Heraeus TFD


:: Corporate Member News ::

* IMAPS 2014 Exhibitors & Sponsors Issue *

:: Join Natel for Their SUPPLIER OF THE YEAR AWARD and Visit the Natel Booth, #505 (full story)

:: Heraeus Precious Metals, Electronic Materials Division is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders... (full story)

:: Visit METALOR at Booth 209 (full story)

:: Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at IMAPS (full story)

:: Visit Palomar at IMAPS 2014 to Hear More About Their Latest and Greatest! (full story)

:: Visit F&K Delvotec and Hear More About Their New Director of Sales (full story)

:: TDK N2 Purge 300mm TAS 300 Loadport used for Next Generation Device Packaging - Visit them at IMAPS San Diego to Learn More (full story)

:: Visit Unisem at IMAPS 2014 - Hear About Their New Business Development Manager for Taiwan Region (full story)

:: Finetech bonding solutions at IMAPS San Diego (full story)

:: Sage Attending IMAPS 2014 (full story)

:: IMAPS 2014 EXHIBITOR DIRECTORY - Learn More About All The Exhibitors On Display Starting October 14... (full story)

:: Job Openings ::

:: AEM has few immediate openings for two R&D engineers and few technicians - Contact Pacific Rim Engineering (full story)

Check back for future job openings from IMAPS corporate members. Be sure to go online to IMAPS JOBS Marketplace to search for additional openings. Interested in posting your job opening? Email Brian Schieman -

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

PREMIER Sponsors:

   Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:
Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver
Honeywell - Student Programs Sponsor
Event Sponsors:

Logo Bags, Final Program, Internet Cafe and Convention Hall Signs:
Natel - Premier Sponsor, Platinum

Logo Bags, Final Program, International Reception, and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
Conference Proceeding USB Drives:
Indium Corp - Keynote Presentations Sponsor

IMAPS Cafe - Refreshment Breaks:
Invensas: IMAPS Cafe Refreshment Breaks Sponsor

Student Programs & Keynotes Sponsor:

Honeywell - Student Programs Sponsor

Dessert "Happy Hour" Sponsor:
Palomar Technologies: Dessert "Happy Hour" Sponsor
Bag Insert:
Plasma Therm: Bag Insert Sponsor
Bag Insert:

Bag Insert:
SEKISUI America Corp.: Bag Insert Sponsor
Golf Sponsors
Golf Hole:
Technic - Golf Hole Sponsor
Golf Hole:
Golf Hole Sponsor: Coining Inc/Ametek
Golf Hole:
Golf Hole Sponsor: AGC Electronics America
Golf Hole:
Golf Hole Sponsor: Quik-Pak
Golf Hole:
Hole Sponsor: NAMICS

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brian Schieman at You should also identify which URL to link your logo to. If you have questions, contact Brian. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Ann Bell,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin.

:: For advertising opportunities, please contact Ann Bell at or 703-860-5770.

:: To have your company logo included in an upcoming "Fast Links," or other questions, contact Brian Schieman at or 412-368-1621.

Join Natel for Their SUPPLIER OF THE YEAR AWARD and Visit the Natel Booth, #505

The leading manufacturer of LTCC/AlN Multilayer Substrates and Packages. RF/Microwave MIC(s), Hybrids, MCM's and Higher Level Assemblies for the Defense, Aerospace, Medical, RR/Microwave, Fiber Optic/Optoelectronic, Telecommunications and Test & Measurement Industries.

IMAPS 2014 will kick off in style with the Monday night WELCOME RECEPTION, featuring Natel’s Second Annual Supplier of the Year Awards. Based on the success of last year’s awards, NATEL EMS will again recognize its best supplier’s Monday evening with its Natel supplier of the Year awards during IMAPS 47th annual International Symposium. The awards presentation will be held at the Town Country Resort and Conference Center in San Diego, CA during the Welcome Reception, Monday, October 13, 2014. “The Supplier of the Year award winners represent a partnership, dedication and commitment to consistently perform above expectations. This continues to play an important role in Natel’s success,” said Sudesh Arora, President of Natel EMS. “We appreciate the efforts of these suppliers and look forward to a mutually beneficial continued relationship in the future.” The awards recognize the significant contributions of Natel suppliers as part of the company’s product and performance achievement. The winners represent Natel’s view, as the best the microelectronics/electronics industry has to offer in innovative technology, superior quality, outstanding launch support, crisis management and competitive total enterprise cost solutions. The suppliers of the Year winners are chosen by the Natel team of purchasing, engineering, quality, manufacturing and logistics executives.

For more information about NATEL, please visit:
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Heraeus Precious Metals, Electronic Materials Division is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders...

Heraeus Precious Metals, Electronic Materials Division is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders to the microelectronics, alternative energy and solid state lighting industries. Featured this year are new products to showcase our commitment to pursuing new technologies. Some of the products we will be highlighting are our new materials sets for heater circuit construction for both low and high temperature heaters, a variety of conductors for use with AlN substrates and also a line of copper pastes for constructing circuits where high thermal and electrical conductivity are required. The copper based pastes are designed to use simple thick film processing to create copper circuits for high power electronics.

Hereaus’ Celcion® Material Set Receives UL Certification
Heraeus is proud to announce that its core Celcion® materials, including a dielectric, conductor and soldermask, have been certified by UL under the following recognitions:

• UL QMTS2 Recognition of metal base laminate with Flame. Recognition of metal clad metal base with Flame, Maximum Solder Temperature (TS), and Maximum Operating Temperature (MOT)

• UL QMJU2 Recognition for Solder Resist. Recognition in accordance with UL746E and UL94

Heraeus Celcion® is a thick film materials system specifically designed to build circuitry directly on aluminum substrates. Celcion® thick film materials have proven to be robust and reliable for LED circuits while providing better thermal conductivity and streamlined additive processing compared to MCPCB and other competitive technologies.

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Visit METALOR at Booth 209

Metalor Technologies USA is a leading participant in Precious Metals and advanced materials. We produce a comprehensive range of precious metal powders and flakes for electronics and adhesive applications. Metalor is a leading supplier of Precious Metal plating products and processes, designed for a comprehensive range of metallization methods.

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Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at IMAPS

Indium Corporation will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), Oct. 14-16 in San Diego, Calif. 

NC-26-A is a halogen-free, no-clean flip-chip dipping flux designed to leave a clear, undetectable residue that allows the manufacturer to eliminate the cleaning process. 

NC-26-A controls wetting activity to better avoid two main soldering issues that plague manufacturing engineers: solder bridging and cold joints. NC-26-A also retains its bump height after reflow, reduces the UBM/bump crack caused by vibration in the cleaning process, and boasts a higher compatibility with capillary and molded underfills (CUF and MUF).

NC-26-A is designed for flip-chip dipping applications and has tackiness suitable for holding die in mass-reflow assembly processes. For more information on NC-26-A, visit or visit Indium Corporation at booth 217.


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Visit Palomar at IMAPS 2014 to Hear More About Their Latest and Greatest!

Apple’s Latest Announcement and its Effect on the MEMS Industry
There was a lot of buzz last week surrounding Apple’s announcement regarding new product releases and enhancements. With the release of the iPhone 6, iPhone 6 Plus, and the long-anticipated Apple Watch, reactions were a mixed bag. But what do these announcements mean for the world of microelectronics? One thing is certain—the MEMS industry was definitely feeling the love. Read more:’s-latest-announcement-and-its-effect-on-the-mems-industry.


Epoxy Die Attach - Anisotropic Conductive Paste
Here is a quick refresher on epoxy die attach and Anisotropic Conductive Paste (ACP). Using a flexible die bonder with 3 channels of fluid dispense and a daub pot, you will be able to perform a highly accurate and reliable bond. Read more:

Subscribe to the PTI Blog! Join the industry peers who already have!



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Visit F&K Delvotec and Hear More About Their New Director of Sales

F&K Delvotec, Inc. has appointed Garrett Jones as Director of Sales & Marketing. Garrett brings over 20 years of experience including applications engineering, product management and sales management of advanced-technology microelectronic assembly equipment, with a focus on wire bonding. He assumes responsibility for supporting our customers in the United States, Canada, Mexico and Central & South America. F&K Delvotec Group is a privately held manufacturer of high quality Semiconductor and Microelectronic Assembly Equipment with Headquarters in Germany and subsidiaries in Foothill Ranch, California and Singapore, and manufacturing facilities in Austria. For more information contact or visit

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TDK N2 Purge 300mm TAS 300 Loadport used for Next Generation Device Packaging - Visit them at IMAPS San Diego to Learn More

TDK Corporation has released next generation N2 purge loadports as an effective method to reduce wafer process cross contamination and oxidation in device packaging.  TDK N2 purge loadports are qualified by leading FABs and process tool manufacturers.  TDK N2 purge loadports are expanding into inspection, cleaning, and metalization tools for device packaging.

The TDK Hybrid N2 Purge Loadport uses a combination of bottom and front door purge systems to maximize process flexibility and cost benefits to the FAB.  TDK Hybrid N2 purge J1 loadport has a field retrofit kit option.  Additionally, the company can supply RFID and E84 options integrated to the loadport. 

   The Front Door N2 Purge option has the advantage of large gas flow fast from the down and side direction. The front purge nozzles are located inside the EFEM, and have capability to maintain low humidity and low particles inside the FOUP. TDK N2 Front door purge system uses existing 300mm FOUPs.. 

   The bottom N2 Purge option uses FOUPs with bottom ports and snorkels. The FOUP door may be open or closed during N2 bottom purge process.

   TDK Stand Alone N2 Purge option allows FAB process flexibility between manufacturing steps. A loadport with N2 side and down purge nozzle can be installed onto a TDK CAVS chamber. TDK CAVS provides a cost effective inert mini environment between FAB process steps.

TDK sealed N2 purge loadports are used on Enclosed N2 EFEM for next generation FAB process and achieves mini environment O2 level of 100ppm using TDK high flow N2 nozzles. 

TDK N2 purge loadports are found to be effective to improve copper and Low K interconnect reliability.  With the demands of leading edge process node, TDK Corporation is working to meet the semi market requirements with innovative FAB mini environment solutions.

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Visit Unisem at IMAPS 2014 - Hear About Their New Business Development Manager for Taiwan Region

Unisem has announced that Dennis Chang has joined its sales team as a Business Development Manager for the Taiwan region, effective immediately.

Dennis joins the company from a Taiwanese packaging manufactory where he was responsible for the sales and marketing of SiP, MCM, MCP, WLCSP and lead frame based packages. Dennis brings over 20 years of experience in the Taiwanese semiconductor assembly and multi die packaging industry, which includes his time at an IC Fabless and Design services company as well as Marketing and Sales experience at a SATS company. Dennis graduated from George Brown College in Toronto, with a Bachelors Degree in Business Administration, Marketing.

Dennis will be based in Hsinchu, Taiwan and can be contacted as follows:

Dennis Chang
Business Development Manager, Taiwan
Tel: +886-926-828-269

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Finetech bonding solutions at IMAPS San Diego

Finetech supplies precision die bonders that provide sub-micron placement accuracy and process modularity. We offer engineering collaboration and customization for complex and novel bonding and packaging applications. Visit us in booth 317 and see our Lambda bonder capabilities: thermo-compression/sonic, eutectic, epoxy, ACF & Indium, UV curing. Applications include flip chip, opto/photonics packaging, MEMs, C2W, Chip-on-Glass, and copper pillar bonding.

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Sage Attending IMAPS 2014

Sage Analytical Lab, the modern independent laboratory dedicated to providing the best-in-class analytical techniques and state of the art equipment for analyzing and diagnosing all levels of failures in today’s highly integrated and advanced semiconductor devices, has announced that they will be attending IMAPS 2014 in San Diego, California on October 14-16.

This year’s International Symposium on Microelectronics promises to deliver success for all conference attendees and bring together the future of packaging. This year is the 47th annual symposium that IMAPS has hosted.

“We are excited and proud to be showcasing our latest services and applications to the IMAPS attendees,” said Moe Homayounieh, President of Sage Analytical Lab, LLC. “We invite everyone to learn about the latest with our 3D/CT Sub-Micron X-Ray.”

Driven by the development of more sophisticated packaging and subtler defects, the applications of 3-dimensional non-destructive techniques have become crucial in standard analysis flows. With this technique, Sage is able to identify and isolate fail signatures including:

    • BGA fatigue
    • BGA cracking
    • BGA voiding
    • C4/Bump cracking
    • Wire bond shorting
    • Die attach issues
    • Copper tracing in laminates, substrates and boards
    • Passive component integrity and placement
    • Various other metal defects

Sage Analytical Lab will be exhibiting at Booth #428. We invite all attendees to stop by and learn about our cutting edge services, applications, and equipment.

For more information and/or to schedule a meeting with us prior to the conference please click here.


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IMAPS 2014 EXHIBITOR DIRECTORY - Learn More About All The Exhibitors On Display Starting October 14...

Thank you to all the companies that will be in San Diego soon with us! The latest and greatest products and services will be on display at IMAPS 2014.

Be sure to visit these great companies - DOWNLOAD a PDF of the FINAL PROGRAM and Exhibit Directory.

5N Plus, Inc.
Booth #: 429

4385 Garand St.
Montreal, Quebec  H4R 2B4
(P) 514-856-0644
5N Plus is a leading producer of specialty metals and compounds for use in advanced electronic, pharmaceutical and industrial applications.  We have recently added production capabilities of high purity metal powders and compounds for the lead-free solder paste, die attach and ECA markets.  5N Plus is headquartered in Montreal, Quebec and operates 12 manufacturing facilities and 16 sales offices in Europe, the Americas and Asia.

Accu-Tech Laser Processing, Inc.
Booth #: 506
550 South Pacific Street Suite A100
San Marcos, CA  92078 USA
(P) 760-744-6692
Since 1977 Accu-Tech Laser Processing has been the benchmark for quality laser services.   Laser Machining, Scribing and Shape Cutting of fired Ceramics, non-fired Ceramics (LTCC / green tape), AlN, Duroid, Thin Metals, Polymers, Rubber, Silicon, Sapphire, Fused Silica, CVD Diamond, and many other applications for the Microelectronics and PCB industries.  Apertures and orifices.  Solar cell scribing and cutting.  Laser Micro-Via drilling.  Laser Skiving, Routing, and PC Board Rework & Recovery Solutions for controlled depth coverlay / dielectric / solder mask / squeeze-out removal.  Cavity formation on rigid circuits.  Prototype to Full-Scale Production Processing.  We Can Use Your Data Formats: (.DXF, .DWG, Gerber, Drill Files).

AdTech Ceramics
Booth #: 616
511 Manufacturers Road
Chattanooga, TN  37405 USA
(P) 423-755-5400
AdTech Ceramics is a fully integrated manufacturer of HTCC and multi-layer AlN electronic packages and feedthroughs based in Chattanooga, TN.  With over 30 years of experience perfecting the multi-layer co-fire process, we are ideally suited to take on new challenges and package designs.  We also offer chemically milled lead frames, seal rings and lids from Kovar, Alloy 42 and others.  Full metallization, electroless and electrolytic plating and brazing capabilities allows us to supply custom brazed ceramic-to-metal assemblies.  Our precision ceramic injection molding (CIM) coupled with our brazing capabilities opens the door to new and exciting design opportunities. 

AdValue Photonics
Booth #:  535

3440 E Britannia Drive, Suite #190
Tucson, AZ  85706 USA
(P) 520-790-5468
AdValue Photonics is a leading manufacturer of 2-micron fiber lasers for the materials processing, scientific, and medical markets. Founded in 2007, with a reputation for delivering groundbreaking products based on its innovative technology, the company utilizes its expertise in specialty glasses and fibers to optimize the performance and reliability of its fiber lasers.

Advance Reproductions Corp.
Booth #: 336
100 Flagship Drive
North Andover, MA  01845  USA
(P) 978-552-1221
Advance Reproductions Corporation is one of the largest high precision photomasking and phototooling service organizations in the United States. As a pioneer in the imaging services industry for over 40 years, Advance offers a vast array of high quality solutions for all your imaging requirements. Advance is located in North Andover, Massachusetts, just North of Boston, along the Route 128 high technology belt. The company's operations are housed in a modern 37,500 square foot facility supported with state-of-the-art environmental control systems. The company is ISO 9001:2008 registered staffed with skilled technicians and quality control personnel. Advance utilizes the most advanced, state-of-the-art CAD and imaging equipment available today assuring finished products of the highest quality, in the fastest time possible

Advanced Dicing Technologies
Booth #: 415
1155 Business Center Drive, Suite 120
Horsham, PA  19044  USA
(P) 215-773-9155 Ext. 100
Advanced Dicing Technologies (ADT) is specialized in the development and manufacturing of dicing systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and Hard Material Microelectronic Components in Ceramic, Glass, Sapphire and Quartz.
ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, annular blades and process know-how we bring our customers comprehensive dicing solutions.  Please visit our Web Site at

Advantest Corporation
Booth #: 523
508 Carnegie Center, Suite 102
Princeton, NJ 08540  USA
(P) 917-568-5395
Advantest America is the North American subsidiary of Advantest Corporation, the world’s largest provider of automatic test equipment (ATE) to the semiconductor industry. ATE is used during semiconductor manufacturing to verify that a chip functions to specification, ensuring it works in the end-use application – be it consumer electronics, telecommunications, medical instrumentation or computers and digital TVs, to name a few. Advantest has for over five decades led the way in developing new and innovative test and handling solutions for the global electronics industry.

AI Technology, Inc.
Booth #: 402
70 Washington Road
Princeton Jct, NJ 08550  USA
(P) 609-799-9388
AI Technology has been one of the leading forces in the development of advanced material and adhesive solutions including: Gap-Filling Compressible Phase-Change Pads, Thermal Gels, Thermal Grease, Stress-free Adhesive Films, Adhesive Pastes, RF/EMI shielding solutions. We also offer Conductive and Dielectric materials, high temperature solutions and room temperature cure materials.

AIM Solder
Booth #: 612
25 Kenney Drive
Cranston RI 02920 USA
(P) 401-429-5215
AIM is a leading global manufacturer of solder assembly materials for the semiconductor, electronics and photonics packaging industries.  We supply lead-free, indium alloy and AuSn alloy solders in all forms, including PREFORMS, Wire, Paste, Foil, Spheres and custom TIM's.  AIM is ISO 9001:2008 and ISO 14001:2004 certified.

Booth #: 434
Draisstrasse 11a
Bühl  77815 Germany
(P) +49 (0)7223 2818483
The company AMADYNE disposes of long-standing experiences in the area of the microtechnical use and assembly process. The today's product portfolio with the systems EMU, SAM42 and fab ¹ is aimed on the exact and careful handling by components of the microsystem technology and microelectronics. These allow the demanding, complicated and exact manufacturing of components of the microsystem technology, the mikro-optoelectronics and micromechanics. The expert's assessment of AMADYNE in the solution of challenges of the automation appears in the unique connection of hardware and software Components.

AMICRA Microtechnologies GmbH
Booth #: 330
Wernerwerk Str. 4
Regensburg, Bavaria 93049 Germany
(P) +49 151 14569902
AMICRA Microtechnologies GmbH provides customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, opto electronics, and MEMS.

ASM Pacific Technology, Ltd.
Booth #: 504
97 E. Brokaw Rd, Suite 100
San Jose, CA 95112 USA
(P) 408-451-0800
ASM equipment for Semiconductor Assembly includes IC, LED, RFID, Image Sensor, Chip on Glass, Chip on Board  markets. 
Equipment: Die Attach; Wire Bond (AU,CU,AL); Cure Ovens; Solder Reflow; Encapsulation (liquid dispense / transfer mold); Ball Attach; Package Inspection; Die Sorting; Package Test Handlers; Integrated Lines.
Materials: Etched / Stamped Leadframes

ATV Technologie GmbH
Booth #: 617
Johann-Sebastian-Bach-Str. 38
Vaterstetten 85591 Germany
(P) 49810630500
ATV manufactures:
IR VACUUM REFLOW/BRAZING/RTA/Lid Sealing/Getter Activation System: - 1 100°C
QUARTZ TUBE Furnaces: up to 300 mm, multipurpose, fast ramping
DIAMOND SCRIBERS: up to 200 mm wafer
Manual Hybrid assembly/test and repair station

Axus  Technology
Booth #: 634
7001 W. Erie Street, Suite 1
Chandler AZ 85226 USA
(P) 480-705-8000
Axus Technology delivers end-to-end support, for R&D through volume production, for CMP and substrate thinning applications.  Starting with process design and development in our CMP Foundry, through delivery of production tools and processes; Axus provides industry-leading process and equipment solutions for fabs, 3D integration, and wafer & device packaging users.

Azimuth Electronics, Inc.
Booth #: 509
2605 S El Camino Real
San Clemente, CA 92672 USA
(P) 949-492-6481
Azimuth Electronics, Inc. is a US manufacturer of Test and Burn-In Sockets providing innovative interconnect solutions for over 50 years.  Our broad experience with test and burn-in allows us to tackle the challenges of a constantly evolving industry.  Complete in-house services from design, prototyping, tooling fabrication, and production injection molding.

Besi North America, Inc.
Booth #: 225
33 East Comstock Drive, Suite 7
Chandler, AZ  85225  USA
(P) 480-497-6420
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries. Through its product groups Datacon (Die Attach), Esec (Die Bonding), Fico (Packaging) and Meco (Plating), Besi develops and markets leading edge assembly processes and equipment for leadframe, array connect and wafer level packaging applications.

Camtek USA
Booth #: 622
2000 Wyatt Dr, Ste 3
Santa Clara, CA 95054 USA
(P) 408-986-9540
Camtek Ltd. is a worldwide provider of automated and technologically advanced solutions designed to enhance manufacturing processes. Camtek's solutions are designed to increase products' yield and reliability, while supporting technology advances and roadmaps of the Semiconductors, Printed Circuit Boards (PCB) and Integrated Circuits (IC) Substrates industries.  With more than 25 years of experience in the field of inspection and metrology and thousands of systems installed worldwide, Camtek addresses the specific needs of these interconnected industries by offering dedicated solutions for yield enhancement and manufacturing optimization. The company's portfolio is based on a wide range of technologies including intelligent imaging, image processing and functional 3D inkjet process. Camtek supports its customers through dedicated service and support teams around to world.

Canon USA
Booth #: 510
3300 North 1st St
San Jose, CA 95134 USA
(P) 408-468-2000
Canon U.S.A., Inc. ( is a leader in Digital Imaging and Industrial Products providing manufacturing solutions for advanced packaging, 2.5D and 3D applications.    Canon continues to provide innovative solutions for advanced packaging applications including the FPA-5510iV stepper, Canon Anelva equipment and flat panel process tools.

Ceradyne, Inc., a 3M company
Booth #: 526
6701 Sixth Ave. S
Seattle, WA 98108 USA
(P) 206-763-2170
Ceradyne, Inc.,  3M company, has a 50-year history of developing and manufacturing specialty glass compositions for a wide range of electronic, industrial and health care markets. Specialty glass is often considered a subset of technical ceramics and can be adapted via its formulation composition to have various desired electrical, sealing and bioactive properties.

Chip Scale Review
Booth #: 426
PO Box 9522
San Jose
(P) 408-429-8585
Founded in 1997, Chip Scale Review covers device and wafer-level test, assembly, and packaging. While holding true to its founding mission, as packaging has evolved, so too has CSR, which now also covers high-density interconnection technologies including 3D packages, MEMS, and other wafer-fabricated devices.

CNSE Center for Nanoscale Science and Engineering
Booth #: 706
1805 Research Park Drive
Fargo, ND 58102 USA
(P) 701-231-5338
Micro-fab (thin-film), thick-film (plating, dispensing, printing), packaging (CSP, multichip), and SMT facilities staffed with full-time research and development employees.  Capabilities include design and simulation, rapid prototyping, electrical and environmental testing, polymer and silicon materials research, and materials characterization (AFM, FTIR, DSC, DTMA, SEM, TEM, XRF, NMR, etc.).

Cleanlogix LLC
Booth #: 229
26074 Ave Hall, Unit 6
Santa Clarita, CA 91355 USA
(P) 661-430-6767
CO2 Surface Preparation for Wire Bonding. Our company has more than 25 years of experience developing and implementing innovative and effective CO2 clean manufacturing technology for both large and small businesses. We have a lot of bright ideas; tools, technology, training, expertise and experience to help sustain your business. CleanLogix works with you to specify, build, validate and implement state-of-the-art lean and green manufacturing technology (CleanTech).  Our business is about reducing your manufacturing waste (i.e., lowering production costs) using best available CleanTech. 

Coining Inc., AMETEK Electronic Components & Packaging
Booth #: 607
15 Mercedes Drive
Montvale, NJ  07645 USA
(P) 201-791-4020
Manufacturer of quality Preforms, Microstampings and Bonding Wire for low-high temp soldering/brazing. Highly pure alloys of gold,silver,lead,tin,indium,bismuth,palladium,aluminum. Lead-free RoHS. Copper, Kovar® & molybdenum, clad, plated stampings. Flux coating. Tape&reel, custom packaging. Cover Assemblies(preform/lid).  Extensive tooling library, standard & custom designs.  Quick turnaround. Request our brochure or go to our website at or

Conductive Containers, Inc
Booth #: 417
4500 Quebec Ave
New Hope, MN 55428 USA
(P) 763-537-2090
At CCI, we eliminate ESD. Every day we take on ESD problems and wrestle them into submission. From material handling products to shippers and packaging to production process reviews. We know what it takes to eliminate ESD from your manufacturing and handling processes.   Our path to leadership in the static safe packaging  industry has included the invention of Corstat conductive corrugated materials in 1978 and the design of a broad scope of products using that material. Our roots go back to a passion for creating complete packaging materials for static sensitive products.

CORWIL Technology
Booth #: 424
1635 McCarthy Blvd.
Milpitas, CA 95035-7415 USA
(P) 408-618-8700
CORWIL Technology Corporation is your domestic partner for all your Die Prep, Assembly and Test Services solutions. As a leading innovation partner to the semiconductor industry, we offer our customers a state of the art facility combined with some of the sharpest minds and most experienced talent in the field to serve your business needs. At CORWIL we excel in quick turn, high touch service projects that require customer service care.
CORWIL's services include superior wafer thinning, dicing, assembly and test services that transform our client's business performance. We are a certified and trusted business partner to the U.S. Military, Aerospace and Medical industry sectors.

CV Inc.
Booth #: 327
850 S. Greenville, Suite 108
Richardson, TX  75081  USA
(P) 972-664-1568
CVI specializes in a number of quick turn processing for die bumping (single die, partial wafers and complete wafers), failure analysis and assembly. Our ability for in-house plating of both electrolytic and electroless (Cu, Sn, Ni, Au and Pd) helps provide same day or next day processing of bumping materials.

Desich Smart Commercialization Center for Microsystems at LCCC
Booth #: 708
141 Innovation Drive | Lorain County Community College
Elyria, Ohio 44035 USA
(P) 440-865-0352
The Richard Desich SMART Commercialization Center for Microsystems provides cost-effective technical, facility, and equipment resources to startups, multinational organizations, industry / academic researchers, and federal agencies that are developing MEMS-based sensor products. Located on the main campus of Lorain County Community College in NE Ohio, the Desich SMART Center is a world-class MEMS development foundry with cleanroom facilities providing microelectronic packaging, assembly, and test capabilities. The Desich SMART Center works with client companies and partners in Ohio and across the United States who focus on “human interface” sensor technologies in markets such as industrial controls, health monitoring, and clinical systems. The Desich SMART Center provides access to capital-intensive resources such as cleanroom facilities and semiconductor packaging equipment to allow clients to reduce the cost of product research and pre-production development.

Deweyl Tool Company, Inc.
Booth #: 408
959 Transport Way
Petaluma, CA 94954 USA
(P) 707-765-5779
DeWeyl provides the finest quality bonding wedges in the world.  Located in the Petaluma, CA, DeWeyl's primary business is manufacturing wire bond wedges and custom high precision tooling for the semiconductor, aerospace and medical industry.  DeWeyl produces wedges made from ceramic, titanium and tungsten carbide for small and large round wire and ribbon applications.

DISCO Hi-Tec America, Inc.
Booth #: 611
3270 Scott Blvd.
Santa Clara, CA 95054-3011 USA
(P) 408-987-3776
DISCO is a company that specializes in advanced cutting, grinding, and polishing technologies.

DuPont Microcircuit Materials
Booth #: 431
14 TW Alexander Drive
Research Triangle Park, NC  27709  USA
(P) 800-284-3382
DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film and GreenTape(tm) low temperature co-fired ceramic (LTCC) compositions for a wide variety of printed electronic applications in the photovoltaic, display, automotive, biomedical, industrial, military, and telecommunications markets. We deliver solutions that lower the cost of ownership and improve performance, reliability and functionality. For more information on DuPont Microcircuit Materials, please visit

East China Research Institute of Microelectronics
Booth #: 512
1011 RIver Mist Dr.
Rochester, MI  48307  USA
(P) 248-462-2712
ECRIM engages in developing, manufacturing and sales of variety of Microelectronic and Pacakge products. ECRIM is known for its technical strength, proven product reliability, innovative solutions, quick response, competitive pricing and overall value. We have seven product lines including LTCC, AIN/HTCC, Thick Film, Thin Film, Metal Hermetic Package and Furnace.

Booth #: 501
Lochhamer Schlag 17
82166 Graefelfing, Germany
(P) +49-89-8299890
EPP was founded in 1987 and is a supplier of High Tech Systems, like: Lasertrimmers, AOI (Automatic Optical Inspection) Systems, Sintering Furnaces and other related Equipment. Our worldwide customers manufacture Electronics for Cars, Telecommunication, Pharmaceutics, Military and Industrial applications. Our customer base includes companies like MICRON, BOSCH, DELPHI, just to name a few. EPP is an Integrator of high tech Systems in your production line. We take full responsibility and Support our System and our customers worldwide. Our AOI Systems inspect all Screen/Stencil printed, sputtered or electroplated Layers

Element Six Technologies US Corp.
Booth #: 530
3901 Burton Drive
Santa Clara, CA 95054  USA
(P) 408-986-2410
E6 fabricates and sells engineered synthetic poly- and single crystal diamond products and diamond composites. Technologies using diamond include thermal management, high power laser optics, beam splitters, IR spectroscopy, high energy particle detectors as well as electrochemistry and scientific applications. Custom engineered configurations are available to meet your requirements.

Epoxy Technology, Inc.
Booth #: 407
14 Fortune Drive
Billerica, MA  01821-3972  USA
(P) 978-667-3805 Ext. 213
Epoxy Technology is a Global Manufacturer and Custom Formulator of Epoxy Adhesives for more than 45 years.  EPO-TEK Specializes in Adhesives for Circuit Assembly (PCB), Die Attach, LED, Solar, Optoelectronic, Hard Drive, Display, Automotive Electronics, Medical Electronics, and Military/Aerospace Applications.   ISO 9001 Certified.  RoHS and REACH Compliant.

ESL ElectroScience
Booth #: 605
416 East Church Road
King of Prussia, PA  19406-2625  USA
(P) 610-755-9111
ESL ElectroScience specializes in providing solutions to enable customers to take technologies from concept through high volume production using thick film pastes and ceramic tapes. ESL products can be found in hybrid microcircuits, multilayer microelectronics, transformers, thick film heaters, sensors, and fuel cells. For more information visit us at

F&K Delvotec
Booth #: 514
27182 Burbank
Fotthill Ranch, CA 92610 USA
(P) 949-595-2200
F&K Delvotec is an industry leader in wire bonding technology. Our broad portfolio of products delivers a solution for any wire bonding application. Over 30 patents in wire bonding technology testify to our continuing emphasis on innovative technology, and our dedicated development, applications and service team provides optimum customer support, worldwide. F&K Delvotec manufactures complete bonding systems including transducers and ultrasonic generators as well as test equipment that has become the industry standard for evaluation of ultrasonic bonding systems. Whatever wire bonding is required, F&K Delvotec offers a suitable tailored solution – from bond process development to complete automation systems.

Ferro Corporation
Booth #: 331
6060 Parkland Boulevard
Mayfield Heights, OH 44124 USA
(P) 216-875-5600
Ferro Electronic Materials develops, manufactures and markets high-purity powders, pastes, and tapes for many electronic applications, including:   Hybrid microelectronics   Multilayer ceramic capacitors   Specialty glasses   Electronic packaging   Component terminations   Display materials   Semiconductor Passivation   Sealing Glasses   Surge Protection

Booth #: 317
560 E Germann Rd, #103
Gilbert, AZ  85297 USA
(P) 480-893-1630
Finetech offers precision die bonders for advanced packaging -- flip chip, VCSELs, laser bars & diodes, sensors, photonics packaging, MEMs, Chip to Wafer, Cu pillar, and Chip on Glass.  A high degree of process flexibility within one platform makes these systems ideal for R&D or prototype environments -- thermo-compression, thermo-sonic, eutectic, epoxy, ACF & Indium bonding.  Manual, motorized and automated models available, with sub-micron placement accuracy. By collaborating with customers to understand their complex and novel applications, we are able to develop a purpose-built solution. Finetech also provides advanced rework systems for today’s most challenging applications.

Fogale Nanotech
Booth #: 528
125, Rue de l'hostellerie
30900 Nimes France  
(P) +33 4 66 62 05 55
FOGALE nanotech is the Leader in Metrology & Inspection Tools for 3D Packaging, MEMS and related applications.
FOGALE’s TMAP is a unique metrology and inspection tool and was recently Awarded “Best Product 2014” by 3DInCites.
It is based on multi-sensor heads which include different technologies in the same integrated tool, capable to measure all required dimensions and defects.
FOGALE has a continuing development effort that has tracked and satisfied customer requirements and stays in front of the next production needs.

Fraunhofer Institute for Reliability and Microintegration IZM
Booth #: 705
Gustav-Meyer-Allee 25
13355 Berlin, Germany
(P) +49 30 46403-100
Fraunhofer IZM specializes in industry-oriented applied research. Fraunhofer IZM develops assembly and interconnection technology, also known as electronic packaging. Our technologies connect the individual components, protect components and devices from vibration and moisture, and reliably dissipate heat. Fraunhofer IZM thus ensures that electronic devices continue to function reliably in even the harshest conditions. Modern packaging technologies make developing smaller and smaller products possible. We process ICs thinner than a sheet of paper. The institute, founded in 1993, has a staff of more than 300. Nearly 80% of our turnover in 2013 was earned through contract research.

FRT of America
Booth #: 620
1101 S. Winchester Blvd.,L-240
San Jose, CA 95128 USA
(P) 408-261-2632
FRT is recognized as a valued partner for optical metrology systems by providing high quality automated measuring tools which fulfill your research, characterization and process verification needs.   The MicroProf TTV measures topography, wafer thickness, TTV, bow and warp and our MicroSpy Topo DT is a high resolution 3D profilometer with combined confocal and interferometric measuring modes.  FRT - The Art of Metrology TM

Geib Refining Corp.
Booth #: 301
399 Kilvert St
Warwick, RI  02886  USA
(P) 800-228-4653
Precious metal reclaim and refining facilities  Gold - Silver - Platinum - Palladium - Rhodium - Iridium  100% destruction of your intellectual properties ensured by our ITAR and EPA certifications.  Ceramic scrap, jars, rages, wipes, vacuum deposition, solutions,   Sound hazardous waste experience.   Please stop over and visit with us.

Georgia Tech 3D Systems Packaging Research Center (PRC)
Booth #: 704
813 Ferst Drive, NW
Atlanta, GA 30332 USA
(P) 404-894-9097
The 3D Systems Packaging Research Center (PRC) at the Georgia Institute of Technology is an Industry-Centric Global Academic Center dedicated to leading-edge research and education in the System-on-a-Package (SOP) vision to enable highly miniaturized, mega-functional systems in a single package. Led by Prof. Rao Tummala, the PRC offers a variety of industry partnerships and consortia research programs which include Design ,Glass Packaging, Organic Packaging, Passives and their Integration with Actives, Interconnections and Assembly, MEMS Packaging and Optoelectronics. Industry benefits include end-user-supply chain eco-system, IP rights, technology transfer, access to students, state-of-the-art 300mm R&D facilities, advanced technology prototypes, and more.

Haiku Tech, Inc.
Booth #: 115
1669 NW 79 Ave.
Miami, FL  33126  USA
(P) 305-463-9304
Technical and equipment solutions for the manufacture of electronic passive components, e.g. LTCC, HTCC, MLCC, etc. Products’ portfolio includes: dielectric powders, binders, tape casters, sheet blankers, mechanical punches, screen printers, stackers, isostatic laminators, green chip dicers, termination equipment, tape and reel, optical dilatometers and visual inspection equipment. Ceramic tape development and consulting services.

Harrop Industries, Inc.
Booth #: 522
3470 East Fifth Avenue
Columbus, Ohio 43219 USA
(P) 614-564-9949
Harrop designs and manufactures a complete line of continuous and periodic tape casters, dryers, burn-off ovens, and kilns to produce ceramic products for laboratory, pilot plant, and industrial applications.  Heat sources can be electric or gas-fired.  Microwave assisted heating is available.  Provide thermal analysis lab services and toll firing.

Hary Manufacturing Inc.
Booth #: 104
24 Cokesbury Road
Lebanon NJ 08833 USA
(P) 908-722-7100
Hary Manufacturing, Inc. (HMI) is a premier supplier of Precision Screen Printers for the thick-film, hybrid and other precision deposition applications. Complimenting products include Infrared conveyor dryers and substrate handling automation for a wide range of applications. HMI offers full spare parts and technical support for AMI Presco printers as well as all HMI equipment. Our consumable product lines provide printing squeegee and lint-free cleaning cloths to satisfy the production needs of our customers.  Please visit for more information

HD MicroSystems (TM), LLC
Booth #: 236
250 Cheesequake Road
Parlin, NJ 08859 USA
(P) 800-346-5656
HD MicroSystems is a joint venture company of Hitachi Chemical and DuPont Electronics specializing in polyimide (PI) and polybenzoxazole (PBO) wafer dielectric coatings.  HDM will highlight new polymeric materials as well as innovative process technologies for WLP and 3D/TSV applications, including stress buffer materials (SB), redistribution layers (RDL) wafer bonding adhesives (temporary and permanent) and interlayer dielectrics (ILD).

Heraeus Electronic Materials Division
Booth #: 205
24 Union Hill Road
West Conshohocken, PA 19428 USA
(P) 610-825-6050
Heraeus Precious Metals, Electronic Materials Division is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders to the microelectronics, alternative energy and solid state lighting industries.  Featured this year are new products to showcase our commitment to pursuing new technologies.  Some of the products we will be highlighting are our new materials sets for heater circuit construction for both low and high temperature heaters, a variety of conductors for use with AlN substrates and also a line of copper pastes for constructing circuits where high thermal and electrical conductivity are required. The copper based pastes are designed to use simple thick film processing to create copper circuits for high power electronics.

Hesse Mechatronics, Inc.
Booth #: 309
225 Hammond Avenue
Fremont, CA 94539 USA
(P) 408-436-9300
Designs and manufactures thin wire bonders for aluminum and gold, and heavy wire bonders for aluminum, gold and copper, round wire and ribbon, including HCR™ (High Current Ribbon). Services include wire bonding equipment training, applications support, development and production of prototypes and pre-production manufacturing at four applications and demonstration labs.

Hi-Rel Laboratories
Booth #: 413
6116 N Freya
Spokane, WA  99217 USA
(P) 509-325-5800
Hi-Rel Laboratories is an independently owned and operated corporation whose main concentration of activity is in the materials evaluation of the micro-electronic oriented phases of commercial, aerospace and defense industries.  We specialize in the solution of process, production and application problems requiring knowledge and experience in microelectronics and materials technology.

Hybond, Inc.
Booth #: 435
330 State Place
Escondido, CA 92029-1364  USA
(P) 760-746-7105
HYBOND, Inc. designs, manufactures, and sells:
•Thermosonic Ball and Wedge Wire Bonders
•Peg Bonders (Single Point TAB Bonders)
•Epoxy and Silver-Glass Die Bonders
•Eutectic and Laser Diode Die Bonders
•Pulsed Heat Fluxless/Eutectic Die Attach Station
•DFS Universal Bonder Test Units
•A variety of adjustable height heated work stages.

i3 Electronics, Inc
Booth #: 507
1701 North Street
Endicott, NY 13760 USA
(P) 866-820-4820
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit

IBM Microelectronics
Booth #: 427
23 Airport Boulevard
Bromont, Quebec, J2L 1A3  Canada
(P) 450-534-6496
IBM Microelectronics - a world leader in semiconductor and packaging technology, products and services has the advanced packaging solutions required for “More-than-Moore”.  Whether it be SoC or multi-component configurations, IBM’s packaging portfolio can help you deliver differentiated solutions while providing personalized, expert support that can help you meet even the toughest application goals.  Exploit IBM’s IDM value stack (Research, Custom Logic, Specialty Foundry, and Packaging) and system-level mindset to integrate disparate technologies (including custom off the shelf components) to achieve more functional density, lower power and higher performance at a competitive cost…..The Right Packaging is essential in this new Era of Computing

Indium Corporation
Booth #: 217
34 Robinson Road
Clinton, NY 13323  USA
(P) 315-853-4900
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, performs, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

Infinite Graphics
Booth #: 314
4611 East Lake St.
Minneapolis, MN 55406  USA
(P) 860-459-5085
Infinite Graphics provides precision imaging and software solutions. We offer high quality quick turn photomask services including non-stick mask coating. We can produce 3D microstructures on substrates up to 800mm x 800mm. Ask about our new solderpaste stencil software. Take stencil edits down from hours to minutes.

Booth #: 614
02150 Espoo, Finland
(P) +358 10 581 2650
Inkron is a developer and manufacturer of next-generation conductive inks and metallization materials for the optical, semiconductor, printed electronics, OLED / LED lighting, and energy storage industries. Our novel, and cost effective manufacturing process for nanomaterials, along with our advanced, next-generation polymer chemistry platforms enable the development of a wide range of customized material properties with superior performance advantages in several high-tech applications.

Integrated Electronics Engineering Center, IEEC
Booth #: 707
85 Murray Hill Road USA
Vestal, NY 13850
(P) 607-777-5314
The Integrated Electronics Engineering Center (IEEC) is a New York State Center for Advanced Technology in Electronics Packaging. Formed in 1991, the IEEC is dedicated to the advancement of electronic packaging technology and the electronics industry. We conduct leading edge research in a wide variety of packaging areas for the technological and economic benefit of our member companies. The combined expertise and facilities of the IEEC and associated Engineering and Science departments at Binghamton University are available to affiliated companies to help advance their business.

Interconnect Systems, Inc.
Booth #: 401
759 Flynn Road
Camarillo, CA 93012
(P) 805-482-2870
Interconnect Systems, Inc. (ISI) is a leading provider of advanced packaging and interconnect solutions, with in-house design, process development, and extensive manufacturing capabilities,  ISI’s breadth of products includes miniaturized FPGA systems, high density modules, IC obsolescence adapters, and standard/custom interconnect solutions.

Isola Group
Booth #: 534
3100 W. Ray Road, Suite 301
Chandler, AZ 85226 USA
(P) 480-282-6368
We are a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer printed circuit boards. Our high-performance materials are used in a diverse range of electronic end-markets including applications in computers, networking and communications equipment, high-end consumer electronics, as well as products designed for use in the advanced automotive, aerospace, military and medical markets. We invest in research and development to create industry-leading products formulated to meet the most demanding performance requirements of our customers, the printed circuit board fabricators, and the designers and original equipment manufacturers (OEMs) that they serve. Our global footprint includes ten manufacturing facilities and three research centers located in Asia, Europe and the United States.

KOA Speer Electronics, Inc.
Booth #: 425
199 Bolivar Drive
Bradford, PA 16701 USA
(P) 814-362-5536
KOA Speer Electronics Inc. is a leading supplier of thick film, thin film resistors, current sense and thru-hole resistors, resistor networks, inductors, integrated components, circuit protection, LTCC modules and EMI/EMC filtering components. KOA manufactures to the highest quality level which makes them ideal for automotive, medical, aerospace, military and alternative energy applications.  KOA Speers ISO9001-2008 & TS-16949 certifications prove to customers just how devoted they are to quality.

Kulicke & Soffa
Booth #: 215
1821 E. Dyer Road #200
Santa Ana, CA 92705 USA
(P) 949-660-0440
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment.  As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades.  In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products.  Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices

Kyocera America, Inc.
Booth #: 410
8611 Balboa Avenue
San Diego, CA  92123  USA
(P) 858-614-2592
Kyocera is North America's largest producer of ceramic semiconductor packages. These packages house microprocessors in the world's leading brand-name personal computers and workstations. They enclose microwave and radio-frequency devices in digital PCS, cellular base stations and handsets around the world. They're hurled into space in satellites orbiting Earth or in probes heading for Saturn where reliability is critical. They are also being implanted in the human body in sophisticated new biotech applications. Today, Kyocera's San Diego Plant is one of the world's largest manufacturers of metallized ceramic packages for the wireless industry.

Booth #: 214
4629 E. Chandler Blvd. Suite 110
Phoenix, AZ  85048  USA
(P) 972-687-9097
LINTEC's semiconductor manufacturing related products Adwill include a wide array of lines consisting of high-function adhesive tapes such as Non UV and UV dicing tape, BG surface protective tape, and die attach specialty films. Additionally, LINTEC is the industry leader in providing Wafer Mounting Systems and UV Irradiation Systems.

Metalor Technologies USA
Booth #: 209
52 Gardner Street
Attleboro, MA 02703-3024 USA
(P) 508-226-4470
Metalor Technologies USA is a leading participant in Precious Metals and advanced materials. We produce a comprehensive range of precious metal powders and flakes for electronics and adhesive applications. Metalor is a leading supplier of Precious Metal plating products and processes, designed for a comprehensive range of metallization methods.

Micro Systems Technologies Management AG
Booth #: 335
Neuhofstrasse 4
Baar 6340 Switzerland
(P) 0041 43 266 1128
The Micro Systems Technologies group comprises four technology companies providing innovative products and services for medical devices, especially implants, and other high-reliability/high-performance industries. The offering includes HDI/microvia PCBs, ceramic substrates, electronic module design and manufacturing, advanced assembly and semiconductor packaging technologies, batteries and hermetic feedthroughs for implants.

MicroScreen LLC
Booth #: 316
1106 S. High Street
South Bend, IN  46601 USA
(P) 574-232-4358
Stainless steel and polyester screens, as well as solar cell and large format screen requirements.  Automated screen coating, photoplotting services, fine line resolution screens are all offered.  Fine Grain, PHD, Invar Fiber Optics Laser Cut stencils for solder paste deposition.  ITAR registered.

Micross Components
Booth #: 420
7725 N. Orange Blossom Trail
Orlando, FL 32810 USA
(P) 407-298-7100
Micross Components is a leading global provider of distributed and specialty electronic components for military, space, medical, and demanding industrial applications. Operating as a single source for high reliability and state-of-the-art electronics, Micross' solutions range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 35+ year heritage, Micross possesses the design, manufacturing and logistics expertise needed to support an application from start to finish.

Mini-Systems, Inc.
Booth #: 406
20 David Rd.  P.O. Box 69
N. Attleboro, MA  02761-0069  USA
(P) 508-695-0203
For over 44 years, MSI has been supplying superb quality and on-time deliveries.  Absolute tolerances starting at 0.005% and TCR's at 2ppm/C.  Case sizes start at 0101.  Standard deliveries under 2 weeks.  MSI is ISO 9001 certified and is on the QPL for MIL-PRF-55342 and MIL_PRF-32159.

Momentive Performance Materials
Booth #: 610
22557 West Lunn Road
Strongsville, OH 44149  USA
(P) 605-740-1683
Momentive Performance Materials Inc. is a global leader in silicones and advanced materials, with a 70-year heritage of being first to market with performance applications for major industries that support and improve everyday life. The company delivers science-based solutions by linking custom technology platforms to opportunities for customers.

MRSI Systems LLC
Booth #: 231
101 Billerica Ave., Bldg. 3
North Billerica, MA 01862 USA
(P) 978-667-9449
MRSI Systems is a leading supplier of high precision dispense and assembly equipment for the microelectronics industry offering systems for the manufacture of Microwave, Optical, MCM’s and MEM’s devices. With three decades of advanced packaging application experience, MRSI Systems products support multiple interconnect technologies, including epoxy die bonding, In-situ UV, eutectic attach, thermo-compression and flip chip. The ultra-precision MRSI Systems M-3 with one micron capability, MRSI-M5 with 5 micron accuracy and MRSI-705 Assembly Work Cells specialize in GaAs handling and the MRSI Systems MRSI-175Ag Epoxy Dispenser is the leader for high precision conductive epoxy dispensing including 125 micron dots.

NAMICS Corporation
Booth #: 320
2055 Gateway Place, Suite 480
San Jose, CA, 95110 USA
(P) 408-516-4611
NAMICS CORPORATION is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells.  NAMICS subsidiary, DIEMAT, Inc. located in Byfield, MA, is the Namics North American R&D center specializing in the development of innovative thermally conductive adhesives and specialty glasses.  Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore, Korea, Taiwan and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.

Natel Electronic Manufacturing Services, Inc.
Booth #: 105
9340 Owensmouth Ave.
Chatsworth, CA  91311-6915  USA
(P) 818-734-6553
The leading manufacturer of LTCC/AlN Multilayer Substrates and Packages. RF/Microwave MIC(s), Hybrids, MCM's and Higher Level Assemblies for the Defense, Aerospace, Medical, RR/Microwave, Fiber Optic/Optoelectronic, Telecommunications and Test & Measurement Industries.

Neu Dynamics Corporation
Booth #: 405
110 Steamwhistle Drive
Ivyland, PA 18974 USA
(P) 215-355-2460
Neu Dynamics Corp is an ISO 9001:2008 certified Tool, Mold and Die manufacturer specializing in tooling and equipment used in building Semiconductors, Electronics, components and a wide variety of the devices used in automotive, telecommunications, solar and medical applications.  We further offer small to medium volume contract molding services for microelectronic packages such as BGA, QFN, MLP, optical components etc. We also have capability to provide insert molding services for items such as connectors.    We offer specialized equipment built for today’s high-tech semiconductor assembly processes.

NorCom Systems, Inc.
Booth #: 210
1055 West Germantown Pike
Norristown, PA  19403 USA
(P) 610-592-0167
NorCom Systems, Inc. manufactures optical leak test equipment for inspecting hermetically sealed packages.  The NorCom 2020 provides automated, in-line, full matrix gross and fine leak testing performed simultaneously with direct measurement of package leak rates in cc-atm/sec.  Package types inspected with the equipment include MEMS, PC board-mounted devices, Hybrids, crystal oscillators, and Hi-Rel.

Nordson DAGE
Booth #: 227
2470 Bates Ave, Suite A
Concord, CA 94520, USA
(P) 925-246-1662
Nordson DAGE is part of the Advanced Technology - Electronics Systems Group of Nordson Corporation (NASDAQ: NDSN). The advanced Nordson DAGE 4000Plus is a multipurpose bond, stress/strain and micro materials test system. The 4000Plus can perform shear tests up to 500kg, pull tests up to 100kg and push tests up to 50kg, covering all test applications including 3 & 4 point bend, and IPC9708 hot bump pull.  The camera assist automation system is ideally suited for pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.

NTK Technologies
Booth #: 517
3979 Freedom Circle Drive, Suite 320
Santa Clara, CA 95054 USA
(P) 408- 562-5124
NTK Technologies is a leader in IC Organic and Ceramic Packaging. With global service centers, NTK offers a wide range of packaging materials and design services for Opto, LED, MCM, RF, CMOS Image Sensors, Hi-Rel, Satellite, FCBGA, FCCSP, FPGA, CPU, MPU, Automotive and Medical applications. Monolithic package designs for Medical and Mobile applications.  Optimum package designs for 10G, 40G, and 100/400G. Large and small scale Ceramic and Organic STFs are manufactured for high-speed probe-cards for semiconductor wafer test. Large and small scale ceramic substrates can be configured with narrow pitches and a wide range of pin count capabilities. NTK supports fast paced product cycle times with our advanced design and production flows featuring high precision processes for fast turn-around with the highest quality.

Palomar Technologies, Inc.
Booth #: 221
2728 Loker Ave. West
Carlsbad, CA 92010  USA
(P) 760-931-3681
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire  bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to  meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit

Perfection Products, Inc.
Booth #: 505
1320 Indianapolis Avenue
Lebanon, IN 46052
(P) 765-482-7786
Perfection Products manufactures Process Magazines and Carriers.  Such products are Film Frames, Grip Rings, Magazines for Frames and Rings.  Lead Frame Magazines, Process Boats (formed & flat style) & Magazines, Antistatic Shippers for Frames and Rings.  Also, available are the 12.0” (300 mm) Wafer Frames and Magazines.    Perfection – Accept Nothing Less

Photofabrication Engineering, Inc.
Booth #: 111
500 Fortune Boulevard
Milford, MA 01757  USA
(P) 508-478-2025
PEI is the world leader in manufacturing custom photo-etched lead frames, chip carriers, surface-mount/hybrid components, EMI/RF shielding, and lids for seam-sealed hermetic devices.  All of our products are made in the USA. PEI is ITAR, ISO9001, and AS9100 certified.

PJC Technologies, Inc.
Booth #: 615
205 Lagrange Avenue
Rochester, NY 14613 USA
(P) 585-820-4661
PJC Technologies, Inc. is a leading fabricator of bare printed circuit boards (PCBs), flexible and rigid-flex circuits, RF / microwave / mm-wave packages and IC packaging substrates. Historically known as Metro Circuits and Speedy Circuits, PJC focuses on time critical prototype to small volume on-shore production. Since 1992 PJC has been a leader in wire bondable gold packages.  Our IC packaging and MCM-L offerings include: MMIC packages, LTCC/HTCC alternatives, air cavity packages, lead-frame alternatives and flip chip modules.

Plasma-Therm, LLC
Booth #: 108
10050 16th Street North
St. Petersburg, FL 33716 USA
(P) 727-577-4999
Plasma-Therm is a U.S. manufacturer of advanced plasma processing equipment for research and development to high-volume production. MicroDieSingulator™ systems deliver plasma dicing-on-tape for advanced packaging applications, and the company’s leading etching and deposition technologies address the needs of specialty semiconductor markets, including solid-state lighting, power, data storage, renewable energy, MEMS, nanotechnology, photonics, wireless communication, and advanced photomask etching. Customers have recognized Plasma-Therm with VLSIresearch awards for the last 16 years. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the needs of Plasma-Therm’s global customer base.

Polysciences, Inc.
Booth #: 422
400 Valley Road
Warrington PA 189876  USA
(P) 800-523-2575
Polysciences, Inc. High Performance Adhesives, Coatings and Encapsulants division offers innovative polymer products to meet the high performance requirements of a variety of industries including alternative energy, automotive electronics, defense & aerospace electronics, portable communications & computing, medical device assembly, optoelectronics & sensors, wireless datacom infrastructure and more. Our expanded line of electronics polymers and chemicals includes but is not limited to underfills, liquid encapsulants, conformal coatings, die attach and optical adhesives for various advanced applications. In addition, we provide custom formulation, high purity polymer and monomer synthesis, and contract packaging services. ISO 9001 & ISO 13485 certified.

PREES @ NC State Univ.
Booth #: 703
1791 Varsity Dr., Ste 100
Raleigh, NC 27606 USA
(P) 919-513-5929
(E) DCHopkins@NCSU.Edu
"The Laboratory for Packaging Research in Electronic Energy Systems" (PREES) brings together academic and business interests in using new approaches to development, and fabrication of power electronic systems.        Design capabilities include Electrical and Multiphysics simulation and full CAD layout. Fabrication uses both conventional and 3D-printing techniques, e.g. thick film, etched DBC, printed interconnects and housings, embed thermal cooling, ribbon and wire bonding, and encapsulate. Designs range to 15kV and 1.5kA.  All processes can include a controlled atmosphere.

Booth #: 312
10987 Via Frontera
San Diego, CA 92127 USA
(P) 858-674-4676
Quik-Pak is an industry leader in creating IC packaging and assembly solutions that accelerate your time to market.  The company is expert in custom process development that takes your design from prototype through volume production.      Quik-Pak offers:  •       A broad range of package types including Open-molded Plastic Packages (OmPP), Open Cavity Plastic Packages (OCPP), or custom packages designed for your specific application.  
 •             Die/wire bonding, encapsulation and marking/branding  •         Assembly services for flip chip, ceramic packages, chip-on-board, stacked die, and MEMS  •  Wafer Preparation Services – dicing, backgrinding, sorting.

Reldan Metals Co., Div. of Abington Reldan Metals, LLC
Booth #: 521
550 Old Bordentown Road
Fairless Hills, PA 19030 USA
(P) 800-764-9222
Maximizing Value From Precious Metal Scrap®   Reldan Metals Co. Div. of Abington Reldan Metals, LLC refinery has been operating and handling precious metal scrap for over 30 years. Our State of the Art LEED certified facility by the U.S. Green Building Council is ISO 14001:2004 certified, zero discharge, e-Steward certified, R2 certified, ITAR registered and CHWMEG reviewed.  LEED certification sets forth strict standards for energy-efficient and environmentally responsible workplaces.  Abington Reldan Metals has the capability to handle all types of scrap using various methods such as pyrometallurgical, hydrometallurgical, mechanical reduction, melting and others.  Depending on the type of scrap generated there are specific techniques we use to recover the highest value from your scrap.

Riv, Inc.
Booth #: 100
31 Railroad Ave.
Merrimack, NH  03054-4121  USA
(P) 603-424-0510
A Leading Manufacturer of Fine Line ThickFilm Printing Screens.  Catering to the Hybrid Microelectronics and  Solar Industries. As well as any other Printing related Industry.  Family/Women owned and Operated since 1986

Royce Instruments LLC
Booth #: 321
831 Latour Court, Suite C
Napa, CA 94558 USA
(P) 707-255-9078
Celebrating over thirty years of US manufacturing, Royce Instruments’ products have earned excellent reputations for performance and reliability.  The 600 Series Bond Test Instruments offer extensive SPC and data sharing options (see in action with trinocular microscope at booth 321), as well as express module support to minimize down-time.  Quick change-over die sorters excel with critical geometry, fragile die.  Semi-automatic (DE35-ST) or fully-automatic with wafer-mapping (AutoPlacer MP300), both are designed to handle a high mix of applications.  Visit Royce booth 321 to discuss how the MP300’s new touchscreen software platform can handle your latest die sorting requirements.

Rudolph Technologies
Booth #: 520
One Rudolph Road P.O. Box 1000
Flanders, NJ 07836
(P) 973-691-1300
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar.

Sage Analytical Lab
Booth #: 428
6370 Nancy Ridge Drive, Suite #112
San Diego, CA 92121 USA
(P) 858- 255-8587
Sage Analytical Lab is a world-class laboratory dedicated to providing the best-in-class analytical techniques using state of the art equipment for analyzing and diagnosing all levels of failures in today's highly-integrated and advanced electronic devices. With over 85 years of work experience in advanced analytical techniques and best practices, we can provide advanced procedures and methods to proficiently analyze and expose various failure sites.     Sage Analytical Lab’s exceptional team of scientists, engineers, and technicians strive to meet and exceed all your Failure Analysis needs.    Our technical team is available to talk with you concerning your analytical needs, and provide an optimum, knowledge based solution to help you solve your problems.

Sales & Service, Inc.
Booth #: 423
4883 E. La Palma Ave. #505
Anaheim, CA  92807  USA
(P) 714-696-5332
Realizing the need for a service and a relationship based representative company, Bill Winn founded Sales & Service Incorporated in 1989. Located in the heart of Orange County, SSI has emerged as a proven and dedicated manufacturer’s representative for over 20 years.

Booth #: 421
5050 List Drive
Colorado Springs, CO 80919 USA
(P) 719-592-9100
The easiest interconnect company to do business with. Samtec is the service leader in the electronic interconnect industry. Founded in 1976, we are a privately held, $565 million global manufacturer of a broad line of electronic interconnects, including high speed, micro pitch, rugged/power, and flexible board stacking systems, cable assemblies and components, IP68 sealed I/O, and RF components and cables.
Samtec is ISO/TS 16949, ISO 9001, and ISO 14001 registered with a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size.

Booth #: 500
10113 Carroll Canyon Road
San Diego, CA  92131  USA
(P) 858-837-1591
SANTIER is a center of excellence for the design and manufacture of microelectronic housings and assemblies.  With our facilities in San Diego, we are integrated to manufacture metal matrix composites, multilayer high temperature co-fired ceramic, assembly and plating for customer thermal management products that span the aerospace, defense, medical, telecom, communications and many other industries around the world.

SavanSys Solutions LLC
Booth #: 329
10409 Peonia Court
Austin, TX, 78733, USA
(P) 512-402-9943
SavanSys is the industry standard choice for electronics manufacturing cost modeling. The company began with a focus on multi-chip module and PCB fabrication and assembly before expanding into electronics packaging. SavanSys provides both cost modeling services and software products and maintains an extensive library of manufacturing activity costs. Projects range from multi-year ventures focused on detailed supply chain modeling to one-time projects comparing a new technology to the current industry standard.

SemiDice, Inc.
Booth #: 102
10961 Bloomfield Street. P.O. Box 3002
Los Alamitos, CA 90720 USA
(P) 562-594-4631
Bare Bare Distribution and Wafer Processing Specialist's. Value-added services include Testing; Electrical Probing, LAT, Burn-in , Class H & K. Extensive inventory with stocking programs available.

Shinko Electric America
Booth #: 609
2880 Zanker Road #204
San Jose, CA, 95134  USA
(P) 408-232-0499
Shinko Electric Industries CO., LTD. is a leading manufacturer of products used in the assembly of IC’s such  as; Organic Substrates, Etched and Stamped Leadframes, TO Packages and Integrated Heatspreaders. Shinko   manufactures a full line of Organic Substrate structures including coreless options offering enhanced   electrical performance and package size reduction. Shinko can also provide subcontract assembly services with an   emphasis on packaging solutions such as POP, SIP and  Camera Modules utilizing our advanced package assembly   technologies, including our molded core embedded package, MCeP™. Shinko is located in Nagano, Japan and   provides the ultimate in service and solutions for our customers with Sales and Engineering support  worldwide.   For more about Shinko please visit our website at

Sierra Circuits, Inc.
Booth #: 608
1108 West Evelyn Avenue
Sunnyvale, CA 94086 USA
(P) 800-763-7503
Sierra Circuits is the leading name in printed circuit boards, specializing in PCB manufacturing and the assembly of High Density Interconnect Technology. From PCB layout and design to assembly and manufacturing, Sierra Circuits handles all aspects of PCB production.     Sierra Circuits has developed technology down to 25 micron trace/space on organic PCB substrates. We provide customers with unprecedented quality, reliability, and a single point of support. Certifications: ISO 9001:2008, ISO 13485:2003, Milspec MIL-P-55110.    For more information on our resources, view For PCB manufacturing news and updates, check out

Sikama International, Inc.
Booth #: 213
118 E. Gutierrez Street
Santa Barbara, CA 93101 USA
(P) 805-962-1000
Sikama International designs, manufactures, and markets solder reflow & curing systems, wafer flux coaters and wafer washers. Our ovens feature a patented conduction plus convection heating technology and are used for Wafer Bumping, LED Die Reflow, BGA Re-balling, High Density Package Reflow, Lid Attach, Fluxless Gold Tin Reflow, Lead Frame Reflow and Curing among many other applications.

Sonoscan, Inc.
Booth #: 315
2149 E. Pratt Boulevard
Elk Grove Village, IL  60007 USA
(P) 847-437-6400
Sonoscan® is a leader and innovator in Acoustic Microscopy  (AM) technology. Sonoscan manufactures acoustic microscope  systems and provides laboratory services to nondestructively inspect  and analyze microelectronic materials, devices, etc. Sonoscan’s  C-SAM® systems provide unmatched accuracy for the inspection of  microelectronics for hidden internal defects that affect short and longterm reliability.

Booth #: 414
434 Olds Station Rd.
Wenatchee, WA 98801 USA
(P) 509-667-5480
SOURIAU PA&E specializes in the custom design and manufacture of hermetic connectors and electronic packaging. Our technology is proven in the harshest environments. We work directly with engineers to custom design and manufacture electronic packaging and connectors that meet the exacting standards for the reliability satellite, missile, fighter aircraft, under-sea and other mission-critical systems require. We use unique materials in our manufacturing processes and offer a range of production capabilities – machining, plating, vacuum brazing, laser welding, and more – all at a single location. This integrated manufacturing approach can reduce complexity and risk on your next project.

SST International
Booth #: 305
9801 Everest Street
Downey, CA  90242,  USA
(P) 562-803-3361
SST International manufactures vacuum/pressure furnaces for high-reliability microelectronic package assembly. SST’s furnaces create void-free solder joints without flux. Applications include eutectic die attach, hermetic package sealing, lead-free soldering, fiber-optic component soldering, glass-to-metal sealing, high temperature brazing, high vacuum MEMS package sealing with getter activation, wafer bonding and solar cell attach.     Let SST International partner with you to assist you in achieving the highest reliability processes possible. This partnership offers over 50 years of soldering experience of SST International and the dedication to provide you with state of the art equipment and the best process support available, worldwide.

Stellar Industries Corp.
Booth #: 400
50 Howe Avenue
Millbury, MA  01527 USA
(P) (508) 865-1668
Stellar offers high performance, high power Copper on Ceramic for Laser Submounts and for RF Microelectronic hybrids.  Stellar also offers vapor deposited AuSn for precision mounting and a complete line of custom ceramic machining and metallization services.

Taiyo Ink Mfg. Co., Ltd.
Booth #: 613
900 Hirasawa Ranzanmachi Hikigun
Saitama 3550215, Japan
(P) 81-493-61-2715
We are one of major solder resists manufacturer, and our products are widely used in package substrates. Using our solder resist technology, Taiyo Ink has expanded business felid in the packaging materilas area. Taiyo Ink aims to expand its business domain through the continual development and provision of new chemical materials for the electronics industry.

Tango Systems, Inc.
Booth #: 436
2363 Bering Drive
San Jose, CA 92131 USA
(P) 408-526-2330
Based in Silicon Valley, Tango Systems develops advanced PVD technology semiconductor PVD systems. With American innovation, American manufacturing and global support we deliver leading performance, high reliability and the results that matter to our worldwide customers.

TDK Corporation
Booth #: 606
475 Half Day Road
Lincolnshire, IL 60069 USA
(P) 847-795-2163
TDK, a leader in Factory Automation solutions for both Front End & Back End, offers the  AFM-15 Flip Chip Ultrasonic Gold-to-Gold Interconnect (GGI) Bonder which provides a low temperature, precision, high reliability, die assembly process. TDK flip chip GGI process provides up to a 70% form factor size reduction and superior electrical high frequency performance compared to other methods. Applications include mobile phones, wireless devices, RF, sensors & more.  TDK TAS N2 Purge 300mm loadports, purge shelves, and stand-alone CAVs reduces FAB wafer process oxidation and cross contamination.   TDK has over 10 years’ experience with this process and has worked with leading FOUP manufactures to provide the best process solution.

Technic, Inc.
Booth #: 411
300 Park East Drive
Woonsocket, RI 02895  USA
(P) 401-769-7000
Certified facility, manufactures metal powders and  flakes for the electronics, electrical, jewelry, medical,  dental and other industries. Our team of customer  driven chemists, engineers, and technicians operate  out of a 93,000 Sq. ft. (8,640 Sq. m.) facility located in  Woonsocket, Rhode Island, USA. With over 60 years  of experience in the industry, Technic can analyze  your application requirements and develop new or  customized products as well as modify existing  products to fit your specific application needs.

Teledyne Microelectronic Technologies, Inc.
Booth #: 300
1425 Higgs Road | Lewisburg, TN  37091  USA
12870 Panama Street | Los Angeles, CA  90066  USA
(P) 931-359-4531 | 310-574-2082
Over the past 50 years, Teledyne Microelectronics has produced millions of microelectronic hybrids that have contributed to countless hours of history. We continue to build on our rich heritage of advanced manufacturing technologies. Our microelectronics packaging experience is now combined with circuit card assembly manufacturing and printed circuit board manufacturing.  Together, we provide a complete, vertically integrated advanced manufacturing solution.

Torrey Hills Technologies, LLC
Booth #: 515
6370 Lusk Blvd., Suite F-111
San Diego, CA  92121  USA
(P) 858-558-6666
Torrey Hills Technologies is a California based manufacturer of tungsten-copper, molybdenum-copper, Cu/Mo/Cu and Cu/Mo70Cu/Cu heat sinks. These products have high thermal conductivity and provide excellent CTE matches. The company is also distributor of conveyor belt furnaces, including fast fire and infrared furnaces for drying, firing, brazing and many other applications.

TPT Wire Bonder
Booth #: 325
704 Ginesi Drive, Suite 11A
Morganville, NJ 07751 USA
(P) 732-536-3964
TPT Wire Bonder manufacturers leading wire bonding solutions for Universities, R&D, and small to large companies. Manual or Semi-Automated Bonders for Ball Bonding, Wedge Bonding, Ribbon Bonding, Heavy Wire or Stud Bump Bonding, They can support standard wire  sizes to heavy wire of varying materials and switch from wire to ball with just the change of a tool.

Tresky Corporation
Booth #: 323
704 Ginesi Drive, Suite 11A
Morganville, NJ 07751 USA
(P) 732-536-8600
Manufacturer of advanced die bonding and pick & place systems.  Tresky's newest system, the T-8000, is a fully-automated die bonding system targeted at R&D and low to medium volume production.  It has been designed, like it's predecessor the T-6000, to be extremely flexible and simple to use, with software that was created to accelerate time to fabrication.  The flagship FC3 systems continue to adapt to today's advanced applications, with higher forces (50kg) and higher resolution flip chip optics (0.5um resolution). The T-4909 provides a flexible entry-level system.

U.S. Tech
Booth #: 430
10 Gay Street
Phoenixville, PA  19460  USA
(P) 610-783-6100
As we enter our 27th year, US Tech has become the major global publication for the electronics industry. In 2011 we introduced our digital edition which we e-mail it to our E-Readers worldwide. We also were granted an Apple App. where readers who have an Apple device can download it free of charge. Subscriptions to our digital edition through our website and App. downloads have been increasing since January 1, 2011.

UBOTIC Company Limited
Booth #: 322
Unit 18, 15/F International Trade Centre, 11 Sha Tsui Road
Tsuen Wan, NT, Hong Kong
(P) 480-208-1999
Specializing in MEMS and Sensor Package Development, Assembly and Test.  Offering Prototype to Production of cavity packages, SIP, LGA and specialty products.  Available in both full LF or singulated format, package Lids with B-stage epoxy and more.  Molded Packages available in both Epoxy Mold Compound or Liquid Crystal Polymer.  Engineering and Design Services, Package and Reliability Testing.

Booth #: 524
1284 Forgewood Avenue
Sunnyvale, CA 94089 USA
(P) 408-685-1674
Unisem is a global provider of semiconductor assembly and test (OSAT) services for many of the world's most successful electronics companies. We offer an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding; a wide range of leadframe and substrate IC packaging; wafer level CSP; and RF, analog, digital, and mixed signal test. Our turnkey services include design, assembly, test, failure analysis, and electrical, mechanical, and thermal characterization and modeling. Unisem is an established MEMS OSAT with several years of experience in volume consumer and automotive production, in addition to a broad package portfolio covering multiple applications. The company has factory locations in Ipoh, Malaysia; Chengdu, People's Republic of China; Batam, Indonesia; and Sunnyvale, USA. Unisem is headquartered in Kuala Lumpur, Malaysia.     For additional information on Unisem, please visit: Follow Unisem on Twitter and on Linkedin.

Booth #: 536
2-6-1, Chiyoda-ku, Otemachi
Tokyo, Japan
(P) 81-6361-5592
USHIO is a leading supplier of lithography tools for 2.5D 3D advanced packaging, packaging substrate, MEMS, LED and power devices. At IMAPS2014, USHIO will propose UX-7, a large-field interposer stepper designed for 2.5D/3D packaging applications, namely TSV, RDL and micro-bumping process, to be manufactured on a large field with high precision at a significantly low cost. In addition, direct imaging system Align 600, which enables observation of 600 alignment points at high speed, is introduced as a new solution to manufacture of Fan-Out wafer-level packaging.

Utz Technologies
Booth #: 328
4 Peckman Road
Little Falls, NJ 07424 USA
(P) 973-339-1100
Utz technologies is North Americas premier Hybrid mesh screen manufacturer. Our services include, hybrid mesh screens, stainless mesh wire , smt stencils and precision metal parts . Please visit us at for more information.

VIOX (now Ceradyne, Inc., a 3M company)
Booth #: 526
6701 Sixth Ave. S
Seattle, WA 98108 USA
(P) 206-763-2170
Ceradyne, Inc.,  3M company, has a 50-year history of developing and manufacturing specialty glass compositions for a wide range of electronic, industrial and health care markets. Specialty glass is often considered a subset of technical ceramics and can be adapted via its formulation composition to have various desired electrical, sealing and bioactive properties.

West Bond, Inc.
Booth #: 416
1551 South Harris Ct.
Anaheim, CA  92806  USA
(P) 714-978-1551
Design and Manufacturer of Automatic, Semiautomatic, and Manual ESD Protected Microelectronic Assembly and Test Equipment, and Accessories, Since 1966.  Ultrasonic, Thermosonic, and Thermocompression Wire/Ribbon Bonders, Eutectic and Epoxy Die Bonders, Insulated Wire Bonders, and Pull Testers, LED Illuminators, Heated and Cold Workholders, Temperature Controllers, Ultrasonic Transducers, Ultrasonic Power Supplies, and Wire Despoolers.  Visit:

Booth #: 404
36 Balch Ave.
Groveland, MA 01834 USA
(P) 978-880-2598
XYZTEC is the technology leader in bond testing. The Condor Sigma is the most advanced bond tester on the market. The Revolving Measurement Unit (RMU) enables continuous operation with up to six different test types on one machine at forces up to 200kgf. XYZTEC is unique in its high force products, automation capability and next generation tweezers.

YINCAE Advanced Materials, LLC
Booth #: 326
19 Walker Way
Albany, NY  12205  USA
(P) 518-452-2880
YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in electronic and optoelectronics industries.

Yxlon FeinFocus
Booth #: 502
5675 Hudson Industrial Parkway
Hudson, OH  44236 USA
(P) 480-432-0840
YXLON is the leading supplier of industrial X-Ray inspection and CT solutions for the non-destructive testing of materials and electronics. The YXLON product portfolio includes the Y.Cheetah and Y.Cougar which offer effortless high-quality X-Ray imaging for a wide range of continuous inspection tasks. The Y.Cheetah and Y.Cougar combine proprietary FeinFocus technology with advanced high-speed flat panel detector technology. Within seconds, the systems adapt between inspection tasks-failure analysis, research and development, process control and product testing including QuickScan mode.

Zeta Instruments
Booth #: 604
2528 Qume Drive, Suite 12
San Jose, CA 95131 USA
(P) 408-573-7638
Zeta Instruments designs, manufactures, sells and services Multi-Mode optical profilers and defect inspection systems for multiple high-technology industries, including: advanced semiconductor packaging, high-brightness LEDs, advanced glass manufacturing, solar, microfluidics and data storage. Zeta has delivered consistent growth and has installed over 180 systems in 18 countries. Its locations include headquarters in San Jose, CA, a regional office in Shanghai, China, and sales and service representatives worldwide.


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:: Job Openings ::

AEM has few immediate openings for two R&D engineers and few technicians - Contact Pacific Rim Engineering

  • AS, BS or advanced degrees in materials science and engineering, or chemical engineering or mechanical engineering.
  • Experience in cofire ceramic materials, process, equipment and designs.
  • US citizen or PR, working permit for outstanding candidates.
  • Working in San Diego, America’s Finest City!
  • Traveling to Asia at 25-35%

Send resume to with compensation history. AEM Components @ AEM Inc. @

Ray Petit
Pacific Rim Engineering
P.O. Box 230667 Encinitas, CA 92023


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:: Issue 165 ::
October 2, 2014


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