging technology industry. The SGIA/FlexTech Printed Electronics Symposium was held October 21 to October 22 in Las Vegas, Nevada. It combined FlexTech Alliance's expertise in flexible printed electronics and the Specialty Graphic Imaging Association's (SGIA) community of imagers, suppliers, distributors, and printed electronic members.

Two Heraeus engineers presented a paper on the "Performance Assessment of a Low-Temperature Polymer Conductor for Lead-Free Soldering Processes" at technical sessions during both shows. The presentation covered the use of low-temperature polymer thick film products in the printed electronics market. It explained how a newly formulated low-temperature-curing (150°C - 200°C), RoHS- and REACH-compliant paste is compatible with a variety of substrates and readily accepts lead-free solder.

Steven Grabey, research engineer, gave the presentation at the IMAPS Symposium; and Sarah Groman, technical service engineer, discussed the paper at the Printed Electronics Symposium during the SGIA Expo.

Heraeus Introduces New Polymer Brochure 

A new brochure featuring Heraeus' low-temperature materials is now available. The brochure presents detailed information about polymer-based Conductors, Dielectrics and Resistors.

Heraeus Polymer Dielectrics are screen-printable, fast-cure coatings designed for circuit protection and insulation. These robust, chemically inert products are compatible with a variety of other Heraeus polymer and cermet conductors and resisters.

The Polymer Conductors are ideal for a wide range of applications such as membrane touch switch and flexible electronics, heaters, and end terminations for multi-layer passive components. They are compatible with an extensive variety of substrates and perform well with other Heraeus polymer thick film pastes.

Our Polymer Resistors are blendable between adjacent end members, with no blend breaks, and are compatible with Heraeus polymer dielectrics and conductors. The series ranges from 250mohm/sq. up to 1kohm/sq. They function well on FR4, alumina and dielectric with minimal variation after curing.
For more information on how to obtain a brochure, please contact the Heraeus Technical Service Department.  



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:: Job Openings ::

DfR Solutions is seeking a customer-focused engineer or scientist to join our Technical Staff
DfR Solutions, one of the 50 fastest-growing engineering firms (according to the 2012 Inc 5000 List of America's Fastest Growing Companies), is seeking a customer-focused engineer or scientist to join our Technical Staff in the Washington, DC, area (Beltsville, MD). Founded in 2005, DfR Solutions specializes in applying the science of Reliability Physics to accelerate time to market for clients in almost every electronics marketplace (e.g., consumer, industrial, transportation, medical, aerospace, military, telecom, oil exploration). Hundreds of customers a year (including SpaceX, Apple, Tesla, Google, Nike, Medtronic, Philips Lumileds, Cree, Johnson & Johnson, Chrysler, Boeing, Hewlett Packard, Bose, Bombardier, NASA, Panasonic, Verizon, Intel and General Electric, to name a few) depend on DfR Solutions to deliver knowledge and science-based solutions to their most difficult product challenges.

DfR is looking for applicants that thrive in a dynamic, fast-pace work environment that provides strong engagement and support from your fellow employees in combination with opportunities for creative problem solving, direct interaction with the customer, travel to technical conferences, and the opportunity to publish in industry journals. The range of projects and technologies you will work on is stunning in its breadth and relevance to the latest technology challenges. You may find yourself working with a team of technical experts on a forensic analysis on a state of the art light emitting diode, advising federal agencies on failure behavior of autonomous vehicles, recommending design changes to wearable electronics, and performing testing on the next generation memory device.

The ideal candidate must be delightfully curious, enjoy working in technical teams, and be confident enough to work alone. The applicant will be expected to work in a laboratory and with test equipment on a regular basis. Strong written and verbal technical communication skills are a must as this position will require frequent verbal and written communication with customers , professional societies, universities, and vendors.

Because of the broad range of potential projects, this position is flexible in regards to degree, experience, and expertise. Qualified candidates must have a Bachelor’s Degree in an engineering (EE, MechE, MatSci, ChemE) or physical science (Physics, Chemistry) field; applicants with Masters and Doctorate degrees are also encouraged to apply. Resumes that demonstrate direct experience with some aspect of electronics design and/or manufacturing will receive preference. Also desirable are experience with a broad range of materials (ceramics, metals, polymers, semiconductors), good understanding of material fundamentals (crystallography, diffusion, creep, fatigue, oxidation, etc.), awareness of or training in statistics and statistical analysis tools, and training or experience with project management.

DfR Solutions is located less than 0.5 mile from mass transit (MARC train) and is easily accessible for applicants living or planning to move to the Washington, DC, area. DfR Solutions offers a generous compensation package including a competitive salary and benefits: vacation and most major holidays, 401(k), tuition reimbursement, health, vision, and dental insurance, short and long term disability insurance. For more information regarding DfR Solutions, visit


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:: Issue 167 ::
November 19, 2014


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