Heraeus TFD


:: Corporate Member News ::

:: Amkor Technology Receives Excellent Service Provider Award from SMIC (full story)

:: News from CPS (full story)

:: Indium Corporation’s Mackie Honored by IMAPS (full story)

:: Visit Nordson DAGE to learn more about its Award Winning Camera Assist Automation on the 4000Plus Bondtester (full story)

:: EV Group Unveils Room-Temperature Covalent Bonder For Engineered Substrate And Power Device Production Applications (full story)

:: News from Palomar (full story)

:: Quik-Pak Offers High Volume Overmolded Packaging and Assembly Services (full story)

:: Rudolph Wins Yield Management Software Sale from the College of Nanoscale Science and Engineering (full story)

:: AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments (full story)

:: Kyocera America, Inc. now supplies high-performance assembly materials (full story)

:: Job Openings ::

:: DfR Solutions is seeking a customer-focused engineer or scientist to join our Technical Staff (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

DPC/GBC Premier Sponsor: Solid State Equipment Corp.
DPC/GBC Premier Sponsor: Amkor Technology
DPC/GBC Premier Sponsor: ASE US, Inc.
Kyocera America
Nordson DAGE

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

Amkor Technology Receives Excellent Service Provider Award from SMIC

Amkor Technology, Inc. has announced that it has received the 2013 Excellent Service Provider Award from Semiconductor Manufacturing International Corporation (SMIC), the third consecutive year Amkor has earned this award.  Mr. TH Chen, SMIC’s Vice President of Corporate Planning Center, presented the award to Amkor at a ceremony held at Amkor’s Shanghai, China facilities.

“We are honored to receive SMIC’s Excellent Service Provider Award for the third consecutive year,” said Gilbert Zhou, Amkor Assembly and Test (Shanghai) Co., Ltd president and China country manager.  “This award is a testament to the hard work of our team in Amkor Technology China, and our commitment and ability to support and provide value to our customers.”

SMIC presents its Excellent Service Provider Awards to its top ranking suppliers each year.  The criteria evaluated in choosing the award recipients include quality, price, on-time delivery, technical support, logistics and customer service. Amkor provides SMIC with 200mm wafer bumping and full turn-key wafer-level CSP services, including probe, 200mm wafer bumping and die processing services.

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News from CPS

CPS Technologies Corporation Announces Third Quarter 2014 Results
CPS Technologies Corporation (OTCQB: CPSH) today announced revenues of $6.1 million and net income of $194 thousand for the quarter ended September 27, 2014. This compares with revenues of $6.0 million and net income of $452 thousand for the quarter ended September 28, 2013.

CPS Technologies Corporation has announced the appointment of Thomas M. Culligan to the Company's Board of Directors.
Mr. Culligan served as the Chairman and Chief Executive Officer of Raytheon International and, concurrently, as the Senior Vice-President of Business Development and Strategy for all of Raytheon until his retirement in December, 2013. Prior to joining Raytheon in 2001, Mr. Culligan held senior positions with Honeywell, Allied Signal and McDonnell Douglas.

CPS Technologies Corporation (OTCQB: CPSH) has announced today that it has been awarded a $600 thousand subcontract from Raytheon Integrated Defense Systems to produce a metal- matrix composite cold plate as part of the U.S. Navy’s next-generation integrated Air and Mission Defense Radar (AMDR) Program. This component, to be delivered in the third and fourth quarters of 2014, will support the Engineering and Manufacturing Development (EMD) Phase of Raytheon’s contract with the U.S. Navy’s for the AMDR Program


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Indium Corporation’s Mackie Honored by IMAPS

Indium Corporation’s Andy C. Mackie, PhD, MSc, senior product manager for semiconductor and advanced assembly materials, was presented with the 2014 William D. Ashman Award at the 47th International Symposium on Microelectronics on Oct. 14 in San Diego, Calif.

The William D. Ashman Award recognizes an individual who has provided significant technical contributions to the electronics packaging industry, while participating and demonstrating support of activities that enhance the electronics packaging profession.

Dr. Mackie is the president of the IMAPS Empire Chapter and chairman of the editorial advisory board for Chip Scale Review Magazine. In 2014, his articles appeared in Semiconductor Packaging News, EP&P (Europe) and Chip Scale Review. Dr. Mackie has also served as a presenter and chair for IMAPS workshops.
“Dr. Mackie’s demonstrated commitment and fervor for advancing the microelectronics industry and electronics packaging technologies distinguishes him as a true leader,” said Voya Markovich, first past president and chairman of the IMAPS Awards committee. “We are honored to be able to recognize him with this award.”

Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science (MSc) in colloid and interface science from the University of Bristol, U.K. Additionally, he is formally trained in Six Sigma – Design of Experiments.


Voya Markovich, first past president and chairman of the IMAPS Awards committee, presents Indium Corporation Senior Product Manager Andy C. Mackie, PhD, MSc with the 2014 William D. Ashman Award on Oct. 14.


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Visit Nordson DAGE to learn more about its Award Winning Camera Assist Automation on the 4000Plus Bondtester

Based upon a pedigree of automatic bond testing technology spanning more than two decades, Nordson DAGE has developed the latest camera assist automation as a feature of the award winning 4000Plus bondtester platform. Built around a unique multi-function cartridge, the camera assist automation system is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages. Easy programming using fiducial camera assist and vector stage nudge buttons provides precise X-Y alignment and facilitates rapid changeover for a variety of bond testing applications.

The advanced Nordson DAGE 4000Plus is a multipurpose bond, stress/strain and micro materials test system. The 4000Plus can perform shear tests up to 200kg, pull tests up to 100kg and push tests up to 50kg, covering all test applications including 3 & 4 point bend, and IPC9708 hot bump pull.

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EV Group Unveils Room-Temperature Covalent Bonder For Engineered Substrate And Power Device Production Applications

EVG®580 ComBond® integrates advanced surface preparation processing to ensure oxide-free bonds and higher device yields

 EV Group has introduced the EVG®580 ComBond®―a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature. Built on a modular platform to support high-volume manufacturing (HVM) requirements, the new system is ideally suited for bonding different substrate materials together in order to enable higher-performing devices and new applications, including:

  • Multi-junction solar cells
  • Silicon photonics
  • High-vacuum MEMS packaging
  • Power devices
  • Compound semiconductor and other advanced engineered substrates for "beyond CMOS" applications such as high-mobility transistors, high-performance/low-power logic and radio frequency (RF) devices

The EVG(r)580 ComBond(r) automated high-vacuum wafer bonding system enables electrically conductive and oxide-free covalent bonds at room temperature. It is ideal for bonding materials with different properties to produce higher-performing electronic devices.
Several EVG580 ComBond systems have already been shipped to device manufacturers and R&D centers. Customer demonstrations are available at EVG's corporate headquarters in St. Florian, Austria. Download the product datasheet at:

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News from Palomar

Providing the Total Solution for Assembly and Packaging
In today’s busy world, figuring out how to maximize the hours in each day and save time have become high priorities. For instance, nobody wants to waste time going to the pet store to pick up dog food, then the pharmacy to pick up a prescription, and then the grocery store to buy dinner for that evening. We need to get the most out of our time and maximize efficiency so that we have more hours in the day to focus on other priorities. This is a major reason why stores like Walmart and Target have become so popular in the last several years -- all it takes is a trip to one place where all of these things can be accomplished. Read more:


The 47th IMAPS International Symposium on Microelectronics Recap
At the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS), attendees were able to observe demonstrations of the Palomar Technologies 8000i Wire Bonder/Ball (Stud) Bumper with Intelligent Interactive Graphical Interface® (i2Gi®). Read more:

Subscribe to the PTI Blog! Join the industry peers who already have!


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Quik-Pak Offers High Volume Overmolded Packaging and Assembly Services

Rising costs, and threats to domestic IP have increased demand for on-shore volume packaging and assembly solutions.

Quik-Pak is now posed to meet this demand with their high volume overmolded packaging and assembly services. The company’s capabilities include saw singulated chip scale packages including QFN (Quad Flat No Lead) and DFN that are ideal for wire bonded and flip chip devices. With Quik-Pak’s backgrinding and dicing services, the company provides a full turnkey high volume packaging and assembly process.


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Rudolph Wins Yield Management Software Sale from the College of Nanoscale Science and Engineering

Leading research enterprise recognizes the value of the analytics that Rudolph’s Yield Management Software will bring to its Global 450 Consortium program

Rudolph Technologies, Inc. has announced hat the SUNY College of Nanoscale Science and Engineering (CNSE), Albany, NY, has selected its Discover Enterprise™ Yield Management Software (YMS) to provide an integrated data warehouse and analytics system for the Global 450 Consortium (G450C) equipment development program. The Rudolph YMS will be used to combine all types of manufacturing data from defect, metrology, process, test and wafer tracking into a single system for comprehensive analysis. The software includes patented analytics specific to the semiconductor industry that will enable G450C to accelerate its process development for this strategic, half-billion dollar program for the industry.

Paul Farrar, general manager of CNSE’s G450C program, said, “As part of our focus on 450mm manufacturing we are not just qualifying the process tools and materials but also the next generation of controls and methodologies necessary to meet the new dynamics created by consumer demands. Rudolph software has an established architecture that aggregates all data collected in the factory into a single database and then applies advanced analytics to that database in order to make sense of the data. These techniques will benefit multiple industries as well as leading-edge 300mm fabs and next generation advanced packaging lines.”

“It was very gratifying to learn that CNSE, after a thorough evaluation of multiple competitive company’s technology and proposals, has chosen Rudolph to be its partner and supplier of data warehousing and analytics,” said Ardy Johnson, Rudolph’s senior vice president of corporate alliances. “We are encouraged to have this important validation of our technology.”

Discover Enterprise is a comprehensive yield management system that aggregates and stores manufacturing data and provides real-time manufacturing monitoring and in-line yield management. It is the foundation of a fully-integrated database and analytical routines that help semiconductor, LED, compound semiconductor, automotive, FPD, HDD and other related manufacturers improve yield, productivity and profitability in their manufacturing lines. It integrates and analyzes data from all inspection, metrology, process, fault detection, run-to-run and test systems in the fab and across the supply chain (from wafer to final packaging) to provide a complete report of fab-wide yield problems, turning raw data into actionable information that separates random from systematic yield loss. Engineers use this information to optimize process tool performance (fleet management) and quickly identify and correct the causes of yield excursions.

Genesis Enterprise™ is Discover Enterprise’s powerful analytics engine that provides data mining, genealogy (unit tracking) and correlation of all data types across the supply chain. The system is designed to maximize factory efficiency and automate the drill down process of identifying causes of yield loss. Specialized analysis algorithms identify domain-specific issues, such as wafer processing sequence problems, commonality of effects, product characterization and systematic versus random yield loss.

For more information about Rudolph’s Discover Enterprise Software, please visit

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AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments

Electronic and electrical devices used outdoors or near the sea require the use of protective coatings commonly referred to as conformal coatings.  However, traditional acrylic, epoxy and polyurethane conformal coatings are not hydrophobic and do not provide adequate protection in heavy moisture and are particularly susceptible to degradation in salt-fog environments.  Silicone based conformal coatings, while hydrophobic to water, allow for very high moisture penetration and are also susceptible to moisture and salt-fog induced corrosion.

Critical infrastructures such as electrical power stations need protection against corrosion in high voltage contact points.  Electrical switches and other controlling electronics in industrial environments require protective coatings that can withstand direct water immersion and "acid rain" induced degradation.  Additionally, outdoor electronics such as those under the hood of automobiles require extended moisture protection during the heat and humidity of summer weather. 

Responding to this pervasive need for conformal coatings,
AI Technology (AIT) is proud to present its improved
Prima Protect™ coating line for moisture and salt fog protection. 

Two chief Prima Protect™ Coatings are CC7090E and CC7130-E.  Both products offer extreme moisture, salt fog and even direct immersion protection for electrical contacts, electronic circuits and devices, printed wiring boards, and structures made with metal, wood and plastics.  AIT’s Prima Protect™ coatings are molecularly flexible for great adhesion and yet resist abrasion. 


AIT’s coatings have added flexibility to withstand low temperature cracking, fungicide to provide additional protection in submerged environments, and are non-silicone and electrically insulating so to not interfere with neighboring electronics.

Both CC7090E and CC7130-E are designed to meet all of the IPC CC830 requirements with UV inspection dye and fungi-resistance.  Additionally, both coatings can be brushed, dipped or sprayed on and are flexible, highly hydrophobic and provide superior protection against corrosion in water, salt water, fog and many other types of environments.

Whether you are looking to coat your outdoor equipment, batteries, wiring, or even boats, AIT’s Prima Protect™ Coatings are good on virtually any surface.  Consult an AIT application engineer to get a personalized recommendation for your application today!


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Kyocera America, Inc. now supplies high-performance assembly materials

Kyocera America, Inc. now supplies high-performance assembly materials, including a
pressureless-sintered silver die attach paste designed for devices requiring high thermal and electrical conductivity. Kyocera’s Pressureless Silver Sintering Paste is processed at low temperature, and offers outstanding workability (it is dispensable) and high reliability.

As a pioneering manufacturer of epoxy molding compounds, Kyocera has earned a reputation for reliability with semiconductor manufacturers worldwide. Kyocera also provides conductive and non-conductive pastes for semiconductors and electronic components used in some of the most advanced devices. Kyocera’s high thermal conductivity pastes are often utilized in the rapidly expanding power-device and LED markets, and have consistently earned a favorable reputation for their performance.

Beginning in April 2014, Kyocera America, Inc. became the sales organization for Kyocera’s chemical products for the semiconductor industry.

Major Kyocera chemical products for the Semiconductor industry include:
• Epoxy Molding Compounds for IC Packages
(transfer molding and compression molding)
• Die Attach Pastes
(silver-filled and non-conductive epoxies, and nano-silver sinter materials)
• Anisotropic Conductive and Non-Conductive Pastes
• Photosensitive Organic Passivation Materials
• Thermoplastic Sealing/Bonding Sheets

San Diego-based Kyocera America, Inc. also continues to provide high-reliability ceramic packages, complex modules, and contract assembly services for numerous electronics markets and applications, with customers in the U.S., Europe, and Asia.

For additional information, please contact:
Kyocera America, Inc.
8611 Balboa Ave.
San Diego, CA 92123
Phone: (800) 468-2957


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:: Job Openings ::

DfR Solutions is seeking a customer-focused engineer or scientist to join our Technical Staff
DfR Solutions, one of the 50 fastest-growing engineering firms (according to the 2012 Inc 5000 List of America's Fastest Growing Companies), is seeking a customer-focused engineer or scientist to join our Technical Staff in the Washington, DC, area (Beltsville, MD). Founded in 2005, DfR Solutions specializes in applying the science of Reliability Physics to accelerate time to market for clients in almost every electronics marketplace (e.g., consumer, industrial, transportation, medical, aerospace, military, telecom, oil exploration). Hundreds of customers a year (including SpaceX, Apple, Tesla, Google, Nike, Medtronic, Philips Lumileds, Cree, Johnson & Johnson, Chrysler, Boeing, Hewlett Packard, Bose, Bombardier, NASA, Panasonic, Verizon, Intel and General Electric, to name a few) depend on DfR Solutions to deliver knowledge and science-based solutions to their most difficult product challenges.

DfR is looking for applicants that thrive in a dynamic, fast-pace work environment that provides strong engagement and support from your fellow employees in combination with opportunities for creative problem solving, direct interaction with the customer, travel to technical conferences, and the opportunity to publish in industry journals. The range of projects and technologies you will work on is stunning in its breadth and relevance to the latest technology challenges. You may find yourself working with a team of technical experts on a forensic analysis on a state of the art light emitting diode, advising federal agencies on failure behavior of autonomous vehicles, recommending design changes to wearable electronics, and performing testing on the next generation memory device.

The ideal candidate must be delightfully curious, enjoy working in technical teams, and be confident enough to work alone. The applicant will be expected to work in a laboratory and with test equipment on a regular basis. Strong written and verbal technical communication skills are a must as this position will require frequent verbal and written communication with customers , professional societies, universities, and vendors.

Because of the broad range of potential projects, this position is flexible in regards to degree, experience, and expertise. Qualified candidates must have a Bachelor’s Degree in an engineering (EE, MechE, MatSci, ChemE) or physical science (Physics, Chemistry) field; applicants with Masters and Doctorate degrees are also encouraged to apply. Resumes that demonstrate direct experience with some aspect of electronics design and/or manufacturing will receive preference. Also desirable are experience with a broad range of materials (ceramics, metals, polymers, semiconductors), good understanding of material fundamentals (crystallography, diffusion, creep, fatigue, oxidation, etc.), awareness of or training in statistics and statistical analysis tools, and training or experience with project management.

DfR Solutions is located less than 0.5 mile from mass transit (MARC train) and is easily accessible for applicants living or planning to move to the Washington, DC, area. DfR Solutions offers a generous compensation package including a competitive salary and benefits: vacation and most major holidays, 401(k), tuition reimbursement, health, vision, and dental insurance, short and long term disability insurance. For more information regarding DfR Solutions, visit


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:: Issue 166 ::
November 4, 2014


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